S2X 040 PDIP600in MatteTin

Compliant with IEC 62474/ D9.00
Compliant to IEC 61249-2-21:2003
Termination Base Alloy:
Copper Alloy (Cu)
Semiconductor Device Type: P and PL
Basic Substance
Fused Silica
Metal Hydro Oxide
Epoxy Resin
Phenol Resin
SiO2
Carbon Black
Copper
Iron
Silver
Zinc
Phosphorous
Polyimide
Poly - ethylene – terephthalate
NBR
Bismaleimide
Phenol resin
Silver
Epoxy Resin
Diluent
Phenolic hardener
Amine type hardener
Dicyandiamide
Silicon
Copper
Palladium
Tin
JEDEC 97
Product Marking
and/or Pkg.
Labeling
e3
Package Homogeneous Materials
(S2X) 040 PDIP .600in Matte Tin
CAS Number
"Contained In"
Sub-Component
60676-86-0
Mold Compound
Trade Secret
Mold Compound
Trade Secret
Mold Compound
Trade Secret
Mold Compound
14808-60-7
Mold Compound
1333-86-4
Mold Compound
7440-50-8
Lead Frame Tape
7439-89-6
Lead Frame Tape
7440-22-4
Lead Frame Tape
7440-66-6
Lead Frame Tape
7723-14-0
Lead Frame Tape
25038-81-7
Lead Frame Tape
25038-59-9
Lead Frame Tape
9003-18-3
Lead Frame Tape
79922-55-7
Lead Frame Tape
453-20-5 / 9016-8
Lead Frame Tape
7440-22-4
Die Attach
9003-36-5
Die Attach
3101-60-8
Die Attach
Trade secret
Die Attach
827-43-0
Die Attach
461-58-5
Die Attach
7440-21-3
Chip (Die)
7440-50-8
Wire Bond palladium coated copper (CuPd)
7440-05-3
Wire Bond palladium coated copper (CuPd)
7440-31-5
Plating on external leads (pins) - Matte Tin / annealed at 150°C for 1 hour
TOTALS:
% Total
Weight
mg/part
ppm
57.132
8.729
5.555
5.555
1.984
0.397
9.984
0.246
0.199
0.013
0.009
0.215
0.190
0.035
0.030
0.030
0.550
0.110
0.055
0.022
0.011
0.002
7.500
0.197
0.004
1.250
100.000
3713.580
567.353
361.043
361.043
128.944
25.789
648.938
15.962
12.940
0.849
0.560
13.975
12.350
2.275
1.950
1.950
35.763
7.152
3.573
1.428
0.717
0.117
487.500
12.773
0.228
81.250
6,500.000
571,320
87,285
55,545
55,545
19,838
3,968
99,837
2,456
1,991
131
86
2,150
1,900
350
300
300
5,502
1,100
550
220
110
18
75,000
1,965
35
12,500
1,000,000
5157.75
Mold Compound
60676-86-0
Trade Secret
Trade Secret
Trade Secret
14808-60-7
1333-86-4
(mg) Total
Copper
Iron
Silver
Zinc
Phosphorous
Lead Frame
7440-50-8
32.50
48.75
6.5000 g Total Mass
7439-89-6
7440-22-4
7440-66-6
7723-14-0
Total
(mg) Total
Lead Frame Tape
Polyimide
25038-81-7
Poly - ethylene – terephthalate
25038-59-9
NBR
9003-18-3
Bismaleimide
79922-55-7
Phenol resin
28453-20-5 / 9016-83-5
Total
(mg) Total
Die Attach
Silver
7440-22-4
Epoxy Resin
9003-36-5
Diluent
3101-60-8
Phenolic hardener
Trade secret
Amine type hardener
827-43-0
Dicyandiamide
461-58-5
Total
487.50
If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology
Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if
any, is not below the threshold of regulatory concern for any regulatory scheme world-wide.
Total (mg)
Chip (Die)
Doped Silicon
7440-21-3
13.00
Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in
their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the
completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier
information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is
provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels
of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts.
Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product
warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s
quotations, sales order acknowledgement, and invoices.
0.5
0.75
7.5
100.00
100.00
Copper
7440-50-8
98.25
Palladium
7440-05-3
1.75
Tin
6,500.000
CuPd
% of Total Weight
Wire Bond
palladium coated
copper (CuPd)
(mg) Total
10.45
100.00
% of Total Weight
Total
81.25
79.35
0.24
(mg) Total
Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or
otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or
of this Certificate of Compliance for semiconductor products.
Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at
http://echa.europa.eu/web/guest/candidate-list-table
100.00
% of Total Weight
95.54
2.35
1.91
0.13
0.08
100.00
% of Total Weight
43.00
38.00
7.00
6.00
6.00
100.00
% of Total Weight
73.36
14.67
7.33
2.93
1.47
Total
Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at
http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/
The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and
certain “reels” may be made from PVC plastic.
% ot Total Weight
72.00
11.00
7.00
7.00
2.50
0.50
Total
679.25
This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March
2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero)
Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data.
(mg) Total
Fused Silica
Metal Hydro Oxide
Epoxy Resin
Phenol Resin
SiO2
Carbon Black
Plating on external
leads (pins) - Matte Tin /
annealed at 150°C for 1
hour
7440-31-5
Total
0.2
100.00
% of Total Weight
1.25
100.00
100.00
100.000
3:03 PM : 8/17/2015