20131030153643463Ls8E

MPTS Series
Polymeric PTC
Feature and Applications
UL E223037
•
ROHS Compliant & Halogen Free
•
Excellent for high density applications
•
Surface Mount, 0805, 1206, 1210, 1812, 2920
•
Faster time to trip than standard SMD devices
•
Lower resistance than standard SMD devices
•
Operation Current: 0.05A ~ 3.0A
•
Maximum Voltage: 6V ~ 60V
•
Temperature Range: -40ºC to 85ºC
MPTS
0805
L
10
Meritek Series
0805
1206
Size
1210
1812
2920
Current rating
Rev.7
MPTS Series
Polymeric PTC
Electrical Characteristics (23ºC)
MPTS0805
Part
Number
MPTS0805L010
MPTS0805L020
MPTS0805L035
MPTS0805L050R
MPTS0805L075R
MPTS0805L100R
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
IH, A
0.10
0.20
0.35
0.50
0.75
1.00
IT, A
0.30
0.50
0.75
1.00
1.50
1.95
VMAX, Vdc
15
9
6
6
6
6
IMAX, A
100
100
100
100
40
40
Pd, W
0.5
0.5
0.5
0.5
0.6
0.6
Max Time to Trip
Current
Amp
0.50
8.00
8.00
8.00
8.00
8.00
Time
Sec
1.50
0.02
0.10
0.10
0.20
0.30
Resistance
RMIN
Ω
0.700
0.400
0.250
0.150
0.090
0.060
R1MAX
Ω
6.000
3.500
1.200
0.850
0.350
0.210
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Product Dimensions (Millimeters)
MPTS0805
Part
Number
MPTS0805L010
MPTS0805L020
MPTS0805L035
MPTS0805L050R
MPTS0805L075R
MPTS0805L100R
A
Min
2.00
2.00
2.00
2.00
2.00
2.00
B
Max
2.30
2.30
2.30
2.30
2.30
2.30
Min
1.20
1.20
1.20
1.20
1.20
1.20
C
Max
1.50
1.50
1.50
1.50
1.50
1.50
Min
0.55
0.55
0.45
0.55
0.55
0.75
D
Max
1.00
1.00
0.75
1.25
1.25
1.80
Min
0.20
0.20
0.20
0.20
0.20
0.20
E
Max
0.60
0.60
0.60
0.60
0.60
0.60
Min
0.10
0.10
0.10
0.10
0.10
0.10
Max
0.45
0.45
0.45
0.45
0.45
0.45
Rev.7
MPTS Series
Polymeric PTC
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
A
B
C
D E
F
100
10
Time-to-trip (S)
A =MPTS0805L010
B =MPTS0805L020
C =MPTS0805L035
D =MPTS0805L050R
E =MPTS0805L075R
F =MPTS0805L100R
1
0.1
0.01
0.1
1
10
Fault current (A)
Rev.7
MPTS Series
Polymeric PTC
The dimension in the table below provides the recommended pad layout for each MPTS0805 device
Pad dimensions (millimeters)
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Device
A
Nominal
B
Nominal
C
Nominal
All 0805 Series
1.20
1.00
1.50
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25 ℃ to Peak Temperature :
20-40 seconds
6 ℃/second max.
8 minutes max.
Solder reflow
•
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
•
Recommended max solder paste
thickness > 0.25mm.
•
Devices can be cleaned using standard
methods and aqueous solvent.
