221AG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−220 FULLPACK, 2−LEAD
CASE 221AG
ISSUE B
DATE 27 AUG 2015
A
B
E
A
P
E/2
0.14
SCALE 1:1
SEATING
PLANE
M
B A
H1
M
A1
4
Q
D
C
NOTE 3
1 2 3
L
L1
3X
3X
c
b
b2
0.25
M
B A
M
C
A2
e
SIDE VIEW
e1
TOP VIEW
A
NOTE 6
NOTE 6
D
H1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH
AND GATE PROTRUSIONS. MOLD FLASH AND GATE
PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE
DIMENSIONS ARE TO BE MEASURED AT OUTERMOST
EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR
PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION
SHALL NOT EXCEED 2.00.
MILLIMETERS
DIM MIN
MAX
A
4.30
4.70
A1
2.50
2.90
A2
2.50
2.90
b
0.54
0.84
b2
1.10
1.40
c
0.49
0.79
D
14.22
15.88
E
9.65
10.67
e
2.54 BSC
e1
5.08 BSC
H1
6.40
6.90
L
12.70
14.73
L1
--2.80
P
3.00
3.40
Q
2.80
3.20
GENERIC
MARKING DIAGRAM*
D
XX
XXXXXXXXX
AWLYWWG
SECTION A−A
A
ALTERNATE
CONSTRUCTION
SECTION D−D
1
A
WL
Y
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
98AON52563E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
SemiconductorComponents
ComponentsIndustries,
Industries,LLC,
LLC,2000
2002
©© Semiconductor
October, DESCRIPTION:
2002
February,
2000 −
− Rev.
Rev. 009AA
http://onsemi.com
1
TO−220 FULLPACK, 2−LEAD 1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case
Case Outline
Outline Number:
Number:
PAGE 1221A−09
OFXXX
2
DOCUMENT NUMBER:
98AON52563E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
10 AUG 2010
A
CHANGED DIMENSION A2 MAX VALUE TO 2.90. REQ. BY D. TRUHITTE.
10 APR 2013
B
ADDED ALTERNATE CONSTRUCTION FOR TAB AREA. CHANGED H1 FROM
5.97 MIN & 6.48 MAX TO 6.4 MIN & 6.9 MAX. REQ. BT D. TRUHITTE.
27 AUG 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. B
Case Outline Number:
221AG
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