LT3667 - 40V 400mA Step-Down Switching Regulator with Dual Fault Protected LDOs

LT3667
40V 400mA Step-Down
Switching Regulator with
Dual Fault Protected LDOs
DESCRIPTION
FEATURES
Triple Output Supply from a Single Input Requires
Only One Inductor
n I = 50μA at 12V to 5V, 3.3V and 2.5V with No Load
Q
IN
n Buck Regulator:
Low Ripple (<15mVP-P) Burst Mode Operation®
400mA Output with Internal Power Switch
4.3V to 40V Input Operation Range (60V Max)
n Dual Low Dropout Linear Regulators
200mA Outputs with Programmable Current Limits
1.6V to 45V Input Range
Fault Protected to ±45V
n Adjustable 250kHz to 2.2MHz Switching Frequency
n Synchronizable Between 300kHz and 2.2MHz
n Programmable Undervoltage Lockout
n Power Good Indicators
n Available in a Thermally-Enhanced 16-Lead MSOP
and 24-Lead (3mm × 5mm) QFN Packages
The LT®3667 is a monolithic triple power supply composed
of a 400mA buck switching regulator and two 200mA low
dropout linear regulators (LDOs).
APPLICATIONS
The LT3667 is available in a thermally-enhanced 16-Lead
MSOP and a 24-Pin 3mm x 5mm QFN package with exposed pad for low thermal resistance.
n
n
n
n
n
The buck regulator includes a high efficiency switch, a
boost diode, and the necessary oscillator, control and
logic circuitry. Current mode topology is used for fast
transient response and good loop stability. Low ripple
Burst Mode operation maintains high efficiency at low
output currents while keeping output ripple below 15mV
in a typical application.
Each LDO supplies 200mA of output current with a typical
dropout voltage of 340mV, and each LDO has an accurate
resistor programmable current limit.
Internal protection circuitry includes reverse-battery
protection, current limiting, thermal limiting and reverse
current protection.
Automotive Battery Regulation
Power for Portable Instrumentation
Industrial Supplies
Fault-Protected Sensor Supply
L, LT, LTC, LTM, Burst Mode, Linear Technology and the Linear logo are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners.
TYPICAL APPLICATION
VIN
6V TO 40V
TRANSIENT
TO 60V
No-Load Supply Current
ON OFF
UVLO1 IN1
BOOST
SW
EN
RT
OUT2
499k
FB2
158k
22pF
BD
IN2
IN3
OUT3
340k
4.7µF
931k
LT3667
174k
22µF
5V
200mA
294k
3.3V
100mA
80
70
60
50
40
30
20
10
2.2µF
FB3
EN2/ILIM2 GND EN3/ILIM3
90
0.22µF 22µH
DA
FB1
PG
2.5V
100mA
100
SUPPLY CURRENT (µA)
4.7µF
158k
3667 TA01a
0
5
10
25
20
15
INPUT VOLTAGE (V)
30
35
3667 TA01b
3667fb
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1
LT3667
ABSOLUTE MAXIMUM RATINGS
(Notes 1, 2)
FB2, FB3 Voltage......................................................±45V
OUT2, OUT3 Voltage................................................±45V
IN2, IN3 (QFN) Voltage.............................................±45V
OUT2 – IN2 Differential Voltage...............................±45V
OUT3 – IN3/BD Differential Voltage (MSOP)...........±45V
OUT3 – IN3 Differential Voltage (QFN).....................±45V
IN1, EN, UVLO1 (QFN) Voltage (Note 3).....................60V
IN1 Reverse Voltage................................................–0.3V
EN Pin Current........................................................–1mA
IN3/BD (MSOP) Voltage.............................................30V
BD (QFN) Voltage.......................................................30V
BOOST Pin Voltage....................................................50V
BOOST Pin Above SW Pin..........................................30V
RT Voltage...................................................................2V
FB1 Voltage..................................................................6V
EN2/ILIM2, EN3/ILIM3 Voltage....................................4V
PG Voltage.................................................................30V
PG1, PG2, PG3 Voltage (QFN)....................................30V
SYNC Voltage (QFN)....................................................6V
Operating Junction Temperature Range (Notes 4, 5)
E-, I-Grades........................................ −40°C to 125°C
H-Grades............................................ −40°C to 150°C
Storage Temperature Range................... −65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSOP Package Only.......................................... 300°C
PIN CONFIGURATION
NC
NC
DA
SW
TOP VIEW
24 23 22 21
BOOST 1
17
GND
16
15
14
13
12
11
10
9
DA
IN1
PG
EN3/ILIM3
EN2/ILIM2
IN2
OUT2
FB2
19 UVLO1
EN 3
18 PG
RT 4
17 EN3/ILIM3
25
GND
BD 5
16 EN2/ILIM2
IN3 6
15 IN2
OUT3 7
MSE PACKAGE
16-LEAD PLASTIC MSOP
θJA = 40°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
14 OUT2
FB3 8
13 FB2
PG1
9 10 11 12
PG3
1
2
3
4
5
6
7
8
PG2
SW
BOOST
EN
RT
IN3/BD
OUT3
FB3
FB1
20 IN1
SYNC 2
FB1
TOP VIEW
UDD PACKAGE
24-LEAD (3mm × 5mm) PLASTIC QFN
θJA = 46°C/W
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB
2
3667fb
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LT3667
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT3667EMSE#PBF
LT3667EMSE#TRPBF
3667
16-Lead Plastic MSOP
–40°C to 125°C
LT3667IMSE#PBF
LT3667IMSE#TRPBF
3667
16-Lead Plastic MSOP
–40°C to 125°C
LT3667HMSE#PBF
LT3667HMSE#TRPBF
3667
16-Lead Plastic MSOP
–40°C to 150°C
LT3667EUDD#PBF
LT3667EUDD#TRPBF
LGFH
24-Lead (3mm × 5mm) Plastic QFN
–40°C to 125°C
LT3667IUDD#PBF
LT3667IUDD#TRPBF
LGFH
24-Lead (3mm × 5mm) Plastic QFN
–40°C to 125°C
LT3667HUDD#PBF
LT3667HUDD#TRPBF
LGFH
24-Lead (3mm × 5mm) Plastic QFN
–40°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping
container. Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN1 = 12V unless otherwise noted. (Note 4)
PARAMETER
CONDITIONS
VIN1 Undervoltage Lockout (Note 6)
VIN2 = 0V, VIN3 = 0V
VIN1 Overvoltage Lockout
MIN
l
l
VIN2 Undervoltage Lockout (Note 6)
VIN1 = 3.5V, VIN3 = 0V
l
UVLO1 Threshold Voltage
Pin Voltage Falling
l
40
0.95
UVLO1 Pin Hysteresis
VUVLO1 = 1V
Quiescent Current from IN1
VEN = 0.3V
VEN = 12V, VIN2 = 0V, Not Switching
Quiescent Current from IN1 + IN2
Quiescent Current from IN3
EN Pin Current
MAX
4
4.3
V
42
44
V
4
4.3
V
1
1.05
V
75
UVLO1 Pin Current
Quiescent Current from IN2
TYP
UNITS
mV
1
30
nA
l
0.01
13
1
30
µA
µA
VEN = 0.3V
VEN = 12V, VIN1 = 0V, VIN2 = 5V
l
0.01
38
1
80
µA
µA
VEN = 0.3V, VIN2 = 5V
VEN = 12V, VIN2 = 5V, Not Switching
l
0.01
40
1
90
µA
µA
VEN = 0.3V, VIN3 = 5V
VEN = 12V, VIN3 = 5V
l
0.01
25
1
60
µA
µA
VEN = 12V
0.6
EN Input Threshold
2
µA
1.1
V
0.1
1
µA
0.2
0.3
V
90
110
92
112
%
%
0.3
Power Good Pins PG (MSOP), PG1, PG2, PG3 (QFN)
Leakage Current
VPG = 5V, VPG1/2/3 = 5V
Output Voltage Low
IPG = 40µA, IPG1/2/3 = 40µA
Threshold as % of VFB (FB1, FB2, FB3)
Pin Voltage Falling
Pin Voltage Rising
PG1 Threshold Hysteresis
Measured at FB1 Pin
30
mV
PG2/PG3 Threshold Hysteresis
Measured at FB2/FB3 Pin
20
mV
l
88
108
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LT3667
ELECTRICAL
CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN1 = 12V unless otherwise noted. (Note 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
1.8
0.8
220
2.0
0.94
243
2.1
1.1
275
MHz
MHz
kHz
120
170
ns
750
550
950
750
mA
mA
Switching Regulator
Switching Frequency
RT = 37.4k
RT = 102k
RT = 487k
Minimum Switch Off-Time
l
Switch Current Limit (Note 7)
5% Duty Cycle, VIN = 5V, VFB1 = 0V
90% Duty Cycle, VIN = 5V, VFB1 = 0V
Switch VCESAT
ISW = 200mA
DA Pin Current to Stop Switching
Switch Leakage Current
l
l
l
l
l
600
450
300
l
420
VSW = 0V
mV
500
650
mA
0.05
2
µA
Boost Schottky Diode Forward Voltage
IBOOSTDIODE = 50mA, VIN = NC, VBOOST = 0V
900
Boost Schottky Diode Reverse Leakage
VREVERSE = 12V, VIN = NC
0.04
4
µA
1.7
2.5
V
Minimum Boost Voltage (Note 8)
BOOST Pin Current
l
ISW = 200mA, VBOOST = 15V
Feedback Voltage (FB1)
l
FB1 Pin Bias Current
Pin Voltage = 1.2V
Reference Voltage Line Regulation
4.2V < VIN1 < 40V
SYNC High Level Input Voltage
SYNC Low Level Input Voltage
1.188
1.176
l
l
l
SYNC Input Frequency
mV
10
16
mA
1.2
1.2
1.212
1.224
V
mV
0.1
20
nA
0.001
0.005
%/V
1.2
0.5
V
V
2.2
MHz
1.6
2.2
V
800
808
816
mV
mV
0.3
Each LDO Regulator
Minimum Input Voltage
ILOAD = 200mA
l
Feedback Voltage (FB2/FB3)
VIN = 2.2V, ILOAD = 1mA
2.2V < VIN < 15V, 1mA < ILOAD < 200mA
l
Load Regulation (Note 12)
VIN = 2.2V, ILOAD = 1mA to 200mA
l
Reference Voltage Line Regulation (Note 12)
2.2V < VIN2,3 < 45V
Dropout Voltage (Notes 9, 10), VIN = VOUT(NOMINAL)
ILOAD = 1mA
ILOAD = 1mA
l
ILOAD = 50mA
ILOAD = 50mA
l
ILOAD = 100mA
ILOAD = 100mA
l
ILOAD = 200mA
ILOAD = 200mA
l
ILOAD = 0mA
ILOAD = 50mA
ILOAD = 200mA
l
l
l
GND Pin Current, VIN = VOUT(NOMINAL) + 0.6V
(Notes 10, 11)
792
784
Quiescent Current IIN2 with LDO2 Disabled
VIN1 = 0V, VIN2 = 12V, VEN2/ILIM2 = 2V
Quiescent Current IIN3 with LDO3 Disabled (QFN)
VIN1 = 16V, VIN3 = 12V, VEN3/ILIM3 = 2V
Quiescent Current IIN3/BD with LDO3 Disabled (MSOP) VIN1 = 16V, VIN3/BD = 12V, VEN3/ILIM3 = 2V
FB2 Pin Bias Current (Note 12)
FB3 Pin Bias Current (Note 12)
VIN2 = 12V
VIN3 = 12V
Ripple Rejection (Note 12)
VIN – VOUT = 2V (Avg), VRIPPLE = 0.5VP-P,
fRIPPLE = 120Hz, ILOAD =200mA
4
l
l
60
0.2
5
mV
0.005
0.01
%/V
70
165
210
mV
mV
230
300
400
mV
mV
280
400
450
mV
mV
340
650
750
mV
mV
40
1
5
90
2
10
µA
mA
mA
13
0.2
1.2
20
1
2
µA
µA
µA
–3
–3
±40
±40
nA
nA
85
dB
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LT3667
ELECTRICAL
CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN1 = 12V unless otherwise noted. (Note 4)
PARAMETER
CONDITIONS
MIN
Reverse Output Current (Note 13)
VOUT2 = 1.2V, VIN1 = VIN2 = VIN3 = 0V
VOUT3 = 1.2V, VIN1 = VIN2 = VIN3 = 0V
Input Reverse Leakage Current LDO2
Input Reverse Leakage Current LDO3 (QFN)
VIN2 = –45V, VIN1 = VIN3 = VOUT2 = 0V
VIN3 = –45V, VIN1 = VIN2 = VOUT3 = 0V
Internal Current Limit (Note 12)
VIN2 = 2.2V, VOUT2 = 0V, EN2/ILIM2 Pin Grounded
TYP
MAX
5
5
40
40
µA
µA
300
300
µA
µA
l
l
300
mA
l
220
∆VOUT3 = –5%
l
220
Externally Programmed Current Limit
REN/ILIM = 31.6k, VOUT2/3 = 5V, VIN2/3 ≥ 5.6V
REN/ILIM = 6.19k, VOUT2/3 = 5V, VIN2/3 ≥ 5.6V
REN/ILIM = 6.19k, VOUT2/3 = 5V, 5.6V ≤ VIN2/3 ≤ 15V
REN/ILIM = 1.54k, VOUT2/3 = 5V, 5.6V ≤ VIN2/3 ≤ 15V
l
l
l
l
9.5
47
48.45
176
10
51
51
197
10.5
55
53.55
230
LDO Disable Threshold
VEN/ILIM Rising
0.9
1
1.2
∆VOUT2 = –5%
VIN3 = 2.2V, VOUT3 = 0V, EN3/ILIM3 Pin Grounded
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Positive currents flow into pins, negative currents flow out of pins.
