Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC34708VKR2 8x8 0.5P 206 MAPBGA SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2012-01-20 009FK10745D078M1.0 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MC34708VKR2 8x8 0.5P 206 MAPBGA ALL 0.147800 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature 2002/95/EC RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2002/95/EC and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon Exemptions in this part List of Freescale Accepted Exemptions 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION SubPart Weight SubstanceClass Substance CAS Epoxy Die Attach 0.0021 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.001547 g Epoxy Die Attach Plastics/polymers Proprietary Material-Di-ester resin - 0.000221 g Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Functionalized Ester - 0.000221 Epoxy Die Attach Plastics/polymers Other Non-halogenated Epoxy resins - 0.000111 Solder Balls - Lead Free Exemption SubstanceWeight UoM SubPart PPM SubPart% REACHPPM REACH% 736842 73.6842 10466 1.0466 105263 10.5263 1495 0.1495 g 105263 10.5263 1495 0.1495 g 52632 5.2632 751 0.0751 g 0.0705 g Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.000353 g 5000 0.5 2388 0.2388 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.000705 g 10000 1 4769 0.4769 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.069442 g 985000 98.5 469847 46.9847 1000000 100 25710 2.571 Bonding Wire 0.0038 Bonding Wire Die Encapsulant g Metals Gold, metal 7440-57-5 0.0038 0.0159 g g Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.000048 g 3024 0.3024 324 0.0324 Die Encapsulant Metals Magnesium Aluminum Hydroxide Carbonate 11097-59-9 0.000801 g 50390 5.039 5419 0.5419 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00032 g 20156 2.0156 2165 0.2165 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.00032 g 20156 2.0156 2165 0.2165 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.01361 g 855884 85.5884 92084 9.2084 Die Encapsulant Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.000801 g 50390 5.039 5419 0.5419 Organic Substrate 0.0471 g Organic Substrate Solvents, additives, and other materials Proprietary Material-Other aliphatic amines - 0.000031 g 649 0.0649 209 0.0209 Organic Substrate Pigments and Dyes Proprietary Material-Other azo dyes - 0.000015 g 325 0.0325 101 0.0101 Organic Substrate Metals Barium sulfate 7727-43-7 0.001972 g 41870 4.187 13342 1.3342 Organic Substrate Metals Copper, metal 7440-50-8 0.025584 g 543182 54.3182 173100 17.31 Organic Substrate Metals Gold, metal 7440-57-5 0.000478 g 10144 1.0144 3234 0.3234 Organic Substrate Solvents, additives, and other materials Other inorganic compounds - 0.004754 g 100931 10.0931 32165 3.2165 Organic Substrate Metals Nickel, metal 7440-02-0 0.001433 g 30430 3.043 9695 0.9695 Organic Substrate Glass Proprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury) - 0.003664 g 77798 7.7798 24790 2.479 Organic Substrate Solvents, additives, and other materials Other miscellaneous substances (less than 5%) - 0.000306 g 6491 0.6491 2070 0.207 Organic Substrate Solvents, additives, and other materials Proprietary Material-Other Aromatic carbonyl compounds - 0.000191 g 4057 0.4057 1292 0.1292 Organic Substrate Plastics/polymers Other acrylic resins - 0.000298 g 6329 0.6329 2016 0.2016 Organic Substrate Solvents, additives, and other materials 3-methoxy-3-methyl-1-butyl acetate 103429-90-9 0.001085 g 23045 2.3045 7341 0.7341 Organic Substrate Plastics/polymers Other Non-halogenated Epoxy resins - 0.007289 g 154749 15.4749 49316 4.9316 Silicon Semiconductor Die 0.0084 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%) - 0.000168 g 20000 2 1136 0.1136 Silicon Semiconductor Die Glass Silicon, doped - 0.008232 g 980000 98 55696 5.5696 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v0.9 Form Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v0.9_MCD_Template.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC34708VKR2_IPC1752_v09.xml http://www.freescale.com/mcds/MC34708VKR2_IPC1752_v11.xml http://www.freescale.com/mcds/MC34708VKR2_IPC1752A.xml