CSD16321Q5C

CSD16321Q5C
www.ti.com
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
DualCool™ N-Channel NexFET™ Power MOSFETs
Check for Samples: CSD16321Q5C
FEATURES
1
•
•
•
•
•
•
•
•
2
PRODUCT SUMMARY
DualCool™ Package SON 5×6mm
Optimized for Two Sided Cooling
Optimized for 5V Gate Drive
Ultralow Qg and Qgd
Low Thermal Resistance
Avalanche Rated
Pb Free Terminal Plating
RoHS Compliant and Halogen Free
VDS
Drain to Source Voltage
25
V
Qg
Gate Charge Total (4.5V)
14
nC
Qgd
Gate Charge Gate to Drain
RDS(on)
VGS(th)
•
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications
and optimized for 5V gate drive applications.
Drain
Gate
Source
Top View
D
D
D
D
Bottom View
D
D
D
2.1
mΩ
VGS = 8V
1.9
mΩ
Threshold Voltage
1.1
S
V
Package
Media
CSD16321Q5C
SON 5×6-mm Plastic
Package
13-Inch
Reel
Qty
Ship
2500
Tape and
Reel
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
VDS
Drain to Source Voltage
25
V
VGS
Gate to Source Voltage
+10 / –8
V
Continuous Drain Current, TC = 25°C
100
A
Continuous Drain Current(1)
31
A
IDM
Pulsed Drain Current, TA = 25°C(2)
200
A
PD
Power Dissipation(1)
3.1
W
TJ,
TSTG
Operating Junction and Storage
Temperature Range
–55 to 150
°C
EAS
Avalanche Energy, single pulse
ID = 66A, L = 0.1mH, RG = 25Ω
218
mJ
ID
(1) Typical RqJA = 39°C/W on 1-in2 Cu (2-oz.) on a 0.060" thick
FR4 PCB
(2) Pulse duration ≤300ms, duty cycle ≤2%
S
S
G
G
S
S
S
RDS(on) vs VGS
Gate Charge
10
6
ID = 25A
4
TC = 125°C
3
2
TC = 25°C
1
ID = 25A
VDS = 12.5V
9
5
VG − Gate Voltage − V
RDS(on) − On-State Resistance − mW
VGS = 4.5V
TA = 25°C unless otherwise stated
DESCRIPTION
S
mΩ
ORDERING INFORMATION
Point-of-Load Synchronous Buck in
Networking, Telecom and Computing Systems
Optimized for Synchronous FET Applications
D
Drain to Source On Resistance
nC
2.8
Device
APPLICATIONS
•
2.5
VGS = 3V
8
7
6
5
4
3
2
1
0
0
0
1
2
3
4
5
6
7
8
VGS − Gate to Source Voltage − V
9
10
G006
0
5
10
15
20
25
Qg − Gate Charge − nC
30
35
G003
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DualCool, NexFET are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
CSD16321Q5C
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Static Characteristics
BVDSS
Drain to Source Voltage
VGS = 0V, ID = 250mA
IDSS
Drain to Source Leakage
VGS = 0V, VDS = 20V
IGSS
Gate to Source Leakage
VDS = 0V, VGS = +10/–8V
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, ID = 250mA
RDS(on)
Drain to Source On Resistance
gfs
Transconductance
25
V
1
mA
100
nA
1.1
1.4
V
VGS = 3V, ID = 25A
2.8
3.8
mΩ
VGS = 4.5V, ID = 25A
2.1
2.6
mΩ
VGS = 8.0V, ID = 25A
1.9
2.4
mΩ
VDS = 12.5V, ID = 25A
150
0.9
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
115
150
RG
Series Gate Resistance
1.5
3
Ω
Qg
Gate Charge Total (4.5V)
14
19
nC
Qgd
Gate Charge – Gate to Drain
Qgs
Gate Charge – Gate to Source
Qg(th)
Gate Charge at Vth
Qoss
Output Charge
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
VGS = 0V, VDS = 12.5V,
f = 1MHz
2360 3100
pF
1700 2200
pF
pF
2.5
nC
4
nC
2.1
nC
VDS = 13.3V, VGS = 0V
36
nC
9
ns
VDS = 12.5V, VGS = 4.5V,
IDS = 25A, RG =2Ω
15
ns
27
ns
17
ns
VDS = 12.5V,
IDS = 25A
Diode Characteristics
VSD
Diode Forward Voltage
IDS = 25A, VGS = 0V
0.8
1
V
Qrr
Reverse Recovery Charge
nC
Reverse Recovery Time
VDD = 13.3V, IF = 25A,
di/dt = 300A/ms
33
trr
32
ns
THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
MIN
(1)
TYP
MAX
UNIT
RqJC
Thermal Resistance Junction to Case (Top Source)
1.2
°C/W
RqJC
Thermal Resistance Junction to Case (Bottom drain) (1)
1.1
°C/W
RqJA
Thermal Resistance Junction to Ambient (1) (2)
48
°C/W
(1)
(2)
2
RqJC is determined with the device mounted on a 1-inch2 2-oz. Cu pad on a 1.5 × 1.5-inch 0.060-inch thick FR4 board. RqJC is specified
by design, whereas RqCA is determined by the user’s board design.
