Data Sheet

PCA9537
4-bit I2C-bus and SMBus low power I/O port with interrupt and
reset
Rev. 05 — 7 May 2009
Product data sheet
1. General description
The PCA9537 is a 10-pin CMOS device that provides 4 bits of General Purpose parallel
Input/Output (GPIO) expansion with interrupt and reset for I2C-bus/SMBus applications
and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders.
I/O expanders provide a simple solution when additional I/O is needed for ACPI power
switches, sensors, push-buttons, LEDs, fans, etc.
The PCA9537 consists of a 4-bit Configuration register (input or output selection),
4-bit Input Port register, 4-bit Output Port register and a 4-bit Polarity Inversion register
(active HIGH or active LOW operation). The system master can enable the I/Os as either
inputs or outputs by writing to the I/O configuration bits. The data for each input or output
is kept in the corresponding Input Port or Output Port register. The polarity of the Input
Port register can be inverted with the Polarity Inversion register. All registers can be read
by the system master.
The PCA9537 open-drain interrupt output (INT) is activated when any input state differs
from its corresponding Input Port register state and is used to indicate to the system
master that an input state has changed. The power-on reset sets the registers to their
default values and initializes the device state machine. The RESET pin causes the same
reset/initialization to occur without de-powering the device.
The I2C-bus address is fixed and allows only one device on the same I2C-bus/SMBus.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
4-bit I2C-bus GPIO with interrupt and reset
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant I/Os
Polarity Inversion register
Active LOW interrupt output
Active LOW reset input
Low standby current
Noise filter on SCL/SDA inputs
No glitch on power-up
Internal power-on reset
4 I/O pins that default to 4 inputs
0 Hz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Offered in TSSOP10 package
3. Ordering information
Table 1.
Ordering information
Tamb = −40 °C to +85 °C
Type number
PCA9537DP
Topside
mark
Package
Name
Description
Version
9537
TSSOP10
plastic thin shrink small outline package;
10 leads; body width 3 mm
SOT552-1
4. Block diagram
PCA9537
IO0
SCL
SDA
INPUT
FILTER
IO1
4-bit
I2C-BUS/SMBus
CONTROL
write pulse
VDD
RESET
POWER-ON
RESET
VSS
IO2
INPUT/
OUTPUT
PORTS
IO3
read pulse
VDD
INT
LP
FILTER
002aae634
Remark: All I/Os are set to inputs at reset.
Fig 1.
Block diagram of PCA9537
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
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PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
5. Pinning information
5.1 Pinning
10 VDD
9 SDA
IO0
1
IO1
2
IO2
3
8
SCL
IO3
4
7
INT
VSS
5
6
RESET
PCA9537DP
002aae633
Fig 2.
Pin configuration for TSSOP10
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
IO0
1
input/output 0
IO1
2
input/output 1
IO2
3
input/output 2
IO3
4
input/output 3
VSS
5
supply ground
RESET
6
active LOW reset input
INT
7
interrupt output (open-drain)
SCL
8
serial clock line
SDA
9
serial data line
VDD
10
supply voltage
PCA9537_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 7 May 2009
3 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6. Functional description
Refer to Figure 1 “Block diagram of PCA9537”.
6.1 Device address
slave address
1
0
0
1
0
0
1
R/W
fixed
002aae635
Fig 3.
PCA9537 address
6.2 Registers
6.2.1 Command byte
The command byte is the first byte to follow the address byte during a write transmission.
It is used as a pointer to determine which of the registers will be written or read.
Table 3.
Command byte
Command
Protocol
Function
0
read byte
Input Port register
1
read/write byte
Output Port register
2
read/write byte
Polarity Inversion register
3
read/write byte
Configuration register
6.2.2 Register 0 - Input Port register
This register is a read-only port. It reflects the incoming logic levels of the pins, regardless
of whether the pin is defined as an input or an output by Register 3. Writes to this register
have no effect.