Minimum and maximum values refer to absolute values.
Note 3: Absolute maximum voltage at the IN1, UVLO1 and EN pins is 60V
for nonrepetitive 1 second transients, and 40V for continuous operation.
Note 4: The LT3667E is guaranteed to meet performance specifications
from 0°C to 125°C junction temperature. Specifications over the −40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LT3667I is guaranteed over the full −40°C to 125°C operating junction
temperature range. The LT3667H is guaranteed over the full −40°C to
150°C operating junction temperature range.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed the maximum operating junction temperature
when overtemperature protection is active. Continuous operation above
the specified maximum operating junction temperature may impair device
reliability.
Note 6: This is the voltage necessary to keep the internal bias circuitry in
regulation.
UNITS
mA
300
mA
mA
mA
mA
mA
mA
V
Note 7: Current limit guaranteed by design and/or correlation to static test.
Slope compensation reduces current limit at higher duty cycles.
Note 8: This is the minimum voltage across the boost capacitor needed to
guarantee full saturation of the switch.
Note 9: Dropout voltage is the minimum input-to-output voltage
differential needed for an LDO to maintain regulation at a specified output
current. When an LDO is in dropout, its output voltage will be equal to
VIN – VDROP.
Note 10: To satisfy minimum input voltage requirements, the LT3667 is
tested and specified for these conditions with an external resistor divider
(80.6k bottom, 422k top) which sets VOUT to 5V. The external resistor
divider adds 9.93μA of DC load on the output. This external current is not
factored into GND pin current.
Note 11: GND pin current is tested with VIN = VOUT(NOMINAL) + 0.6V and a
current source load. GND pin current increases in dropout.
Note 12: The LT3667 is tested and specified for these conditions with FB2
(FB3) pin connected to the OUT2 (OUT3) pin.
Note 13: Reverse output current is tested with the IN2 (IN3) pin grounded
and the OUT2 (OUT3) pin forced to the rated output voltage. This current
flows into the OUT2 (OUT3) pin and out of the GND pin.
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LT3667
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency, VOUT = 3.3V
Efficiency, VOUT = 5V
80
70
EFFICIENCY (%)
40
30
FRONT PAGE APPLICATION
BUCK REGULATOR ONLY
VOUT1 = 3.3V
L: MSS7341-223MLB
20
10
0
0.01
0.1
1
10
LOAD CURRENT (mA)
VIN1 = 24V
60
VIN1 = 36V
50
1.20
40
FRONT PAGE APPLICATION
BUCK REGULATOR ONLY
VOUT1 = 5V
L: MSS7341-223MLB
20
10
0
0.01
100
0.1
1
10
LOAD CURRENT (mA)
100
1.15
792
1.10
–50 –25
SUPPLY CURRENT (A)
80
50
40
FRONT PAGE APPLICATION
VOUT1 = 3.3V
650
1m
INCREASED SUPPLY CURRENT
DUE TO CATCH DIODE LEAKAGE
AT HIGH TEMPERATURE
100µ
30
784
25 50 75 100 125 150
TEMPERATURE (°C)
Maximum Load Current
700
FRONT PAGE APPLICATION
CATCH DIODE: CMMSH1-60
FRONT PAGE APPLICATION
60
0
3667 G03
No-Load Supply Current
70
VFB1
VFB2
VFB3
3667 G02
No-Load Supply Current
90
800
30
3667 G01
100
808
VFB2/3 (mV)
VIN1 = 36V
50
1.25
VIN1 = 12V
70
VIN1 = 24V
60
816
VFB1 (V)
VIN1 = 12V
1.30
LOAD CURRENT (mA)
80
EFFICIENCY (%)
VFB1/2/3 vs Temperature
90
90
SUPPLY CURRENT (µA)
TA = 25°C, unless otherwise noted.
20
600
TYPICAL
550
500
MINIMUM
450
10
0
5
10
25
20
15
30
INPUT VOLTAGE (V)
35
10µ
–50 –25
40
0
500
450
400
10
25
20
30
15
INPUT VOLTAGE (V)
0.02
0
–0.02
–0.04
SWITCH PEAK
CURRENT LIMIT
700
600
CATCH DIODE VALLEY CURRENT LIMIT
500
–0.08
35
40
3667 G07
6
0.04
–0.06
MINIMUM
5
SWITCH CURRENT LIMIT (mA)
LOAD REGULATION (%)
LOAD CURRENT (mA)
0.06
TYPICAL
40
800
FRONT PAGE APPLICATION
0.08 REFERENCED FROM V
OUT1 AT 200mA LOAD
FRONT PAGE APPLICATION
VOUT1 = 5V
550
35
Switch Current Limit
0.10
600
25
20
30
15
INPUT VOLTAGE (V)
10
3667 G06
Switching Regulator
Load Regulation
Maximum Load Current
650
5
3667 G05
3667 G04
700
400
25 50 75 100 125 150
TEMPERATURE (°C)
–0.10
0
50
100 150 200 250 300 350 400
LOAD CURRENT (mA)
3667 G08
400
0
20
60
40
DUTY CYCLE (%)
80
100
3667 G09
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LT3667
TYPICAL PERFORMANCE CHARACTERISTICS
200
2.4
2.2
RT = 37.4k
2.0
0% DUTY CYCLE
FREQUENCY (MHz)
SWITCH CURRENT LIMIT (mA)
900
800
700
600
Minimum Switch On-Time/
Switch-Off Time
Switching Frequency
100% DUTY CYCLE
SWITCH ON-TIME/SWITCH OFF-TIME (ns)
Switch Current Limit
TA = 25°C, unless otherwise noted.
1.8
1.6
1.4
1.2
RT = 95.3k
1.0
0.8
0.6
500
0.4
CATCH DIODE VALLEY CURRENT LIMIT
400
–50 –25
0
RT = 487k
0.2
0
–50 –25
25 50
75 100 125 150
TEMPERATURE (°C)
0
80
60
40
20
5.0
300
200
TJ = –50°C
TJ = 25°C
TJ = 125°C
TJ = 150°C
100
0
100
200 300 400 500 600
SWITCH CURRENT (mA)
700
16
INPUT VOLTAGE VIN1 (V)
400
14
12
10
8
6
TA = 150°C
TA = 25°C
TA = –50°C
4
2
0
100
200
300
400
500
SWITCH CURRENT (mA)
3667 G13
FRONT PAGE APPLICATION
VEN = VIN1, VOUT1 = 3.3V
600
4.5
TO RUN
3.5
3.0
3.5
0
50
100 150 200 250 300 350 400
LOAD CURRENT IOUT1 (mA)
3667 G15
Transient Load Response
Load Step 150mA to 300mA
FRONT PAGE APPLICATION
5.5
TO START
4.0
Transient Load Response,
Load Step 10mA to 140mA
TO START
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G14
Minimum Input Voltage,
VOUT = 5V
6.0
0
Minimum Input Voltage,
VOUT = 3.3V
18
BOOST PIN CURRENT (mA)
SWITCH VCESAT (mV)
MINIMUM ON-TIME
100
3667 G12
20
500
INPUT VOLTAGE VIN1 (V)
120
BOOST Pin Current
600
6.5
MINIMUM OFF-TIME
3667 G11
Switch VCESAT
0
160
140
0
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G10
LOAD CURRENT = 200mA
180
FRONT PAGE APPLICATION
VOUT1
100mV/DIV
VOUT1
100mV/DIV
IL
100mA/DIV
IL
150mA/DIV
TO RUN
5.0
4.5
4.0
FRONT PAGE APPLICATION
VEN = VIN1, VOUT1 = 5V
0
50
100 150 200 250 300 350 400
LOAD CURRENT IOUT1 (mA)
100µs/DIV
3667 G17
100µs/DIV
3667 G18
3667 G16
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LT3667
TYPICAL PERFORMANCE CHARACTERISTICS
Switching Waveforms,
Burst Mode Operation
TA = 25°C, unless otherwise noted.
