MEC1609/MEC1609i Mixed Signal Mobile Embedded Flash ARC EC BC-Link/VLPC Base Com

MEC1609/MEC1609i
Mixed Signal Mobile Embedded Flash ARC EC BC-Link/
VLPC Base Component
Product Features
• 3.3V Operation
• ACPI Compliant
• LPC Interface
- LPC I/O and Trusted Cycles Decoded
• VTR (standby) and VBAT (Power Planes)
- Low Standby Current in Sleep Mode
• Configuration Register Set
- Compatible with ISA Plug-and-Play Standard
- EC-Programmable Base Address
• ARC-625D Embedded Controller (EC)
- 16 KB Single Cycle 32-bit Wide Dual-ported
SRAM, Accessible as Closely Coupled Data
Memory and Instruction Memory
- 2 KB Instruction Cache and AHB Memorymapped SPI Flash Read Controller
- 32 x 32 x 64 Fast Multiply
- Divide Assist and Saturation Arithmetic
- Maskable Interrupt Aggregator/Accelerator
Interface
- Maskable Hardware Wake-Up Events
- Sleep mode
- JTAG Debug Port, Includes JTAG Master
- MCU Serial Debug Port
- 8-Channel DMA Interface Supports SMBus
Controllers and EC/Host GP-SPI Controllers
• Embedded Flash
- 192 KB user space + 2kB info block, 32-bit
Access, 35ns Access Time, 1 K Cycles
Endurance
- Programmable by LPC, EC and JTAG Interfaces
- Flash Security Enhancements
– 4K Boot Block Protection
– Direct JTAG and Direct LPC-protected (2) Pages
at or Near Top of Memory for Password
Protection
• Legacy Support
- Fast GATEA20 & Fast CPU_RESET
• System to EC Message Interface
- 8042 Style Host Interface
 2014 Microchip Technology Inc.
- Embedded Memory Interface
– Host Serial or Parallel IRQ Source
– Provides Two Windows to On-Chip SRAM for
Host Access
– Two Register Mailbox Command Interface
– Host Access of Virtual Registers Without EC
Intervention
- Mailbox Registers Interface
– Thirty-two 8-Bit Scratch Registers
– Two Register Mailbox Command Interface
– Two Register SMI Source Interface
- ACPI Embedded Controller Interface
– Four Instances
– 1 or 4 Byte Data transfer capable
- ACPI Power Management Interface
– SCI Event-Generating Functions
• Battery Backed Resources
- Power-Fail Status Register
- 32 KHz Clock Generator
- Week Alarm Timer Interface with Programmable Wake-up from 1ms to 45 Days
- VBAT-Powered Control Interface
- VBAT-Backed 64 Byte Memory
• Three EC-based SMBus 2.0 Host Controllers
- Allows Master or Dual Slave Operation
- Controllers are Fully Operational on Standby
Power
- DMA-driven I2C Network Layer Hardware
- I2C Datalink Compatibility Mode
- Multi-Master Capable
- Supports Clock Stretching
- Programmable Bus Speeds
- 400 KHz Capable
- Hardware Bus Access “Fairness” Interface
- SMBus Time-outs Interface
- 8 x 3 x 3 Port Multiplexing
• PECI Interface 2.0
• 18 x 8 Interrupt Capable Multiplexed Keyboard
Scan Matrix
• Three independent Hardware Driven PS/2 Ports
- Fully functional on Main and/or Suspend
Power
- PS/2 Edge Wake Capable
• 115 General Purpose I/O Pins
- 8 GPIO Pass-Through Port (GPTP)
DS00001769A-page 1
MEC1609/MEC1609i
• 3-pin LED Interface
- Programmable Blink Rates
- Breathing LED Output
- Operational in EC Sleep State
• Programmable 16-bit Counter/Timer Interface
- Four Wake-capable 16-bit Auto-reloading
Counter/Timer Instances
- Four Operating Modes per Instance: Timer,
One-shot, Event and Measurement.
