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HSP061-4M10Y
Automotive 4-line ESD protection for high speed lines
Datasheet - production data
• ISO 7637-3:
– pulse 3a: -150 V
– pulse 3b: +100 V
Applications
The HSP061-4M10Y is designed to protect
against electrostatic discharge on sub micron
technology circuits driving:
µQFN-10L package
• Automotive communication buses
Features
• Flow-through routing to keep signal integrity
• Ultralarge bandwidth: 8.7 GHz
• HDMI 1.3 and 1.4
• LVDS
• APIX
• Ultralow capacitance: 0.3 pF
• Digital Video Interface
• Low leakage current: 70 nA at 25 °C
• Extended operating junction temperature
range: -40 °C to 150 °C
• Thin package: 0.5 mm max.
• USB 3.0
Description
The HSP061-4M10Y is a 4-channel ESD array
with a rail to rail architecture designed specifically
for the protection of high speed differential lines.
• RoHS compliant
• AEC-Q101 qualified
The ultralow variation of the capacitance ensures
very low influence on signal-skew. The large
bandwidth makes the device compatible with
3.4 Gbps.
Benefits
• High ESD robustness of the equipment
• Suitable for high density boards
Complies with following standards
• MIL-STD 883G Method 3015-7 Class 3B:
– 8 kV
The device is packaged in µ QFN-10L 2.5 x 1 mm
with a 500 µm pitch, which minimizes the PCB
area.
• IEC 61000-4-2 level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
• ISO 10605: C = 150 pF, R = 330 Ω :
– 8 kV (contact discharge)
– 15 kV (air discharge)
• ISO 10605: C = 330 pF, R = 330 Ω :
– 8 kV (contact discharge)
– 15 kV (air discharge)
December 2013
This is information on a product in full production.
DocID025560 Rev 1
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Characteristics
1
HSP061-4M10Y
Characteristics
Figure 1. Functional schematic (top view)
Internally
not connected
I/O 1 1
10
I/O 2 2
9
GND 3
8 GND
I/O 3 4
7
I/O 4 5
6
Internally
not connected
Table 1. Absolute maximum ratings Tamb = 25 °C
Symbol
VPP
Parameter
Peak pulse voltage
Value
ISO 10605: C = 150 pF, R = 330 Ω
contact discharge
air discharge
ISO 10605: C = 330 pF, R = 330 Ω
contact discharge
air discharge
Unit
8
15
kV
8
15
Operating junction temperature range
-40 to +150
°C
Tstg
Storage temperature range
-65 to +150
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Tj
Table 2. Electrical characteristics Tamb = 25 °C
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
VBR
Breakdown voltage
IR = 1 mA
IRM
Leakage current
VRM = 3 V
70
nA
VCL
Clamping voltage
IPP = 1 A, 8/20 µs
15
V
CI/O - I/O
Capacitance
(I/O to I/O)
VI/O = 0 V, F = 1 MHz, VOSC = 30 mV
0.3
0.4
pF
CI/O - GND
Capacitance
(I/O to GND)
VI/O = 0 V F = 1 MHz, VOSC = 30 mV
0.6
0.8
pF
Cut-off frequency
-3dB
8.7
Differential
impedance
tr = 200 ps (10 - 90%)(1), Z0 Diff = 100 Ω
fC
ZDiff
6
85
V
100
GHz
115
1. HDMI specification conditions. This information can be provided for other applications. Please contact your
local ST office.
2/11
DocID025560 Rev 1
Ω
HSP061-4M10Y
Characteristics
Figure 2. Leakage current versus junction
temperature (typical values)
10
Figure 3. Attenuation versus frequency
0 S21 (db)
IR (nA)
VR =VRM= 3V
-1
1
-2
-3
0,1
-4
TJ(°C)
0,01
25
50
75
100
125
150
Figure 4. Differential impedance (Zdiff)(1)
F (Hz)
-5
100k
1M
10M
100M
1G
10G
Figure 5. Eye diagram - HDMI mask at 3.4 Gbps
per channel(1)
250 mV/div
tr = 200 ps (10% - 90%)
12.5 Ω /div
50 ps/div
1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office.