•
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
•
Storage Environment : < 30ºC / 60%RH
Caution:
•
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
•
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Polymeric PTC
MPTS Series
Electrical Characteristics (23º)
MPTS1206
Part
Number
MPTS1206L005
MPTS1206L010
MPTS1206L012
MPTS1206L016
MPTS1206L020
MPTS1206L025
MPTS1206L035
MPTS1206L050
MPTS1206L050-24R
MPTS1206L075R
MPTS1206L075-16R
MPTS1206L100R
MPTS1206L110R
MPTS1206L150R
MPTS1206L200R
Max Time to Trip
Resistance
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
Current
Time
RMIN
R1MAX
IH, A
0.05
0.10
0.12
0.16
0.20
0.25
0.35
0.50
0.50
0.75
0.75
1.00
1.10
1.50
2.00
IT, A
0.15
0.25
0.39
0.45
0.40
0.50
0.75
1.00
1.00
1.50
1.50
1.80
2.20
3.00
3.50
VMAX, Vdc
60
60
48
48
30
16
16
8
24
6
16
6
6
6
6
IMAX, A
10
10
10
10
10
40
40
40
100
100
100
100
100
100
100
Pd, W
0.4
0.4
0.6
0.6
0.4
0.6
0.4
0.4
0.6
0.6
0.6
0.6
0.8
0.8
0.8
Amp
0.25
0.50
1.00
1.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
Sec
1.50
1.00
0.20
0.30
0.10
0.08
0.10
0.10
0.10
0.20
0.20
0.30
0.30
1.00
1.50
Ω
3.60
1.60
1.40
1.10
0.600
0.550
0.300
0.150
0.150
0.090
0.090
0.055
0.040
0.030
0.018
Ω
50.00
15.00
6.50
5.00
2.500
2.300
1.200
0.700
0.750
0.290
0.290
0.210
0.180
0.120
0.080
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Rev.7
MPTS Series
Polymeric PTC
Product Dimensions (Millimeters)
MPTS1206
Part
Number
MPTS1206L005
MPTS1206L010
MPTS1206L012
MPTS1206L016
MPTS1206L020
MPTS1206L025
MPTS1206L035
MPTS1206L050
MPTS1206L050-24R
MPTS1206L075R
MPTS1206L075-16R
MPTS1206L100R
MPTS1206L110R
MPTS1206L150R
MPTS1206L200R
A
Min
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
B
Max
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
3.50
Min
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
C
Max
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
Min
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.25
0.90
0.45
0.45
0.45
0.45
0.80
0.85
D
Max
0.85
0.85
0.85
0.75
0.75
0.75
0.75
0.55
1.30
1.25
1.25
1.00
1.00
1.40
1.60
Min
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.25
0.25
0.25
0.25
0.25
0.25
0.25
E
Max
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
Min
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Max
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Rev.7
MPTS Series
Polymeric PTC
Thermal Derating Curve
Typical Time-To-Trip at 23º
A B C DE F G
H I J KL
100
Time-to-trip (S)
Z= MPTS1206L005
A= MPTS1206L010
B= MPTS1206L012
C= MPTS1206L016
D= MPTS1206L020
E= MPTS1206L025
F= MPTS1206L035
G= MPTS1206L050
MPTS1206L050-24R
H= MPTS1206L075R
MPTS1206L075-16R
I= MPTS1206L100R
J= MPTS1206L110R
K= MPTS1206L150R
L= MPTS1206L200R
10
1
0.1
0.01
0.1
1
10
100
Fault current (A)
Rev.7
MPTS Series
Polymeric PTC
The dimension in the table below provides the recommended pad layout for each MPTS1206 device
Pad dimensions (millimeters)
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Device
A
Nominal
B
Nominal
All 1206 Series
2.00
1.00
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25 ℃ to Peak Temperature :
20-40 seconds
6 ℃/second max.
8 minutes max.
C
Nominal
1.90
Solder reflow
•
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
•
Recommended max solder paste
thickness > 0.25mm.
•
Devices can be cleaned using standard
methods and aqueous solvent.
