RClamp0501T Datasheet

RClamp0501T
Low Capacitance
1-Line ESD protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed
data interfaces. This series has been specifically
designed to protect sensitive components which are
connected to high-speed data and transmission lines
from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT
(electrical fast transients).
‹ Transient protection for data lines to
ing in excess of 100MHz without signal attenuation.
They may be used to meet the ESD immunity requirements of IEC 61000-4-2.
Mechanical Characteristics
‹
‹
‹
‹
®
‹
The RClamp 0501T has a maximum capacitance of
only 1.5pF. This allows it to be used on circuits operat- ‹
‹
‹
The RClamp0501T is in a 2-pin SLP1006P2T package
‹
measuring 1.0 x 0.6 x 0.4mm. The leads are spaced
‹
at a pitch of 0.65mm and feature a lead-free finish.
‹
Each device will protect one high-speed line operating
at 5 volts. It gives the designer the flexibility to protect ‹
single lines in applications where arrays are not practical. The combination of small size, low capacitance,
and high ESD surge capability makes them ideal for
protection of high speed digital lines in cellular handsets and other portable electronic devices.
IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.4mm)
Protects one data or I/O line
Low capacitance: 1.5pF
Low clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
SLP1006P2T package
Molding compound flammability rating: UL 94V-0
Marking: Marking code
Packaging: Tape and Reel
Lead Finish: NiPdAu
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Applications
‹
‹
‹
‹
‹
‹
Dimensions
Cellular Handsets & Accessories
Multimedia Card Interfaces
Digital Signal Lines
SIM Ports
Keypads
SD Lines
Schematic & PIN Configuration
1.0
2
0.60
0.65
1
0.40
Maximum Dimensions (mm)
Revision 11/02/2010
SLP1006P2T (Bottom View)
1
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RClamp0501T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
150
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
10
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
+/- 25
+/- 20
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
9.7
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
0.100
μA
Clamping Voltage
VC
IPP = 3A, tp = 8/20μs
Pi n 2 to 1
12
V
Clamping Voltage
VC
IPP = 10A, tp = 8/20μs
Pi n 2 to 1
15
V
Forward Clamping Voltage
VF
IPP = 3A, tp = 8/20μs
Pi n 1 to 2
4
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
T = 25oC
0.6
1.5
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
T = 0 to +85oC
0.5
1.7
pF
© 2010 Semtech Corp.
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RClamp0501T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current
20
10
Clamping Voltage -VC (V)
Peak Pulse Power - P PP (kW)
18
1
0.1
16
14
12
10
8
6
Waveform
Parameters:
tr = 8µs
td = 20µs
4
2
0
0.01
0.1
1
10
0
100
2
4
Pulse Duration - tp (us)
8
10
12
Peak Pulse Current - IPP (A)
Normalized Capacitance vs. Reverse Voltage
Forward Voltage vs. Peak Pulse Current
10
2
9
1.8
8
1.6
7
1.4
Cj(VR) / Cj(VR=0V)
Forward Clamping Voltage (V)
6
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
2
1
1.2
1
0.8
0.6
0.4
0.2
f = 1 MHz
0
0
0
2
4
6
8
0
10
1
2
3
4
5
Reverse Voltage (VR)
Peak Pulse Current (A)
ESD Clamping
(8kV Contact per IEC 61000-4-2)
Insertion Loss S21
CH1 S21
LOG
6 dB / REF 0 dB
1: - 0.4325dB
800 MHz
5
0 dB
12
3
2: - 0.4268dB
900 MHz
4
3: - 0.5534dB
1.8 GHz
-6 dB
-12 dB
4: - 0.7752dB
2.5 GHz
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
Note: Data is taken with a 10x attenuator
© 2010 Semtech Corp.
1
MHz
START . 030 MHz
3
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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RClamp0501T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Equivalent Circuit Diagram
These low capacitance TVS diodes are designed to
provide common mode protection for one high-speed
line. The device is unidirectional and may be used on
lines where the signal polarity is positive.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2010 Semtech Corp.
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RClamp0501T
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2T
A
B
D
E
DIM
A
A1
b
D
E
e
L
R
N
aaa
bbb
TOP VIEW
A
SEATING
PLANE
aaa C
C
A1
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.015 .016 .017
.000 .001 .002
.018 .020 .022
.035 .039 .043
.020 .024 .028
.026 BSC
.008 .010 .012
.002 .004 .006
2
.003
.004
0.37 0.40 0.43
0.00 0.03 0.05
0.45 0.50 0.55
0.90 1.00 1.10
0.50 0.60 0.70
0.65 BSC
0.20 0.25 0.30
0.05 0.10 0.15
2
0.08
0.10
PIN 1 ID
R
bxN
bbb
C A B
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2T
DIMENSIONS
Y
(C)
DIM
C
G
X
Y
Z
Z
G
INCHES
(.033)
.012
.024
.022
.055
MILLIMETERS
(0.85)
0.30
0.60
0.55
1.40
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2010 Semtech Corp.
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RClamp0501T
PROTECTION PRODUCTS
Marking Code
Ordering Information
97
Part Number
Qty per
Reel
Reel
Size
RClamp 0501T.TN T
10,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
Notes:
1)Marking will also include line matrix date code
Carrier Tape Specification
Bo
Ao
Ko
Device Orientation in Tape
A0
0.70 +/-0.05 mm
B0
1.15 +/-0.05 mm
K0
0.55 +/-0.05 mm
97
97
97
97
97
Note: All dimensions in mm unless otherwise specified
Pin 2 Cathode Location
(Towards Sprocket Holes)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2010 Semtech Corp.
6
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