2.5V / 3.3V 1:2 Differential LVPECL Clock / Data Fanout Buffer

NB6L611
2.5V / 3.3V 1:2 Differential
LVPECL Clock / Data Fanout
Buffer
Multi−Level Inputs with Internal Termination
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Description
The NB6L611 is a differential 1:2 clock or data fanout buffer. The
differential inputs incorporate internal 50 W termination resistors that
are accessed through the VTD pins and will accept LVPECL, CML,
LVDS, LVCMOS or LVTTL logic levels.
T h e V R E FA C r e f e r e n c e o u t p u t c a n b e u s e d t o r e b i a s
capacitor−coupled differential or single−ended input signals. When
used, decouple VREFAC with a 0.01 mF capacitor and limit current
sourcing or sinking to 0.5 mA. When used, decouple VREFAC with a
0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA.
When not used, VREFAC output should be left open.
The device is housed in a small 3x3 mm 16 pin QFN package.
The NB6L611 is a member of the ECLinPS MAX™ family of high
performance clock and data management products.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Input Clock Frequency > 4.0 GHz
280 ps Typical Propagation Delay
100 ps Typical Rise and Fall Times
0.5 ps maximum RMS Clock Jitter
Differential LVPECL Outputs, 780 mV Amplitude, typical
LVPECL Operating Range: VCC = 2.375 V to 3.63 V with VEE = 0 V
NECL Operating Range: VCC = 0 V with VEE = −2.375 V to −3.63 V
Internal Input Termination Resistors, 50 W
VREFAC Reference Output Voltage
Functionally Compatible with Existing 2.5 V / 3.3 V LVEL, LVEP,
EP, and SG Devices
−40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 4
1
MARKING
DIAGRAM*
1
QFN−16
MN SUFFIX
CASE 485G
1
16
NB6L
611
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
Q0
VTD
Q0
D
D
Q1
VTD
VREFAC
Q1
Figure 1. Simplified Logic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Publication Order Number:
NB6L611/D
NB6L611
VCC
16
VTD
1
D
2
VEE VEE
VCC
15
13
14
Exposed Pad (EP)
12
Q0
11
Q0
NB6L611
D
3
10
Q1
VTD
4
9
Q1
5
6
7
VCC VREFAC VEE
8
VCC
Figure 2. Pin Configuration (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
1
VTD
−
Description
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted Differential Input. Note1. Internal 50 W Resistor to Termination Pin, VTD.
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Note 1. Internal 50 W Resistor to Termination Pin, VTD.
4
VTD
−
Internal 50 W Termination Pin for D input.
5
VCC
−
Positive Supply Voltage
6
VREFAC
Internal 50 W Termination Pin for D input.
Output Reference Voltage for direct or capacitor coupled inputs
7
VEE
−
Negative Supply Voltage
8
VCC
−
Positive Supply Voltage
9
Q1
LVPECL Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC − 2.0 V.
10
Q1
LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 W Resistor to VCC − 2.0 V.
11
Q0
LVPECL Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC − 2.0 V.
12
Q0
LVPECL Output
Noninverted Differential Output. Typically Terminated with 50 W Resistor to VCC − 2.0 V.
13
VCC
−
Positive Supply Voltage
14
VEE
−
Negative Supply Voltage
15
VEE
−
Negative Supply Voltage
16
VCC
−
Positive Supply Voltage
−
EP
−
The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat−sinking
conduit. The pad is not electrically connected to the die, but is recommended to be electrically
and thermally connected to VEE on the PC board.
1. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage or left open, and
if no signal is applied on D/D input, then, the device will be susceptible to self−oscillation.