•
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
•
Storage Environment : < 30ºC / 60%RH
Caution:
•
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
•
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Polymeric PTC
MPTS Series
Electrical Characteristics (23º)
MPTS1210
Part
Number
MPTS1210L005
MPTS1210L010
MPTS1210L020
MPTS1210L035
MPTS1210L050
MPTS1210L075
MPTS1210L110R
MPTS1210L150R
MPTS1210L175R
MPTS1210L200R
Max Time to Trip
Resistance
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
Current
Time
RMIN
R1MAX
IH, A
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
1.75
2.00
IT, A
0.15
0.25
0.40
0.70
1.00
1.50
2.20
3.00
4.00
4.00
VMAX, Vdc
60
60
30
16
16
8
6
6
6
6
IMAX, A
10
10
10
40
40
40
100
100
100
100
Pd, W
0.60
0.60
0.60
0.60
0.60
0.60
0.80
0.80
0.80
0.80
Amp
0.25
0.50
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
Sec
3.00
1.50
0.02
0.20
0.10
0.10
0.30
0.50
0.60
1.00
Ω
3.600
1.600
0.800
0.320
0.250
0.130
0.060
0.040
0.020
0.015
Ω
50.000
15.000
5.000
1.300
0.900
0.400
0.210
0.110
0.080
0.070
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Rev.7
Polymeric PTC
MPTS Series
Product Dimensions (Millimeters)
MPTS1210
Part
Number
MPTS1210L005
MPTS1210L010
MPTS1210L020
MPTS1210L035
MPTS1210L050
MPTS1210L075
MPTS1210L110R
MPTS1210L150R
MPTS1210L175R
MPTS1210L200R
A
Min
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
B
Max
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
Min
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
C
Max
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
Min
0.60
0.60
0.40
0.40
0.30
0.30
0.60
0.50
0.80
0.80
D
Max
1.15
1.15
0.85
0.80
0.75
0.70
1.00
0.90
1.40
1.40
Min
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
E
Max
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
0.75
Min
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Max
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Rev.7
MPTS Series
Polymeric PTC
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
B
C
D
E FG
H
IJ
100
10
Time-to-trip (S)
A =MPTS1210L005
B =MPTS1210L010
C =MPTS1210L020
D =MPTS1210L035
E =MPTS1210L050
F =MPTS1210L075
G =MPTS1210L110R
H =MPTS1210L150R
I= MPTS1210L175R
J =MPTS1210L200R
1
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
Rev.7
MPTS Series
Polymeric PTC
The dimension in the table below provides the recommended pad layout for each MPTS1210 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
All 1210 Series
2.00
1.00
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25 ℃ to Peak Temperature :
20-40 seconds
6 ℃/second max.
8 minutes max.
C
Nominal
2.80
Solder reflow
•
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
•
Recommended max solder paste
thickness > 0.25mm.
•
Devices can be cleaned using standard
methods and aqueous solvent.
•
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
•
Storage Environment : < 30ºC / 60%RH
Caution:
•
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
•
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
MPTS Series
Polymeric PTC
Electrical Characteristics (23º)
MPTS1812
Part
Number
MPTS1812L010
MPTS1812L014
MPTS1812L020
MPTS1812L035
MPTS1812L050
MPTS1812L075
MPTS1812L075-24R
MPTS1812L075-33R
MPTS1812L110
MPTS1812L110-16
MPTS1812L110-24R
MPTS1812L125
MPTS1812L150
MPTS1812L150-12R
MPTS1812L150-24R
MPTS1812L160
MPTS1812L160-12R
MPTS1812L160-16R
MPTS1812L200R
MPTS1812L260R
MPTS1812L260-13R
MPTS1812L260-16R
MPTS1812L300R
Hold
Trip
Current Current
Max Time to Trip
Resistance
Rated
Voltage
Max
Current
Typical
Power
Current
Time
RMIN
R1MAX
IH, A
IT, A
VMAX, Vdc