The default value ‘X’ is determined by the externally applied logic level.
Table 4.
Register 0 - Input Port register bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
I7
read only
1*
not used
6
I6
read only
1*
5
I5
read only
1*
4
I4
read only
1*
3
I3
read only
X*
2
I2
read only
X*
1
I1
read only
X*
0
I0
read only
X*
PCA9537_5
Product data sheet
value ‘X’ is determined by externally applied logic
level
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 7 May 2009
4 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.2.3 Register 1 - Output Port register
This register reflects the outgoing logic levels of the pins defined as outputs by Register 3.
Bit values in this register have no effect on pins defined as inputs. Reads from this register
return the value that is in the flip-flop controlling the output selection, not the actual pin
value.
Table 5.
Register 1 - Output Port register bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
O7
R
1*
not used
6
O6
R
1*
5
O5
R
1*
4
O4
R
1*
3
O3
R
1*
2
O2
R
1*
1
O1
R
1*
0
O0
R
1*
reflects outgoing logic levels of pins defined as outputs
by Register 3
6.2.4 Register 2 - Polarity Inversion register
This register allows the user to invert the polarity of the Input Port register data. If a bit in
this register is set (written with 1), the corresponding Input Port data is inverted. If a bit in
this register is cleared (written with a 0), the Input Port data polarity is retained.
Table 6.
Register 2 - Polarity Inversion register bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
N7
R/W
0*
not used
6
N6
R/W
0*
5
N5
R/W
0*
4
N4
R/W
0*
3
N3
R/W
0*
2
N2
R/W
0*
0 = Input Port register data retained (default value)
1
N1
R/W
0*
1 = Input Port register data inverted
0
N0
R/W
0*
inverts polarity of Input Port register data
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
5 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.2.5 Register 3 - Configuration register
This register configures the directions of the I/O pins. If a bit in this register is set, the
corresponding port pin is enabled as an input with high-impedance output driver. If a bit in
this register is cleared, the corresponding port pin is enabled as an output. At reset, the
I/Os are configured as inputs.
Table 7.
Register 3 - Configuration register bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
C7
R/W
1*
not used
6
C6
R/W
1*
5
C5
R/W
1*
4
C4
R/W
1*
3
C3
R/W
1*
2
C2
R/W
1*
0 = corresponding port pin enabled as an output
1
C1
R/W
1*
0
C0
R/W
1*
1 = corresponding port pin configured as an input
(default value)
configures the directions of the I/O pins
6.3 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9537 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9537 registers and state machine will initialize to their default states.
Thereafter, VDD must be lowered below 0.2 V to reset the device.
For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the
operating voltage.
6.4 RESET input
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst).
The PCA9537 registers and SMBus/I2C-bus state machine will be held in their default
state until the RESET input is once again HIGH. This input requires a pull-up resistor to
VDD if no active connection is used.
6.5 Interrupt output
The open-drain interrupt output (INT) is activated when one of the port pins changes state
and the pin is configured as an input. The interrupt is de-activated when the input returns
to its previous state or the Input Port register is read.
Note that changing an I/O from an output to an input may cause a false interrupt to occur
if the state of the pin does not match the contents of the Input Port register.
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
6 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.6 I/O port
When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a
high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V.
If the I/O is configured as an output, then either Q1 or Q2 is enabled, depending on the
state of the Output Port register. Care should be exercised if an external voltage is applied
to an I/O configured as an output because of the low-impedance paths that exist between
the pin and either VDD or VSS.
data from
shift register
output port
register data
configuration
register
data from
shift register
D
VDD
Q1
Q
FF
write
configuration
pulse
write pulse
CK
Q
D
Q
FF
I/O pin
Q2
CK
output port
register
input port
register
D
Q
FF
read pulse
VSS
input port
register data
CK
to INT
polarity inversion
register
data from
shift register
D
Q
FF
write polarity
pulse
polarity
inversion
register data
CK
002aad723
Remark: At power-on reset, all registers return to default values.