Switching Waveforms, Full
Frequency Continuous Operation
EN Threshold
1.0
0.9
VSW
5V/DIV
IL
100mA/DIV
IL
200mA/DIV
VOUT1
5mV/DIV
VOUT1
5mV/DIV
ILOAD = 10mA
FRONT PAGE APPLICATION
THRESHOLD VOLTAGE (V)
VSW
5V/DIV
3667 G19
0.5
0.4
0.3
0.2
0
–50 –25
3667 G20
1µs/DIV
0.6
0.1
ILOAD = 400mA, FRONT PAGE APPLICATION
1µs/DIV
0.8
0.7
0
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G21
LDOs:
Typical Dropout Voltage
600
1.0
500
DROPOUT VOLTAGE (mV)
EN PIN CURRENT (µA)
0.6
0.4
0.2
800
TA = –50°C
TA = 25°C
TA = 125°C
TA = 150°C
550
0.8
LDOs:
Guaranteed Dropout Voltage
450
400
350
300
250
200
150
100
0
5
25 30
10 15 20
EN PIN VOLTAGE (V)
35
0
40
0
180
20
10
0
–50 –25
VIN2/3 = 5V
VEN = 0.3V
0
3667 G25
8
140
120
100
80
60
VEN2/ILIM2 = 0V
40
20
25 50 75 100 125 150
TEMPERATURE (°C)
0
20 40 60 80 100 120 140 160 180 200
OUTPUT CURRENT (mA)
LDOs:
5V Quiescent Current IN3
0
180
5
10
15
20 25
VIN2 (V)
30
140
120
100
80
60
VEN3/ILIM3 = 0V
40
20
VEN2/ILIM2 = 2V
0
VIN1 = VEN = 12V
160
QUIESCENT CURRENT IIN3 (µA)
QUIESCENT CURRENT IIN2 (µA)
QUIESCENT CURRENT (µA)
IN3
30
200
3667 G24
VIN1 = VEN = 12V
160
IN2
TJ = 25°C
300
LDOs:
5V Quiescent Current IN2
60
40
400
3667 G23
LDOs:
IN2, IN3 Quiescent Current
VIN2/3 = 5V
VEN = 2V, VIN1 = 0
VOUT2/3 = 0.8V
ILOAD = 5µA
TJ = 150°C
500
0
20 40 60 80 100 120 140 160 180 200
OUTPUT CURRENT (mA)
3667 G22
50
600
100
50
0
= TEST POINTS
700
DROPOUT VOLTAGE (mV)
EN Pin Current
35
40
45
3667 G26
0
VEN3/ILIM3 = 2V
0
5
10
15
20 25
VIN3 (V)
30
35
40
45
3667 G27
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LT3667
TYPICAL PERFORMANCE CHARACTERISTICS
LDOs:
Internal Current Limit
FB2, FB3 Pin Bias Current
325
4
300
FB3
FB2
1
200
150
100
TA = 140°C
TA = 125°C
TA = 25°C
TA = –50°C
50
0
25 50
75 100 125 150
TEMPERATURE (°C)
0
5
10 15 20 25 30 35 40
INPUT/OUTPUT DIFFERENTIAL (V)
50
45
40
0.7
35
CURRENT (µA)
0.8
0.6
0.5
0.4
20
15
10
0.1
5
10
15
25 30
VOUT2/3 (V)
20
35
40
IOUT2/3
0
–50 –25
45
0
1.4
1.2
1.0
0.8
0.6
0.4
0
25 50 75 100 125 150
TEMPERATURE (°C)
–1
–2
–3
3667 G34
∆IOUT2/3 = 1mA TO 200mA
VOUT2/3 = 0.8V
VIN2/3 = 2.2V
VIN1 = 5V
–5
–50 –25
0
45
OUT2
(VIN1 = 12V)
50
40
30
20
0
IOUT2/3 = 200mA
VOUT2/3 = 5V
VIN2/3 = 5.8V + 50mVRMS RIPPLE
10
1k
10k 100k
FREQUENCY (Hz)
100
1M
10M
3667 G33
LDOs:
Output Noise Spectral Density
0
–4
0.2
0
–50 –25
60
10
25 50 75 100 125 150
TEMPERATURE (°C)
1
LOAD REGULATION (mV)
1.6
40
OUT3 (VIN1 = 12V)
70
LDOs:
Load Regulation
IL = 200mA
VOUT2/3 = 0.8V
VIN1 = 5V
1.8
15 20 25 30 35
OUTPUT VOLTAGE (V)
3667 G32
LDOs:
Minimum Input Voltage
2.0
80
IFB2/3
3667 G31
2.2
10
90
VOUT2/3 = VFB2/3 = 2V
VIN2/3 = 0V
25
0.2
5
5
LDOs:
Input Ripple Rejection
30
0.3
0
0
3667 G30
LDOs:
Reverse Output Current
ALL PINS GROUNDED
EXCEPT FOR OUT2/3
0.9
TA = 140°C
TA = 125°C
TA = 25°C
TA = –50°C
3667 G29
LDOs:
Reverse Output Current
1.0
250
200
45
INPUT RIPPLE REJECTION (dB)
0
275
225
OUTPUT NOISE SPECTRAL DENSITY (µV/√Hz)
2
CURRENT LIMIT (mA)
3
250
3667 G28
IOUT2/3 (nA)
VIN2/3-VOUT2/3(NOMINAL) = 1V
300
0
–50 –25
MINIMUM INPUT VOLTAGE (V)
LDOs:
Internal Current Limit
350
CURRENT LIMIT (mA)
FB2/3 PIN BIAS CURRENT (nA)
5
0
TA = 25°C, unless otherwise noted.
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G35
10
1
VOUT2/3 = 5V
VOUT2/3 = 3.3V
VOUT2/3 = 2.5V
VOUT2/3 = 1.8V
VOUT2/3 = 1.5V
VOUT2/3 = 1.2V
VOUT2/3 = 0.8V
0.1
0.01
10
100
COUT = 10µF
IL = 200mA
1k
10k
FREQUENCY (Hz)
100k
3667 G36
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9
LT3667
TYPICAL PERFORMANCE CHARACTERISTICS
LDOs:
RMS Output Noise
350
COUT = 10µF
fOUT = 10Hz TO 100kHz
LDOs:
Channel-to-Channel Isolation
IOUT2/3 = 20mA TO 200mA
VOUT2/3 = 5V
VOUT2/3
100mV/DIV
300
250
VOUT2/3 = 3.3V
200
VOUT2/3 = 2.5V
150
VOUT2/3 = 1.8V
VOUT2/3
50mV/DIV
50
VOUT2/3 = 1.2V
0.1
VOUT2/3 = 0.8V
VOUT2/3 = 1.5V
1
10
LOAD CURRENT (mA)
200µs/DIV
VIN2/3 = 6V, VOUT2/3 = 5V
CIN2/3 = COUT2/3 = 10µF
100
LDOs: External Current Limit,
REN/ILIM = 1.54k
52.0
VIN2/3 = 5.6V
VIN2/3 = 10V
195
190
185
VIN2/3 = 15V
180
175
170
–50 –25
51.0
LDOs: External Current Limit,
REN/ILIM = 31.6k
10.2
VIN2/3 = 5.6V
VIN2/3 = 10V
50.5
50.0
3667 G39
VIN2/3 = 15V
49.5
49.0
VOUT2/3 = 5V
10.1
VIN2/3 = 5.6V
VIN2/3 = 10V
10.0
VIN2/3 = 15V
9.9
48.5
0
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G40
10
100µs/DIV
VOUT2/3 = 5V
51.5
CURRENT LIMIT (mA)
200
3667 G38
LDOs: External Current Limit,
REN/ILIM = 6.19k
VOUT2/3 = 5V
205
IOUT2/3 = 20mA TO 200mA
VIN2/3 = 6V, VOUT2/3 = 5V
CIN2/3 = COUT2/3 = 10µF
IOUT3/2 = 20mA
3667 G37
210
IOUT2/3
100mV/DIV
VOUT3/2
50mV/DIV
100
0
0.01
CURRENT LIMIT (mA)
LDOs:
Transient Response
CURRENT LIMIT (mA)
OUTPUT NOISE VOLTAGE (µVRMS)
400
TA = 25°C, unless otherwise noted.
48.0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G41
9.8
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3667 G42
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LT3667
PIN FUNCTIONS
(MSOP/QFN)
SW (Pin 1/Pin 24): The SW pin is the output of the internal
power switch. Connect this pin to the inductor, the catch
diode and the boost capacitor.
voltage. PG1 output is valid when VIN1 or VIN2 are above
the minimum input voltage and EN is high.
BOOST (Pin 2/Pin 1): This pin is used to provide a drive
voltage, higher than the input voltage, to the internal bipolar
NPN power switch of the switching regulator. Connect
a capacitor (typically 0.22μF) between BOOST and SW.
IN2 (Pin 11/Pin 15), IN3/BD (Pin 5, MSOP), IN3 (Pin 6,
QFN): These pins are the inputs of the two LDOs. IN3/BD
also connects to the anode of the internal boost diode and
also supplies current to the LT3667’s internal regulator
when IN3/BD is above 3.2V.
SYNC (Pin 2, QFN Only): This is the external clock synchronization input. Ground this pin for low ripple Burst
Mode operation at low output loads. Tie to a clock source
for synchronization. Refer to Synchronization section in
Applications Information for more details.
PG2 (Pin 11, QFN Only): The PG2 pin is the open-drain
output of an internal window comparator. PG2 remains
low until the FB2 pin is within ±10% of its final regulation
voltage. PG2 output is valid when VIN1 or VIN2 are above
the minimum input voltage and EN is high.
EN (Pin 3/Pin 3): The EN pin is used to put the LT3667 in
shutdown mode. Tie to ground to shut down the LT3667.
Tie to 1V or more for normal operation. If the EN pin is to
be pulled below ground, use a series resistor to limit the
pin current to 1mA.
EN2/ILIM2 (Pin 12/Pin 16), EN3/ILIM3 (Pin 13/Pin 17):
Precision current limit programming pins. They connect
to collectors of current mirror PNPs which are 1/799th
the size of the output power PNPs of the two LDOs. These
pins are also the inputs to the current limit amplifiers.
Current limit thresholds are set by connecting resistors
between the EN2/ILIM2 pin and GND and between the
EN3/ILIM3 pin and GND. Stability requirements demand
47nF capacitors in parallel to these resistors. For detailed
information on how to set the pin resistor values, see the
Operation section. If any of these pins is not used, tie it to
GND. To disable an LDO, pull its EN/ILIM pin above 1.2V.
RT (Pin 4/Pin 4): Oscillator Resistor Input. Connect a resistor from this pin to ground to set the switching frequency.
