AN-892: 温度测量原理及实用技术 (Rev. 0) PDF

AN-892
ᆌᆩԴऻ
One Technology Way t P.O. Box 9106 t Norwood, MA 02062-9106, U.S.A. t Tel: 781.329.4700 t Fax: 781.461.3113 t www.analog.com
࿒‫֪܈‬ଉᇱ૙तํᆩरຍ
ፕኁǖDonal McNamara
ඤ‫ڿد‬૙ஃ
ඤଉ‫ڿدڦ‬ཚ‫׉‬๟ٗߛ࿒࿿༹‫گڟ‬࿒࿿༹ăཚࡗഽ዆ဣཥ
(සգၒ)৊ႜీଉ‫ڿد‬Ljඤଉ੗ᅜٗૐ‫ڦ‬൶ᇘ‫ڟڿد‬ඤ‫ڦ‬
൶ᇘă
WARM AIR
RISES
t ‫ڞد‬
t ‫ୁܔ‬
t ‫ޖ‬พ
06506-002
COOLER AIR DROPS
AND REPLACES THE
WARMER AIR
ඤ‫ڿد‬੗ᅜཚࡗෙዖएԨ‫ํ݆ݛ‬၄ă
HEATER
‫ڞد‬
཮2. ‫ୁܔ‬
‫ڞد‬๟ፌ‫׉‬९‫༹ࠦڦ‬ඤ‫ݛڿد‬๕ăٗྲ࠵ঙ‫ੂ܈‬Lj‫ڞد‬๟
ኸघଜĂ੺໏ᅎ‫ۯ‬ईና‫ڦۯ‬ᇱጱࢅ‫ݴ‬ጱᇑତৎ‫ڦ‬ᇱጱࢅ‫ݴ‬
ጱ၎ࢻፕᆩLjॽ໲்‫ڦ‬ᅃև‫ీݴ‬ଉ(ඤଉ)‫ߴڿد‬ኄၵ၎ତ
‫ڦ‬ᇱጱă
CROSS SECTIONAL AREA = A
‫ޖ‬พ๟ྸᅃփႴᄲඪࢆ঻ዊ‫ڦ‬ඤ‫ڿد‬ႚ๕Ljᄺ๟ཚࡗኈ੣
৊ႜඤ‫ྸڦڿد‬ᅃ‫ݛ‬๕ăඤ‫ޖ‬พ๟֌ଙዐ‫ڦ‬ᇱጱࢅ‫ݴ‬ጱሏ
‫ڦۯ‬኱থ঳ࡕăᆯᇀ‫ޖ‬พଉໜጣ࿒‫ܸߛืڦ܈‬ሺेLjኄᄣ
৽ׂࣷิٗডߛ࿒‫ڟ܈‬ড‫گ‬࿒‫ڦ܈‬৫ీଉ‫ڿد‬ă
COLD
HEAT FLOW
L
06506-001
HOT
‫ޖ‬พ
཮1. ‫ڞد‬
‫ୁܔ‬
ेฉᆯ‫ڞد‬ᆅഐ‫ڦ‬ඤ‫ڿد‬Ljࠌཞᆅഐକ‫ୁܔ‬ዐ‫ڦ‬ඤଉ‫د‬
‫ڿ‬ă
Rev. 0 | Page 1 of 8
06506-003
‫ୁܔ‬ཚ‫׉‬๟ᅂ༹ࢅഘ༹ඤ‫ڦڿد‬ዷᄲႚ๕ăُຍᇕᆩᇀ௮
ຎ‫ڞد‬ᇑୁ༹ୁ‫ڦۯ‬ፇࢇၳᆌăୁ༹ዐඤईૐ‫ڦݴׯ‬ሏ
‫ۯ‬Lj
཮3. ‫ޖ‬พ
AN-892
ణ୤
ඤ‫ڿد‬૙ஃ ...................................................................................... 1
ᆩᇀ֪ଉPCB࿒‫ڦ܈‬ኟඓPCBքਆ ..................................... 4
ᆩᇀ֪ଉ࣍ৣ࿒‫ڦ܈‬ኟඓPCBքਆ ..................................... 5
‫ހ‬ጎ ............................................................................................ 6
Rev. 0 | Page 2 of 8
AN-892
๚ํǖ‫ڞد‬๟PCBዐፌ೵Փ‫ڦ‬ඤ‫݆ݛڿد‬
සࡕPCB‫ڦ‬ᅃ‫܋‬࿒‫܈‬ডߛLjీଉࣷၠPCB࿒‫܈‬ড‫ڦگ‬ᅃ‫܋‬
‫ڿد‬ăߛ໏૭ጱಸጐ‫گ‬໏૭ጱ้Ljࣷᇑ‫گ‬໏૭ጱ݀ิ৫ీ
ଉ‫ڿد‬ă‫دڦڞد‬ඤ୲๟ǖ
H
ഄዐǖ
H = ‫ڇ‬࿋้क़‫ీڦڞد‬ଉ(ঋܺ/௱)
K = ๪࿒ူཟ‫ڦ‬ඤ‫ڞد‬ဣຕ8Nt,
A = PCBฉཟ‫ڦ‬௬ओ
T = ࿒‫܈‬
L = ඤ‫ڦ‬࿿༹ᇑૐ‫ڦ‬࿿༹ኮक़‫ڦ‬ਐ૗
06506-004
A
T
཮4. ‫دڦڞد‬ඤ୲
ཟ๟टࡻ‫ڞڦ‬ඤ༹Ljᅺُሞ࢔‫ܠ‬PCBยऺዐᆩᇀඤᇸ‫ڦ‬ො
ඤăᆀࢅূߑ็๟ৈᆶ‫ڦ‬ଇ߲ਏᆶ߸ࡻඤ‫ڞد‬ဣຕ‫֌ڦ‬ଙ
(९՗1)ă
՗1. ֌ଙ‫ڦ‬ඤ‫ڞد‬ဣຕ՗
཮4၂๖Ljසࡕඤ‫ڦ‬࿿༹ᇑૐ‫ڦ‬࿿༹ኮक़‫ڞ‬ඤ঻ዊ)සཟ*‫ڦ‬
௬ओሺेLjఫ஺ඤଉ‫੺߸ࣷڿد‬ăཞᄣ‫ں‬Ljසࡕཟ‫ڦ‬௬ओ
३ၭLj‫د‬ඤ୲ᄺࣷ३ၭăཚࡗ‫๎׉‬੗ᅜླྀ܏Ljଇ߲࿿༹ਐ
૗ሁᇺLjૐ‫ڦ‬࿿༹Վඤ໯Ⴔ‫้ڦ‬क़৽ሁ‫׊‬ă
֌ଙ
ূߑ็
ᆀ
ཟ
ূ
Rev. 0 | Page 3 of 8
ඤ‫ڞد‬ဣຕ (WNtK)
1000 to 2600
406
385
320
AN-892
ᆩᇀ֪ଉPCB࿒‫ڦ܈‬ኟඓPCBքਆ
PCBඤଉ‫ڦ‬60%዁65%ཚࡗᆅগ‫ڟڿد‬ႊೌඤ‫ߌد‬ഗăGNDᆅগ૶থ‫ڟ‬एӱLjᅺُLjGNDᆅগᇑ࿒‫ߌد܈‬ഗࢅඤᇸኮक़‫ڦ‬ඤ
ፆፌၭ)ස཮5*ă
MAIN HEAT SOURCE
(μCONTROLLER)
06506-005
TEMPERATURE
SENSOR
཮֪ଉPCB࿒‫ڦ܈‬ኟඓքਆ
ᆶၳ֪ଉPCB࿒‫ڦ܈‬रേ
ස཮6໯๖Lj๑ᆩසူरേ੗ᅜඓԍ࿒‫ߌد܈‬ഗీࠕ߶ጷժ৛ඓ֪ଉPCB࿒‫ࢅ܈‬ዷᄲ‫ڦ‬ඤᇸă
t ࿒‫ߌد܈‬ഗࢅඤᇸᄲࠌᆩཞᅃ߲GNDೝ௬ă
t ඓԍ࿒‫ߌد܈‬ഗ໯ᆶ‫ڦ‬GNDᆅগ‫ۼ‬ᇑඤᇸ‫ڦ‬GNDೝ௬၎૶ă
t ሞPCBฉLj࿒‫ߌد܈‬ഗᇑඤᇸᆌ৑੗ీ၎ࢻ੍ৎă
28.0
27.5
MAIN HEAT SOURCE
(μCONTROLLER)
TEMPERATURE
SENSOR
TEMPERATURE (°C)
27.0
26.5
26.0
25.5
25.0
24.0
TIME (Minutes)
06506-006
24.5
཮ຕጴ࿒‫ߌد܈‬ഗ৛ඓ‫߶ں‬ጷඤᇸ‫ڦ‬࿒‫܈‬
‫ܠٷ‬ຕਜ਼ࢽထྭ๑ᆩIC࿒‫ߌد܈‬ഗઠ֪ଉPCBईኁഗॲ‫ڦ‬࿒‫܈‬ăᅺُLjፌࡻ๑ᆩ཮5ࢅ཮6ዐ໯๖‫ڦ‬PCBքਆ‫݆ݛ‬ă
Rev. 0 | Page 4 of 8
AN-892
ᆩᇀ֪ଉ࣍ৣ࿒‫ڦ܈‬ኟඓPCBքਆ
࢔‫ܠ‬ยऺኁփႴᄲ֪ଉPCB‫ڦ‬࿒‫܈‬Lj໱்ኻၙ֪ଉ࣍ৣ࿒‫܈‬ă࿚༶๟Ljยऺኁසࢆ‫ݞ‬ኹPCBฉ‫ڦ‬ඤᇸᆖၚ࿒‫ߌد܈‬ഗ‫ৣ࣍ܔ‬
࿒‫֪ڦ܈‬ଉǛ๑ᆩස཮7໯๖‫ڦ‬PCBքਆยऺLj࿚༶৽ీᆓඬܸ঴ă
SOLID GND
PLANE UNDER
μCONTROLLER
TEMPERATURE
SENSOR
06506-007
MAIN HEAT SOURCE
(μCONTROLLER)
HASH GND
PLANE
཮7. ֪ଉ࣍ৣ࿒‫ڦ܈‬ኟඓքਆ
ᆶၳ֪ଉ࣍ৣ࿒‫ڦ܈‬रേ
๑ᆩසူरേ੗ᅜ‫ݞ‬ኹዷᄲඤᇸ‫ڦ‬ොඤ‫ܔ‬࿒‫ߌد܈‬ഗׂิᆖၚLjժీࠕ৛ඓ‫ৣ֪࣍॔ں‬࿒‫܈‬ă
t ๑ᆩොଚGNDೝ௬ă३ณGNDೝ௬‫ڦ‬௬ओઠሺेඤፆă
t ࿒‫ߌد܈‬ഗ৑੗ీ‫ں‬ᇺ૗ඤᇸă
t ྺ࿒‫ߌد܈‬ഗ༵ࠃ‫ڦ܀ڇ‬GNDೝ௬Lj৑ଉ३ณᇑዷGNDೝ௬‫૶ڦ‬থă
t ๑ᆩ቏‫ڦ‬GND૶থઠሺेඤፆă
t ዷඤᇸူ௬๑ᆩํ႐GNDೝ௬Ljժ୞‫୴؜‬෥ፆࡰఈăኄᄣ੗๑ዷඤᇸොඤ‫ڦ‬ඤፆፌ‫گ‬ă
26.0
25.5
MAIN HEAT SOURCE
(μCONTROLLER)
TEMPERATURE
SENSOR
TEMPERATURE (°C)
25.0
24.5
24.0
23.5
23.0
22.5
22.0
06506-008
TIME (Minutes)
཮8. ຕጴ࿒‫ߌد܈‬ഗ৛ඓ‫߶ں‬ጷ࣍ৣ࿒‫܈‬
ᅃၵਜ਼ࢽထྭ֪॔੣ഘ࿒‫܈‬ժ૧ᆩIC࿒‫ߌد܈‬ഗ৛ඓĂ၍ႠĂၚᆌ໏‫੺܈‬त๑ᆩ‫ݛ‬Ս‫ڦ‬༬‫ۅ‬ă໱்‫ڦ‬ፌࡻ჋ስ๟๑ᆩ཮7ࢅ
཮8ዐ໯๖‫ڦ‬PCBքਆ‫݆ݛ‬ă
Rev. 0 | Page 5 of 8
AN-892
‫ހ‬ጎ
θJAඤ ፆ ๢ ᆩ ᇀ ࿄ ๑ ᆩ ྔ և ො ඤ ഗ ‫ ހ ڦ‬ጎ Lj ഄ ‫ ڇ‬࿋ ྺ
°C/Wă໲‫ڦ‬ኵሁ‫گ‬ሁࡻă૩සǖ
‫أ‬କ؅٫ࢅᆅগຕኮྔLj࠲ᇀ‫ހ‬ጎ‫ݛ‬௬࣏ᆶഄ໱ᅃၵႴᄲ
੊୯‫ڦ‬ᅺ໎ǖ
t 8ᆅগMSOP‫ހ‬ጎ = 205.9°C/W
t 8ᆅগSOIC‫ހ‬ጎ = 157°C/W
‫ހ‬ጎඤፆ
ഗॲాևࠀ୲໦ࡼ
ࡰথ࿒‫܈‬
ඤ؋ऍၚᆌ
঳዁ྔ੕(θJC)ඤፆ
ኄ߲ኸՔ࢚ଉႊೌ՗௬ᇑ‫ހ‬ጎ՗௬ኮक़ඤଉୁ‫ڦۯ‬వᅟ‫ײ‬
‫܈‬ă໲ᄺ‫ݒ‬ᆙඤଉ๟සࢆୁ෇ྔևොඤഗ‫ڦ‬Ljᅺُ๢ᆩᇀ
๑ᆩොඤഗ‫ހڦ‬ጎăθJCඤፆ‫ڇڦ‬࿋๟°C/Wă໲‫ڦ‬ኵሁ
‫گ‬Ljඤଉ৽ሁඹᅟୁ෇ොඤഗă૩සǖ
‫ހ‬ጎඤፆ
ຕ਍๮֩ዐཚ‫׉‬ኸ௽ଇ߲‫ހ‬ጎႠీኸՔLjन঳዁੣ഘ(θJA)
ඤፆࢅ঳዁ྔ੕(θJC)ඤፆă
t 8ᆅগMSOP‫ހ‬ጎ = 43.74°C/W
t 8ᆅগSOIC‫ހ‬ጎ = 56°C/W
঳዁੣ഘ(θJA)ඤፆ
ኄ߲ኸՔ࢚ଉႊೌ՗௬ᇑ੣ഘኮक़ඤଉୁ‫ڦۯ‬వᅟ‫܈ײ‬ă
໲ᄺ‫ݒ‬ᆙକඤଉ๟සࢆཚࡗ߳ዖୟ০ሞ঳዁࣍ৣ࿒‫܈‬ኮक़
ୁ‫ڦۯ‬ăዷᄲୟ০ྺᆅগ‫ۉڟ‬ୟӱă
TA
MOLD COMPOUND
GOLD WIRE
TJ
LEADFRAME
DIE
TCASE
DIE ATTACH PAD
06506-009
DIE ATTACH
ADHESIVE
཮9. TSSOP‫ހ‬ጎ‫ڦ‬প௬཮
PATHS TO AIR:
1. PACKAGE TOP TO AIR: 15%
2. PACKAGE BOTTOM TO BOARD: 20%
3. PACKAGE LEADS TO BOARD: 65%
06506-010
DIE
཮10. ཚྫ੣ഘ‫ڦ‬ዷᄲୟ০
PATHS TO AIR:
NEARLY ALL HEAT FLOWING
OUT OF TOP OF PACKAGE
DIE
཮11. ཚྫ੣ഘ‫ڦ‬໯ᆶୟ০
Rev. 0 | Page 6 of 8
06506-011
t
t
t
t
AN-892
ഗॲాևࠀ୲໦ࡼ
ူ௬‫ڦ‬ኄ߲ࠅ๕੗ᅜٗຕ਍๮֩ዐ‫ڦ‬ਨ‫ܔ‬ፌ‫ۨܮٷ‬ኵև‫ݴ‬इ‫ڥ‬ă໲ԥۨᅭྺፌ‫ۨܮ୲ࠀٷ‬ኵă
ഄዐǖ
WMAX =ഗॲዐ‫ڦ‬ፌ‫୲ࠀٷ‬໦ࡼ
TAMB max =ຕ਍๮֩ዐۨᅭ‫ڦ‬ፌߛ࣍ৣ࿒‫܈‬
TA =঳࿒
θJA = ঳዁࣍ৣඤፆLj‫ڇ‬࿋ྺ°C/W
LOWER θ
JA
HAS BETTER
POWER DISSIPATION
1.2
SOIC
1.0
0.8
MSOP
0.6
0.4
0.2
SOIC PD @ 150°C = 4.4mW
MSOP PD @ 150°C = 3.4mW
0
–55
0
50
100
06506-012
MAXIMUM POWER IDSSIPATION (W)
1.4
150
TEMPERATURE (°C)
཮12. SOICࢅMSOP‫ހ‬ጎዐ‫ࡼࠀڦ‬
‫ހ‬ጎࡰথ႑တ
ADIࠅິิׂଇዖ‫ހ‬ጎᆅগLjࡤത‫ڦ‬ဍതᆅগࢅ࿮തᆅগ)ٗ2006౎ਸ๔LjADI݀ք‫ڦ‬໯ᆶႎഗॲኻԈࡤ࿮ത֌ଙ*ă‫ࡰړ‬থଇ
ዖᆅগ้Lj٪ሞփཞ‫้ڦ‬क़ࢅ࿒‫֖܈‬ຕăᆶതᇑ࿮തᆅগፌዘᄲ‫ڦ‬൶՚๟‫ރ‬ኵࡰথ࿒‫ڦ܈‬փཞăଇኁ‫ֶڦ‬ᅴሞ՗2ዐᆩࣨ෥
ᅽᆖ՗๖ă
՗2. ࡰথဍതࢅ࿮ത‫ހ‬ጎ‫ڦ‬ຕ਍՗
ೝ਩ฉืၽೢ໏୲
ᇨඤ
ፌ‫گ‬࿒‫(܈‬TSMIN)
ፌߛ࿒‫(܈‬TSMAX)
้क़(TSMIN዁TSMAX)
ྼ‫้׼‬क़
࿒‫܈‬
้क़
‫ރ‬ኵࡰথ࿒‫܈‬
ํा‫ރ‬ኵ࿒‫܈‬±5°Cᅜా‫้ڦ‬क़
ူইၽೢ໏୲
ٗ25°C዁‫ރ‬ኵ࿒‫้ڦ܈‬क़
ဍതፇጎ(3°C/௱Ljፌ‫ٷ‬ኵ)
࿮തፇጎ(3°C/௱Ljፌ‫ٷ‬ኵ)
100°C
150°C
60௱዁120௱
100°C
150°C
60௱዁120௱
183°C
60௱዁150௱
220°C
10௱዁30௱
6°C/௱Ljፌ‫ٷ‬ኵ
6‫ݴ‬ዓLjፌ‫ٷ‬ኵ
217°C
60௱዁150௱
260°C
20௱዁40௱
6°C/௱Ljፌ‫ٷ‬ኵ
6‫ݴ‬ዓLjፌ‫ٷ‬ኵ
Rev. 0 | Page 7 of 8
AN-892
ඤ؋ऍၚᆌ
ႊೌᇑඤᇸኮक़ඤፆ‫ڦ‬ই‫ࣷگ‬ই‫گ‬ඤ้क़‫׉‬ຕLj༵ߛႊೌ
‫ڦ‬ඤၚᆌăඤ้क़‫׉‬ຕ๟ኸ࿒‫܈‬ΔՎࣅ‫ڟ‬ഄፌዕኵ‫ڦ‬63.2%
໯Ⴔᄲ‫้ڦ‬क़ăሞ཮13ዐLjADT7301ঢ়૦ٗ25°C዁125°C‫ڦ‬
ඤ؋ऍǗཚ‫׉‬൧઄ူLjADT7301‫ڟٳ‬88.2°CႴᄲ2௱ă
ᅜ ‫ ୁ ۉ‬๼ ‫ ؜‬࿒ ‫ ߌ د ܈‬ഗ ྺ ૩ (૩ ස Lj AD590Ă AD592ࢅ
TMP17)LjTO-52ĂT0-92(९཮14)ĂCQFPࢅSOIC‫ހ‬ጎᆯᇀ
ড‫ڦگ‬θJC + θJAඤፆܸਏᆶড੺‫ڦ‬ඤၚᆌăጀᅪLjኄၵഗॲ
ுᆶGNDᆅগă
140
100
80
06506-014
TEMPERATURE (°C)
120
60
཮14. TO-92‫ހ‬ጎ
40
LFCSP‫ހ‬ጎ)९཮15*ሞ‫ڹ‬ևᆶᅃ߲ূຌ‫ڹ‬ፗᇑႊೌGND኱
থ၎૶ăॽኄ߲ূຌ‫ڹ‬ፗᇑPCB‫ڦ‬GNDೝ௬၎૶Lj੗ᅜ๑
LFCSPइ‫ڥ‬Բ‫ܠٷ‬ຕ‫ހ‬ጎ߸‫ڦگ‬ඤፆă
0
0
5
t = 2SECONDS
10
15
20
25
30
35
40
45
TIME (Seconds)
50
06506-013
20
཮13՗௽LjADT7301‫ڦ‬SOT-23ࢅMSOPଇዖ‫ހ‬ጎ‫ڦ‬ඤ้क़
‫׉‬ຕ၎ཞăೠࠚຕ਍՗௽Lj‫ހ‬ጎૌ႙‫ܔ‬ඤ้क़‫׉‬ຕኵ‫ڦ‬ᆖ
ၚ࢔ၭăኄຫ௽‫ܠٷ‬ຕඤଉཚࡗ‫ހ‬ጎᆅগୁ‫ۯ‬ăθJA(঳዁
੣ഘඤፆ)ࢅθJC(঳዁ྔ੕ඤፆ)‫ܔ‬՗௬ཌྷጎຕጴ࿒‫ߌد܈‬ഗ
‫ڦ‬ඤၚᆌ‫ڦ‬ᆖၚ࢔ၭă
ᅃӯઠຫLjGNDᆅগᇑඤᇸ‫ںڦ‬ೝ௬ీ‫ޏ‬ᆶၳথ‫ة‬LjᇺԲ
‫ހ‬ጎૌ႙ዘᄲă‫ܠٷৃړ‬ຕ࿒‫ߌد܈‬ഗৈधൽ‫׉ݥ‬ၭ‫ۉڦ‬
ୁ(μAप)ăᅺُLjࠀࡼतഄᆅഐ‫ڦ‬ጲඤփ๟ᆌ޿ࡗ‫੊ݴ‬୯
‫ڦ‬ᅺ໎ă
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
AN06506-0-12/06(0)
Rev. 0 | Page 8 of 8
06506-015
཮13. ADT7301‫ڦ‬ඤ้क़‫׉‬ຕ
Figure 15. LFCSP
཮15. LFCSP‫ހ‬ጎ
Similar pages