IMAX, A
Pd, W
Amp
Sec
Ω
Ω
0.10
0.14
0.20
0.35
0.50
0.75
0.75
0.75
1.10
1.10
1.10
1.25
1.50
1.50
1.50
1.60
1.60
1.60
2.00
2.60
2.60
2.60
3.00
0.30
0.30
0.40
0.70
1.00
1.50
1.50
1.50
2.20
2.20
2.20
2.50
3.00
3.00
3.00
3.20
3.20
3.20
3.50
5.00
5.00
5.00
5.00
60
60
30
16
16
16
24
33
8
16
24
6
8
12
24
8
12
16
8
6
13.2
16
6
10
10
10
40
40
40
40
40
100
100
100
40
100
100
100
100
100
100
100
100
100
100
100
0.8
0.8
0.8
0.8
0.8
0.8
1.0
1.0
0.8
0.8
1.0
0.8
0.8
1.0
1.0
0.8
1.0
1.0
1.0
1.0
1.3
1.3
1.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
0.020
0.008
0.020
0.100
0.150
0.200
0.200
0.200
0.300
0.500
0.500
0.400
0.500
0.500
1.500
0.500
1.000
1.000
2.000
2.500
5.000
5.000
4.000
1.600
1.200
0.800
0.320
0.150
0.110
0.110
0.110
0.040
0.040
0.060
0.050
0.040
0.040
0.040
0.030
0.030
0.030
0.020
0.015
0.015
0.015
0.012
15.00
6.500
5.000
1.500
1.000
0.450
0.290
0.400
0.210
0.180
0.200
0.140
0.110
0.110
0.120
0.100
0.100
0.100
0.070
0.047
0.050
0.050
0.040
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Rev.7
Polymeric PTC
MPTS Series
Product Dimensions (Millimeters)
MPTS1812
Part
Number
A
B
C
D
E
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
MPTS1812L010
4.37
4.73
3.07
3.41
0.60
0.90
0.30
0.95
0.25
0.65
MPTS1812L014
4.37
4.73
3.07
3.41
0.60
0.90
0.30
0.95
0.25
0.65
MPTS1812L020
4.37
4.73
3.07
3.41
0.60
0.90
0.30
0.95
0.25
0.65
MPTS1812L035
4.37
4.73
3.07
3.41
0.40
0.70
0.30
0.95
0.25
0.65
MPTS1812L050
4.37
4.73
3.07
3.41
0.35
0.65
0.30
0.95
0.25
0.65
MPTS1812L075
4.37
4.73
3.07
3.41
0.35
0.65
0.30
0.95
0.25
0.65
MPTS1812L075-24R
4.37
4.73
3.07
3.41
0.80
1.55
0.25
0.95
0.25
0.65
MPTS1812L075-33R
4.37
4.73
3.07
3.41
0.80
1.55
0.25
0.95
0.25
0.65
MPTS1812L110
4.37
4.73
3.07
3.41
0.25
0.55
0.30
0.95
0.25
0.65
MPTS1812L110-16
4.37
4.73
3.07
3.41
0.25
0.90
0.30
0.95
0.25
0.65
MPTS1812L110-24R
4.37
4.73
3.07
3.41
0.80
1.30
0.25
0.95
0.25
0.65
MPTS1812L125
4.37
4.73
3.07
3.41
0.25
0.55
0.30
0.95
0.25
0.65
MPTS1812L150
4.37
4.73
3.07
3.41
0.25
0.55
0.30
0.95
0.25
0.65
MPTS1812L150-12R
4.37
4.73
3.07
3.41
0.60
1.10
0.25
0.95
0.25
0.65
MPTS1812L150-24R
4.37
4.73
3.07
3.41
0.60
1.55
0.25
0.95
0.25
0.65
MPTS1812L160
4.37
4.73
3.07
3.41
0.25
0.90
0.30
0.95
0.25
0.65
MPTS1812L160-12R
4.37
4.73
3.07
3.41
0.60
1.35
0.25
0.95
0.25
0.65
MPTS1812L160-16R
4.37
4.73
3.07
3.41
0.60
1.35
0.25
0.95
0.25
0.65
MPTS1812L200R
4.37
4.73
3.07
3.41
0.55
1.20
0.25
0.95
0.25
0.65
MPTS1812L260R
4.37
4.73
3.07
3.41
0.55
1.20
0.25
0.95
0.25
0.65
MPTS1812L260-13R
4.37
4.73
3.07
3.41
0.80
1.55
0.25
0.95
0.25
0.65
MPTS1812L260-16R
4.37
4.73
3.07
3.41
0.80
1.55
0.25
0.95
0.25
0.65
MPTS1812L300R
4.37
4.73
3.07
3.41
0.80
1.55
0.25
0.95
0.25
0.65
Rev.7
MPTS Series
Polymeric PTC
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
AB C
100
D E F GHI J KL
M
10
Time-to-trip (S)
A = MPTS1812L010
B = MPTS1812L014
C = MPTS1812L020
D = MPTS1812L035
E = MPTS1812L050
F = MPTS1812L075
MPTS1812L075-24R
MPTS1812L075-33R
G = MPTS1812L110
MPTS1812L110-16
MPTS1812L110-24R
H = MPTS1812L125
I = MPTS1812L150
MPTS1812L150-12R
MPTS1812L150-24R
J = MPTS1812L160
MPTS1812L160-12R
MPTS1812L160-16R
K = MPTS1812L200R
L = MPTS1812L260R
MPTS1812L260-13R
MPTS1812L260-16R
M = MPTS1812L300R
1
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
Rev.7
MPTS Series
Polymeric PTC
The dimension in the table below provides the recommended pad layout for each MPTS1812 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
All 1812 Series
3.45
1.78
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25 ℃ to Peak Temperature :
20-40 seconds
6 ℃/second max.