BD (Pin 5, QFN Only): This pin connects to the anode of
the internal boost diode. This pin also supplies current to
the LT3667’s internal regulator when BD is above 3.2V.
OUT3 (Pin 6/Pin 7), OUT2 (Pin 10/Pin 14): These are the
outputs of the two LDOs. Stability requirements demand
a minimum 2.2μF ceramic output capacitor to prevent
oscillations.
FB3 (Pin 7/Pin 8), FB2 (Pin 9/Pin 13): The two LDOs of
the LT3667 regulate the FB2 and FB3 pins to 0.8V. Connect
the feedback resistor divider taps to these pins.
FB1 (Pin 8/Pin 10): The switching regulator of the LT3667
regulates the FB1 pin to 1.2V. Connect the feedback resistor divider tap to this pin.
PG1 (Pin 9, QFN Only): The PG1 pin is the open-drain
output of an internal window comparator. PG1 remains
low until the FB1 pin is within ±10% of its final regulation
PG3 (Pin 12, QFN Only): The PG3 pin is the open-drain
output of an internal window comparator. PG3 remains
low until the FB3 pin is within ±10% of its final regulation
voltage. PG3 output is valid when VIN1 or VIN2 are above
the minimum input voltage and EN is high.
PG (Pin 14/Pin 18): The PG pin is the open-drain output
of an internal window comparator. PG remains low until
the FB1, FB2, and FB3 pin are within ±10% of their final
regulation voltages. PG output is valid when VIN1 or VIN2
are above the minimum input voltage and EN is high.
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11
LT3667
PIN FUNCTIONS
(MSOP/QFN)
IN1 (Pin 15/Pin 20): The IN1 pin supplies current to the
internal regulator and to the internal power switch. This
pin must be locally bypassed.
DA (Pin 16/Pin 23): Connect the anode of the catch diode
(D1 in Block Diagrams) to this pin. Internal circuitry senses
the current through the catch diode providing frequency
foldback in overload conditions.
UVLO1 (Pin 19, QFN Only): The precise 1V threshold voltage of this pin can function as an accurate undervoltage
lockout (UVLO). The switching regulator only operates
when the voltage at the UVLO1 pin exceeds this threshold.
The LDOs are not affected by this pin.
NC (Pins 21, 22, QFN only): These pins are not connected
internally and can be left floating or tied to ground.
GND (Exposed Pad Pin 17/Exposed Pad Pin 25): This is
the ground of all internal circuitry, as well as the power
ground used by the catch diode (D1). The exposed pad
must be soldered to the PCB.
12
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LT3667
BLOCK DIAGRAM
(MSOP)
R4
R3
11
IN2
R6
9
7
FB2
CURRENT LIMIT
AMPLIFIER
C4
12
EN2/
ILIM2
80Ω
0.4V
14
VIN1
15
+
–
+
–
1V
0.72V
+ –
LDO
DISABLE
IN3/
BD
LDO
DRIVER
OUT3
CURRENT LIMIT
0.72V
AMPLIFIER
+
–
80Ω
6
C5
EN3/
ILIM3
VOUT3
13
0.4V
+
–
LDO
DISABLE
1V
PG
IN1
–
+
C1
3
0.88V
+ –
10
–
+
+
–
VOUT2
OUT2
5
FB3
ERROR
AMPLIFIER
ERROR
AMPLIFIER
LDO
DRIVER
R5
0.8V
INTERNAL REF
1.2V
EN
SLOPE COMP
OSCILLATOR
250kHz TO 2.2MHz
ERROR
AMPLIFIER
+ –
+
–
1.32V
1.08V
GND
17
VC
8
R1
B00ST
R
S
Burst Mode
DETECT
FB1
R2
BOOST
DIODE
RT
2
Q
SW
–
+
DA
1
C2
L1
D1
VOUT1
C3
16
CATCH DIODE
CURRENT LIMIT
4
RT
3667 BD MSOP
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13
LT3667
BLOCK DIAGRAM
(QFN)
R4
R3
15
IN2
LDO
DRIVER
OUT2
C4
16
EN2/
ILIM2
80Ω
CURRENT LIMIT
AMPLIFIER
0.4V
1V
18
11
12
0.72V
+
–
+
–
+ –
R5
8
6
IN3
FB3
ERROR
AMPLIFIER
–
+
0.88V
+ –
14
13
FB2
ERROR
AMPLIFIER
+
–
VOUT2
R6
LDO
DISABLE
LDO
DRIVER
OUT3
+
–
80Ω
EN3/
ILIM3
20
1V
PG2
PG3
IN1
–
+
C1
19
3
UVLO1
0.8V
INTERNAL REF
1.2V
EN
1.08V
+
–
OSCILLATOR
250kHz TO 2.2MHz
1.32V
PG1
VC
B00ST
R
S
25
FB1
R2
10
R1
SYNC
4
24
C2
L1
D1
DA
VOUT1
C3
23
CATCH DIODE
CURRENT LIMIT
2
RT
14
SW
–
+
RT
1
Q
Burst Mode
DETECT
4M
GND
5
BOOST
DIODE
SLOPE COMP
ERROR
AMPLIFIER
+ –
9
17
PG
BD
VIN1
VOUT3
0.4V
+
–
LDO
DISABLE
7
C5
CURRENT LIMIT
0.72V
AMPLIFIER
3667 BD QFN
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LT3667
OPERATION
The LT3667 combines a 400mA buck switching regulator
and two 200mA low dropout linear regulators. Operation
is best understood by referring to the Block Diagrams.
The buck regulator part is a constant frequency, current
mode step-down regulator. An oscillator, with frequency
set by RT, sets an RS flip-flop, turning on the internal
power switch. An amplifier and comparator monitor the
current flowing between the IN1 and SW pins, turning the
switch off when this current reaches a level determined by
the voltage at VC. An error amplifier measures the output
voltage through an external resistor divider tied to the
FB1 pin and servos the VC node. If the error amplifier’s
output increases, more current is delivered to the output;
if it decreases, less current is delivered.
Another comparator monitors the current flowing through
the catch diode and reduces the operating frequency when
the current exceeds the 500mA bottom current limit. This
foldback in frequency helps to control the output current
in fault conditions such as a shorted output with high
input voltage. Maximum deliverable current to the output
is therefore limited by both switch current limit and catch
diode current limit.
An internal regulator provides power to the control circuitry.
The bias regulator normally draws power from the IN1 pin,
but if the IN3/BD (MSOP) or BD (QFN) pin is connected
to an external voltage higher than 3.2V, bias power will
be drawn from the external source (typically the regulated
output voltage). This improves efficiency.
The switch driver operates from either IN1 or from the
BOOST pin. An external capacitor is used to generate a
voltage at the BOOST pin that is higher than the input
supply. This allows the driver to fully saturate the internal
NPN power switch for efficient operation.
To further optimize efficiency, the LT3667 automatically
switches to Burst Mode operation in light load situations.
Between bursts, all circuitry associated with controlling
the output switch is shut down, reducing the input supply
current to 50μA (including the current drawn by the LDOs).
The switching regulator has an overvoltage protection
feature which disables switching action when IN1 goes
above 42V (typical) during transients. It can then safely
sustain transient input voltages up to 60V.
The switching regulator can also be separately shut down
via the UVLO1 pin, which can be used to implement a
programmable undervoltage lockout with an external
resistive divider.
The LDO blocks are micropower, low noise 200mA linear
regulators with low dropout voltage and current limit,
which provide fast transient response with minimum low
ESR 2.2µF ceramic output capacitors. Each output current limit can be programmed individually with a single
resistor, and pulling the EN2/ILIM2 or EN3/ILIM3 pin high
shuts down the corresponding LDO. Internal protection
circuitry includes reverse-battery protection, reverseoutput protection, reverse-current protection, and current
limit with foldback.
The internal reference voltage circuitry is supplied by
the IN1 and IN2 pins. This allows the LDO at IN2 to run
independently and supply the switching regulator with its
output OUT2.
The EN pin is used to place the LT3667 in shutdown,
thereby reducing the input current to less than 1μA.
The LT3667 contains three power good window comparators that indicate whether the output voltages are
within ±10% of their nominal value. The outputs of these
comparators are open-drain transistors which are off
when their corresponding output is in regulation, allowing
external resistors to pull the power good pins high. The
PG pin provides a combined power good signal, while the
QFN package additionally allows access to the individual
power good signals through pins PG1, PG2 and PG3.
Power good is valid if the LT3667 is enabled and IN1 or
IN2 are above their minimum input voltages.
Internal thermal limiting protects the LT3667 during
overload conditions.
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15
LT3667
APPLICATIONS INFORMATION
SWITCHING REGULATOR
Operating Frequency Trade-Offs
FB1 Resistor Network
Selection of the operating frequency is a trade-off between
efficiency, component size, minimum dropout voltage, and
maximum input voltage. The advantage of high frequency
operation is that smaller inductor and capacitor values may
be used. The disadvantages are lower efficiency, lower
maximum input voltage, and higher dropout voltage. The
highest acceptable switching frequency (fSW(MAX)) for a
given application can be calculated as follows:
The switching regulator output voltage of the LT3667 is
programmed with a resistor divider between the output
of the switching regulator and the FB1 pin. Choose the
resistor values according to:
V

R1= R2  OUT1 – 1
 1.2V 
Reference designators refer to the Block Diagram of the
LT3667. 1% resistors are recommended to maintain output
voltage accuracy. Note that choosing larger resistors will
decrease the quiescent current of the application circuit.
Setting the Switching Frequency
The LT3667 regulator uses a constant frequency PWM
architecture that can be programmed to switch from
250kHz to 2.2MHz by using a resistor tied from the RT
pin to ground. Table 1 shows the necessary RT value for
a desired switching frequency.
Table 1: Switching Frequency vs RT Value
SWITCHING FREQUENCY (MHz)
RT VALUE (kΩ)
0.25
475
0.3
383
0.4
274
0.5
215
0.6
174
16
0.8
124
1
95.3
1.2
75
1.4
61.9
1.6
51.1
1.8
43.2
2
37.4
2.2
32.4
fSW(MAX) =
VOUT1 + VD
tON(MIN) ( VIN1 – VSW + VD )
where VIN1 is the typical input voltage, VOUT1 is the output
voltage, VD is the catch diode drop (~0.5V) and VSW is the
internal switch drop (~0.5V at max load). This equation
shows that slower switching frequency is necessary to
accommodate high VIN1/VOUT1 ratio.
Lower frequency also allows a lower dropout voltage. Input
voltage range depends on the switching frequency because
the LT3667 switch has finite minimum on and off times.
The switch can turn on for a minimum of ~150ns and turn
off for a minimum of ~170ns (note that the minimum ontime is a strong function of temperature). The minimum
and maximum duty cycles that can be achieved taking
minimum on and off times into account are:
DCMIN = fSW • tON(MIN)
DCMAX = 1 − fSW • tOFF(MIN)
where fSW is the switching frequency, tON(MIN) is the
minimum switch on-time (~150ns), and tOFF(MIN) is the
minimum switch off-time (~170ns). These equations show
that the duty cycle range increases when the switching
frequency is decreased.