Fig 4.
Simplified schematic of IO0 to IO3
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
7 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
6.7 Bus transactions
Data is transmitted to the PCA9537 registers using the write mode as shown in Figure 5
and Figure 6. Data is read from the PCA9537 registers using the read mode as shown in
Figure 7 and Figure 8. These devices do not implement an auto-increment function so
once a command byte has been sent, the register which was addressed will continue to
be accessed by reads until a new command byte has been sent.
SCL
1
2
3
4
5
6
7
8
9
slave address
SDA S
1
0
0
1
0
0
1
START condition
0
R/W
A
0
0
0
0
0
0
STOP
condition
data to port
command byte
0
1
A
DATA 1
A
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
P
write to port
tv(Q)
data out from port
DATA 1 VALID
002aae636
Expanded diagram is shown in Figure 16.
Fig 5.
Write to output port register
SCL
1
2
3
4
5
6
7
8
9
slave address
SDA S
1
0
0
1
START condition
0
0
1
0
R/W
A
0
0
0
0
0
0
STOP
condition
data to register
command byte
1 1/0 A
acknowledge
from slave
acknowledge
from slave
DATA 1
A
P
acknowledge
from slave
data to register
002aae637
Fig 6.
Write to configuration or polarity inversion registers
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
8 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
slave address
SDA S
1
0
0
1
0
0
1
START condition
0
A
acknowledge
from slave
R/W
acknowledge
from slave
slave address
(cont.) S
1
0
0
1
0
Fig 7.
data from register
0
(repeated)
START condition
(cont.)
A
COMMAND BYTE
1
1
A
data from register
DATA (first byte)
A
R/W
DATA (last byte)
acknowledge
from master
acknowledge
from slave
NA P
no acknowledge
from master
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
STOP
condition
002aae638
Read from register
SCL
1
2
3
4
5
6
7
8
9
slave address
SDA S
1
0
0
1
0
START condition
data from port
0
1
1
R/W
A
data from port
A
DATA 1
DATA 4
acknowledge
from master
acknowledge
from slave
no acknowledge
from master
1
P
STOP
condition
read from
port
data into
port
DATA 2
DATA 1
th(D)
DATA 3
DATA 4
tsu(D)
INT
tv(INT)
trst(INT)
002aae639
This figure assumes the command byte has previously been programmed with 00h.
Transfer of data can be stopped at any moment by a STOP condition.
Expanded diagram is shown in Figure 15.
Fig 8.
Read input port register
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
9 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
7. Application design-in information
VDD
(5 V)
10 kΩ
10 kΩ
10 kΩ
10 kΩ
2 kΩ
VDD
VDD
MASTER
CONTROLLER
PCA9537
INT
SCL
SCL
IO0
SDA
SDA
IO1
INT
INT
RESET
SUB-SYSTEM 1
(e.g., temp sensor)
100 kΩ
SUB-SYSTEM 2
(e.g., counter)
IO2
RESET
RESET
IO3
VSS
VSS
A
controlled
switch
(e.g., CBT device)
enable
B
002aae640
Device address is 1001 001x for this example.
IO0, IO2, IO3 configured as outputs.
IO1 configured as input.
Fig 9.
Typical application
7.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 9. Since the LED acts as a diode, when the LED is off the I/O
VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower
than VDD.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 10 shows a high value resistor in parallel with the LED. Figure 11 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI
at or above VDD and prevents additional supply current consumption when the LED is off.
