MMBZ15VDLT1 D

MMBZxxVxL,
SZMMBZxxVxL Series
40 Watt Peak Power
Zener Transient Voltage
Suppressors
www.onsemi.com
SOT−23 Dual Common Cathode Zeners
for ESD Protection
These dual monolithic silicon zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
cathode design protects two separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
The SZ/MMBZ27VCL can be used to protect a single wire
communication network form EMI and ESD transient surge voltages.
The SZ/MMBZ27VCL is recommended by the
Society of Automotive Engineers (SAE), February 2000, J2411
“Single Wire Can Network for Vehicle Applications” specification as
a solution for transient voltage problems.
SOT−23
CASE 318
STYLE 9
ANODE 1
3 CATHODE
ANODE 2
MARKING DIAGRAM
Specification Features:
XXX MG
G
• SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• Working Peak Reverse Voltage Range − 12.8 V, 22 V, 31.2 V
• Standard Zener Breakdown Voltage Range − 15 V, 27 V, 39 V
• Peak Power − 40 W @ 1.0 ms (Bidirectional),
per Figure 5 Waveform
• ESD Rating of Class 3B (exceeding 16 kV) per the Human
•
•
•
•
•
Body Model
ESD Rating of IEC61000−4−2 Level 4, ±30 kV Contact Discharge
Low Leakage < 100 nA
Flammability Rating: UL 94 V−O
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 15
1
1
XXX = 15D, 27C or 39C
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MMBZ15VDLT1G,
SOT−23
SZMMBZ15VDLT1G (Pb−Free)
3,000 /
Tape & Reel
MMBZ15VDLT3G,
SOT−23
SZMMBZ15VDLT3G (Pb−Free)
10,000 /
Tape & Reel
MMBZxxVCLT1G,
SZMMBZxxVCLT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
MMBZxxVCLT3G,
SZMMBZxxVCLT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MMBZ15VDLT1/D
MMBZxxVxL, SZMMBZxxVxL Series
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Power Dissipation @ 1.0 ms (Note 1) @ TL ≤ 25°C
Rating
Ppk
40
Watts
Total Power Dissipation on FR−5 Board (Note 2)
@ TA = 25°C
Derate above 25°C
°PD°
225
1.8
mW
mW/°C
Thermal Resistance Junction−to−Ambient
RqJA
556
°C/W
Total Power Dissipation on Alumina Substrate (Note 3)
@ TA = 25°C
Derate above 25°C
°PD°
300
2.4
°
mW
mW/°C
Thermal Resistance Junction−to−Ambient
RqJA
417
°C/W
Junction and Storage Temperature Range
TJ, Tstg
− 55 to +150
°C
TL
260
°C
Lead Solder Temperature − Maximum (10 Second Duration)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6.
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
I
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
VBR
IF
Parameter
VC VBR VRWM
Working Peak Reverse Voltage
V
IR VF
IT
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
Maximum Temperature Coefficient of VBR
IF
Forward Current
VF
Forward Voltage @ IF
IPP
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage
Device*
MMBZ15VDLT1G/T3G
VBR (Note 4) (V)
IR @ VRWM
VC @ IPP (Note 5)
@ IT
Device
Marking
VRWM
Volts
nA
Min
Nom
Max
mA
15D
12.8
100
14.3
15
15.8
1.0
VC
IPP
VBR
V
A
mV/5C
21.2
1.9
12
(VF = 1.1 V Max @ IF = 200 mA)
Breakdown Voltage
VBR (Note 4) (V)
VC @ IPP (Note 5)
@ IT
VC
IPP
VBR
V
A
mV/5C
38
1.0
26
0.76
35.3
Device
Marking
VRWM
IR @ VRWM
Volts
nA
Min
Nom
Max
mA
MMBZ27VCLT1G/T3G
27C
22
50
25.65
27
28.35
1.0
MMBZ39VCLT1G/T3G
39C
31.2
50
37.05
39
40.95
1.0
55
Device*
4. VBR measured at pulse test current IT at an ambient temperature of 25°C.
5. Surge current waveform per Figure 5 and derate per Figure 6
*Include SZ-prefix devices where applicable.
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2
MMBZxxVxL, SZMMBZxxVxL Series
TYPICAL CHARACTERISTICS
MMBZ15VDL, SZMMBZ15VDL
MMBZ27VCL, SZMMBZ27VCL
BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T )
BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T )
17
BIDIRECTIONAL
16
15
14
UNIDIRECTIONAL
13
-40
+125
+25
+85
TEMPERATURE (°C)
29
BIDIRECTIONAL
28
27
26
25
-55
Figure 2. Typical Breakdown Voltage
versus Temperature
1000
300
100
250
PD , POWER DISSIPATION (mW)
IR (nA)
Figure 1. Typical Breakdown Voltage
versus Temperature
10
1
0.1
0.01
-40
+25
+85
TEMPERATURE (°C)
ALUMINA SUBSTRATE
200
150
100
FR-5 BOARD
50
0
+125
0
PEAK VALUE—IPP
VALUE (%)
100
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
50% OF IPP.
IPP
HALF VALUE—
2
50
tP
0
0
1
2
3
t, TIME (ms)
4
25
50
75
100
125
TEMPERATURE (°C)
150
175
Figure 4. Steady State Power Derating Curve
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25 ° C
Figure 3. Typical Leakage Current
versus Temperature
tr ≤ 10 ms
+125
+25
+85
TEMPERATURE (°C)
100
90
80
70
60
50
40
30
20
10
0
0
Figure 5. Pulse Waveform
25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (°C)
Figure 6. Pulse Derating Curve
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3
175
200
MMBZxxVxL, SZMMBZxxVxL Series
TYPICAL APPLICATIONS
VBatt
ECU Connector
Single Wire
CAN Transceiver
47 mH
Bus
Loss of
Ground
Protection
Circuit
RLoad
9.09 kW 1%
*
Load
CLoad
220 pF 10%
GND
*ESD Protection − MMBZ27VCL or equivalent. May be located
in each ECU (CLoad needs to be reduced accordingly) or at a
central point near the DLC.
Figure 7. Single Wire CAN Network
Figure is the recommended solution for transient EMI/ESD protection. This circuit is shown in the
Society of Automotive Engineers February, 2000 J2411 “Single Wire CAN Network for Vehicle Applications” specification
(Figure 6, page 11). Note: the dual common anode zener configuration shown above is electrically equivalent to a dual common
cathode zener configuration.
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4
MMBZxxVxL, SZMMBZxxVxL Series
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
b
0.25
e
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 °
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0°
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10°
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
L1
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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5
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For additional information, please contact your local
Sales Representative
MMBZ15VDLT1/D