Data Sheet

UBA2021
630 V driver IC for CFL and TL lamps
Rev. 04 — 25 July 2008
Product data sheet
1. General description
The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent
Lamps (CFL) or fluorescent TL lamps. It contains a driver circuit for an external
half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp
burning and protection.
2. Features
n
n
n
n
n
n
n
n
Adjustable preheat and ignition time.
Adjustable preheat current.
Adjustable lamp power.
Lamp power independent from mains voltage variations.
Overpower protection.
Lamp temperature stress protection at higher mains voltages.
Capacitive mode protection.
Protection against a drive voltage that is too low for the power MOSFETs.
3. Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
IFS < 15 µA; t < 0.5 s
-
-
630
V
-
11.95
-
V
High voltage supply
VFS
high side supply voltage
Start-up state
VVS(start)
oscillator start voltage
VVS(stop)
oscillator stop voltage
IVS(standby)
standby current
VVS = 11 V
-
10.15
-
V
-
200
-
µA
-
108
-
kHz
Preheat mode
fstart
start frequency
tph
preheat time
VRS(ctrl)
control voltage at pin RS
CCP = 100 nF
-
666
-
ms
-
−600
-
mV
Frequency sweep to ignition
fB
bottom frequency
-
42.9
-
kHz
tign
ignition time
-
625
-
ms
Normal operation
fB
bottom frequency
-
42.9
-
kHz
tno
non-overlap time
-
1.4
-
µs
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Itot
total supply current
fB = 43 kHz
-
1
-
mA
RG1(on),
RG2(on)
high and low side on
resistance
-
126
-
Ω
RG1(off),
RG2(off)
high and low side off
resistance
-
75
-
Ω
-
63.6
-
kHz
kHz
Feed-forward
fff
feed-forward frequency
Ii(RHV)
operating range of input
current at pin RHV
IRHV = 0.75 mA
IRHV = 1.0 mA
-
84.5
-
0
-
1000 µA
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
UBA2021T
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
UBA2021P
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
5. Block diagram
VS
RHV
5
13
RREF CF
10
12
CI
14
bootstrap
charging circuit
SB
SUPPLY
n.c.
1
4
OSCILLATOR
LEVEL
SHIFTER
HIGH SIDE
DRIVER
BAND GAP
REFERENCE
CP
RS
8
9
NON
OVERLAP
TIMING
RS
MONITOR
CONTROL
LOW SIDE
DRIVER
2
3
6
7
UBA2021
11
FS
G1
S1
G2
PGND
mgs988
SGND
Fig 1.
Block diagram
UBA2021_4
Product data sheet
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Rev. 04 — 25 July 2008
2 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
6. Pinning information
6.1 Pinning
FS
1
14 CI
FS
1
14 CI
G1
2
13 RHV
G1
2
13 RHV
S1
3
12 CF
S1
3
12 CF
n.c.
4
11 SGND
n.c.
4
UBA2021P 11 SGND
VS
5
10 RREF
VS
5
10 RREF
G2
6
9
RS
G2
6
9
RS
PGND
7
8
CP
PGND
7
8
CP
UBA2021T
001aai566
Fig 2.
001aai567
Pin configuration (SO14)
Fig 3.
Pin configuration (DIP14)
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
FS
1
high side floating supply voltage
G1
2
gate high transistor (T1)
S1
3
source high transistor (T1)
n.c.
4
high-voltage spacer, not to be connected
VS
5
low voltage supply
G2
6
gate low transistor (T2)
PGND
7
power ground
CP
8
timing/averaging capacitor
RS
9
current monitoring input
RREF
10
reference resistor
SGND
11
signal ground
CF
12
oscillator capacitor
RHV
13
start-up resistor/feed-forward resistor
CI
14
integrating capacitor
7. Functional description
7.1 Introduction
The UBA2021 is an integrated circuit for electronically ballasted compact fluorescent
lamps and their derivatives operating with mains voltages up to 240 V (RMS). It provides
all the necessary functions for preheat, ignition and on-state operation of the lamp. In
addition to the control function, the IC provides level shift and drive functions for the two
discrete power MOSFETs, T1 and T2 (see Figure 7).
UBA2021_4
Product data sheet
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Rev. 04 — 25 July 2008
3 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
7.2 Initial start-up
Initial start-up is achieved by charging capacitor CS9 with the current applied to the
RHV-pin. At start-up, MOSFET T2 conducts and T1 does not conduct. This ensures Cboot
becomes charged. This start-up state is reached for a supply voltage of VVS(reset). This is
the voltage level on the VS-pin at which the circuit will be reset to its initial state and
maintained until the low voltage supply (VVS) reaches a value of VVS(start). The circuit is
reset to the start-up state.