VDD
VDD
LED
100 kΩ
IOn
VDD
5V
LED
IOn
002aac660
Fig 10. High value resistor in parallel with
the LED
PCA9537_5
Product data sheet
3.3 V
002aac661
Fig 11. Device supplied by a lower voltage
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Rev. 05 — 7 May 2009
10 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
8. Limiting values
Table 8.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
−0.5
+6.0
V
II
input current
-
±20
mA
VI/O
voltage on an input/output pin
VSS − 0.5
5.5
V
IO(IOn)
output current on pin IOn
-
±50
mA
IDD
supply current
-
85
mA
ISS
ground supply current
-
100
mA
Ptot
total power dissipation
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj(max)
maximum junction temperature
-
+125
°C
operating
9. Static characteristics
Table 9.
Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
operating mode; VDD = 5.5 V;
no load; fSCL = 100 kHz
-
104
175
µA
IstbL
LOW-level standby current
Standby mode; VDD = 5.5 V;
no load; VI = VSS;
fSCL = 0 kHz; I/O = inputs
-
0.25
1
µA
IstbH
HIGH-level standby current
Standby mode; VDD = 5.5 V;
no load; VI = VDD;
fSCL = 0 kHz; I/O = inputs
-
0.25
1
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.5
1.65
V
−0.5
-
+0.3VDD
V
[1]
Input SCL; input/output SDA
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
3
7
-
mA
IL
leakage current
VI = VDD = VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
5
10
pF
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
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PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Table 9.
Static characteristics …continued
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
−0.5
-
+0.8
V
2.0
-
5.5
V
I/Os
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
IOL
LOW-level output current
VOL = 0.5 V
VDD = 2.3 V
[2]
8
10
-
mA
VDD = 3.0 V
[2]
8
14
-
mA
VDD = 4.5 V
[2]
8
17
-
mA
VDD = 2.3 V
[2]
10
13
-
mA
VDD = 3.0 V
[2]
10
19
-
mA
VDD = 4.5 V
[2]
10
24
-
mA
VDD = 2.3 V
[3]
1.8
-
-
V
VDD = 3.0 V
[3]
2.6
-
-
V
VDD = 4.5 V
[3]
4.1
-
-
V
VDD = 2.3 V
[3]
1.7
-
-
V
VDD = 3.0 V
[3]
2.5
-
-
V
VDD = 4.5 V
[3]
4.0
-
-
V
−1
-
+1
µA
-
5
10
pF
VOL = 0.7 V
VOH
HIGH-level output voltage
IOH = −8 mA
IOH = −10 mA
IL
leakage current
Ci
input capacitance
VI = VDD = VSS
Interrupt INT
IOL
LOW-level output current
VOL = 0.4 V
3
13
-
mA
IOH
HIGH-level output current
VOL = 0.4 V
−1
-
+1
µA
−0.5
-
+0.8
V
2.0
-
5.5
V
−1
-
+1
µA
Select input RESET
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
IL
leakage current
VI = VDD = VSS
[1]
VDD must be lowered to 0.2 V in order to reset part.
[2]
Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
[3]
The total current sourced by all I/Os must be limited to 85 mA.
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
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PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
10. Dynamic characteristics
Table 10.
Dynamic characteristics
Symbol
Parameter
Conditions
Standard-mode
I2C-bus
Min
Max
Fast-mode I2C-bus
Min
Max
Unit
fSCL
SCL clock frequency
0
100
0
400
tBUF
bus free time between a STOP and
START condition
4.7
-
1.3
-
kHz
µs
tHD;STA
hold time (repeated) START condition
4.0
-
0.6
-
µs
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
µs
tSU;STO
set-up time for STOP condition
4.0
-
0.6
-
µs
tHD;DAT
data hold time
0
-
0
-
ns
0.3
3.45
0.1
0.9
µs
300
-
50
-
ns
tVD;ACK
data valid acknowledge time
[1]
tVD;DAT
data valid time
[2]
tSU;DAT
data set-up time
250
-
100
-
ns
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
tr
rise time of both SDA and SCL signals
-
1000
20 + 0.1Cb[3]
300
ns
tf
fall time of both SDA and SCL signals
-
300
20 + 0.1Cb[3]
300
ns
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
Port timing
tv(Q)
data output valid time
-
200
-
200
ns
tsu(D)
data input set-up time
100
-
100
-
ns
th(D)
data input hold time
1
-
1
-
µs
Interrupt timing
tv(INT)
valid time on pin INT
-
4
-
4
µs
trst(INT)
reset time on pin INT
-
4
-
4
µs
tw(rst)
reset pulse width
4
-
4
-
ns
trec(rst)
reset recovery time
0
-
0
-
ns
trst
reset time
400
-
400
-
ns
RESET
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for the SDA data out to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
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PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 12. Definition of timing
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 1
(D1)
bit 0
(D0)
STOP
condition
(P)
acknowledge
(A)
1 / fSCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab285
Rise and fall times refer to VIL and VIH.