Device mounted on FR4 material with 1-inch2 of 2-oz. Cu.
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
CSD16321Q5C
www.ti.com
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
GATE
GATE
Source
N-Chan 5x6 QFN TTA MIN Rev3
N-Chan 5x6 QFN TTA MAX Rev3
Max RqJA = 48°C/W
when mounted on 1 in2
of 2-oz. Cu.
Source
Max RqJA = 115°C/W
when mounted on
minimum pad area of
2-oz.Cu.
DRAIN
DRAIN
M0137-02
M0137-01
Text
and
Text
and
Text
and
Text and br Added for Spacing
br
br
br
Added
Added
Added
for
for
for
Spacing
Spacing
Spacing
TYPICAL MOSFET CHARACTERISTICS
(TA = 25°C unless otherwise stated)
ZqJA – NormalizedThermal Impedance
10
1
0.5
0.3
0.1
Duty Cycle = t1/t2
0.1
0.05
P
0.02
0.01
t1
0.01
t2
o
Typical R qJA = 93 C/W (min Cu)
TJ = P x ZqJA x R qJA
Single Pulse
0.001
0.001
0.01
0.1
1
10
100
1k
tP – Pulse Duration–s
G012
Figure 1. Transient Thermal Impedance
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
3
CSD16321Q5C
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
TYPICAL MOSFET CHARACTERISTICS (continued)
(TA = 25°C unless otherwise stated)
TEXT ADDED FOR SPACING
TEXT ADDED FOR SPACING
80
80
70
VGS = 8V
ID − Drain Current − A
ID − Drain Current − A
70
60
VGS = 4.5V
50
VGS = 3V
40
30
VGS = 2.5V
20
VGS = 2V
VDS = 5V
60
TC = 25°C
50
40
TC = 125°C
30
TC = −55°C
20
10
10
0
0.0
0
0.5
0.25
1
0.75
1.25
1
1.5
VDS − Drain to Source Voltage − V
1.25
1.5
2.25
2
2.5
VGS − Gate to Source Voltage − V
G001
Figure 2. Saturation Characteristics
G002
Figure 3. Transfer Characteristics
TEXT ADDED FOR SPACING
TEXT ADDED FOR SPACING
10
6
ID = 25A
VDS = 12.5V
9
8
f = 1MHz
VGS = 0V
5
C − Capacitance − nF
VG − Gate Voltage − V
1.75
7
6
5
4
3
2
Coss = Cds + Cgd
4
Ciss = Csd + Cgs
3
2
Crss = Cgd
1
1
0
0
0
5
10
15
20
25
30
35
Qg − Gate Charge − nC
0
5
10
TEXT ADDED FOR SPACING
RDS(on) − On-State Resistance − mW
VGS(th) − Threshold Voltage − V
G004
TEXT ADDED FOR SPACING
ID = 250mA
1.0
0.8
0.6
0.4
0.2
6
ID = 25A
5
4
TC = 125°C
3
2
TC = 25°C
1
0
−25
25
75
125
175
TC − Case Temperature − °C
0
1
2
3
4
5
6
7
8
9
VGS − Gate to Source Voltage − V
G005
Figure 6. Threshold Voltage vs. Temperature
4
25
Figure 5. Capacitance
1.4
0.0
−75
20
VDS − Drain to Source Voltage − V
G003
Figure 4. Gate Charge
1.2
15
10
G006
Figure 7. On Resistance vs. Gate Voltage
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
CSD16321Q5C
www.ti.com
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
TYPICAL MOSFET CHARACTERISTICS (continued)
(TA = 25°C unless otherwise stated)
TEXT ADDED FOR SPACING
TEXT ADDED FOR SPACING
100
ID = 25A
VGS = 4.5V
1.4
ISD − Source to Drain Current − A
Normalized On-State Resistance
1.6
1.2
1.0
0.8
0.6
0.4
0.2
0.0
−75
10
0.1
TC = 25°C
0.01
0.001
0.0001
−25
25
75
125
175
TC − Case Temperature − °C
0.0
0.4
0.6
0.8
G007
Figure 8. On Resistance vs. Temperature
Figure 9. Typical Diode Forward Voltage
TEXT ADDED FOR SPACING
TEXT ADDED FOR SPACING
1.0
G008
1k
I(AV) − Peak Avalanche Current − A
ID − Drain Current − A
0.2
VSD − Source to Drain Voltage − V
1k
100
1ms
10
10ms
100ms
1
Area Limited
by RDS(on)
1s
0.1
0.01
0.01
TC = 125°C
1
Single Pulse
Typical RqJA = 93°C/W (min Cu)
0.1
DC
1
10
10
TC = 125°C
1
0.01
100
VD − Drain Voltage − V
TC = 25°C
100
0.1
1
10
t(AV) − Time in Avalanche − ms
G009
Figure 10. Maximum Safe Operating Area
100
G010
Figure 11. Single Pulse Unclamped Inductive Switching
TEXT ADDED FOR SPACING
120
ID − Drain Current − A
100
80
60
40
20
0
−50
−25
0
25
50
75
