SMF05 and SMF12 TVS Diode Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description Features The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to four lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. Transient protection for data lines to Mechanical Characteristics EIAJ SC70-5L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel Applications Circuit Diagram 1 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Small package for use in portable electronics Protects four I/O lines Working voltage: 5V and 12V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 3 4 5 1 5 2 3 4 2 SC70-5L (Top View) Revision 01/22/08 1 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Ppk 200 Watts Peak Forward Voltage (IF = 1A, tp=8/20µs) VFP 1.5 V ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD 20 15 kV Lead Soldering Temperature TL 260 (10 seconds) o Operating Temperature TJ -55 to +125 o TSTG -55 to +150 o Storage Temperature C C C Electrical Characteristics SMF05 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbo l Co nditio ns Minimum Typical VRWM Maximum Units 5 V V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 10 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µ s 9.5 V Clamp ing Voltage VC IPP = 12A, tp = 8/20µ s 12.5 V Peak Pulse Current IP P tp = 8/20µ s 12 A Junction Cap acitance Cj Between I/O p ins and Ground VR = 0V, f = 1MHz 150 175 pF Symbo l Co nditio ns Typical Maximum Units 12 V 6 V SMF12 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Minimum VRWM V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µ s 19 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µ s 25 V Peak Pulse Current IP P tp = 8/20µ s 8 A Junction Cap acitance Cj Between I/O p ins and Ground VR = 0V, f = 1MHz 75 pF 2008 Semtech Corp. 2 13.3 V 60 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 75 100 125 150 o Pulse Waveform Clamping Voltage vs. Peak Pulse Current 30 110 90 80 70 Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs 100 Percent of IPP 50 Ambient Temperature - TA ( C) Pulse Duration - tp (µs) -t e 60 50 40 td = IPP/2 30 20 25 20 SMF12 15 SMF05 10 Waveform Parameters: tr = 8µs td = 20µs 5 10 0 0 0 5 10 15 20 25 0 30 2 4 6 8 10 12 14 Peak Pulse Current - IPP (A) Time (µs) SMF05 Insertion Loss S21 Capacitance vs. Reverse Voltage CH1 S21 160 LOG 6 dB / REF 0 dB Capacitance - Cj (pF) 140 120 100 SMF05 80 60 40 20 f = 1MHz 0 0 1 2 3 4 5 6 Reverse Voltage - VR (V) START . 030 MHz 2008 Semtech Corp. 3 STOP 3000. 000000 MHz www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Typical Characteristics (Continued) SMF05 ESD Clamping (8kV Contact per IEC 61000-4-2) 2008 Semtech Corp. SMF12 ESD Clamping (8kV Contact per IEC 61000-4-2) 4 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Applications Information SMF Circuit Diagram Device Connection for Protection of Four Data Lines The SMFxx is designed to protect up to four unidirectional data lines. The device is connected as follows: 1 3 4 5 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4, and 5 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. 2 Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the SMFxx near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the SMFxx and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Protection of Four Unidirectional Lines Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2008 Semtech Corp. 5 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Typical Applications 2008 Semtech Corp. 6 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Outline Drawing - SC70 5L A DIM e1 D H N EI ccc C 2X N/2 TIPS c GAGE PLANE 2X E/2 1 E 0.15 L (L1) 2 e DETAIL 01 A B D aaa C SEATING PLANE A2 A SEE DETAIL A A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .043 .000 .004 .028 .035 .039 .006 .012 .003 .009 .075 .079 .083 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 5 0° 8° .004 .004 .012 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.90 2.00 2.10 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 5 0° 8° 0.10 0.10 0.30 SIDE VIEW C A1 bxN bbb C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AA. Land Pattern - SC70 5L X DIM C G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P NOTES: 1. 2008 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 7 www.semtech.com SMF05 and SMF12 PROTECTION PRODUCTS Marking Codes Part Number Marking Code SMF05 F05 SMF12 F12 Ordering Information Part Number Lead Finish Qty per R eel R eel Size SMF05.TC SnPb 3,000 7 Inch SMF12.TC SnPb 3,000 7 Inch SMF05.TCT Pb free 3,000 7 Inch SMF12.TCT Pb free 3,000 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2008 Semtech Corp. 8 www.semtech.com