7.3 Oscillation
When the low voltage supply (VVS) has reached the value of VVS(start) the circuit starts
oscillating in the preheat state. The internal oscillator is a current-controlled circuit which
generates a sawtooth waveform. The frequency of the sawtooth is determined by the
capacitor CCF and the current out of the CF-pin, mainly set by RRREF. The sawtooth
frequency is twice the frequency of the signal across the load. The IC brings MOSFETs
T1 and T2 alternately into conduction with a duty factor of approximately 50 %. Figure 4
represents the timing of the IC. The circuit block 'non-overlap' generates a non-overlap
time tno that ensures conduction periods of exclusively T1 or T2. Time tno is dependent on
the reference current IRREF.
start-up
VCF
0
internal
clock
0
V(G1-S1)
0
V(G2)
tno
tno
0
time
mgs991
Fig 4.
Oscillator timing
7.4 Operation in the preheat mode
The circuit starts oscillating at approximately 2.5 × fB (108 kHz). The frequency gradually
decreases until a defined value of current Ishunt is reached (see Figure 5). The slope of the
decrease in frequency is determined by capacitor CCI. The frequency during preheating is
approximately 90 kHz. This frequency is well above the resonant frequency of the load,
which means that the lamp is off, the load only consists of L2, C5 and the electrode
resistance. The preheat time is determined by capacitor CCP. The circuit can be locked in
the preheat state by connecting the CP-pin to ground. During preheating, the circuit
monitors the load current by measuring the voltage drop over external resistor Rshunt at
the end of
conduction of T2 with decision level VRS(ctrl). The frequency is decreased as long as
VRS > VRS(ctrl). The frequency is increased for VRS < VRS(ctrl).
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
4 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
fstart
fB
preheat state
ignition
state
burn state
time
mgs992
Fig 5.
Operation in the preheat mode
7.5 Ignition state
The RS monitoring function changes from VRS(ctrl) regulation to capacitive mode
protection at the end of the preheat time. Normally this results in a further frequency
decrease down to the bottom frequency fB (approximately 43 kHz). The rate of change of
frequency in the ignition state is less than that in the preheat mode. During the downward
frequency sweep the circuit sweeps through the resonant frequency of the load. A high
voltage then appears across the lamp. This voltage normally ignites the lamp.
7.6 Failure to ignite
Excessive current levels may occur if the lamp fails to ignite. The IC does not limit these
currents in any way.
7.7 Transition to the burn state
Assuming that the lamp has ignited during the downward frequency sweep, the frequency
normally decreases to the bottom frequency. The IC can transit to the burn state in two
ways:
1. In the event that the bottom frequency is not reached, transition is made after
reaching the ignition time tign.
2. As soon as the bottom frequency is reached.
The bottom frequency is determined by RRREF and CCF.
7.8 Feed-forward frequency
During burn state a feed-forward mechanism ensures that the lamp power will not
increase above the maximum allowed value due to an increased mains voltage. In the
feed-forward range the UBA2021 driver IC can be configured in such a way that the
application is optimized for close to constant lamp power. Above a defined voltage level
the oscillation frequency also depends on the supply voltage of the half-bridge (see
Figure 6). The current for the current controlled oscillator is derived from the current
through RRHV in the feed-forward range. The feed-forward frequency is proportional to the
average value of the current through RRHV within the operating range of Ii(RHV), given the
lower limit set by fB. For currents beyond the operating range (i.e. between 1.0 mA and 1.6
mA) the feed-forward frequency is clamped. In order to prevent feed-forward of ripple on
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
5 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
Vin, the ripple is filtered out. The capacitor connected to the CP-pin is used for this
purpose. This pin is also used in the preheat state and the ignition state for timing (tph and
tign).
f
(kHz)
feed-forward
range
bottom
frequency
IRHV (mA)
mgs993
Fig 6.
Feed-forward frequency
7.9 Capacitive mode protection
When the preheat mode is completed, the IC will protect the power circuit against losing
the zero voltage switching condition and getting too close to the capacitive mode of
operation. This is detected by monitoring voltage VRS at the RS-pin. If the voltage is below
VRS(cap) at the time of turn-on of T2, the capacitive mode operation is assumed.