A good choice of switching frequency should allow an
adequate input voltage range (see Input Voltage Range
section) and keep the inductor and capacitor values small.
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LT3667
APPLICATIONS INFORMATION
Input Voltage Range
The minimum input voltage is determined by either the
LT3667’s minimum operating voltage of 4.3V or by its
maximum duty cycle (as discussed in the previous section). The minimum input voltage due to duty cycle is:
VIN1(MIN) =
VOUT1 + VD
–V +V
1– fSW • tOFF(MIN) D SW
where VIN(MIN) is the minimum input voltage, VOUT1 is the
output voltage, VD is the catch diode drop (~0.5V), VSW
is the internal switch drop (~0.5V at maximum load), fSW
is the switching frequency, and tOFF(MIN) is the minimum
switch off-time (~170ns). Note that a higher switching
frequency will increase the minimum input voltage. If a
lower dropout voltage is desired, a lower switching frequency should be used.
The highest allowed VIN1 during normal operation
(VIN1(OP‑MAX)) is limited by minimum duty cycle and is
given by:
VIN1(OP-MAX) =
VOUT1 + VD
–V +V
fSW • tON(MIN) D SW
where VOUT1 is the output voltage, VD is the catch diode
drop (~0.5V), VSW is the internal switch drop (~0.5V at
maximum load), fSW is the switching frequency, and
tON(MIN) is the minimum switch on-time (~150ns).
However, the LT3667 will tolerate inputs up to the absolute
maximum ratings of the VIN1 and BOOST pins, regardless
of the chosen switching frequency. During such transients
where VIN1 is higher than VIN1(OP-MAX), the part will skip
pulses to maintain output regulation. The output voltage
ripple and inductor current ripple will be higher than in
normal operation. Input voltage transients of up to 60V are
also safely withstood, though the LT3667 stops switching
while VIN1 > VOVLO (overvoltage lockout, 42V typical), allowing the output to fall out of regulation.
During start-up, short-circuit, or other overload conditions
the inductor peak current might reach and even exceed the
maximum current limit of the LT3667, especially in those
cases where the switch already operates at minimum ontime. The catch diode current limit circuitry prevents the
switch from turning on again if the inductor valley current
is above 500mA nominal.
Inductor Selection and Maximum Output Current
For a given input and output voltage, the inductor value
and switching frequency will determine the ripple current,
which increases with higher VIN1 or VOUT1 and decreases
with higher inductance and higher switching frequency.
A good first choice for the inductor value is:
L = ( VOUT1 + VD ) •
2.4
fSW
where fSW is the switching frequency in MHz, VOUT1 is the
output voltage, VD is the catch diode drop (~0.5V) and L is
the inductor value in μH. The inductor’s RMS current rating
must be greater than the maximum load current and its
saturation current should be about 30% higher. For robust
operation in fault conditions (start-up or short-circuit) and
high input voltage (>30V), the saturation current should
be above 900mA. To keep the efficiency high, the series
resistance (DCR) should be less than 0.3Ω, and the core
material should be intended for high frequency applications. Table 2 lists several vendors.
Table 2. Inductor Vendors
VENDOR
URL
Coilcraft
www.coilcraft.com
Sumida
www.sumida.com
Toko
www.tokoam.com
Würth Elektronik
www.we-online.com
Coiltronics
www.cooperet.com
Murata
www.murata.com
3667fb
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17
LT3667
APPLICATIONS INFORMATION
This simple design guide will not always result in the
optimum inductor selection for a given application. As a
general rule, lower output voltages and higher switching
frequency will require smaller inductor values. If the application requires less than 400mA load current, then a
lesser inductor value may be acceptable. This allows the
use of a physically smaller inductor, or one with a lower
DCR resulting in higher efficiency. However, the inductance
should in general not be smaller than 10µH.
Be aware that if the inductance differs from the simple
rule above, then the maximum load current will depend
on input voltage. In addition, low inductance may result
in discontinuous mode operation, which further reduces
maximum load current. For details of maximum output
current and discontinuous mode operation, see Linear
Technology’s Application Note 44. Finally, for duty cycles
greater than 50% (VOUT1/VIN1 > 0.5), a minimum inductance
is required to avoid sub-harmonic oscillations:
LMIN = ( VOUT1 + VD ) •
2
fSW
where fSW is the switching frequency in MHz, VOUT1 is
the output voltage, VD is the catch diode drop (~0.5V)
and LMIN is the inductor value in µH.
Catch Diode
The catch diode (D1 from block diagram) conducts current
only during switch off-time. Use a 1A Schottky diode for
best performance.
Peak reverse voltage is equal to VIN1 if it is below the
overvoltage protection threshold. This feature keeps the
switch off for VIN1 > OVLO (44V maximum). For inputs up
to the maximum operating voltage of 40V, use a diode with
a reverse voltage rating greater than the input voltage. If
transients at the input of up to 60V are expected, use a diode
with a reverse voltage rating only higher than the maximum
OVLO of 44V. If operating at high ambient temperatures,
consider using a Schottky with low reverse leakage. For
example, Diodes Inc. SBR1U40LP or DFLS160, ON Semi
MBRM140, and Central Semiconductor CMMSH1-60 are
good choices for the catch diode.
Input Capacitor
Bypass the input of the LT3667 circuit with a ceramic
capacitor of X7R or X5R type. Y5V types have poor
performance over temperature and applied voltage, and
should not be used. A 1μF to 4.7μF ceramic capacitor is
adequate to bypass the LT3667 and will easily handle
the ripple current. Note that a larger input capacitance
is required when a lower switching frequency is used
(due to longer on-times). If the input power source has
high impedance, or there is significant inductance due to
long wires or cables, additional bulk capacitance may be
necessary. This can be provided with a low performance
electrolytic capacitor. Step-down regulators draw current
from the input supply in pulses with very fast rise and
fall times. The input capacitor is required to reduce the
resulting voltage ripple at the LT3667 and to force this
very high frequency switching current into a tight local
loop, minimizing EMI. A 1μF capacitor is capable of this
task, but only if it is placed close to the LT3667 (see the
PCB Layout section). A second precaution regarding the
ceramic input capacitor concerns the maximum input
voltage rating of the LT3667. A ceramic input capacitor
combined with trace or cable inductance forms a high
quality (under damped) tank circuit. If the LT3667 circuit
is plugged into a live supply, the input voltage can ring to
twice its nominal value, possibly exceeding the LT3667’s
voltage rating. This situation is easily avoided (see the Hot
Plugging Safely section).
Output Capacitor and Output Ripple
The output capacitor has two essential functions. Along
with the inductor, it filters the square wave generated
by the LT3667 to produce the DC output. In this role it
determines the output ripple, and low impedance at the
switching frequency is important. The second function
is to store energy in order to satisfy transient loads and
stabilize the switching regulator’s control loop. Ceramic
capacitors have very low equivalent series resistance
(ESR) and provide the best ripple performance. A good
starting value is:
18
COUT1 =
50
VOUT1 • fSW
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LT3667
APPLICATIONS INFORMATION
where fSW is in MHz, and COUT1 is the recommended output
capacitance in μF. Use X5R or X7R types. This choice will
provide low output ripple and good transient response.
Transient performance can be improved with a higher value
capacitor if combined with a phase lead capacitor (typically
22pF) between the output and pin FB1. Note that a larger
phase lead capacitor should be used with a large output
capacitor. A lower value of output capacitor can be used to
save space and cost but transient performance will suffer.
When choosing a capacitor, look carefully through the
data sheet to find out what the actual capacitance is under
operating conditions (applied voltage and temperature).
A physically larger capacitor, or one with a higher voltage
rating, may be required. Table 3 lists several capacitor
vendors.
Table 3: Capacitor Vendors
VENDOR
URL
Panasonic
www.panasonic.com
Kemet
www.kemet.com
Sanyo
www.sanyovideo.com
Murata
www.murata.com
AVX
www.avxcorp.com
Taiyo Yuden
www.taiyo-yuden.com
Low Ripple Burst Mode Operation
To enhance efficiency at light loads, the LT3667 operates in low ripple Burst Mode operation which keeps
the output capacitor charged to the proper voltage while
minimizing the input quiescent current. During Burst Mode
operation, the LT3667 delivers single cycle bursts of
current to the output capacitor followed by sleep periods
where the output power is delivered to the load by the
output capacitor. Because the LT3667 delivers power
to the output with single, low current pulses, the output
ripple is kept below 5mV for a typical application. As the
load current decreases towards a no load condition, the
percentage of time that the LT3667 operates in sleep mode
increases and the average input current is greatly reduced
resulting in high efficiency even at very low loads. Note
that during Burst Mode operation, the switching frequency
will be lower than the programmed switching frequency.
At higher output loads (above ~50mA for the front page
application) the LT3667 will be running at the frequency
programmed by the RT resistor, and will be operating in
standard PWM mode. The transition between PWM and
low ripple Burst Mode operation is seamless, and will not
disturb the output voltage.
Audible Noise
Ceramic capacitors are small, robust and have very
low ESR. However, ceramic capacitors can sometimes
cause problems when used with the LT3667 due to their
piezoelectric nature. When in Burst Mode operation, the
LT3667’s switching frequency depends on the load current,
and at very light loads the LT3667 can excite the ceramic
capacitor at audio frequencies, generating audible noise.
Since the LT3667 operates at a lower current limit during
Burst Mode operation, the noise is typically very quiet. If
this is unacceptable, use a high performance tantalum or
electrolytic capacitor at the output.
VSW
5V/DIV
IL
100mA/DIV
VOUT1
5mV/DIV
ILOAD = 10mA
1µs/DIV
FRONT PAGE APPLICATION
3667 F01
Figure 1. Burst Mode Operation
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19
LT3667
APPLICATIONS INFORMATION
Capacitor C2 and the internal boost Schottky diode (see the
Block Diagram) are used to generate a boost voltage that
is higher than the input voltage. In most cases a 0.22μF
capacitor will work well. Figure 2 shows two ways to arrange the boost circuit. The BOOST pin must be more than
1.9V above the SW pin for best efficiency. For outputs of
2.2V and above, the standard circuit (Figure 2a) is best.
For outputs between 2.2V and 2.5V, use a 0.47μF boost
capacitor. For output voltages below 2.2V, the boost diode
can be tied to the input (Figure 2b), or to another external
supply greater than 2.2V. However, the circuit in Figure 2a
is more efficient because the BOOST pin current and BD
pin quiescent current come from a lower voltage source.
Also, be sure that the maximum voltage ratings of the
BOOST and BD pins are not exceeded.