Fig 13. I2C-bus timing diagram
ACK or read cycle
START
SCL
SDA
30 %
trst
RESET
50 %
50 %
trec(rst)
50 %
tw(rst)
trst
IOn
50 %
after reset,
I/Os reconfigured
as inputs
002aad732
Fig 14. Definition of RESET timing
PCA9537_5
Product data sheet
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PCA9537
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4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
SCL
2
1
0
A
P
70 %
30 %
SDA
tsu(D)
th(D)
input
50 %
tv(INT)
trst(INT)
INT
002aae641
Fig 15. Expanded view of read input port register
SCL
2
1
0
A
P
70 %
SDA
tv(Q)
output
50 %
002aad735
Fig 16. Expanded view of write to output port register
PCA9537_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
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PCA9537
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4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
11. Test information
VDD
PULSE
GENERATOR
VI
RL
500 Ω
VO
6.0 V
open
VSS
DUT
CL
50 pF
RT
002aab393
RL = load resistor.
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 17. Test circuitry for switching times
RL
from output under test
500 Ω
CL
50 pF
S1
2VDD
open
GND
RL
500 Ω
002aac226
Fig 18. Test circuit
Table 11.
Test
tv(Q)
Test data
Load
RL
CL
500 Ω
50 pF
PCA9537_5
Product data sheet
Switch
2 × VDD
© NXP B.V. 2009. All rights reserved.
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PCA9537
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4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
12. Package outline
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
D
E
SOT552-1
A
X
c
y
HE
v M A
Z
6
10
A2
(A3)
A1
A
pin 1 index
θ
Lp
L
1
5
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.15
0.23
0.15
3.1
2.9
3.1
2.9
0.5
5.0
4.8
0.95
0.7
0.4
0.1
0.1
0.1
0.67
0.34
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-07-29
03-02-18
SOT552-1
Fig 19. Package outline SOT552-1 (TSSOP10)
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
17 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
13. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
PCA9537_5
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Rev. 05 — 7 May 2009
18 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 20) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 20.
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
19 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 20. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 14.