Consequently the frequency increases as long as the capacitive mode is detected. The
frequency decreases down to the feed-forward frequency if no capacitive mode is
detected. Frequency modulation is achieved via the CI-pin.
7.10 IC supply
Initially, the IC is supplied from Vin by the current through RRHV. This current charges the
supply capacitor CS9 via an internal diode. As soon as VVS exceeds VVS(start), the circuit
starts oscillating. After the preheat phase is finished, the pin is connected to an internal
resistor Ri(RHV), prior to this the RHV-pin is internally connected to the VS-pin. The voltage
level at the RHV-pin thus drops from VVS + Vdiode to IRHV × Ri(RHV). The capacitor CS9 at
the VS-pin will now be charged via the snubber capacitor CS7. Excess charge is drained
by an internal clamp that turns on at voltage VVS(clamp).
7.11 Minimum gate-source voltage of T1 and T2
The high side driver is supplied via capacitor Cboot. Capacitor Cboot is charged via the
bootstrap switch during the on periods of T2. The IC stops oscillating at a voltage level
VVS(stop). Given a maximum charge consumption on the load at the G1-pin of 1 nC/V, this
safeguards the minimum drive voltages V(G1-S1) for the high side driver, see Table 1.
Table 4.
Minimum gate-source voltages
FREQUENCY
VOLTAGE
< 75 kHz
8 V (min)
75 kHz to 85 kHz
7 V (min)
≥ 85 kHz
6 V (min)
The drive voltage at G2 will exceed the drive voltage of the high side driver.
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
6 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
7.12 Frequency and change in frequency
At any point in time during oscillation, the circuit will operate between fB and fstart. Any
change in frequency will be gradual, no steps in frequency will occur. Changes in
frequency caused by a change in voltage at the CI-pin show a rather constant ∆f/∆t over
the entire frequency range. The following rates are realized (at a frequency of 85 kHz and
with a 100 nF capacitor connected to the PCI-pin):
• For any increase in frequency: ∆f/∆t is between 15 kHz/ms and 37.5 kHz/ms.
• During preheat and normal operation: ∆f/∆t for a decrease in frequency is between
−6 kHz/ms and −15 kHz/ms.
• During the ignition phase: ∆f/∆t for a decrease in frequency is between
−150 Hz/ms and −375 Hz/ms.
7.13 Ground pins
The PGND-pin is the ground reference of the IC with respect to the application. As an
exception the SGND-pin provides a local ground reference for the components connected
to the CP-pin, CI-pin, RREF-pin and thee CF-pin. For this purpose the PGND-pin and
SGND-pin are short circuited internally. External connection of the PGND-pin and the
SGND-pin is not preferred. The sum of currents flowing out of the CP-pin, CI-pin,
RREF-pin, CF-pin and the SGND-pin must remain zero at all time.
7.14 Charge coupling
Due to parasitic capacitive coupling to the high voltage circuitry, all pins are burdened with
a repetitive charge injection. Given the typical application in Figure 7, the RREF-pin and
the CF-pin are sensitive to this charge injection. For the rating Qcouple a safe functional
operation of the IC is guaranteed, independent of the current level. Charge coupling at
current levels below 50 mA will not interfere with the accuracy of the VRS(cap) and VRS(ctrl)
levels. Charge coupling at current levels below 20 mA will not interfere with the accuracy
of any parameter.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to
ground.
Symbol
Parameter
Conditions
Min
Max
Unit
VFS
high side floating supply
voltage
operating
-
570
V
t ≤ 0.5 s
-
630
V
-
35
mA
−2.5
+2.5
V
−15
+2.5
V
IVS(clamp)
clamp current
VRS
input voltage pin RS
transient of 50 ns
SR
slew rate at pins S1, G1
and FS (with respect to
ground)
−4
+4
V/ns
P
power dissipation
-
500
mW
Tamb
ambient temperature
−40
+150
°C
Tj
junction temperature
−40
+150
°C
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
7 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to
ground.
Symbol
Parameter
Conditions
Tstg
storage temperature
Qcouple
charge coupling at pins
RREF and CF
operating
Ves
electrostatic handling
voltage
human body
model
machine model
Min
Max
Unit
−55
+150
°C
−8
+8
pC
[1]
-
2000
V
[2]
-
250
V
[1]
HBM: 2000 V, except pins FS, G1, S1 and VS which are 1000 V maximum and G2 which is 800 V
maximum.
[2]
MM: 250 V except for the G1-pin which is 100 V.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction
to ambient
in free air
Typ
Unit
100
K/W
60
K/W
S014
50
K/W
DIP14
30
K/W
S014
DIP14
Rth(j-pin)
thermal resistance from junction
to PCB
in free air
10. Characteristics
Table 7.