8 minutes max.
C
Nominal
3.50
Solder reflow
•
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
•
Recommended max solder paste
thickness > 0.25mm.
•
Devices can be cleaned using standard
methods and aqueous solvent.
•
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
•
Storage Environment : < 30ºC / 60%RH
Caution:
•
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
•
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
Polymeric PTC
MPTS Series
Electrical Characteristics (23ºC)
MPTS2920
Part
Number
MPTS2920L030
MPTS2920L050
MPTS2920L075
MPTS2920L100
MPTS2920L125
MPTS2920L150
MPTS2920L185
MPTS2920L200
MPTS2920L250
MPTS2920L260
MPTS2920L300
Hold
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
IH, A
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
3.00
IT, A
0.60
1.00
1.50
2.20
2.50
3.00
3.70
4.00
5.00
5.20
5.20
VMAX,Vdc
60
60
33
33
33
33
33
16
16
6
6
IMAX, A
10
10
40
40
40
40
40
40
40
40
40
Pd, W
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
Max Time to Trip
Current
A
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Time
Sec
3.0
4.0
0.3
0.5
2.0
2.0
2.5
4.5
16.0
20.0
25.0
Resistance
RMIN
Ω
1.000
0.300
0.180
0.090
0.050
0.050
0.040
0.035
0.025
0.020
0.010
R1MAX
Ω
4.800
1.400
1.000
0.410
0.250
0.230
0.150
0.120
0.085
0.075
0.048
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air
environment.
RMIN=Minimum device resistance at 23ºC prior to tripping.
R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Rev.7
MPTS Series
Polymeric PTC
Product Dimensions (Millimeters)
MPTS2920
Part
Number
MPTS2920L030
MPTS2920L050
MPTS2920L075
MPTS2920L100
MPTS2920L125
MPTS2920L150
MPTS2920L185
MPTS2920L200
MPTS2920L250
MPTS2920L260
MPTS2920L300
A
Min
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
B
Max
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
Min
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
C
Max
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
Min
0.60
0.60
0.40
0.40
0.40
0.40
0.30
0.30
0.30
0.30
0.40
D
Max
1.15
1.15
1.15
1.00
0.90
0.90
0.90
0.90
0.90
0.90
0.90
Min
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
E
Max
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
Min
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
Max
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
Rev.7
MPTS Series
Polymeric PTC
Thermal Derating Curve
Typical Time-To-Trip at 23ºC
A
B
C
D
EFGHIJK
100
10
Time-to-trip (S)
A = MPTS2920L030
B = MPTS2920L050
C = MPTS2920L075
D = MPTS2920L100
E = MPTS2920L125
F = MPTS2920L150
G = MPTS2920L185
H = MPTS2920L200
I = MPTS2920L250
J = MPTS2920L260
K= MPTS2920L300
1
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
Rev.7
MPTS Series
Polymeric PTC
The dimension in the table below provides the recommended pad layout for each MPTS2920 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
All 2920 Series
5.10
2.30
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Pb-Free Assembly
3 ℃/second max.
150 ℃
200 ℃
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Time 25 ℃ to Peak Temperature :
20-40 seconds
6 ℃/second max.
8 minutes max.
C
Nominal
5.60
Solder reflow
•
Due to “Lead Free” nature, Temperature
and Dwell time for the soldering zone is
higher than those for Non-compliant
parts. This may cause damage to other
components.
•
Recommended max solder paste
thickness > 0.25mm.
•
Devices can be cleaned using standard
methods and aqueous solvent.
•
Rework should utilize standard industry
practices. Theses changes should apply
to all notes for each case size.
•
Storage Environment : < 30ºC / 60%RH
Caution:
•
If reflow temperatures exceed the
recommended profile, devices may not
meet the performance requirements.
•
Devices are not designed to be wave
soldered to the bottom side of the board.
Rev.7
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