Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA7056B
5 W mono BTL audio amplifier with
DC volume control
Product specification
Supersedes data of 1996 May 28
1997 Aug 15
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
FEATURES
GENERAL DESCRIPTION
 DC volume control
The TDA7056B is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control.
It is designed for use in TV and monitors, but is also
suitable for battery-fed portable recorders and radios.
The device is contained in a 9-pin medium power package.
 Few external components
 Mute mode
 Thermal protection
 Short-circuit proof
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).
 No switch-on and switch-off clicks
 Good overall stability
 Low power consumption
 Low HF radiation
 ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VP
supply voltage
PO
output power
Gv(max)
maximum total voltage gain
CONDITIONS
MIN.
TYP.
4.5

RL = 16 
3
RL = 8 
5
MAX.
UNIT
18
V
3.5

W
5.5

W
39.5
40.5
41.5
dB
VP = 12 V

gain control
68
73.5

dB
Iq(tot)
total quiescent current
VP = 12 V; RL = 

9.2
13
mA
THD
total harmonic distortion
PO = 0.5 W

0.3
1
%
ORDERING INFORMATION
TYPE
NUMBER
TDA7056B
1997 Aug 15
PACKAGE
NAME
SIL9MPF
DESCRIPTION
plastic single in-line medium power package with fin; 9 leads
2
VERSION
SOT110-1
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
BLOCK DIAGRAM
VP
handbook, full pagewidth
2
n.c.
n.c.
input
DC volume control
1
TDA7056B
9
I + i
6
I – i
8
positive output
3
5
STABILIZER
Vref
negative output
TEMPERATURE
PROTECTION
4
7
MSA708 - 1
power
ground
signal
ground
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
handbook, halfpage
n.c.
1
not connected
VP
2
positive supply voltage
VI
3
voltage input
GND1
4
signal ground
VC
5
DC volume control
OUT+
6
positive output
GND2
7
power ground
OUT
6
OUT
8
negative output
GND2
7
n.c.
9
not connected
OUT
8
n.c.
1
VP
2
VI
3
GND1
4
VC
5
n.c.
TDA7056B
9
MSA707
Fig.2 Pin configuration.
1997 Aug 15
3
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
FUNCTIONAL DESCRIPTION
TDA7056B
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to 33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The TDA7056B is a mono BTL output amplifier with DC
volume control, designed for use in TV and monitor but is
also suitable for battery-fed portable recorders and radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7056B
the DC volume control stage is integrated into the input
stage so that no coupling capacitors are required. With this
configuration, a low offset voltage is still maintained and
the minimum supply voltage remains low.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
The BTL principle offers the following advantages:
 Lower peak value of the supply current
Power dissipation
 The frequency of the ripple on the supply voltage is twice
the signal frequency.
Assume VP = 12 V; RL = 16 .
The maximum sine wave dissipation is = 1.8 W.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The Rth vj-a of the package is 55 K/W.
Therefore Tamb (max) = 150  55  1.8 = 51 C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage

18
V
V3, 5
input voltage pins 3 and 5

5
V
IORM
repetitive peak output current

1.25
A
IOSM
non-repetitive peak output current

1.5
A
Ptot
total power dissipation

9
W
Tamb
operating ambient temperature
40
+85
C
Tstg
storage temperature
55
+150
C
Tvj
virtual junction temperature

+150
C
Tsc
short-circuit time

1
h
Tcase  60 C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
55
K/W
Rth j-c
thermal resistance from junction to case
10
K/W
1997 Aug 15
4
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
positive supply voltage
Iq(tot)
total quiescent current
4.5

18
V
note 1; RL = 

9.2
13
mA
W
Maximum gain (V5 = 1.4 V)
PO
output power
THD = 10%; RL = 16 
3
3.5

THD = 10%; RL = 8 
5
5.5

W
THD
total harmonic distortion
PO = 0.5 W

0.3
1
%
Gv(max)
maximum total voltage gain
39.5
40.5
41.5
dB
VI
input signal handling (RMS value)
Gv(max) = 0 dB; THD  1%
1.0