The minimum operating voltage of an LT3667 application is limited by the minimum input voltage (4.3V) and
by the maximum duty cycle as outlined in a previous
section. For proper start-up, the minimum input voltage
is also limited by the boost circuit. If the input voltage
is ramped slowly, the boost capacitor may not be fully
charged. Because the boost capacitor is charged with the
energy stored in the inductor, the circuit relies on some
minimum load current to get the boost circuit running
properly. This minimum load depends on input and output
voltages, and on the arrangement of the boost circuit. The
minimum load generally goes to zero once the circuit has
started. Figure 3 shows a plot of minimum load to start
and to run as a function of input voltage. In many cases
the discharged output capacitor will present a load to the
switcher, which will allow it to start. The plots show the
worst-case situation where VIN1 is ramping very slowly.
For lower start-up voltage, the boost diode can be tied to
VIN1; however, this restricts the input range to one-half of
the absolute maximum rating of the BOOST pin.
5.0
INPUT VOLTAGE VIN1 (V)
BOOST and BD, IN3/BD Pin Considerations
FRONT PAGE APPLICATION
VEN = VIN1, VOUT1 = 3.3V
4.5
TO START
4.0
TO RUN
3.5
3.0
VOUT1
3.5
BD
VIN1
IN1
BOOST
6.5
D1
INPUT VOLTAGE VIN1 (V)
DA
(2a) For VOUT1 ≥ 2.2V
BD
IN1
BOOST
TO START
6.0
5.5
TO RUN
5.0
4.5
C2
LT3667
SW
D1
GND
100 150 200 250 300 350 400
LOAD CURRENT IOUT1 (mA)
3667 F03a
SW
VIN1
50
C2
LT3667
GND
0
VOUT1
4.0
FRONT PAGE APPLICATION
VEN = VIN1, VOUT1 = 5V
0
DA
50
100 150 200 250 300 350 400
LOAD CURRENT IOUT1 (mA)
3667 F03b
3667 F02
(2b) For VOUT1 < 2.2V; VIN1 < 25V
Figure 3. The Minimum Input Voltage Depends on
Output Voltage, Load Current and Boost Circuit
Figure 2. Two Circuits for Generating the Boost Voltage
20
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LT3667
APPLICATIONS INFORMATION
Synchronization (QFN Only)
from SYNC to ground which will draw current.
Synchronizing the oscillator of the LT3667 to an external
frequency can be done by connecting a digital clock signal
to the SYNC pin. The LT3667 then synchronizes its SW
node to the rising edge of this clock signal, as shown in
Figure 4. The square wave amplitude should have valleys
that are below 0.5V and peaks that are above 1.2V (up to
6V), and its on-time and off-time should not fall below
50ns. There is a time delay of typically 280ns between the
rising edge of SYNC and the rising edge of SW which is
in part caused by the minimum switch off-time. The falling edge of SW is sensitive to the falling edge of SYNC,
it is therefore recommended to adjust the duty cycle of
the SYNC clock signal accordingly to keep its on-time as
short as possible. Alternatively, AC coupling as shown in
Figure 5 can be used to shorten the clock signal's on-time.
The LT3667 may be synchronized over a 300kHz to 2.2MHz
range. The RT resistor should be chosen to set the switching
frequency 20% below the lowest synchronization input.
For example, if the synchronization signal is 360kHz, RT
should be chosen for 300kHz. Since RT also sets the slope
compensation which avoids subharmonic oscillations, the
minimum inductor value must be calculated using the
frequency determined by RT.
FRONT PAGE APPLICATION
UVLO1 Pin (QFN Only)
The switching regulator part of the LT3667 can be independently disabled via the UVLO1 pin. The falling threshold of
the UVLO1 comparator is 1V, with a 75mV hysteresis. The
UVLO1 pin has no effect if VIN1 and VIN2 are below 4.3V,
because then the internal undervoltage lockout keeps the
LT3667 shut down anyway.
Adding a resistive divider from IN1 to UVLO1 as shown
in Figure 6 programs the LT3667 to enable the switching
regulator only when VIN1 is above a certain threshold
voltage VIN(UVLO1), given by:
VSYNC
2V/DIV
RINSING
SYNC
TRIGGERS
SW
VSW
5V/DIV
3667 F04
200ns/DIV
Figure 4. Synchronization Waveforms
VIN(UVLO1) =
Note that due to the comparator’s hysteresis, the switching
regulator will not be enabled until the input rises slightly
above VIN(UVLO1).
VIN1
SYNC
3.3V
10k
IN1
R1
LT3667
10pF
R1+R2
•1V
R2
UVLO1
LT3667
1V
+
–
SWITCHING
REGULATOR
SHUT DOWN
R2
3667 F06
GND
3667 F05
Figure 5. Example of AC Coupling of SYNC Clock Signal
The LT3667 still enters Burst Mode operation at low
output loads while synchronized to an external clock, but
the burst pulses are synchronized to that clock signal. If
synchronization is not needed, the SYNC pin should be
grounded. It may also be tied to a voltage above 1.2V
(logic high), but note that there is an internal 4M resistor
Figure 6. UVLO1 Pin Allows Programmable Undervoltage
Lockout or Independent Disable of the Switching Regulator
Shorted and Reversed Input Protection
If the inductor is chosen so that it won’t saturate excessively, the switching regulator will tolerate a shorted
output. There is another situation to consider in systems
where the output will be held high when the input to the
LT3667 is absent. This may occur in battery charging
applications or in battery backup systems where a battery
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21
LT3667
APPLICATIONS INFORMATION
or some other supply is diode ORed with the switching
regulator’s output. If the IN1 pin is allowed to float and
the EN and UVLO1 pins are held high (either by a logic
signal or because they are tied to IN1), then the LT3667’s
internal circuitry will pull its quiescent current through the
SW pin. This is fine if the system can tolerate a few μA
in this state. If the EN pin or the UVLO1 pin is grounded,
the SW pin current will drop to 0.7μA. However, if the IN1
pin is grounded while the output is held high, regardless
of EN and UVLO1, parasitic diodes inside the LT3667 can
pull current from the output through the SW pin and the
IN1 pin. Figure 7 shows a circuit that will run only when
the input voltage is present and that protects against a
shorted or reversed input. Alternatively, the switching
regulator can be supplied by the LDO at OUT2 as shown
in the Applications Information section of the LDOs.
FB2/FB3 Resistor Networks
Each LDO output voltage of the LT3667 is programmed
with a resistor divider between the output of that LDO and
its FB2/FB3 pin as shown in Figure 8. The pin current, IFB,
(3nA at 25°C, ±40nA at 150°C) of each FB2/FB3 pin flows
out of that pin, which results in
 R2 
VOUT = 0.8V  +1 –IFB •R2
 R1 
The value of R1 should not exceed 160k to provide a
minimum 5µA load current so that the output voltage
error, caused by the FB2/FB3 pin current, is minimized.
Rearranging for R2 gives:
R2 =
D1
MBRS140
VIN
LDOs
BD
BOOST
IN1
Note that choosing smaller resistors will increase the
quiescent current of the application circuit.
EN
LT3667
UVLO1
GND
VOUT
SW
DA
FB1
0.8V – VOUT
IFB – 0.8V/R1
VIN
+
INn
OUTn
LT3667
BACKUP
GND
22
R2
FBn
3667 F07
Figure 7. Diode D1 Prevents a Shorted Input from Discharging
a Backup Battery Tied to the Output. It Also Protects the Circuit
from a Reversed Input, in Which Case the Resistor at the EN Pin
Limits the Current Drawn from That Pin. The LT3667 Runs Only
When the Input Is Present
VOUT
IFB
R1
3667 F08
Figure 8. Setting the Output Voltage of Each LDO
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APPLICATIONS INFORMATION
Input Supply
The internal biasing and reference circuitry of the LT3667
is supplied by the IN1 and IN2 pins.This allows connecting
the switching regulator input IN1 to the LDO output OUT2.
This can be used to shield the supply at IN2 from the high
start-up currents of the switching regulator by utilizing the
LDO’s programmable current limit. The Typical Applications section shows an example of such an application,
which also benefits from the reverse voltage protection
of the LDO.
Input Capacitance and Stability
Each LDO is stable with an input capacitor typically between
1μF and 10μF. This input capacitor must be placed as close
as possible to the corresponding input pin. Applications
operating with smaller input to output differential voltages
and that experience large load transients may require a
higher input capacitor value to prevent input voltage droop
and letting the regulator enter dropout.
Very low ESR ceramic capacitors may be used. However,
in cases where long wires connect the power supply to
the LDOs input and ground, use of low value input capacitors may result in instability. The resonant LC tank circuit
formed by the wire inductance and the input capacitor is
the cause and not a result of LDO instability.
The minimum input capacitance needed to stabilize the
application also varies with power supply output impedance variations. Placing additional capacitance on an LDO’s
output also helps. However, this requires an order of
magnitude more capacitance in comparison with additional
input bypassing. Series resistance between the supply and
an LDO’s input also helps stabilize the application; as little
as 0.1Ω to 0.5Ω suffices. This impedance dampens the
LC tank circuit at the expense of dropout voltage. A better
alternative is to use higher ESR tantalum or electrolytic
capacitors at the input in place of ceramic capacitors.
capacitor of 2.2μF to prevent oscillations. Applications with
output voltages of less than 2.5V and applications where
the difference between input and output voltage exceeds
20V require a minimum output capacitor of 10µF. In addition, the ESR of the output capacitor must not exceed 3Ω.
The LT3667 is a micropower device and output load
transient response is a function of output capacitance.
Larger values of output capacitance decrease the peak
deviations and provide improved transient response for
larger load current changes, especially for low output
voltages. Bypass capacitors, used to decouple individual
components powered by the LT3667, increase the effective output capacitor value. For applications with large
load current transients, a low ESR ceramic capacitor in
parallel with a bulk tantalum capacitor often provides an
optimally damped response.
Note that some ceramic capacitors have a piezoelectric
response. A piezoelectric device generates voltage across
its terminals due to mechanical stress, similar to the way
a piezoelectric accelerometer or microphone works. For
a ceramic capacitor, the stress is induced by vibrations in
the system or thermal transients. The resulting voltages
produced cause appreciable amounts of noise. A ceramic
capacitor produced the trace in Figure 9 in response to light
tapping from a pencil. Similar vibration induced behavior
can masquerade as increased output voltage noise.
VOUT2 = 5V
COUT2 = 10µF
VOUT2
1mV/DIV
2ms/DIV
Output Capacitance, Transient Response, Stability
Each LT3667’s LDO is stable with a wide range of output
capacitors. The ESR of the output capacitor affects stability,
most notably with small capacitors. Use a minimum output
3667 F09
Figure 9. Noise Resulting from Tapping On a Ceramic Capacitor
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LT3667
APPLICATIONS INFORMATION
External Programmable Current Limit, Enable
Each EN/ILIM pin (EN2/ILIM2 and EN3/ILIM3) is the collector of a PNP which mirrors the corresponding LDO’s
output at a ratio of 1:799 (see Block Diagram). The EN2/
ILIM2 and EN3/ILIM3 pins are also the inputs to precision current limit amplifiers. If an output load increases
to the point where it causes the corresponding current
limit amplifier input voltage to reach 0.4V, the current
limit amplifier takes control of output regulation so that
its input clamps at 0.4V, regardless of the output voltage.