- 4 External Inputs, 4 External Outputs
• Hibernation Timer Interface
- Two 32.768 KHz Driven Timers
- Programmable Wake-up from 0.5ms to 128
Minutes
• System Watch Dog Timer (WDT)
• Input Capture and Compare Timer
- 32-bit Free-running timer
- Six 32-bit Capture Registers
- Two 32-bit Compare Registers
- Capture, Compare and Overflow Interrupts
• Microchip’s Multipoint VLPCTM Serial Interconnect Bus Master
- Forwards LPC transactions to VLPC peripherals
- Forwards ARC transactions to VLPC peripherals
• BC-LinkTM Interconnection Bus
- Three High Speed and one Low Speed Bus
Masters Controllers
• Two General Purpose Serial Peripheral Interface
Controllers (ECGP-SPI)
- One 3-pin EC-driven Full Duplex Serial Communication Interface
- One 4-pin EC/Host-driven Full Duplex Serial
Communication Interface to SPI Flash Interface
- Flexible Clock Rates
- SPI Burst Capable
• SPI Flash Read Controller
- 4 MB AHB Memory-Mapped address space
- Supports 2 KB EC Instruction Cache
DS00001769A-page 2
• FAN Support
- 8 Programmable Pulse-Width Modulator Outputs
– Multiple Clock Rates
– 16-Bit ‘On’ & 16-Bit ‘Off’ Counters
•
•
•
•
•
•
•
- Four Fan Tachometer Inputs
- 6 x 2 Capture/Compare Timer Interface
ADC Interface
- 10-bit Conversion in 10μs
- 16 Channels
- Integral Non-Linearity of ±0.5 LSB; Differential Non-Linearity of ±0.5 LSB
Two Pin Debug Port with Standard 16C550A Register Interface
- Accessible from Host and EC
- Programmable Input/output Pin Polarity
Inversion
- Programmable Main Power or Standby
Power Functionality
- Standard Baud Rates to 115.2 Kbps, Custom
Baud Rates to 2 Mbps
Resistor/Capacitor Identification Detection
(RC_ID)
- Single Pin Interface to External Inexpensive
RC Circuit
- Replacement for Multiple GPIO’s
- Provides 8 Quantized States on One Pin
Integrated Standby Power Reset Generator
Clock Generator
- 32.768 KHz-input Clock
- operational on Suspend Power
- Programmable Clock Power Management
Control & Distribution
- 64.52 MHz ±2% Accuracy
Packages
- 144 Pin LFBGA RoHS Compliant package
- 144 Pin TFBGA RoHS Compliant package
Operating Temperature
- The MEC1609 supports the commercial temperature range of 0o C to +70o C
- The MEC1609i supports the industrial temperature range of -40o C to +85o C
 2014 Microchip Technology Inc.
MEC1609/MEC1609i
Description
The MEC1609/MEC1609i is the mixed signal base component of a multi-device advanced I/O controller architecture.
The MEC1609/MEC1609i incorporates a high-performance 32-bit ARC 625 embedded microcontroller with a 192 Kilobyte embedded Flash subsystem, 16 Kilobytes of SRAM and 2 Kilobytes of instruction cache with an AHB memorymapped SPI Flash Read Controller. The MEC1609 communicates with the system host using the Intel® Low Pin
Count bus.
There are two distinct protocols that provide communication between the MEC1609/MEC1609i base component and
companion components: BC-Link and VLPC. BC-Link in the MEC1609/MEC1609i can access up to four companion components. The BC-Link protocol is peer-to-peer providing communication between the MEC1609/
MEC1609i embedded controller and registers located in a companion. VLPC is a multi-drop protocol that matches
the MEC1609/MEC1609i with up to three untrusted companion components and one trusted companion
component. The MEC1609/MEC1609i accepts LPC Host (ICH/PCH) transactions targeting blocks internal to the
MEC1609/MEC1609i and blocks physically located in VLPC companions. The ARC 625 embedded microcontroller
can also access blocks that are physically located in VLPC companion components.
