Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC34709VKR2 MAPBGA 130 8*8*1.25 P0.5 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2013-09-11 00A1K10745D084M1.0 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MC34709VKR2 MAPBGA 130 8*8*1.25 P0.5 ALL 0.239400 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon Exemptions in this part List of Freescale Accepted Exemptions 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION SubPart Weight SubstanceClass Substance CAS Epoxy Die Attach 0.0017 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.001253 g Epoxy Die Attach Plastics/polymers Proprietary Material-Di-ester resin - 0.000179 g Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Functionalized Ester - 0.000179 Epoxy Die Attach Plastics/polymers Other Non-halogenated Epoxy resins - 0.000089 Solder Balls - Lead Free Exemption SubstanceWeight UoM SubPart PPM SubPart% REACHPPM REACH% 736842 73.6842 5233 0.5233 105263 10.5263 747 0.0747 g 105263 10.5263 747 0.0747 g 52632 5.2632 371 0.0371 g 0.0744 g Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.000372 g 5000 0.5 1553 0.1553 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.000744 g 10000 1 3107 0.3107 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.073284 g 985000 98.5 306120 30.612 1000000 100 3341 0.3341 Bonding Wire 0.0008 Bonding Wire Die Encapsulant g Metals Gold, metal 7440-57-5 0.0008 0.0872 g g Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.000264 g 3024 0.3024 1102 0.1102 Die Encapsulant Metals Magnesium Aluminum Hydroxide Carbonate 11097-59-9 0.004394 g 50390 5.039 18354 1.8354 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.001758 g 20156 2.0156 7343 0.7343 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.001758 g 20156 2.0156 7343 0.7343 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.074632 g 855884 85.5884 311755 31.1755 Die Encapsulant Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.004394 g 50390 5.039 18354 1.8354 Organic Substrate 0.0437 g Organic Substrate Metals Barium sulfate 7727-43-7 0.000914 g 20910 2.091 3817 0.3817 Organic Substrate Metals Proprietary Material-Other barium compounds - 0.001202 g 27507 2.7507 5020 0.502 Organic Substrate Metals Copper, metal 7440-50-8 0.026877 g 615034 61.5034 112269 11.2269 Organic Substrate Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.004629 g 105937 10.5937 19335 1.9335 Organic Substrate Plastics/polymers Other Epoxy resins - 0.000871 g 19935 1.9935 3638 0.3638 Organic Substrate Metals Gold, metal 7440-57-5 0.000445 g 10172 1.0172 1858 0.1858 Organic Substrate Metals Nickel, metal 7440-02-0 0.001334 g 30517 3.0517 5572 0.5572 Organic Substrate Plastics/polymers Proprietary Material-Other polymers - 0.000221 g 5067 0.5067 923 0.0923 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.004154 g 95058 9.5058 17351 1.7351 Organic Substrate Solvents, additives, and other materials Proprietary Material-Other Aromatic carbonyl compounds - 0.000164 g 3747 0.3747 685 0.0685 Organic Substrate Plastics/polymers Other acrylic resins - 0.00156 g 35688 3.5688 6516 0.6516 Organic Substrate Plastics/polymers Proprietary Material-Other acyrlic resins - 0.000255 g 5846 0.5846 1065 0.1065 Organic Substrate Solvents, additives, and other materials Proprietary Material-Other aliphatic amine compounds - 0.000026 g 599 0.0599 108 0.0108 Organic Substrate Metals Copper phthalocyanine 147-14-8 0.000013 g 300 0.03 54 0.0054 Organic Substrate Solvents, additives, and other materials 3-methoxy-3-methyl-1-butyl acetate 103429-90-9 0.00093 g 21286 2.1286 3884 0.3884 Organic Substrate Solvents, additives, and other materials Other organosilane compounds - 0.000105 g 2397 0.2397 438 0.0438 Silicon Semiconductor Die 0.0316 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000632 g 20000 2 2639 0.2639 Silicon Semiconductor Die Glass Silicon, doped - 0.030968 g 980000 98 129358 12.9358 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v0.9 Form Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v0.9_MCD_Template.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC34709VKR2_IPC1752_v09.xml http://www.freescale.com/mcds/MC34709VKR2_IPC1752_v11.xml http://www.freescale.com/mcds/MC34709VKR2_IPC1752A.xml