The current limit threshold (ILIMIT) of an LDO is set by
attaching a resistor (RIMAX) from the corresponding EN/
ILIM pin to ground:
RIMAX =
799 • 0.4V
– 80Ω
ILIM
In order to maintain stability, each EN/ILIM pin requires
a 47nF capacitor from that pin to ground.
In cases where the input to output voltage differential
exceeds 10V, foldback current limit will lower the internal current level limit, possibly causing it to preempt the
external programmable current limit. See the Internal
Current Limit vs Input/Output Differential graph in the
Typical Performance Characteristics section.
If an external current limit is not needed, the corresponding EN/ILIM pin must be connected to ground, in which
case no capacitor is required.
Each LDO can be individually shut down by pulling its EN/
ILIM pin above 1.2V (1V typical). Note that in this case this
pin will draw up to 500µA in certain operating conditions
until the LDO is shut down, which the circuit driving this
pin must be able to deliver. When an EN/ILIM pin is only
used to enable/disable an LDO, no capacitor is required
on this pin.
Overload Recovery
Each LDO of the LT3667 has a safe operating area protection, which decreases current limit as input-to-output
voltage increases, and keeps the power transistor inside
a safe operating region for all values of input-to-output
voltage. Each LDO provides some output current at all
values of input-to-output voltage up to the device break-
24
down. When power is first applied to an LDO, the input
voltage rises and the output follows the input; allowing the
regulator to start-up into very heavy loads. During start-up,
as the input voltage is rising, the input-to-output voltage
differential is small, allowing the regulator to supply large
output currents. With a high input voltage, a problem can
occur wherein the removal of an output short will not allow
the output to recover. The problem occurs with a heavy
output load when the input voltage is high and the output
voltage is low. Common situations are: immediately after
the removal of a short-circuit or if an LDO is enabled via
its EN/ILIM pin after the input voltage is already turned
on. In such cases, the regulator would have to operate its
power device outside its safe operating are (high voltage
and high current) in order to bring up the output voltage.
Since this is prevented by the safe operating area protection, the output gets stuck at a low voltage. Essentially,
the load line for such a load intersects the output current
curve at two points, resulting in two stable output operating
points for the regulator. With this double intersection, the
input power supply needs to be cycled down to zero and
brought up again to make the output recover.
Protection Features
The LT3667 LDO’s protect against reverse-input voltages, reverse-output voltages and reverse output-to-input
voltages. Current limit protection and thermal overload
protection protect the LDOs against current overload
conditions at their outputs. For normal operation, do not
exceed the maximum operating junction temperature. The
LT3667 IN2 and IN3 (QFN only) pins withstand reverse
voltages of 45V. The device limits current flow to less than
300μA (typically less than 10μA) and no negative voltages
appear at OUT2 or OUT3. The LDOs incur no damage if
their outputs are pulled below ground. If an input is left
open circuit or grounded, the corresponding output can be
pulled below ground by 45V. No current flows through the
pass transistor from the output. However, current flows in
(but is limited by) the corresponding resistor divider that
sets the output voltage. Current flows from the bottom
resistor in the divider and from the FB2/FB3 pin’s internal
clamp through the top resistor in the divider to the external
circuitry pulling OUT2/OUT3 below ground. If the input
is powered by a voltage source, the output sources cur3667fb
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LT3667
APPLICATIONS INFORMATION
rent equal to its current limit capability and the LT3667
protects itself by thermal limiting. Note that the externally
programmable current limit is less accurate if the output
is pulled below ground.
These protection features can be used to protect the
switching regulator input as shown in the Typical Applications section.
COMMON
PCB Layout
Ceramic Capacitor Characteristics
Give extra consideration to the use of ceramic capacitors.
Manufacturers make ceramic capacitors with a variety of
dielectrics, each with different behavior across temperature and applied voltage. The most common dielectrics
are specified with EIA temperature characteristic codes
of Z5U, Y5V, X5R and X7R. The Z5U and Y5V dielectrics
provide high C-V products in a small package at low cost,
but exhibit strong voltage and temperature coefficients,
as can be seen for Y5V in Figures 10 and 11. When used
with a 5V regulator, a 16V 10μF Y5V capacitor can exhibit an effective value as low as 1μF to 2μF for the DC
bias voltage applied, and over the operating temperature
range. The X5R and X7R dielectrics yield much more
stable characteristics and are more suitable for use as
input and output capacitors. The X7R type works over
a wider temperature range and has better temperature
stability, while the X5R is less expensive and is available
in higher values. Still exercise care when using X5R and
20
The SW and BOOST nodes should be as small as possible.
Keep the FB1, FB2, and FB3 nodes small so that the ground
traces will shield them from the SW and BOOST nodes.
The exposed pad must be soldered such that it can act as a
heat sink. (See High Temperature Considerations section.)
40
20
X5R
CHANGE IN VALUE (%)
CHANGE IN VALUE (%)
For proper operation and minimum EMI, care must be
taken during printed circuit board layout. Figures 12 and
13 show the recommended component placement with
trace, ground plane and via locations. Note that large,
switched currents flow in the LT3667’s IN1, SW, GND
and DA pins, the catch diode and the input capacitor. The
loop formed by these components should be as small as
possible. These components, along with the inductor and
output capacitor, should be placed on the same side of
the circuit board, and their connections should be made
on that layer. Place a local, unbroken ground plane below
these components.
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10µF
0
–20
–40
–60
Y5V
–80
–100
X7R capacitors; the X5R and X7R codes only specify
operating temperature range and maximum capacitance
change over temperature. Capacitance change due to DC
bias with X5R and X7R capacitors is better than Y5V and
Z5U capacitors, but can still be significant enough to drop
capacitor values below appropriate levels. Capacitor DC
bias characteristics tend to improve as component case
size increases, but expected capacitance at operating
voltage should be verified.
–20
–40
2
4
8
6
10 12
DC BIAS VOLTAGE (V)
14
16
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10µF
–100
–50 –25
3667 F10
Figure 10. Ceramic Capacitor DC Bias Characteristics
Y5V
–60
–80
0
X5R
0
50
25
75
0
TEMPERATURE (°C)
100
125
3667 F11
Figure 11. Ceramic Capacitor Temperature Characteristics
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25
LT3667
APPLICATIONS INFORMATION
OUT1
OUT1
GND
GND
SW
IN1
SW
IN1
24 23 22 21
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9 10 11 12
3667 F13
VIAS TO LOCAL GROUND PLANE
VIAS TO LOCAL GROUND PLANE
Figure 12. Good PCB Layout Ensures
Proper, Low EMI Operation (MSOP)
Figure 13. Good PCB Layout Ensures
Proper, Low EMI Operation (QFN)
Hot Plugging Safely
High Temperature Considerations
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitors of LT3667 circuits. However, these capacitors can cause problems if the LT3667 is plugged into
a live supply. The low loss ceramic capacitor, combined
with stray inductance in series with the power source,
forms an under damped tank circuit, and the voltage at the
input pins of the LT3667 can ring to twice their nominal
input voltage, possibly exceeding the LT3667’s rating and
damaging the part. If the input supply is poorly controlled
or the user will be plugging the LT3667 into an energized
supply, the input network should be designed to prevent
this overshoot. See Linear Technology Application Note 88
for a complete discussion.
The LT3667’s maximum rated junction temperature of
125°C (E- and I-grades) and 150°C (H-grade) respectively
limits its power handling capability.
26
Power dissipation within the switching regulator can be
estimated by calculating the total power loss from an
efficiency measurement and subtracting inductor loss.
Be aware that at high ambient temperatures the external
Schottky diode will have significant leakage current (see
Typical Performance Characteristics), increasing the quiescent current of the switching regulator.
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LT3667
APPLICATIONS INFORMATION
The power dissipation of each LDO is comprised of two
components. Each power device dissipates:
of 12V and a maximum ambient temperature of 85°C, what
will the maximum junction temperature be?
PPASS = (VIN − VOUT) • IOUT
As can be seen from the Typical Performance Characteristics, the switching regulator efficiency approaches 85% at
400mA output current. This leads to a power loss, PLOSS, of:
where PPASS is the power, VIN the input voltage, VOUT
the output voltage, and IOUT the output current. The base
currents of the LDO power PNP transistors flow to ground
internally and are the major component of the ground
current. For each LDO, this causes a power dissipation
PGND of:
PGND = VIN • IGND
where VIN is the input voltage and IGND the ground current
generated by the corresponding power device. GND pin
current is determined by the current gain of the power
PNP, which has a typical value of 40 for the purpose of
this calculation:
IGND =
IOUT
40
 1

PLOSS = 5V • 400mA • 
– 1 = 353mW
 0.85 
(For the sake of simplicity and as a conservative estimate
assume that all of this power is dissipated in the LT3667.)
The power dissipations of the LDO power devices are:
PPASS2 = (5V − 2.5V) • 100mA = 250mW
PPASS3 = (5V − 3.3V) • 100mA = 170mW
For 100mA load current a maximum ground current of
2.5mA is to be expected. Thus, the corresponding power
dissipations are:
PGND2 = PGND3 = 5V • 2.5mA = 12.5mW
The total power dissipation equals the sum of the power
loss in the switching regulator and the two LDO components listed above.
The LT3667 has internal thermal limiting that protects
the device during overload conditions. If the junction
temperature reaches the thermal shutdown threshold, the
LT3667 will shut down the LDOs and stop switching to
prevent internal damage due to overheating. For continuous
normal conditions, do not exceed the maximum operating junction temperature. Carefully consider all sources
of thermal resistance from junction-to-ambient including
other nearby heat sources. Both LT3667 packages have
exposed pads that must be soldered to a ground plane to
act as heat sink. To keep thermal resistance low, extend the
ground plane as much as possible, and add thermal vias
under and near the LT3667 to additional ground planes
within the circuit board and on the bottom side.
The die temperature rise is calculated by multiplying the
power dissipation of the LT3667 by the thermal resistance
from junction to ambient. Example: Given the front page
application with maximum output current, an input voltage
Finally, the total power dissipation is:
PTOT = PLOSS + PPASS2 + PPASS3 + PGND2 + PGND3
= 786mW
Using the MSOP package, which has a thermal resistance
of approximately 40°C/W, this total power dissipation
would raise the junction temperature above ambient by:
0.786W • 40°C/W = 32°C
With the assumed maximum ambient temperature of 85°C,
this puts the maximum junction temperature at:
TJMAX = 85°C + 32°C = 117°C
Other Linear Technology Publications
Application Notes 19, 35 and 44 contain more detailed
descriptions and design information for buck regulators
and other switching regulators. The LT1376 data sheet
has a more extensive discussion of output ripple, loop
compensation and stability testing. Design Note 318
shows how to generate a bipolar output supply using a
buck regulator.