Characteristics
VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
leakage current on high
voltage pins
VFS, VG1 and VS1 = 630 V
-
-
15
µA
VVS(reset)
reset voltage
T1 off; T2 on
4
5.5
6.5
V
VVS(start)
oscillator start voltage
11.35
11.95
12.55
V
VVS(stop)
oscillator stop voltage
9.55
10.15
10,75
V
VVS(hys)
supply voltage hysteresis
1.5
1.8
2
V
150
200
250
µA
0.7
0.8
1
V
0.2
0.3
0.4
V
High voltage supply
IL
Start-up state
IVS(standby)
standby supply current at pin VVS = 11 V
VS
∆V(RHV-VS)
voltage difference between
pins RHV and VS
VVS(clamp-start) clamp margin VVS(clamp) to
VVS(start)
[1]
IRHV = 1.0 mA
[2]
UBA2021_4
Product data sheet
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Rev. 04 — 25 July 2008
8 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
Table 7.
Characteristics …continued
VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IVS(clamp)
clamp current
VVS < 17 V
-
14
35
mA
Preheat mode
fstart
starting frequency
VCI = 0 V
98
108
118
kHz
tg
conducting time T1 and T2
fstart = 108 kHz
-
3.2
-
µs
ICI(charge)
charge current at pin CI
VCI = 1.5 V; VRS = −0.3 V
38
44
50
µA
ICI(discharge)
discharge current at pin CI
VCI = 1.5 V; VRS = −0.9 V
79
93
107
µA
tph
preheat time
599
666
733
ms
ICP(charge)
charge current at pin CP
VCP = 1 V
-
6
-
µA
ICP(discharge)
discharge current at pin CP
VCP = 1 V
-
5.95
-
µA
∆VCP(pk)
peak voltage difference at
pin CP
when timing
-
2.5
-
V
VRS(ctrl)
control voltage at pin RS
−636
−600
−564
mV
[3]
Frequency sweep to ignition
ICI(charge)
charge current at pin CI
VCI = 1.5 V; f ≈ 85 kHz
0.8
1
1.2
µA
fB
bottom frequency
VCI at clamp level
-
42.9
-
kHz
tign
ignition time
-
625
-
µs
41.21
42.9
44.59
kHz
Normal operation
fB
bottom frequency
tg
conducting time T1 and T2
tno
non-overlap conductance
time
Itot
total supply current
-
10.2
-
µs
1.05
1.4
1.75
µs
[4]
0.85
1
1.1
mA
0
20
40
mV
2.425
2.5
2.575
V
fB = 43 kHz
fB = 43 kHz
VRS(cap)
capacitive mode control
voltage
[5]
VRREF
reference voltage
[6]
VG1(on)
on voltage at pin G1
IG1 = 1 mA
10.5
-
-
V
VG1(off)
off voltage at pin G1
IG1 = 1 mA
-
-
0.3
V
VG2(on)
on voltage at pin G2
IG2 = 1 mA
10.5
-
-
V
VG2(off)
off voltage at pin G2
IG2 = 1 mA
-
-
0.3
V
100
126
152
Ω
RG1(on)
high side driver on
resistance
V(G1 - S1) = 3 V
[7]
RG1(off)
high side driver off
resistance
V(G1 - S1) = 3 V
[7]
60
75
90
Ω
RG2(on)
low side driver on resistance VG2 = 3 V
[7]
100
126
152
Ω
RG2(off)
low side driver off resistance VG2 = 3 V
[7]
60
75
90
Ω
Vdrop
voltage drop at bootstrap
switch
0.6
1
1.4
V
IFS = 5 mA
Feed-forward
Ri(RHV)
input resistance at pin RHV
Ii(RHV)
operating range of input
current at
[8]
1.54
2.2
2.86
kΩ
0
-
1000
µA
pin RHV
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
9 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
Table 7.
Characteristics …continued
VVS = 11 V; VFS - VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; unless otherwise specified. See Figure 8.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fff
feed-forward frequency
IRHV = 0.75 mA
60.4
63.6
66.15
kHz
80.3
84.5
88.2
kHz
IRHV = 1 mA
[9]
SYMff
symmetry
IRHV = 1 mA
0.9
1
1.1
RR
ripple rejection
fVin = 100 Hz
-
6
-
dB
RCP(sw)
CP switch series resistance
ICP = 100 µA
0.75
1.5
2.25
kΩ
RAV
averaging resistor
ICP = 10 µA
22.4
32
41.6
kΩ
[1]
The start-up supply current is specified in a temperature (Tvj) range of 0 °C to 125 °C. For Tvj < 0 °C and Tvj >125 °C the start-up supply
current is < 350 µA.
