Piet De Pauw Melexis Opto Datacom March 31, 2009 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 150 Mbps FOT's Compatible with Leadfree SMD solder processes MLX75603 “Heaven” FOT MLX75605 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” Receiver “Heaven” pigtail for Receiver © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved SP4 Eye Mask checked over Complete Temperature range -40C to +95C OK © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved SP4 Eye Mask checked and over the complete Light Intensity Range OK SP4 Jitter spec checked the Complete Temperature range -40C to +95C OK © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Spec SP4: max jitter is 230 ps RMS “Heaven” Transmitter (RC)LED MLX75604 “Heaven” FOT MLX75605 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” pigtail for Transmitter Issue 1: Peaking in order to reduce rise time Issue 2: Increase drive current with temperature MLX75605AA Optical power over temperature into 1mm PMMA SI POF 0 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 -1 Optical power (dB) -2 -3 -4 -5 -6 -7 Trimmed optical power Untrimmed optical power -8 Temperature (degC) 80 90 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Driving (RC)LEDs 100 Transmitter SP2 Overshoot Mask Rise time: min 1.0ns max: 1.4ns MOST specification: 0.5UI=3.391ns/2=1.6955ns in the worst case (48kHz frame speed) © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved OK Transmitter SP2 Undershoot Mask Fall time: min 0.7ns max: 1.6ns MOST specification: 0.5UI=3.391ns/2=1.6955ns in the worst case (48kHz frame speed) © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved OK Transmitter SP2 Eye Mask Time base: 424ps/div Transmitter eye diagram obtained with MOST worst case pattern © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved OK OK Spec Requirement: Extinction Ratio min 10 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Transmitter Extinction Ratio OK © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Transmitter Jitter Spec SP2: max jitter is 112 ps RMS © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Transmitter -3 dB function “Heaven” FOT MLX75605 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” Package Use of SMD package for FOTs results in reduced cost of ownership, since the following steps can be omitted: - Manual insertion of the FOT - Separate wave soldering step for soldering the FOTs. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Why is a surface mountable FOT important? Picking and Placing the “Heaven” Package This allows the device to be handled by the vacuum pick-up head of standard automated pick & place SMD machines. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Flat surface area on top has a length larger than 6 mm. Leadfree Reflow Soldering the “Heaven” Package Moisture Sensitivity Level: Already demonstrated: MSL3 (84 devices in test, no fails) Planned tests: MSL2a and MSL2 10 to 30 s 245 °C <3 °C/s 217 °C 200 °C <6 °C/s 60 to 150 s 150 °C 60 to 180 s <8 min © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MLX75605 withstands lead free SMD assembly processes according IPC/JEDEC J-STD020B i.e. withstands 245 oC +0 oC/-5 oC during at least 30 sec In order to protect devices during the soldering process, devices are delivered with a kapton tape on the top. Kapton tape can be easily removed before ferrule insertion. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Leadfree Reflow Soldering the “Heaven” Package Material TCE below Tg (for epoxies) Silicon 2.6 ppm/C Cu Leadframe 16.5 ppm/C Pure epoxy without filler 64 to 67 ppm/C (*) Black Epoxy (standard amount of filler) Depending on the molding compound: alfa1 = 7 to 20 ppm/C Clear Epoxy with micron size glass filler 52 ppm/C (30% filler) (**) 43 ppm/C (50% filler) (**) 35 ppm/C (70% filler) (**) Clear Epoxy with nanopartcles filler 58 ppm/C (20% filler) 52 ppm/C (30% filler =max) (*) http://www1.nitto.co.jp/nt/EN/tech/en_300table.html (**) http://home.jeita.or.jp/ecb/material/No021.pdf © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved TCEs (Temperature Coefficient of Expansion) relevant for Pacakges Shear Stress in bond area in clear molding compounds is about an order of magnitude larger than in black molding compounds TCE mismatch between: • • Shear stress (arbitrary units) 60000 50000 40000 Typical Clear Molding Compound 30000 Typical Black Molding Compound 20000 10000 leadframe and molding compound Silicon die and molding compound gives rise to shear forces. When shear force exceeds adhesion force between molding compound and silicon or leadframe, delamnination occurs. Delamination results in wirebond breakage during temperature cycling. 0 1 2 3 4 5 6 7 8 9 10 11 Distance from center of package body (arbitrary units) Shear force increases with third power from center of package body. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Difference in Shear Stress in bond area within Package Connecting the “Heaven” Package Sideview “Heaven Pigtail” in GOF Integrated ferrule clamp Fiber Optic Transceiver (FOT) in 24 pin SOIC © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Standard MOST 2+x (x= 4, 12, 20,…) connector Connecting the “Heaven” Package Topview Standard MOST 2+x (x= 4, 12, 20,…) connector Fiber Optic Transceiver (FOT) in 24 pin SOIC © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven Pigtail” Pigtail connecting FOT and MOST connector Connecting the “Heaven” Package 2+x Connector (x= 4, 12, 20,…) and “Heaven” Pigtails © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” Pigtail Pigtail connecting FOT and MOST connector “Heaven” Pigtail Pull-out Force Performance Measurement data For clamp part with thickness 0.3 mm: 13.5N 12.3N 15.6N 13.0N 15.0N 12.8N Average = 13.7N +/- 1.3N © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Spec pigtail pull-out force: 7N to 20N Pigtail height same as connector height Standard MOST 2+x (x= 4, 12, 20,…) connector Height 12.8 mm to 14.1. mm Total height using GOF 13 mm GOF: 5 mm FOT: 8 mm © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven Pigtail” in GOF © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Multicore Glas Optical Fiber (GOF) 00050D Multicore Glas Optical Fiber (GOF) Fiber Core Fiber Cladding Fiber Bundle Fiber bundle diameter Numerical Aperture Attenuation at 650 nm Temperature Range Minimal Bending Radius Ø 53 ± 4 µm 3 µm 380 fibers Ø1 mm 0,5 < 0,25 dB/m - 40°°C bis +125°°C 5 mm Fiber Cladding ε Critcical Angle Fiber Core © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Technical Data: Wavelength (nm) GOF 0,60 0,40 0,20 0,00 POF © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 900 880 860 840 820 800 780 760 740 720 700 680 660 640 620 600 580 560 540 520 500 Attenuation (dB/m) 00051D Attenuation GOF versus POF 1,20 1,00 0,80 Coupling to GOF Pigtails The Optical coupling loss for in line connections in MOST includes: Coupling loss due to reflection of light at the fiber end surfaces (in- and outcoupling) Coupling loss due to axial misalignment Coupling loss due to lateral misalignment ~0.5dB additional coupling loss 0.0dB additional coupling loss By coupling light from a monocore-POF into a multicore-GOF power which is emitted on the optical cladding of each single fiber is absorbed. This adds an additional coupling loss of 0.5dB. Despite this 0.5 dB coupling loss into GOF, pigtail loss including this coupling loss, is limited to max 1.5 dB, which is within the requirements for MOST. By coupling light from a multicore-GOF into a monocore-POF the complete transmitted power is coupled into the monocore fiber. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Signal direction “Heaven” Pigtails Hence, in development: Dedicated “heaven” ferrule for “heaven” pigtail. Dedicated 2+x connectors for GOF “heaven” pigtails Conclusion: SOIC FOT’s will be used GOF pigtails the new standard for “Heaven” Pigtails? © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” pigtails in GOF meet performance requirements, and seem to be close to meet cost requirements. Optische Gehäuse 2x1-polig a K o m b Optische Gehäuse 2x1-polig Sender/Empfänger für POF t io n Sender/Empfänger für GOF F O G i n / PO F Kappe Stiftwanne © 2008, KOSTAL Kontakt Systeme GmbH. Inhalt und Darstellung sind weltweit geschützt. Vervielfältigung, Weitergabe oder Verwertung ist ohne Zustimmung auch auszugsweise verboten. Alle Rechte - inkl. Schutzrechtsanmeldungen - sind vorbehalten. 00054D GOF / POF - Kombinierbarkeit 00055D POF GOF Faserendhülse Ferrule Optisches Gehäuse 1-polig ( Empfänger ) für POF Optisches Gehäuse 1-polig ( Empfänger ) für GOF Inline - Koppler Optisches Gehäuse 1-polig ( Sender ) für POF Ferrule Optisches Gehäuse 1-polig POF ( Sender ) für GOF Faserendhülse GOF Wellrohr (optional) © 2008, KOSTAL Kontakt Systeme GmbH. Inhalt und Darstellung sind weltweit geschützt. Vervielfältigung, Weitergabe oder Verwertung ist ohne Zustimmung auch auszugsweise verboten. Alle Rechte - inkl. Schutzrechtsanmeldungen - sind vorbehalten. Inline - Koppler Qualification of the “Heaven” Package • Release of Standard: MOST Physical Layer Basic Specification Rev1.0 • Final silicon for RX and TX: • End evaluation of RX and TX: • Conformance testing specs Date October 2008 March 2009 May 2009 To be defined Qualification • Release of Standard: Automotive Application Recommendation for optical MOST Components, Surface Mount Device (SMD): To be defined • Start of Qualification Tests: May 2009 • End of Qualification tests: December 2009 • Apply for "Automotive Application Recommendation for optical MOST Components, Surface Mount Device (SMD)": December 2009 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Conformance to 150 MOST Standard Devices fully optically activated during High Temperature Operating Lifetest Two SOIC devices connected top to top © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved SMD Parts Ready for High Temperature Lifetests © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved SMD High Temperature Lifetest Set-up Now FOT + INIC150 FOT integrated with INIC150 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” Roadmap Later Use of SMD package for FOTs results in reduced cost of ownership, since the following steps can be omitted: - Manual insertion of the FOT - Separate wave soldering step for soldering the FOTs. Melexis packaging technology for Fiber Optic Transceivers demonstrated to withstand leadfree SMD processes. GOF pigtails, the new standard for “heaven” pigtails? 150 Mbps MOST Fiber Optic Transceivers in SMD Package ready for Conformance Testing and Qualification start. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Heaven” Conclusions Piet De Pauw, Business Unit Opto Datacom, [email protected] Tel +32 57 226147, gsm +32 485 556208 Melexis Contact persons for support in Japan: David Poole, E-mail: [email protected], +81 90 4226 9543 Yuji Ohkawa: E-mail: [email protected], +81 90 1761 0501 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Thank You