HSP061-4M10Y Automotive 4-line ESD protection for high speed lines Datasheet - production data • ISO 7637-3: – pulse 3a: -150 V – pulse 3b: +100 V Applications The HSP061-4M10Y is designed to protect against electrostatic discharge on sub micron technology circuits driving: µQFN-10L package • Automotive communication buses Features • Flow-through routing to keep signal integrity • Ultralarge bandwidth: 8.7 GHz • HDMI 1.3 and 1.4 • LVDS • APIX • Ultralow capacitance: 0.3 pF • Digital Video Interface • Low leakage current: 70 nA at 25 °C • Extended operating junction temperature range: -40 °C to 150 °C • Thin package: 0.5 mm max. • USB 3.0 Description The HSP061-4M10Y is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. • RoHS compliant • AEC-Q101 qualified The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes the device compatible with 3.4 Gbps. Benefits • High ESD robustness of the equipment • Suitable for high density boards Complies with following standards • MIL-STD 883G Method 3015-7 Class 3B: – 8 kV The device is packaged in µ QFN-10L 2.5 x 1 mm with a 500 µm pitch, which minimizes the PCB area. • IEC 61000-4-2 level 4: – 8 kV (contact discharge) – 15 kV (air discharge) • ISO 10605: C = 150 pF, R = 330 Ω : – 8 kV (contact discharge) – 15 kV (air discharge) • ISO 10605: C = 330 pF, R = 330 Ω : – 8 kV (contact discharge) – 15 kV (air discharge) December 2013 This is information on a product in full production. DocID025560 Rev 1 1/11 www.st.com Characteristics 1 HSP061-4M10Y Characteristics Figure 1. Functional schematic (top view) Internally not connected I/O 1 1 10 I/O 2 2 9 GND 3 8 GND I/O 3 4 7 I/O 4 5 6 Internally not connected Table 1. Absolute maximum ratings Tamb = 25 °C Symbol VPP Parameter Peak pulse voltage Value ISO 10605: C = 150 pF, R = 330 Ω contact discharge air discharge ISO 10605: C = 330 pF, R = 330 Ω contact discharge air discharge Unit 8 15 kV 8 15 Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Tj Table 2. Electrical characteristics Tamb = 25 °C Symbol Parameter Test conditions Min. Typ. Max. Unit VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V 70 nA VCL Clamping voltage IPP = 1 A, 8/20 µs 15 V CI/O - I/O Capacitance (I/O to I/O) VI/O = 0 V, F = 1 MHz, VOSC = 30 mV 0.3 0.4 pF CI/O - GND Capacitance (I/O to GND) VI/O = 0 V F = 1 MHz, VOSC = 30 mV 0.6 0.8 pF Cut-off frequency -3dB 8.7 Differential impedance tr = 200 ps (10 - 90%)(1), Z0 Diff = 100 Ω fC ZDiff 6 85 V 100 GHz 115 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. 2/11 DocID025560 Rev 1 Ω HSP061-4M10Y Characteristics Figure 2. Leakage current versus junction temperature (typical values) 10 Figure 3. Attenuation versus frequency 0 S21 (db) IR (nA) VR =VRM= 3V -1 1 -2 -3 0,1 -4 TJ(°C) 0,01 25 50 75 100 125 150 Figure 4. Differential impedance (Zdiff)(1) F (Hz) -5 100k 1M 10M 100M 1G 10G Figure 5. Eye diagram - HDMI mask at 3.4 Gbps per channel(1) 250 mV/div tr = 200 ps (10% - 90%) 12.5 Ω /div 50 ps/div 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. DocID025560 Rev 1 3/11 11 Characteristics HSP061-4M10Y Figure 6. ESD response to IEC 61000-4-2 (+8 kV Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) contact discharge) 20 V/div 20 V/div 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 112 V 1 27 V -16 V 2 20 V 3 2 -11 V 3 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns -119 V 1 20 ns/div 20 ns/div Figure 8. Response to ISO 7637-3 (pulse 3a) US Figure 9. Response to ISO 7637-3 (pulse 3b) US = -150 V = 100 V 5.00 V/div 5.00 V/div 50.0 ns/div 500 mA/div 50.0 ns/div 500 mA/div 50.0 ns/div 4/11 DocID025560 Rev 1 50.0 ns/div HSP061-4M10Y 2 Package information Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. µQFN-10L dimension definitions D R b1 5 12 0. 1 5 L E PIN 1 ID 6 10 b e A A1 Seating plane A2 Table 3. µQFN-10L dimension values Dimensions Ref Millimeters Inches Min Typ Max Min Typ Max A 0.40 0.48 0.50 0.018 0.019 0.020 A1 0.00 0.03 0.05 0.00 0.001 0.002 A2 0.13 0.005 b 0.15 0.20 0.30 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.041 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.9 1.00 1.10 0.035 0.039 0.043 e L 0.50 0.30 0.38 0.206 0.425 DocID025560 Rev 1 0.012 0.015 0.017 5/11 11 Package information HSP061-4M10Y Figure 11. Footprint recommendations (dimensions in mm) 0.40 Figure 12. Marking 0.50 0.20 0.58 H4Y 1.40 2.20 Figure 13. µQFN-10L tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 1.35 H4Y H4Y H4Y 8.00 3.5 2.75 1.75 0.25 4.0 0.55 All dimensions are typical values in mm 6/11 User direction of unreeling DocID025560 Rev 1 HSP061-4M10Y 3 Recommendation on PCB assembly Recommendation on PCB assembly Figure 14. Recommended stencil window position Copper Thickness: 100 µm Stencil window Footprint 10 µm 5 µm 10 µm 5 µm 380 µm 550 µm 15 µm 580 µm 550 µm 580 µm 15 µm 190 µm 15 µm 15 µm 400 µm 3.1 200 µm Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. DocID025560 Rev 1 7/11 11 Recommendation on PCB assembly 3.2 3.3 HSP061-4M10Y Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Figure 15. Printed circuit board layout recommendations 1 10 500 µm Via to Via to GND GND 5 Footprint pad 8/11 DocID025560 Rev 1 6 PCB tracks HSP061-4M10Y 3.4 Recommendation on PCB assembly Reflow profile Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID025560 Rev 1 9/11 11 Ordering information 4 HSP061-4M10Y Ordering information Figure 17. Ordering information scheme HSP 06 1 - 4 M10 Y High speed line protection Breakdown voltage Version Number of lines Package μQFN-10L Automotive Table 4. Ordering information 5 Order code Marking Package Weight Base qty Delivery mode HSP061-4M10Y H4Y µQFN-10L 3.27 mg 3000 Tape and reel Revision history Table 5. Document revision history 10/11 Date Revision 9-Dec-2013 1 Changes Initial release. DocID025560 Rev 1 HSP061-4M10Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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