100
125
TC − Case Temperature − °C
150
175
G011
Figure 12. Maximum Drain Current vs. Temperature
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
5
CSD16321Q5C
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
MECHANICAL DATA
Q5C Package Dimensions
E1
K
L
E2
8
8
7
7
6
4
4
5
5
e
3
6
3
Pin 9
D2
D1
E
2
N
1
Exposed
Heat Slug
1
c1
q
2
N1
L
b
M1
M
Top View
Bottom View
Side View
TM
DualCool Pinout
c
E1
A
q
Pin#
Label
1, 2, 3, 9
Source
4
Gate
5, 6, 7, 8
Drain
Front View
M0162-01
DIM
MILLIMETERS
MAX
MIN
MAX
A
0.950
1.050
0.037
0.039
b
0.360
0.460
0.014
0.018
c
0.150
0.250
0.006
0.010
c1
0.150
0.250
0.006
0.010
D1
4.900
5.100
0.193
0.201
D2
4.320
4.520
0.170
0.178
E
4.900
5.100
0.193
0.201
E1
5.900
6.100
0.232
0.240
E2
3.920
4.12
0.154
e
6
INCHES
MIN
1.27 TYP
0.162
0.050
L
0.510
0.710
0.020
0.028
q
–
–
–
–
K
0.760
–
0.030
–
M
3.260
3.460
0.128
0.136
M1
0.520
0.720
0.020
0.028
N
2.720
2.920
0.107
0.115
N1
1.227
1.427
0.048
0.056
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
CSD16321Q5C
www.ti.com
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
Recommended PCB Pattern
DIM
F1
F7
F3
8
1
F2
F11
F5
F9
5
4
F6
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
F1
6.205
6.305
0.244
0.248
F2
4.46
4.56
0.176
0.18
F3
4.46
4.56
0.176
0.18
F4
0.65
0.7
0.026
0.028
F5
0.62
0.67
0.024
0.026
F6
0.63
0.68
0.025
0.027
F7
0.7
0.8
0.028
0.031
F8
0.65
0.7
0.026
0.028
F9
0.62
0.67
0.024
0.026
F10
4.9
5
0.193
0.197
F11
4.46
4.56
0.176
0.18
F8
F4
F10
M0139-01
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through
PCB Layout Techniques.
K0
4.00 ±0.10 (See Note 1)
0.30 ±0.05
2.00 ±0.05
+0.10
–0.00
12.00 ±0.30
Ø 1.50
1.75 ±0.10
Q5C Tape and Reel Information
5.50 ±0.05
B0
R 0.30 MAX
A0
8.00 ±0.10
Ø 1.50 MIN
A0 = 6.50 ±0.10
B0 = 5.30 ±0.10
K0 = 1.40 ±0.10
R 0.30 TYP
M0138-01
Notes:
1. 10-sprocket hole-pitch cumulative tolerance ±0.2
2. Camber not to exceed 1mm in 100mm, noncumulative over 250mm
3. Material: black static-dissipative polystyrene
4. All dimensions are in mm, unless otherwise specified.
5. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket
6. MSL1 260°C (IR and convection) PbF reflow compatible
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
7
CSD16321Q5C
SLPS242B – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
REVISION HISTORY
Changes from Original (December 2009) to Revision A
•
Page
Changed the Mechanical Data dimensions table. Added dimensions for M, M1, N and N1 ................................................ 6
Changes from Revision A (January 2010) to Revision B
Page
•
Changed RDS(on) - VGS = 3V, ID = 25A MAX value From: 3.5 To: 3.8 ................................................................................... 2
•
Deleted the Package Marking Information section ............................................................................................................... 7
8
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CSD16321Q5C
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Apr-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CSD16321Q5C
Package Package Pins
Type Drawing
VSONCLIP
DQU
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.8
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
5.3
1.4
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Apr-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CSD16321Q5C
VSON-CLIP
DQU
8
2500
335.0
335.0
32.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages