TC4626 DATA SHEET (08/07/2014) DOWNLOAD

TC4626/TC4627
Power CMOS Drivers With Voltage Tripler
Features:
General Description:
•
•
•
•
•
•
The TC4626/TC4627 are single CMOS high-speed
drivers with an on-board voltage boost circuit. These
parts work with an input supply voltage from 4 to 6 volts.
The internal voltage booster will produce a VBOOST
potential up to 12 volts above VIN. This VBOOST is not
regulated, so its voltage is dependent on the input VDD
voltage and output drive loading requirements. An
internal undervoltage lockout circuit keeps the output in
a low state when VBOOST drops below 7.8 volts. Output
is enabled when VBOOST is above 11.3 volts.
Power Driver With On-Board Voltage Booster
Low IDD: < 4 mA
Small Package: 8-Pin PDIP
Undervoltage Circuitry
Fast Rise/Fall Time: <40 ns @1000 pF
Below-Rail Input Protection
Applications:
• Raises 5V to drive higher – Vgs (ON) MOSFETs
• Eliminates one system power supply
Note:
Check the Microchip web site for available
package types and package information.
Package Type
PDIP/CERDIP
C1-
8 VDD
1
C1+ 2
TC4626
C2 3
TC4627
GND 4
SOIC
C1-
1
16 VDD
7 IN
NC 2
6 VBOOST C1+ 3
NC 4
5 OUT
C2 5
NC 6
15 NC
14 NC
TC4626 13 IN
TC4627 12 NC
11 VBOOST
NC 7
GND 8
10 NC
9 OUT
Functional Block Diagram
EXT +
C1
EXT +
C2
C1+
C1-
2
(Unregulated 3 x VDD)
6
1
3
C2
VBOOST
V = 2 x VDD
EXT +
C3
Voltage
Booster
UV LOCK
Noninverting
4#
5
VDD
I0
GND
8
Output
Clock
7
Inverting
4#
4
NOTE: Pin numbers correspond to 8-pin package.
 2001-2014 Microchip Technology Inc.
DS20001426D-page 1
TC4626/TC4627
1.0
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated
in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage ......................................................6.2V
Input Voltage, Any Terminal
..................................... VS + 0.3V to GND – 0.3V
Package Power Dissipation (TA 70°C)
PDIP ........................................................730 mW
CERDIP...................................................800 mW
SOIC .......................................................760 mW
Derating Factor
PDIP .......5.6 mW/°C Above 36°C
CERDIP...............................................6.0 mW/°C
Operating Temperature Range (Ambient)
C Version......................................... 0°C to +70°C
E Version ......................................-40°C to +85°C
M Version ...................................-55°C to +125°C
Storage Temperature Range ..............-65°C to +150°C
TC4626/TC4627 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, VDD= 5V, C1 = C2 = C3 10µF unless otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Logic ‘1’, High Input Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1
—
+1
µA
High Output Voltage
VOH
VBOOST – 0.025
—
—
V
Low Output Voltage
VOL
—
—
0.025
V
Output Resistance, High
RO
—
10
15
Ω
IOUT = 10 mA, VDD = 5V
Output Resistance, Low
RO
—
8
10
Ω
IOUT = 10 mA, VDD = 5V
Peak Output Current
IPK
—
1.5
—
A
Rise Time
tR
—
33
40
ns
Figure 3-1, Figure 3-2
Fall Time
tF
—
27
35
ns
Figure 3-1, Figure 3-2
Delay Time
tD1
—
35
45
ns
Figure 3-1, Figure 3-2
Delay Time
tD2
—
45
55
ns
Figure 3-1, Figure 3-2
FMAX
1.0
—
—
MHz
Voltage Tripler Output
Source Resistance
R3
—
300
400
Ω
Voltage Doubler Output
Source Resistance
R2
—
120
200
Ω
Oscillator Frequency
FOSC
12
—
28
kHz
Oscillator Amplitude Measured
at C1-
VOSC
4.5
—
10
V
Input
0VVINVDRIVE
Output
Switching Time
Maximum Switching Frequency
VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
Undervoltage Threshold
Start-Up Voltage
DS20001426D-page 2
UV @VBOOST
7.0
7.8
8.5
V
VSTART
@VBOOST
10.5
11.3
12
V
IL = 10mA, VDD = 5V
RLOAD = 10 kΩ
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = +25°C, VDD= 5V, C1 = C2 = C3 10µF unless otherwise noted.
Parameter
@VDD = 5V
Symbol
Min.
Typ.
Max.
Units
VBOOST
14.6
—
—
V
Test Conditions
No Load
Power Supply
Power Supply Current
IDD
—
—
2.5
mA
Supply Voltage
VDD
4.0
—
6.0
V
Logic 1, High Input Voltage
VIH
2.4
—
—
V
Logic 0, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-10
—
1
µA
VIN = Low or High
Input
0VVINVBOOST
Output
High Output Voltage
VOH
VDRIVE – 0.025
—
—
V
Low Output Voltage
VOL
—
—
0.025
V
Output Resistance, High
RO
—
15
15
20
25
RO
—
10
10
13
15
IPK
—
1.5
—
A
Rise Time
tR
—
—
55
ns
Figure 3-1, Figure 3-2
Fall Time
tF
—
—
50
ns
Figure 3-1, Figure 3-2
Delay Time
tD1
—
—
60
ns
Figure 3-1, Figure 3-2
Delay Time
tD2
—
—
70
ns
Figure 3-1, Figure 3-2
FMAX
750
—
—
kHz
Voltage Boost Output
Source Resistance
R3
—
400
500
Ω
Voltage Doubler Output
Source Resistance
R2
—
170
300
Ω
Oscillator Frequency
FOSC
5
—
50
kHz
Oscillator Amplitude
Measured at C1-
VOSC
4.5
—
10
V
Output Resistance, Low
Peak Output Current
Ω
IOUT = 10 mA, VDD = 5V
C & E Version
(TA = +70°C or +85°C)
M Version (TA = +125°C)
Ω
IOUT = 10 mA, VDD = 5V
C & E Version
(TA = +70°C or +85°C)
M Version (TA = +125°C)
Switching Time
Maximum Switching Frequency
VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
UV @VBOOST
7.0
7.8
8.5
V
VSTART
@VBOOST
10.5
11.3
12
V
VBOOST
14.6
—
—
V
Power Supply Current
IDD
—
—
4
mA
Supply Voltage
VDD
4.0
—
6.0
V
Undervoltage Threshold
Start-Up Voltage
@VDD = 5V
IL = 10 mA, VDD = 5V
RLOAD = 10 kΩ
No Load
Power Supply
 2001-2014 Microchip Technology Inc.
VIN = Low or High
DS20001426D-page 3
TC4626/TC4627
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(8-Pin PDIP,
CERDIP)
PIN FUNCTION TABLE
Pin No.
(16-Pin SOIC Wide)
Symbol
Description
1
1
C1-
See Section 3.1 “Booster Function” for description
2
3
C1+
See Section 3.1 “Booster Function” for description
See Section 3.1 “Booster Function” for description
3
5
C2
4
8
GND
Ground.
Output
5
9
OUT
6
11
VBOOST
7
13
IN
Control Input
8
16
VDD
Supply Input
—
2, 4, 6, 7, 10, 12, 14, 15
NC
Not connected.
DS20001426D-page 4
See Section 3.1 “Booster Function” for description
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
3.0
APPLICATIONS INFORMATION
VBOOST
VBOOST
C3
10ȝF
0.1ȝF Ceramic
C3
10ȝF
6
Input
6
7
2
C1
10ȝF
1
3
5
C1+
Output
CL = 1000pF
7
2
C1
10ȝF
1
TC4626
C2
10ȝF
8
3
VDD = 5V
5
C1+
C2
TC4627
8
Input
VDD = 5V
4
+5V
90%
Output
CL = 1000pF
C1-
C2
10ȝF
4
+5V
0V
Input
C1-
C2
0.1ȝF Ceramic
90%
Input
10%
VBOOST
tD1
tF
tD2
0V
tR
VBOOST
90%
90%
Output
0V
tD1
90%
10%
10%
Inverting Driver Switching
 2001-2014 Microchip Technology Inc.
90%
tD2
tF
tR
Output
Input: 100kHz,square wave,
tRISE = tFALL ≤ 10ns
FIGURE 3-1:
Time.
10%
10%
0V
10%
Input: 100kHz,square wave,
tRISE = tFALL ≤ 10ns
FIGURE 3-2:
Switching Time.
Noninverting Driver
DS20001426D-page 5
TC4626/TC4627
3.1
BOOSTER FUNCTION
The voltage booster is an unregulated voltage tripler
circuit. The tripler consists of three sets of internal
switches and three external capacitors. S1a and S1b
charge capacitor C1 to VDD potential. S2a and S2b add
C1 potential to VDD input to charge C2 to 2 x VDD. S3a
and S3b add C1 potential to C2 to charge C3 to 3 x
VDD. The position of the switches is controlled by the
internal four-phase clock.
6
3 x VDD, VBOOST
6
+
C3
S3a
2 x VDD
3
+
S2a
C2
(4 to 6V)
VDD
S3b
8
S1a
S2b
2
+
C1
1
S1b
GND
4
FIGURE 3-3:
DS20001426D-page 6
Voltage Booster.
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
Pin 1 CPF 2 Waveforms
3 x VDD
2 x VDD
Pin 2
Voltage
VDD
2 x VDD
Pin 1
Voltage
VDD
0
On
S1
Off
S2
On
Off
S3
On
Off
FIGURE 3-4:
Position of Switches.
 2001-2014 Microchip Technology Inc.
DS20001426D-page 7
TC4626/TC4627
4.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
TC4626 VOH vs. Frequency
TC4626 VOH vs. Frequency
16
VS = 5V
TA = -55°C
470pF
14
14
12
VOUT HI (Volts)
VOUT HI (Volts)
12
10
2200pF
8
1000pF
6
10
8
6
2200pF
4
4
2
2
0
10
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
Delay Time vs. Temperature
TC4626 VOH vs. Frequency
100
14
VS = 5V
TA = 125°C
12
10
80
470pF
Time (nsec)
VOUT HI (Volts)
1000pF
0
5
8
6
2200 pF
1000pF
Input = 0-5V;
TR& TF <10NS
@ <20kHz
VS = 4V
CLOAD = 1000pF
tD2
60
tD1
40
4
tRISE
20
2
0
5
tFALL
0
500 1,000 1,500 2,000 2,500 3,000 3,500
-40 -20
50
VS = 5V
40
30
20
60
80 100 120
VS = 6V
40
tD2
tD1
tFALL
40
CLOAD = 1000pF
CLOAD = 1000pF
Time (nsec)
50
20
Delay Time vs. Temperature
Delay Time vs. Temperature
60
0
TEMPERATURE (°C)
FREQUENCY (kHz)
Time (nsec)
VS = 5V
TA = 25°C
470pF
tD2
30
tD1
20
tRISE
tFALL
tRISE
Input = 0-5V;
TR & TF <10ns
@ <20kHz
10
0
10
Input = 0-5V;
TR & TF <10NS
@ <20kHz
0
-40
-20
0
20
40
60
TEMPERATURE (°C)
DS20001426D-page 8
80
100 120
-40
-20
0
20
40
60
80
100 120
TEMPERATURE (°C)
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
TC4626 VOH vs. Frequency
TC4626 VOH vs. Frequency
16
16
VS = 5V
TA = 25°C
15
14
14
VOUT HI (Volts)
VOUT HI (Volts)
VS = 5V
TA = -55°C
15
13
12
470pF
11
1,000pF
10
9
470pF
13
12
1,000pF
11
2,200pF
10
9
2,200pF
8
8
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY x 100 kHz
FREQUENCY x 100 kHz
TC4626 VOH vs. Frequency
16
VS = 5V
TA = 125°C
15
VOUT HI (Volts)
14
13
12
11
470pF
10
1,000pF
9
2,200pF
8
0
1
2
3
4
5
6
7
8
9
10
FREQUENCY x 100 kHz
 2001-2014 Microchip Technology Inc.
DS20001426D-page 9
TC4626/TC4627
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead CERDIP (.300”) (TC4627 Only)
Example
XXXXXXXX
XXXXXNNN
TC4627
MJA e^^256
3
1423
YYWW
8-Lead PDIP (300 mil)
Example
XXXXXXXX
XXXXXNNN
TC4626
CPA e^^256
3
1423
YYWW
TC4627EOE e^^
3
1423256
e3
*
Note:
DS20001426D-page 10
TC4626
EPA e^^256
3
1423
Example
16-Lead SOIC (7.50 mm)
Legend: XX...X
Y
YY
WW
NNN
OR
OR
TC4627COE e^^
3
1423256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2014 Microchip Technology Inc.
DS20001426D-page 11
TC4626/TC4627
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
3/$1(
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20001426D-page 12
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
 2001-2014 Microchip Technology Inc.
DS20001426D-page 13
TC4626/TC4627
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001426D-page 14
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2014 Microchip Technology Inc.
DS20001426D-page 15
TC4626/TC4627
/HDG3ODVWLF6PDOO2XWOLQH2(±:LGHPP%RG\>62,&@/DQG3DWWHUQ
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
DS20001426D-page 16
 2001-2014 Microchip Technology Inc.
TC4626/TC4627
APPENDIX A:
REVISION HISTORY
Revision D (July 2014)
The following is the list of modifications:
• Restructured Table 2-1 for readability purposes.
• Updated package specification drawings in
Section 5.0, Packaging Information to match all
views available.
• Added new Product Identification System.
Revision C (December 2012)
Added a note to each package outline drawing.
 2001-2014 Microchip Technology Inc.
DS20001426D-page 17
TC4626/TC4627
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
–
X
/XX
Temperature
Range
Package
Device:
TC4626:
TC4627:
Temperature
Range:
C
E
Package:
JA =
a)
TC4626CPA:
b)
TC4626EPA:
High-Speed Inverting
Single CMOS Driver,
0C to +70C.
High-Speed Inverting
Single CMOS Driver,
-40C to +85C.
= 0C to +70C
= -40C to +85C
OE =
PA =
DS20001426D-page 18
Single CMOS High-Speed Driver, Inverting
Single CMOS High-Speed Driver, Non-Inverting
Examples:
8-Lead Ceramic Dual In-Line, 300" Body (CERDIP)
(TC4627 only)
16-Lead Plastic Small Outline, Wide, 7.50 mm Body (SOIC)
8-Lead Plastic Dual In-Line, 300 mil Body (PDIP)
 2001-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-380-8
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2001-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001426D-page 19
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20001426D-page 20
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
 2001-2014 Microchip Technology Inc.