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27
LT3667
TYPICAL APPLICATIONS
5V, 3.3V and 2.5V Step-Down Converter
VIN
6V TO 40V
TRANSIENT
TO 60V
C1
4.7µF
UVLO1 IN1
BOOST
ON OFF
f = 600kHz
2.5V
100mA
C4
4.7µF
RT
174k
R3
340k
R4
158k
EN
SW
PG
DA
FB1
RT
C2
L1
0.22µF 22µH
D1
DFLS160
OUT2
FB2
FB3
EN2/ILIM2 GND EN3/ILIM3
C1-C5: X5R OR X7R
L1: CDRH4D22/HP
R2
294k
C6
22pF
LT3667
BD
IN2
IN3
OUT3
R1
931k
5V
C3 200mA
22µF
3.3V
100mA
R5
499k
C5
2.2µF
R6
158k
3667 TA02
Dual 5V/200mA Step-Down Converter
VIN
7V TO 40V
TRANSIENT
TO 60V
C1
4.7µF
UVLO1 IN1
BOOST
ON OFF
f = 600kHz
5V
200mA
C4
2.2µF
RT
174k
R3
787k
R4
150k
EN
SW
PG
DA
FB1
RT
OUT2
FB2
BD
IN2
IN3
OUT3
FB3
EN2/ILIM2 GND EN3/ILIM3
6V
D1
DFLS160
R1
1020k
R5
787k
R6
150k
C3
22µF
R2
255k
C6
22pF
LT3667
C1-C5: X5R OR X7R
L1: CDRH4D22/HP
28
C2
L1
0.22µF 22µH
5V
200mA
C5
2.2µF
3667 TA03
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LT3667
TYPICAL APPLICATIONS
5V, 3.3V and 2.5V Step-Down Converter with 100mA LDO Current Limits
VIN
8.5V TO 16V
TRANSIENT
TO 60V
C1
4.7µF
UVLO1 IN1
BOOST
ON OFF
RT
37.4k
f = 2MHz
2.5V*
C4
4.7µF
R3
340k
R4
158k
EN
SW
PG
DA
FB1
RT
LT3667
BD
IN2
IN3
OUT3
OUT2
FB2
FB3
EN2/ILIM2 GND EN3/ILIM3
C7
47nF
R7
3.09k
R8
3.09k
C2
L1
0.1µF 10µH
D1
DFLS160
5V
C3 200mA
10µF
R1
931k
R2
294k
C6
22pF
3.3V*
R5
499k
R6
158k
C5
2.2µF
C8
47nF
3667 TA04
*100mA CURRENT LIMIT
C1-C5: X5R OR X7R
L1: CDRH4D22/HP
Programming LDO Current Limits with a Digital/Analog Converter
VDAC
DAC OUTPUT
0V TO 0.8V
3.01k
LT3667
LT3667
EN2/ILIM2
EN2/ILIM2
3.01k
47nF
CURRENT LIMIT = 799
0.8V – VDAC
3.01kΩ + 160Ω
IDAC
DAC OUTPUT
0µA TO 267µA
1.5k
CURRENT LIMIT = 799
47nF
0.4V – IDAC • 1.5kΩ
1.5kΩ + 80Ω
3667 TA05
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29
LT3667
TYPICAL APPLICATIONS
This application allows a small input current to support
a high current pulsed load. The switching regulator is
supplied by the LDO2 at OUT2, which is programmed to
limit its current to 3.5mA. PG2 serves as “READY” signal
to tell a controller (not shown) that C6 is charged to 17V,
the regulation voltage of LDO2. It can then turn on a load
drawing high current out of the switching regulator.
Since LDO2 can only supply 3.5mA, this quickly discharges
C6 and decreases VOUT2 (=VIN1). The switching regulator
will maintain its programmed output voltage until VIN1
drops below the undervoltage lockout threshold of 5.5V
set by R3 and R4.
Pulsed Power Supply for 4mA to 20mA Current Loops.
OUT2 Supplies the Switching Regulator, Which Is Kept Off at Lower Voltages by UVLO1
VIN
18V TO 45V
TRANSIENTS
DOWN TO –28V
LDO2 Input
C1
1µF
ON OFF
BUCK Input
EN
IN2
BOOST
IN1
C4
2.2µF
Threshold
5.5V
Regulation
Voltage 17V
R3
4.5M
R4
1M
RT
174k
f = 600kHz
UVLO1
SW
RT
DA
FB1
C6
1000µF
R8
3010k
R9
150k
D1
DFLS160
BD
IN3
PG2
OUT3
OUT2
FB2
FB3
EN2/ILIM2 GND EN3/ILIM3
C7
47nF
R2
249k
PG2 Indicates
when C6 is
Charged
C5
10µF
R6
158k
R10
150k
READY
1.8V
100mA
R5
200k
3.3V
C3 100mA
22µF
R1
442k
C8
22pF
LT3667
LDO2 Output
Big Capacitor
Here to
Accumulate
Energy
C2
L1
0.22µF 22µH
R7
90.9k
3667 TA06a
ILOAD (mA)
VPG2 (V)
VOUT2 (V)
IIN2 (mA)
3.5mA Current Limit
C1-C5: X5R OR X7R
L1: CDRH4D22/HP
5
4
3
2
1
0
18
16
14
12
10
8
6
4
IIN2 Limited by Current
Limit of LDO2
VOUT2 Rises as C6 is Charged
by the Constant Current IOUT2
C6 is Quickly Discharged
by High Load Current
3
PG2 Signals That
VOUT2 is High Enough
2
1
0
100
80
60
40
20
0
IIN2 Drops as VOUT2
Reaches Programmed Value
Controller Decides
to Activate Load
0
1
2
3
TIME (SECONDS)
30
For more information www.linear.com/LT3667
4
5
3667 TA06b
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LT3667
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev F)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
5.10
(.201)
MIN
2.845 ±0.102
(.112 ±.004)
0.889 ±0.127
(.035 ±.005)
8
1
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102 3.20 – 3.45
(.065 ±.004) (.126 – .136)
0.305 ±0.038
(.0120 ±.0015)
TYP
16
0.50
(.0197)
BSC
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
0.35
REF
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
9
NO MEASUREMENT PURPOSE
0.280 ±0.076
(.011 ±.003)
REF
16151413121110 9
DETAIL “A”
0° – 6° TYP
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
4.90 ±0.152
(.193 ±.006)
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1.10
(.043)
MAX
0.18
(.007)
SEATING
PLANE
1234567 8
0.17 – 0.27
(.007 – .011)
TYP
0.50
NOTE:
(.0197)
1. DIMENSIONS IN MILLIMETER/(INCH)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE16) 0213 REV F
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31
LT3667
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UDD Package
24-Lead Plastic QFN (3mm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
0.70 ±0.05
3.50 ± 0.05
2.10 ± 0.05
3.65 ± 0.05
1.50 REF
1.65 ± 0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ± 0.10
0.75 ± 0.05
1.50 REF
23
R = 0.05 TYP
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
24
0.40 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
5.00 ± 0.10
1
2
3.65 ± 0.10
3.50 REF
1.65 ± 0.10
(UDD24) QFN 0808 REV Ø
0.200 REF
0.00 – 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
32
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LT3667
REVISION HISTORY
REV
DATE
DESCRIPTION
PAGE NUMBER
A
4/14
Added H-grade in MS16E package to Order Information
B
11/14
3
Clarified Externally Programmable Current Limit specifications
5
Grammatical correction in Setting the Switching Frequency description
16
Clarified Typical Application schematic
29
3667fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LT3667
33
LT3667
TYPICAL APPLICATION
5V, 3.3V and 51mA Regulator
C6
1µF
C7
1µF
IN3
IN2
VIN*
6V TO 40V
IN1
C1
2.2µF
f = 600kHz
BOOST
C2
L1
0.22µF
22µH
UVLO1
RT
174k
EN
SW
RT
DA
FB1
LT3667
D1
DFLS160
51mA*
OUT3
FB2
FB3
EN2/ILIM2 GND EN3/ILIM3
C4
10µF
C9
47nF
R2
249k
C8
22pF
BD
OUT2
R1
931k
R3
499k
R4
158k
5V
C3 400mA
22µF
3.3V*
200mA
C5
10µF
R5
6.19k
3667 TA07
C1-C7: X5R OR X7R
L1: CDRH4D22/HP
*DERATE OUTPUT CURRENT AT HIGHER AMBIENT TEMPERATURES
AND INPUT VOLTAGES TO MAINTAIN JUNCTION TEMPERATURE
BELOW THE ABSOLUTE MAXIMUM
RELATED PARTS
PART NUMBER
DESCRIPTION
LT3500
36V (40VMAX), 2A (IOUT), 2.2MHz Step-Down Switching Regulator VIN: 3V to 36V, VOUT(MIN) = 0.8V, IQ = 2.5mA, ISD < 12µA,
with LDO Controller
3mm × 3mm DFN-10, MSOP-16E
LT1939
25V, 2A (IOUT), 2.2MHz Step-Down Switching Regulator with LDO VIN: 3V to 25V, VOUT(MIN) = 0.8V, IQ = 2.5mA, ISD < 12µA,
Controller
3mm × 3mm DFN-10, MSOP-16E
LT3694
36V (70VMAX), 2.6A (IOUT), 2.5MHz Step-Down Switching
Regulator with Dual LDO Controller
VIN: 4V to 36V, VOUT(MIN) = 0.8V, IQ = 1mA, ISD < 1µA,
4mm × 5mm QFN-28, TSSOP-20E
LT3507/LT3507A
36V, 2.5MHz, Triple (2.4A + 1.5A + 1.5A (IOUT) with LDO
Controller High Efficiency Step-Down DC/DC Converter
VIN: 4V to 36V, VOUT(MIN) = 0.8V, IQ = 7mA, ISD = 1µA,
5mm × 7mm QFN-38
LT3970
40V, 350mA (IOUT), 2.2MHz Step-Down Switching Regulator with VIN: 4.2V to 40V, VOUT(MIN) = 1.2V, IQ = 2.5µA, ISD < 1µA,
IQ = 2.5µA
3mm × 2mm DFN, MSOP-10
LT3502/LT3502A
40V, 500mA (IOUT), 1.1MHz/2.2MHz Step-Down Switching
Regulator
34
COMMENTS
VIN: 3V to 40V, VOUT(MIN) = 0.8V, IQ = 1.5mA, ISD < 1µA,
2mm × 2mm DFN-8, MSOP-10E
3667fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LT3667
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LT3667
LT 1114 REV B • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2014