The MEC1609/MEC1609i is directly powered by two separate suspend supply planes (VBAT and VTR) and senses a
third runtime power plane (VCC) to provide “instant on” and system power management functions. The MEC1609/
MEC1609i also contains an integrated VTR Reset Interface and a system Power Management Interface that supports
low-power states and can drive state changes as a result of hardware wake events as defined by the MEC1609/
MEC1609i Wake Interface.
The MEC1609/MEC1609i defines a software development system interface that includes an MCU Serial Debug Port, a
two pin serial debug port with a 16C550A register interface that is accessible to the EC or to the LPC host and can operate up to 2 MB/s, a flexible Flash programming interface and a JTAG interface. The EC can also drive the JTAG interface as a master.
A top-level block diagram of the MEC1609/MEC1609i is shown in FIGURE 1: MEC1609/MEC1609i Top-Level Block
Diagram on page 5. An example of system level connection is shown in FIGURE 2: Example of MEC1609/MEC1609i’s
Connections to System Components on page 6.
 2014 Microchip Technology Inc.
DS00001769A-page 3
MEC1609/MEC1609i
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
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revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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DS00001769A-page 4
 2014 Microchip Technology Inc.
MEC1609/MEC1609i
BLOCK DIAGRAM
MEC1609/MEC1609i TOP-LEVEL BLOCK DIAGRAM
vcc
LPC
Interface
& Host
Interrupt
Interface
LAD[3:0]
LFRAME#,
LRESET#,
PCI_CLK
nSMI
SER_IRQ,
nCLKRUN
LPC ACCESS
vcc
UART_TX
Mailbox
Registers
I/F
8042
Host
MSG
I/F
A20M*
Legacy
(Fast_KB)
Flash
SPI
KBRST*
Port 92, CPU_Reset, GateA20
`
UART_RX
ACPI
PM
MSG
I/F
EM
I/F
16550
(UART)
debug port
ACPI
EC
MSG
I/F
(x4)
`
FIGURE 1:
nRESET_OUT
VLPC_CLK
System Reset
JTAG_TDO
JTAG_RST#
JTAG_TDI
JTAG_TMS
JTAG_CLK
VLPC
Interface
Host
Configuration
Space
Access Port
JTAG
Master
and
Slave
Flash
Programming
&
Securitty
nFWP
JTAG
ACCESS
RC_ID Analog
KSI[7:0]
KSO[17:0]
RC_ID
XTAL2
VBAT
XTAL1
32 KHz
Crystal
Oscillator
VR_CAP
SPI Flash
Read
Controller
Embedded
Flash
ARC 625
Embedded
Controller
(EC)
Subsystem
Interrupt
Accelerator
8 Channel
DMA
Clock
Generation
&
PM I/F
Analog
VCC_PWRGD
Configuration
Registers
MCU Debug Port
BC-Link
Interface
General Purpose
I/O Interface
Power Fail Reg
VBAT
64 byte memory
General
Purpose SPI
Interface
PS2_CLK[2:0]*
SMB0[7:0]_DATA*,
SMB1[2:0]_DATA*,
SMB2[2:0]_DATA*
EC ACCESS
PWM &
Fan Tachometer
Interface
Input Capture
Compare Timer
Data
Acquisition
SMBus
Interface
VREF
PECI
READY
PECI_REQUEST#
ADC[15:0]*
ICT[5:4]
PWM[7:0]
FAN_TACH[3:0]
(ICT[3:0])
