CDBV3-706F-HF

SMD Schottky Barrier Diode
CDBV3-706F-HF
Io = 30 mA
VR = 40 Volts
RoHS Device
Halogen Free
SOT-323
Features
0.087(2.20)
0.079(2.00)
- Small package
3
0.053(1.35)
- Low VF and Low IR
0.045(1.15)
- High reliability
1
2
0.055(1.40)
0.047(1.20)
Mechanical data
- Case: SOT-323, molded plastic.
0.006(0.15)
0.003(0.08)
- Terminals: Soldeable per MIL-STD-750,
method 2026.
- Mounting position: Any.
0.039(1.00)
0.096(2.45)
0.035(0.90)
0.085(2.15)
- Weight: 0.005 grams(approx.).
0.004(0.10)
0.000(0.00)
0.016(0.40)
0.018(0.46)
0.010(0.26)
0.008(0.20)
Circuit Diagram
3
1
Dimensions in inches and (millimeter)
2
Maximum Rating (at Ta=25°C unless otherwise noted)
Symbol
Value
Unit
Peak reverse voltage
VRM
45
V
DC reverse voltage
VR
40
V
Mean rectifying current
IO
30
mA
Non-repetitive peak forward surge
current @ t=8.3ms
IFSM
200
mA
Power dissipation
PD
200
mW
RΘJA
500
°C/W
Junction temperature range
Tj
-40 to +125
°C
Storage Temperature range
TSTG
-55 to +150
°C
Parameter
Thermal resistance from Junction to ambient
Electrical Characteristics (at Ta=25°C unless otherwise noded)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Forward voltage
IF = 1mA
VF
0.37
V
Reverse current
VR = 10V
IR
1
μA
Capacitance between terminals
VR = 1V, f=1MHz
CT
2
pF
Company reserves the right to improve product design , functions and reliability without notice.
REV:A
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Page 1
Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
RATING AND CHARACTERISTIC CURVES (CDBV3-706F-HF)
Fig.1 - Typical Forward Characteristics
Fig.2 - Typical Reverse Characteristics
100
Reverse Current, (μA)
Forward Current, (mA)
100
10
TA=100°C
TA=75°C
TA=50°C
TA=25°C
1
10
TA=100°C
TA=75°C
1
TA=50°C
0.1
TA=25°C
0.01
0
0
0
0.1
0.2
0.4
0.3
0.5
0.6
0.7
0
10
Forward Voltage, (V)
30
40
Reverse Voltage, (V)
Fig.3 - Typical Capacitance Characteristics
4
Fig.4 - Typical Power Derating Curve
0.30
O
TA=25 C
f=1MHz
Mounting on glass epoxy PCBs
0.25
Power Dissipation, (w)
Capacitance Between Terminals, (PF)
20
3
2
1
0.20
0.15
0.10
0.05
0
0
0
5
10
15
20
25
30
Reverse Voltage, (V)
0
25
50
75
100
125
Ambient Temperature, (°C)
Company reserves the right to improve product design , functions and reliability without notice.
REV:A
QW-JB064
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
Reel Taping Specification
P1
F
E
d
P0
W
B
3
XXX
1
2
C
A
P
12
o
0
D2
D1
D
W1
SOT-323
SOT-323
SYMBOL
A
B
C
d
D
D1
D2
(mm)
2.25 ± 0.05
2.55 ± 0.05
1.19 ± 0.05
1.55 ± 0.10
178 ± 2.00
54.40 ± 1.00
13.00 ± 1.00
(inch)
0.089 ± 0.002
0.100 ± 0.002
0.047 ± 0.002
0.061 ± 0.004
7.008 ± 0.079
2.142 ± 0.039
0.512 ± 0.039
SYMBOL
E
F
P
P0
P1
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.10
8.00 + 0.30 /–0.10
12.30 ± 1.00
(inch)
0.069 ± 0.004
0.138 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039
Company reserves the right to improve product design , functions and reliability without notice.
REV:A
QW-JB064
Page 3
Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
Marking Code
3
Part Number
Marking Code
CDBV3-706F-HF
3J
XXX
●
●
1
2
xxx = Product type marking code
Solid dot = Halogen free parts
Suggested PAD Layout
B
SOT-323
SIZE
(mm)
(inch)
A
0.80
0.031
B
0.50
0.020
C
1.30
0.051
D
2.20
0.087
A
D
C
Standard Packaging
REEL PACK
Case Type
SOT-323
REEL
Reel Size
( pcs )
(inch)
3,000
7
Company reserves the right to improve product design , functions and reliability without notice.
REV:A
QW-JB064
Page 4
Comchip Technology CO., LTD.
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