V
Vno
noise output voltage (RMS value)
note 2; f = 500 kHz

210

V
B
bandwidth
at 1 dB

0.02 to 300 
kHz
SVRR
supply voltage ripple rejection
note 3
34
38

dB
VO
DC output offset voltage
V8  v6

0
200
mV
ZI
input impedance (pin 3)
15
20
25
k

35
45
V
68
73.5

dB
20
25
30
A
Mute position
VO
output voltage in mute position
note 4; V5  0.4 V;
VI = 1.0 V
DC volume control; note 5

gain control
I5
control current
V5 = 0 V
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0  and B = 5 kHz.
3. The ripple rejection is measured with RS = 0  and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
1997 Aug 15
5
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH372
40
MBH365
1
handbook, halfpage
handbook, halfpage
Gv
(dB)
Vno
(mV)
0
10−1
−40
−80
−120
0
0.4
0.8
1.2
10−2
1.6
2.0
VDC (V)
0
0.4
0.8
1.2
1.6
2
VDC (V)
Measured with RS = 5 k unweighted.
Frequency range is 22 Hz to 22 kHz.
Fig.3
Gain control as a function of DC volume
control.
Fig.4
MBH376
25
Noise output voltage as a function of DC
volume control.
MBH367
20
handbook, halfpage
handbook, halfpage
IDC
(μA)
IP
(mA)
15
15
5
−5
10
−15
−25
5
0
Fig.5
0.4
0.8
1.2
1.6
2.0
VDC (V)
0
8
12
16
VP (V)
20
Measured with RL = .
Control current as a function of DC volume
control.
1997 Aug 15
4
Fig.6 Quiescent current versus supply voltage.
6
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH361
10
MBH362
10
handbook, halfpage
handbook, halfpage
THD
(%)
8
THD
(%)
8
(1)
(2)
6
6
4
4
2
2
(1)
(2)
0
10-1
1
0
10−2
10
PO (W)
(1) RL 16 .
(2) RL = 8 .
Fig.7
10−1
1
10
f (kHz)
102
PO = 0.1 W.
(1) Gv(max) = 40 dB.
(2) Gv(max) = 30 dB.
Total harmonic distortion versus output
power.
Fig.8 Total harmonic distortion versus frequency.
MBH363
MBH364
6
Pd
(W)
5
10
handbook, halfpage
handbook, halfpage
PO
(W)
8
4
6
3
(2)
(1)
(1)
4
(2)
2
2
1
0
0
0
4
8
12
16
VP (V)
20
0
Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 .
(2) RL = 16 .
8
12
16
VP (V)
20
(1) RL = 8 .
(2) RL = 16 .
Fig.10 Total worst case power dissipation versus
supply voltage.
Fig.9 Output power versus supply voltage.
1997 Aug 15
4
7
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
MBH374
−20
MBH375
2.0
VI
(V)
handbook, halfpage
handbook, halfpage
SVRR
(dB)
−30
1.6
(1)
−40
1.2
−50
0.8
(2)
−60
−70
10−2
0.4
10−1
1
10
f (kHz)
0
102
0
Measured with VR = 0.2 V.
(1) VDC = 1.4 V.
(2) VDC = 0.4 V.
8
12
16
VP (V)
Measured at a THD of 1% and a voltage gain of 0 dB.
Fig.11 Supply voltage ripple rejection versus
frequency.
1997 Aug 15
4
Fig.12 Input signal handling.
8
20
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
TEST AND APPLICATION INFORMATION
(1)
VP = 12 V
handbook, full pagewidth
220 μF
100 nF
2
n.c.
n.c.
input
0.47 μF
1
9
TDA7056B
I+i
6
+
3
5
RL = 8 Ω
I−i
8
−
RS
5 kΩ
DC
volume
control
STABILIZER
TEMPERATURE
PROTECTION
4
7
MSA709 - 2
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2.
Fig.13 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1997 Aug 15
9
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
handbook, halfpage
TDA7056B
VP = 12 V
handbook, halfpage
volume
control
volume
control
5
100 kΩ
5
1 μF
1 MΩ
1 μF
22 kΩ
MSA710
MBH366
Fig.14 Application with potentiometer as volume
control; maximum gain = 34 dB.
1997 Aug 15
Fig.15 Application with potentiometer as volume
control; maximum gain = 40 dB.
10
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D1
q
A2
P1
P
A3
q1
q2
A
A4
seating plane
E
pin 1 index
c
L
1
9
b
e
Z
Q
b2
w M
b1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
max.
A3
A4
b
b1
b2
c
D (1)
D1
E (1)
e
L
P
P1
Q
q
q1
q2
w
Z (1)
max.
mm
18.5
17.8
3.7
8.7
8.0
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
2.54
3.9
3.4
2.75
2.50
3.4
3.2
1.75
1.55
15.1
14.9
4.4
4.2
5.9
5.7
0.25
1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-02-25
03-03-12
SOT110-1
1997 Aug 15
EUROPEAN
PROJECTION
11
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
SOLDERING
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
1997 Aug 15
TDA7056B
12
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
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provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
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those described in the Product data sheet.
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not designed, authorized or warranted to be suitable for
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of an NXP Semiconductors product can reasonably be
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accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
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DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
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shall have no liability for the consequences of use of such
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Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
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Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
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Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
1997 Aug 15
13
NXP Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
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Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
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Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1997 Aug 15
TDA7056B
14
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2011
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
RM5/03/pp15
Date of release: 1997 Aug 15
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