Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA7052B
Mono BTL audio amplifier with DC
volume control
Product specification
Supersedes data of 1996 May 28
1997 Aug 15
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
FEATURES
GENERAL DESCRIPTION
• DC volume control
The TDA7052B and TDA7052BT are 1 W and 0.5 W mono
Bridge-Tied Load (BTL) output amplifiers with DC volume
control.
They have been designed for use in TV and monitors, but
are also suitable for use in battery-fed portable recorders
and radios.
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
• No switch-on and switch-off clicks
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
PARAMETERS
VP
supply voltage
PO
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
4.5
−
18
V
1.0
−
W
VP = 6 V
TDA7052B
RL = 8 Ω
0.9
TDA7052BT
RL = 16 Ω
0.5
0.55
−
W
Gv(max)
maximum total voltage gain
39.5
40.5
41.5
dB
φ
gain control
68
73.5
−
dB
Iq(tot)
total quiescent current
VP = 6 V; RL = ∞
−
9.2
13
mA
THD
total harmonic distortion
TDA7052B
PO = 0.5 W
−
0.3
1
%
TDA7052BT
PO = 0.25 W
−
0.3
1
%
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA7052B
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
TDA7052BT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
1997 Aug 15
2
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
BLOCK DIAGRAM
VP
handbook, full pagewidth
1
n.c.
7
TDA7052B
TDA7052BT
input
DC volume control
I + i
5
I – i
8
positive output
2
4
STABILIZER
Vref
negative output
TEMPERATURE
PROTECTION
3
6
MSA705 - 1
power
ground
signal
ground
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
VP
1
supply voltage
IN+
2
input
GND1
3
signal ground
VC
4
DC volume control
OUT+
5
positive output
GND2
6
power ground
n.c.
7
not connected
OUT−
8
negative output
1997 Aug 15
handbook, halfpage
VP
1
IN
2
GND1
3
VC
4
TDA7052B
TDA7052BT
8
OUT
7
n.c.
6
GND2
5
OUT
MSA704 - 1
Fig.2 Pin configuration.
3
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
FUNCTIONAL DESCRIPTION
TDA7052B
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to −33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The TDA7052B and TDA7052BT are mono BTL output
amplifiers with DC volume control which have been
designed for use in TV and monitors but are also suitable
for use in battery-fed portable recorders and radios.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7052B
and TDA7052BT the DC volume control stage is integrated
into the input stage so that no coupling capacitors are
required. With this configuration, a low offset voltage is
maintained and the minimum supply voltage remains low.
The BTL principle offers the following advantages:
Power dissipation
• Lower peak value of the supply current
Assume for the TDA7052B that VP = 6 V; RL = 8 Ω.
The maximum sine wave dissipation is 0.9 W.
The Rth j-a of the package is 100 K/W.
Therefore Tamb(max) = 150 − 100 × 0.9 = 60 °C.
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
Assume for the TDA7052BT that VP = 6 V; RL = 16 Ω.
The maximum sine wave dissipation is 0.46 W.
The Rth j-a of the package is 155 K/W.
Therefore Tamb(max) = 150 − 155 × 0.46 = 78 °C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
18
V2, 4
input voltage pins 2 and 4
−
5
V
IORM
repetitive peak output current
−
1.25
A
IOSM
non-repetitive peak output current
−
1.5
A
Ptot
total power dissipation
TDA7052B
−
1.25
W
TDA7052BT
−
0.8
W
V
Tamb ≤ 25 °C
Tamb
operating ambient temperature
−40
+85
°C
Tstg
storage temperature
−55
+150
°C
Tvj
virtual junction temperature
−
+150
°C
Tsc
short-circuit time
−
1
h
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
1997 Aug 15
PARAMETER
VALUE
UNIT
TDA7052B
100
K/W
TDA7052BT
155
K/W
thermal resistance from junction to ambient in free air
4
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
CHARACTERISTICS
VP = 6 V; VDC = 1.4 V; f = 1 kHz; RL = 8 Ω; Tamb = 25 °C; unless otherwise specified (see Fig.13).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
4.5
−
18
V
−
9.2
13
mA
TDA7052B
0.9
1.0
−
W
TDA7052BT
0.5
0.55
−
W
0.3
1
%
VP
supply voltage
Iq(tot)
total quiescent current
note 1; RL = ∞
Maximum gain (V4 = 1.4 V)
PO
THD
output power
THD = 10%
total harmonic distortion
TDA7052B
PO = 0.5 W
−
TDA7052BT
PO = 0.25 W
−
0.3
1
%
Gv(max)
maximum total voltage gain
39.5
40.5
41.5
dB
VI
input signal handling (RMS value) Gv(max) = 0 dB; THD < 1%
1.0
−
−
V
−
μV
Vno
noise output voltage (RMS value)
note 2; f = 500 kHz
−
210
B
bandwidth
at −1 dB
−
0.02 to 300 −
SVRR
supply voltage ripple rejection
note 3
48
60
−
⎪ΔVO⎪
DC output offset voltage
⎪V8 − V5⎪
−
0
200
mV
ZI
input impedance (pin 3)
15
20
25
kΩ
−
−
30
μV
68
73.5
−
dB
−20
−25
−30
μA
kHz
dB
Mute position
VO
output voltage in mute position
note 4; V4 ≤ 0.4 V;
VI = 1.0 V
DC volume control; note 5
φ
gain control
I4
control current
V4 = 0 V
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and B = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
1997 Aug 15
5
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
MBH372
40
MBH373
1
handbook, halfpage
handbook, halfpage
Gv
(dB)
0
Vno
(mV)
−40
10−1
−80
−120
10−2
0
0.4
0.8
1.2
1.6
V
DC
2.0
(V)
0
0.4
0.8
1.2
1.6
2.0
VDC (V)
Measured with RS = 5 kΩ unweighted.