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Characteristics
HSP061-4M10Y
Figure 6. ESD response to IEC 61000-4-2 (+8 kV Figure 7. ESD response to IEC 61000-4-2 (-8 kV
contact discharge)
contact discharge)
20 V/div
20 V/div
1 VPP: ESD peak voltage
2 VCL :clamping voltage @ 30 ns
3 VCL :clamping voltage @ 60 ns
112 V 1
27 V
-16 V
2
20 V 3
2
-11 V
3
1 VPP: ESD peak voltage
2 VCL :clamping voltage @ 30 ns
3 VCL :clamping voltage @ 60 ns
-119 V 1
20 ns/div
20 ns/div
Figure 8. Response to ISO 7637-3 (pulse 3a) US Figure 9. Response to ISO 7637-3 (pulse 3b) US
= -150 V
= 100 V
5.00 V/div
5.00 V/div
50.0 ns/div
500 mA/div
50.0 ns/div
500 mA/div
50.0 ns/div
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50.0 ns/div
HSP061-4M10Y
2
Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 10. µQFN-10L dimension definitions
D
R
b1
5
12
0.
1
5
L
E
PIN 1 ID
6
10
b
e
A
A1
Seating
plane
A2
Table 3. µQFN-10L dimension values
Dimensions
Ref
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.40
0.48
0.50
0.018
0.019
0.020
A1
0.00
0.03
0.05
0.00
0.001
0.002
A2
0.13
0.005
b
0.15
0.20
0.30
0.006
0.008
0.012
b1
0.35
0.40
0.45
0.014
0.016
0.041
D
2.40
2.50
2.60
0.094
0.098
0.102
E
0.9
1.00
1.10
0.035
0.039
0.043
e
L
0.50
0.30
0.38
0.206
0.425
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0.012
0.015
0.017
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Package information
HSP061-4M10Y
Figure 11. Footprint recommendations
(dimensions in mm)
0.40
Figure 12. Marking
0.50
0.20
0.58
H4Y
1.40
2.20
Figure 13. µQFN-10L tape and reel specification
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
1.35
H4Y
H4Y
H4Y
8.00
3.5
2.75
1.75
0.25
4.0
0.55
All dimensions are typical values in mm
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HSP061-4M10Y
3
Recommendation on PCB assembly
Recommendation on PCB assembly
Figure 14. Recommended stencil window position
Copper
Thickness:
100 µm
Stencil window
Footprint
10 µm
5 µm
10 µm
5 µm
380 µm
550 µm
15 µm
580 µm
550 µm
580 µm
15 µm
190 µm
15 µm
15 µm
400 µm
3.1
200 µm
Solder paste
1.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste recommended.
3.
Offers a high tack force to resist component displacement during PCB movement.
4.
Use solder paste with fine particles: powder particle size 20-45 µm.
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Recommendation on PCB assembly
3.2
3.3
HSP061-4M10Y
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Figure 15. Printed circuit board layout recommendations
1
10
500 µm
Via to
Via to
GND
GND
5
Footprint pad
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6
PCB tracks
HSP061-4M10Y
3.4
Recommendation on PCB assembly
Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
240-245 °C
Temperature (°C)
250
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
Note:
30
60
90
120
150
180
210
240
270
300
Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
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Ordering information
4
HSP061-4M10Y
Ordering information
Figure 17. Ordering information scheme
HSP 06 1 - 4 M10 Y
High speed line protection
Breakdown voltage
Version
Number of lines
Package
μQFN-10L
Automotive
Table 4. Ordering information
5
Order code
Marking
Package
Weight
Base qty
Delivery mode
HSP061-4M10Y
H4Y
µQFN-10L
3.27 mg
3000
Tape and reel
Revision history
Table 5. Document revision history
10/11
Date
Revision
9-Dec-2013
1
Changes
Initial release.
DocID025560 Rev 1
HSP061-4M10Y
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