[2]
The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The clamp is in the off-state
at start of oscillation.
[3]
Data sampling of VRS(ctrl) is performed at the end of conduction of T2.
[4]
The total supply current is specified in a temperature (Tvj) range of −20 °C to +125 °C. For Tvj < −20 °C and Tvj >125 °C the total supply
current is < 1.5 mA.
[5]
Data sampling of VRS(cap) is performed at the start of conduction of T2.
[6]
Within the allowed range of RRREF, defined as 30 kΩ +10 %.
[7]
Typical values for the on and off resistances at Tvj = 87.5 °C are: RG2(on) and RG1(on) = 164 Ω, RG2(off) and RG1(off) = 100 Ω.
[8]
The input current at RHV pin may increase to 1600 µA during voltage transient at Vin. Only for currents IRHV beyond approximately
550 µA is the oscillator frequency proportional to IRHV.
[9]
The symmetry SYMff is calculated from the quotient SYMff = T1tot / T2tot, with T1tot the time between turn-off of G2 and turn-off of G1,
and T2tot the time between turn-off of G1 and turn-off of G2.
11. Design information
11.1 Design equations
• Bottom frequency:
1
f B = -----------------------------------------------------------------------------------------------------------------------2 × { [ ( C CF + C par ) × ( X 1 × R RREF – R int ) ] + τ }
(1)
• Feed-forward frequency:
1
f ff = -------------------------------------------------------------------------------------------------------------------------X
2 × V RREF


2 ×  ( C CF + C par ) ×  ----------------------------– R int + τ 
 I i ( RHV ) 


(2)
• Where:
– X1 = 3.68.
– X2 = 22.28.
– τ = 0.4 µs.
– Rint = 3 kΩ.
– Cpar = 4.7 pF
• Operating frequency is the maximum of fB, fff or fcm.
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
10 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
•
•
•
•
Where:
fB = bottom frequency.
fff = feed-forward frequency.
fcm = frequency due to capacitive mode detection.
C
150nF
R
30KΩ
CP
RREF
• Preheat time: t ph = --------------- × ----------------
• Ignition time: t ign = 15
------ × t ph
16
R
30kΩ
RREF
• Non-overlap time: t no = 1.4µs × ---------------
12. Application information
Vin
L1
RRHV
490 kΩ
DS1
DS2
C3
G1
T1
lamp
RHV
CI
13
14
2
CCI
100 nF
S1
R1
8
3
CCP
CP
100 nF
100 nF
L2
mains
supply
FS
CS7
C2
Cboot
C5
UBA2021
12
CCF
CF
100 pF
G2
T2
1
6
10
RREF
RRREF
30 kΩ
DS7
DS3
DS4
VS
C4
CS4
DS6
CS9
5
7
PGND
9 11
SGND
RS
Rshunt
mgs994
Fig 7.
Application diagram
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
11 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
13. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
MH
8
14
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.02
0.13
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 8.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT27-1
050G04
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
DIP14: plastic dual in-line package;
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
12 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
SO14 plastic small outline package
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
13 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
14. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2021_4
20080725
Product data sheet
-
UBA2021_3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
UBA2021_3
20080802
Product data sheet
-
UBA2021_2
UBA2021_2
20010130
Product data sheet
-
UBA2021_1
UBA2021_1
20000724
Product data sheet
-
-
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
14 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UBA2021_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 25 July 2008
15 of 16
UBA2021
NXP Semiconductors
630 V driver IC for CFL and TL lamps
17. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
8
9
10
11
11.1
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Initial start-up . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Operation in the preheat mode . . . . . . . . . . . . . 4
Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Failure to ignite . . . . . . . . . . . . . . . . . . . . . . . . . 5
Transition to the burn state . . . . . . . . . . . . . . . . 5
Feed-forward frequency . . . . . . . . . . . . . . . . . . 5
Capacitive mode protection . . . . . . . . . . . . . . . 6
IC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Minimum gate-source voltage of T1 and T2 . . . 6
Frequency and change in frequency. . . . . . . . . 7
Ground pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Design information . . . . . . . . . . . . . . . . . . . . . 10
Design equations . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 July 2008
Document identifier: UBA2021_4
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