Frequency range is 22 Hz to 22 kHz.
Fig.3
Gain control as a function of DC volume
control.
Fig.4
MBH376
25
Noise output voltage as a function of DC
volume control.
MBH367
20
handbook, halfpage
handbook, halfpage
IDC
(μA)
IP
(mA)
15
15
5
−5
10
−15
−25
5
0
Fig.5
0.4
0.8
1.2
0
1.6
2.0
VDC (V)
8
12
16
VP (V)
20
Measured with RL = ∞.
Control current as a function of DC volume
control.
1997 Aug 15
4
Fig.6 Quiescent current versus supply voltage.
6
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
MBH368
10
MBH369
10
handbook, halfpage
handbook, halfpage
THD
(%)
8
THD
(%)
8
(1)
(3)
(2)
6
6
(1)
4
4
2
2
0
10−1
1
0
10−2
10
PO (W)
(1) VP = 5 V; RL = 8 Ω.
(2) VP = 6 V; RL = 8 Ω.
(3) VP = 12 V; RL = 25 Ω.
Fig.7
(2)
10−1
1
10
f (kHz)
102
PO = 0.1 W.
(1) Gv(max) = 40 dB.
(2) Gv(max) = 30 dB.
Total harmonic distortion versus output
power.
Fig.8 Total harmonic distortion versus frequency.
MBH370
2.5
PO
(W)
MBH371
handbook, halfpage
2.5
Pd
(W)
handbook, halfpage
2.0
(2)
(3)
2.0
1.5
1.5
(1)
1.0
(1)
(2)
(3)
8
12
1.0
0.5
0.5
0
0
4
8
12
16
VP (V)
20
0
0
Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
4
16
VP (V)
20
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
(3) RL = 25 Ω.
Fig.10 Total worst case power dissipation versus
supply voltage.
Fig.9 Output power versus supply voltage.
1997 Aug 15
7
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
MBH374
−20
MBH375
2.0
VI
(V)
handbook, halfpage
handbook, halfpage
SVRR
(dB)
−30
1.6
(1)
−40
1.2
−50
0.8
(2)
−60
−70
10−2
0.4
10−1
1
10
f (kHz)
0
102
4
0
Measured with VR = 0.2 V.
(1) VDC = 1.4 V.
(2) VDC = 0.4 V.
12
16
VP (V)
Measured at a THD of 1% and a voltage gain of 0 dB.
Fig.11 Supply voltage ripple rejection versus
frequency.
Fig.12 Input signal handling.
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”, if this type is used as an audio amplifier.
1997 Aug 15
8
8
20
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
TEST AND APPLICATION INFORMATION
(1)
VP = 6 V
handbook, full pagewidth
220 μF
100 nF
1
n.c.
7
TDA7052B
TDA7052BT
input
0.47 μF
5
I + i
+
2
4
RL = 8 Ω
8
I – i
−
RS
5 kΩ
DC
volume
control
STABILIZER
TEMPERATURE
PROTECTION
3
6
MSA706 - 2
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 μF electrolytic capacitor is connected close to pin 1.
Fig.13 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MCL) will be activated.
1997 Aug 15
9
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
handbook, halfpage
TDA7052B
VP = 6 V
handbook, halfpage
volume
control
volume
control
4
56 kΩ
4
1 μF
1 MΩ
1 μF
22 kΩ
MCD387
MBH360
Fig.14 Application with potentiometer as volume
control; maximum gain = 34 dB.
1997 Aug 15
Fig.15 Application with potentiometer as volume
control; maximum gain = 40 dB.
10
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
1997 Aug 15
11
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
inches
0.010 0.057
0.069
0.004 0.049
0.05
0.244
0.039 0.028
0.041
0.228
0.016 0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
1997 Aug 15
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
12
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
SOLDERING
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Aug 15
TDA7052B
13
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
1997 Aug 15
14
NXP Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
1997 Aug 15
TDA7052B
15
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/03/pp16
Date of release: 1997 Aug 15
Document order number:
9397 750 02729
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