 2014 Microchip Technology Inc.
CPU
Voltage
SMB0[7:0]_CLK*,
SMB1[2:0]_CLK*,
SMB2[2:0]_CLK*
SB-TSI_CLK
SB-TSI_DAT
PECI
Notes
Analog
ECGP_SIN
ECGP_SCLK
ECGP_SOUT
PS2_DAT[2:0]*
WDT
VSS
GPTP-IN[7:0],
GPTP-OUT[7:0]
PS/2 Interface
16-Bit Counter/
Timers
VBAT
BCM_INT#[A:D]
GPIO*
VBAT
Hibernation Timer
x2
VTR
BCM_CLK[A:D],
BCM_DAT[A:D]
1 LS-Master
3 HS-Masters
Alarm Wake
Reset
Interface &
Power Mux
Voltage
Regulator
MSDATA, MSCLK
LED Controls
2 KB
Cache
VBAT
Power
control
FLSCLK, FLSOUT,
FLSIN,FLSCS#
LED[2:0]
16 K Byte
SRAM
Keyboard
Scan
VLPC_DATA
VLPC_FRAME
CPU Voltage
1) All blocks powered by VTR except where noted.
2) Signals with unique electrical requirements are
highlighted.
3) Asterisks (*) denote multiplexed signal
functions.
DS00001769A-page 5
MEC1609/MEC1609i
FIGURE 2:
EXAMPLE OF MEC1609/MEC1609i’S CONNECTIONS TO SYSTEM COMPONENTS
MEC1609/MEC1609i
EC
ADC
Flash
144 pin
DS00001769A-page 6
 2014 Microchip Technology Inc.
MEC1609/MEC1609i
PACKAGE OUTLINES
Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging.
FIGURE 3:
144-PIN LFBGA 10X10X0.8 MM PACKAGE OUTLINE (1.4 MM HEIGHT)
 2014 Microchip Technology Inc.
DS00001769A-page 7
MEC1609/MEC1609i
144-PIN TFBGA 7X7X0.5 MM PACKAGE OUTLINE (1.2 MM HEIGHT)
Note: For the most current package drawings,
see the Microchip Packaging Specification at
http://www.microchip.com/packaging
FIGURE 4:
DS00001769A-page 8
 2014 Microchip Technology Inc.
MEC1609/MEC1609i
APPENDIX A:
TABLE A-1:
PRODUCT BRIEF REVISION HISTORY
REVISION HISTORY
Revision
DS00001769A (06-03-14)
 2014 Microchip Technology Inc.
Section/Figure/Entry
Correction
Document Release
DS00001769A-page 9
MEC1609/MEC1609i
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Users of Microchip products can receive assistance through several channels:
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•
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Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
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Technical support is available through the web site at: http://www.microchip.com/support
DS00001769A-page 10
 2014 Microchip Technology Inc.
MEC1609/MEC1609i
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
[X]
XXX
-
Temperature
Range
-
Package
[X](1)
Tape and Reel
Option
Examples:
a)
b)
Device:
MEC1609, MEC1609i
Temperature
Range:
Blank
i
Package:
PZV
PZP
Tape and Reel
Option:
Blank
TR
c)
=
0°C to
= -40°C to
+70°C
+85°C
(Extended Commercial)
(Industrial)
d)
=
=
144-pin TFBGA
144-pin LFBGA
MEC1609-PZV
144-pin TFBGA (7mm x 7mm, 0.5 pitch)
RoHS Compliant package
MEC1609-PZP
144-pin TFBGA (10mm x 10mm, 0.8 pitch)
RoHS Compliant package
MEC1609i-PZV
Industrial temperature,
144-pin TFBGA (7mm x 7mm, 0.5 pitch)
RoHS Compliant package
MEC1609i-PZP
Industrial temperature,
144-pin TFBGA (10mm x 10mm, 0.8 pitch)
RoHS Compliant package
= Standard packaging (tray)
= Tape and Reel(1)
Note 1:
 2014 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Reel size is 4,000.
DS00001769A-page 11
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32
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flexPWR, JukeBlox, Kleer, KleerNet, MediaLB, and MOST
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ISBN: 9781632762627
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CERTIFIED BY DNV
== ISO/TS 16949 ==
DS00001769A-page 12
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.
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DS00001769A-page 13
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03/25/14
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