Compliant with IEC 62474/ D9.00 Compliant to IEC 61249-2-21:2003 Termination Base Alloy: Copper Alloy (Cu) Semiconductor Device Type: Basic Substance Fused Silica Metal Hydro Oxide Epoxy Resin Phenol Resin SiO2 Carbon Black Copper Iron Silver Zinc Phosphorous Polyimide Poly - ethylene – terephthalate NBR Bismaleimide Phenol resin Silver Epoxy Resin Diluent Phenolic hardener Amine type hardener Dicyandiamide Silicon Copper Palladium Tin SP JEDEC 97 Product Marking and/or Pkg. Labeling e3 Package Homogeneous Materials (MDX) 028 SPDIP .300in Matte Tin CAS Number "Contained In" Sub-Component 60676-86-0 Mold Compound Trade Secret Mold Compound Trade Secret Mold Compound Trade Secret Mold Compound 14808-60-7 Mold Compound 1333-86-4 Mold Compound 7440-50-8 Lead Frame Tape 7439-89-6 Lead Frame Tape 7440-22-4 Lead Frame Tape 7440-66-6 Lead Frame Tape 7723-14-0 Lead Frame Tape 25038-81-7 Lead Frame Tape 25038-59-9 Lead Frame Tape 9003-18-3 Lead Frame Tape 79922-55-7 Lead Frame Tape 453-20-5 / 9016-8 Lead Frame Tape 7440-22-4 Die Attach 9003-36-5 Die Attach 3101-60-8 Die Attach Trade secret Die Attach 827-43-0 Die Attach 461-58-5 Die Attach 7440-21-3 Chip (Die) 7440-50-8 Wire Bond palladium coated copper (CuPd) 7440-05-3 Wire Bond palladium coated copper (CuPd) 7440-31-5 Plating on external leads (pins) - Matte Tin / annealed at 150°C for 1 hour TOTALS: % Total Weight mg/part ppm 57.132 8.729 5.555 5.555 1.984 0.397 9.984 0.246 0.199 0.013 0.009 0.215 0.190 0.035 0.030 0.030 0.550 0.110 0.055 0.022 0.011 0.002 7.500 0.197 0.004 1.250 100.000 1192.631 182.207 115.950 115.950 41.411 8.282 208.409 5.126 4.156 0.273 0.180 4.488 3.966 0.731 0.626 0.626 11.485 2.297 1.148 0.459 0.230 0.038 156.563 4.102 0.073 26.094 2,087.500 571,320 87,285 55,545 55,545 19,838 3,968 99,837 2,456 1,991 131 86 2,150 1,900 350 300 300 5,502 1,100 550 220 110 18 75,000 1,965 35 12,500 1,000,000 1656.43 Mold Compound 60676-86-0 Trade Secret Trade Secret Trade Secret 14808-60-7 1333-86-4 (mg) Total Copper Iron Silver Zinc Phosphorous Lead Frame 7440-50-8 10.44 15.66 2.0875 g Total Mass 7439-89-6 7440-22-4 7440-66-6 7723-14-0 Total (mg) Total Lead Frame Tape Polyimide 25038-81-7 Poly - ethylene – terephthalate 25038-59-9 NBR 9003-18-3 Bismaleimide 79922-55-7 Phenol resin 28453-20-5 / 9016-83-5 Total (mg) Total Die Attach Silver 7440-22-4 Epoxy Resin 9003-36-5 Diluent 3101-60-8 Phenolic hardener Trade secret Amine type hardener 827-43-0 Dicyandiamide 461-58-5 Total 156.56 If a chemical substance is absent from the list above, the chemical substance is NOT an intentional ingredient in the semiconductor device and, to the best of Microchip Technology Incorporated's knowledge and belief as of the date of this document, there is no credible reason to believe that the unavoidable impurity concentration of the chemical substance, if any, is not below the threshold of regulatory concern for any regulatory scheme world-wide. Total (mg) Chip (Die) Doped Silicon 7440-21-3 % ot Total Weight 100.00 % of Total Weight 95.54 2.35 1.91 0.13 0.08 100.00 % of Total Weight 43.00 38.00 7.00 6.00 6.00 100.00 % of Total Weight 73.36 14.67 7.33 2.93 1.47 % of Total Weight Copper 7440-50-8 98.25 Microchip Technology Incorporated does not provide any warranty, express or implied, with respect to the information provided in this declaration. The exclusive, limited product warranties provided by Microchip Technology Incorporated and its subsidiaries are contained in Microchip’s standard terms and conditions of sale. These are provided in Microchip’s quotations, sales order acknowledgement, and invoices. Palladium 7440-05-3 1.75 Assembled package referenced above is EU REACH compliant based on the latest SVHC candidate list of ECHA which can be found at http://echa.europa.eu/web/guest/candidate-list-table % of Total Weight Total 26.09 (mg) Total Tin 7.5 100.00 Microchip Technology Incorporated believes the information in this form concerning substances restricted by RoHS in Microchip Technology Incorporated’s semiconductor devices in their original packing materials is true and correct to the best of its knowledge and belief, as of the date listed in this form. Microchip Technology Incorporated cannot guarantee the completeness and accuracy of data in this form because it has been compiled based on the ranges provided in Material Safety Data Sheets provided by raw material suppliers. Supplier information is often protected from disclosure as trade secrets and some information may not have been provided by subcontract assemblers and raw material suppliers. Information is provided only as estimates of the average weight of these parts and the average weight of anticipated significant toxic metals components. These estimates do not include trace levels of dopants, metals, and non-metal materials contained within silicon devices (silicon IC) in the finished parts. Microchip disclaims any duty to notify users of updates or changes to Material Content Declarations and shall not be liable for any damages, direct or indirect, consequential or otherwise, suffered by users or third parties as a result of the users’ reliance on the information in Material Content Declarations (MCD) or independent third party test reports (SGS) or of this Certificate of Compliance for semiconductor products. 0.75 100.00 Wire Bond palladium coated copper (CuPd) 4.18 0.5 100.00 (mg) Total The protective “tubes” in which the specific product is shipped are made from polyvinyl chloride (PVC) plastic. “Window envelopes” used to hold the packing slip on the outer box and certain “reels” may be made from PVC plastic. 10.45 0.24 Total Molding compounds used by Microchip meet the UL94 V0 flammability standard for plastics. You can access the UL iQTM family of databases to obtain a test report at http://ul.com/global/eng/pages/offerings/industries/chemicals/plastics/ 79.35 72.00 11.00 7.00 7.00 2.50 0.50 Total 218.14 This semiconductor device and its homogenous materials comply with EU Directives: 2002/95/EC (27 January 2003) & Directive 2011/65/EU (08 June 2011) and 2015/863/EU (31 March 2015) and 2002/53/EC (End-of-Life Vehicles (ELV) without exemption (zero) Compliance with the above EU Directives has been verified via internal design controls, supplier declarations, and /or analytical test data. (mg) Total Fused Silica Metal Hydro Oxide Epoxy Resin Phenol Resin SiO2 Carbon Black Plating on external leads (pins) - Matte Tin / annealed at 150°C for 1 hour 7440-31-5 Total 0.2 100.00 % of Total Weight 1.25 100.00 100.00 2,087.500 CuPd 100.000 2:09 PM : 8/17/2015