Abbreviations
Acronym
Description
ACPI
Advanced Configuration and Power Interface
CBT
Cross-Bar Technology
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
FET
Field-Effect Transistor
FF
Flip-Flop
GPIO
General Purpose Input/Output
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
LED
Light Emitting Diode
LP
Low-Pass
MM
Machine Model
POR
Power-On Reset
SMBus
System Management Bus
PCA9537_5
Product data sheet
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Rev. 05 — 7 May 2009
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PCA9537
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4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
16. Revision history
Table 15.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9537_5
20090507
Product data sheet
-
PCA9537_4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Pin names changed from “I/O0, I/O1, I/O2, I/O3” to “IO0, IO1, IO2, IO3”, respectively
Section 6.4 “RESET input”, 1st sentence: changed symbol from “tW” to “tw(rst)”
Figure 5 “Write to output port register”: changed symbol from “tpv” to “tv(Q)”
Figure 8 “Read input port register”:
– changed symbol from “tph” to “th(D)”
– changed symbol from “tps” to “tsu(D)”
– changed symbol from “tiv” to “tv(INT)”
– changed symbol from “tir” to “trst(INT)”
•
Table 8 “Limiting values”:
– parameter description for symbol VI/O changed from “DC voltage on an I/O” to “voltage on an
input/output pin”
– parameter description for symbol ISS changed from “supply current” to “ground supply current”
– symbol/parameter changed from “II/O, DC output current on an I/O” to “IO(IOn), output current
on pin IOn”
•
Table 9 “Static characteristics”, sub-section “Supplies”:
– symbol/parameter changed from “Istbl, Standby current” to “IstbL, LOW-level standby current”
– symbol/parameter changed from “Istbh, Standby current” to “IstbH, HIGH-level standby current”
•
Table 10 “Dynamic characteristics”, sub-section “Port timing”:
– symbol/parameter changed from “tPV, Output data valid” to “tv(Q), data output valid time”
– symbol/parameter changed from “tPS, Input data setup time” to “tsu(D), data input set-up time”
– symbol/parameter changed from “tPH, Input data hold time” to “th(D), data input hold time”
•
Table 10 “Dynamic characteristics”, sub-section “Interrupt timing”:
– symbol/parameter changed from “tIV, Interrupt valid” to “tv(INT), valid time on pin INT”
– symbol/parameter changed from “tIR, Interrupt reset” to “trst(INT), reset time on pin INT”
•
Table 10 “Dynamic characteristics”, sub-section “RESET”:
– symbol changed from “tW” to “tw(rst)”
– symbol changed from “tREC” to “trec(rst)”
– symbol/parameter changed from “tRESET, Time to reset” to “trst, reset time”
•
Figure 14 “Definition of RESET timing”:
– symbol changed from “tW” to “tw(rst)”
– symbol changed from “tREC” to “trec(rst)”
– symbol changed from “tRESET” to “trst”
•
Figure 15 “Expanded view of read input port register”:
– changed symbol from “tPH” to “th(D)”
– changed symbol from “tPS” to “tsu(D)”
– changed symbol from “tIV” to “tv(INT)”
– changed symbol from “tIR” to “trst(INT)”
PCA9537_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 7 May 2009
21 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Table 15.
Revision history …continued
Document ID
Modifications
(continued):
Release date
•
•
Data sheet status
Change notice
Supersedes
Figure 16 “Expanded view of write to output port register”: changed symbol from “tPV” to “tv(Q)”
(Old) Figure 18, “Test circuit” split into Figure 18 “Test circuit” and Table 11 “Test data”
– symbol changed from “tpv” to “tv(Q)”
•
•
Added soldering information
Added Table 14 “Abbreviations”
PCA9537_4
20060921
Product data sheet
-
PCA9537_3
PCA9537_3
(9397 750 14259)
20041129
Product data sheet
-
PCA9537_2
PCA9537_2
(9397 750 14052)
20040930
Objective data sheet
-
PCA9537_1
PCA9537_1
(9397 750 12894)
20040820
Objective data sheet
-
-
PCA9537_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 7 May 2009
22 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9537_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 7 May 2009
23 of 24
PCA9537
NXP Semiconductors
4-bit I2C-bus and SMBus low power I/O port with interrupt and reset
19. Contents
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.3
6.4
6.5
6.6
6.7
7
7.1
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 4
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 4
Register 0 - Input Port register . . . . . . . . . . . . . 4
Register 1 - Output Port register. . . . . . . . . . . . 5
Register 2 - Polarity Inversion register . . . . . . . 5
Register 3 - Configuration register . . . . . . . . . . 6
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6
RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 6
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 8
Application design-in information . . . . . . . . . 10
Minimizing IDD when the I/Os are used to
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 11
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Handling information. . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 18
Introduction to soldering . . . . . . . . . . . . . . . . . 18
Wave and reflow soldering . . . . . . . . . . . . . . . 18
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 23
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 May 2009
Document identifier: PCA9537_5
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