2. All VCC and VEE pins must be externally connected to a power supply for proper operation.
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NB6L611
Table 2. ATTRIBUTES
Characteristics
ESD Protection
Value
Human Body Model
Machine Model
Moisture Sensitivity
16−QFN
Flammability Rating
Oxygen Index: 28 to 34
> 2 kV
> 200V
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
Positive Power Supply
Parameter
VEE = 0 V
Condition 1
Condition 2
4.0
V
VEE
Negative Power Supply
VCC = 0 V
−4.0
V
VIO
Positive Input/Output Voltage
Negative Input/Output Voltage
VEE = 0 V
VCC = 0 V
4.5
−4.5
V
V
VINPP
Differential Input Voltage |D − D|
VCC−VEE
V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
mA
IOUT
Output Current (LVPECL Output)
Continuous
Surge
50
100
mA
mA
IVREFAC
VREFAC Sink/Source Current
2.0
mA
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient)
(Note 3)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
(Note 3)
Tsol
Wave Solder Pb−Free
−0.5 VIo VCC + 0.5
+0.5 VIo VEE − 0.5
16 QFN
−40 to +85
°C
−65 to +150
°C
QFN−16
QFN−16
42
35
°C/W
°C/W
QFN−16
4
°C/W
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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NB6L611
Table 4. DC CHARACTERISTICS, Multi−Level Inputs VCC = 2.375 V to 3.63 V, VEE = 0 V, or VCC = 0 V, VEE = −2.375 V to
−3.63 V, TA = −40°C to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
30
45
60
mA
VCC = 3.3 V
VCC = 2.5 V
VCC − 1075
2225
1425
VCC − 950
2350
1550
VCC − 825
2475
1675
mV
VCC = 3.3V
VCC = 2.5V
VCC − 1875
1475
675
VCC − 1725
1575
775
VCC − 1625
1675
875
mV
VEE + 1050
VCC − 150
mV
POWER SUPPLY CURRENT
ICC
Power Supply Current (Inputs and Outputs Open)
LVPECL OUTPUTS (Notes 4 and 5)
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
DIFFERENTIAL INPUT DRIVEN SINGLE−ENDED (see Figures 9 and 10) (Note 6)
Vth
Input Threshold Reference Voltage Range (Note 7)
VIH
Single−ended Input HIGH Voltage
Vth + 150
VCC
mV
VIL
Single−ended Input LOW Voltage
VEE
Vth − 150
mV
VISE
Single−ended Input Voltage Amplitude (VIH − VIL)
300
VCC−VEE
mV
VCC – 1.325
mV
VREFAC
VREFAC
Output Reference Voltage (VCC 25 V)
VCC – 1.525
VCC – 1.425
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (see Figures 11, 12 and 13) (Note 8)
VIHD
Differential Input HIGH Voltage
VEE + 1200
VCC
mV
VILD
Differential Input LOW Voltage
VEE
VCC − 150
mV
VID
Differential Input Voltage (VIHD − VILD)
VEE + 150
VCC−VEE
mV
VCMR
Input Common Mode Range (Differential Configuration) (Note9)
VEE + 950
VCC − 75
mV
IIH
Input HIGH Current D/D, (VTD/VTD Open)
−150
150
mA
IIL
Input LOW Current D/D, (VTD/VTD Open)
−150
150
mA
60
W
TERMINATION RESISTORS
RTIN
Internal Input Termination Resistor (Measured from D to VTD)
40
50
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. LVPECL outputs loaded with 50 W to VCC − 2.0 V for proper operation.
5. Input and output parameters vary 1:1 with VCC.
6. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously.
7. Vth is applied to the complementary input when operating in single−ended mode.
8. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously.
9. VCMR minimum varies 1:1 with VEE, VCMR maximum varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the
differential input signal.
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NB6L611
Table 5. AC CHARACTERISTICS VCC = 2.375 V to 3.63 V, VEE = 0 V, or VCC = 0 V, VEE = −2.375 V to −3.63 V,
TA = −40°C to +85°C; (Note 10)
Characteristic
Symbol
VOUTPP
Output Voltage Amplitude (@ VINPP)
(Note 14) (See Figure 3)
Min
Typ
fin ≤ 1.5 GHz
fin = 2.0 GHz
fin = 3.0 GHz
fin = 4.0 GHz
725
520
320
170
780
680
500
400
D to Q
225
280
375
ps
3
15
15
80
ps
50
60
ps
0.2
0.5
ps
VCC − VEE
mV
170
ps
tPD
Propagation Delay
tSKEW
Duty Cycle Skew (Note 11)
Within Device Skew
Device to Device Skew (Note 12)
tDC
Output Clock Duty Cycle
(Reference Duty Cycle = 50%)
fin ≤ 4.0 GHz
tJITTER
RMS Random Clock Jitter (Note 13)
fin ≤ 4.0 GHz
VINPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 14)
tr,tf
Output Rise/Fall Times @ 0.5 GHz (20% − 80%)
40
150
Q, Q
100
Max
Unit
mV
VOUTPP OUTPUT VOLTAGE AMPLITUDE (mV)
(TYPICAL)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. Measured by forcing VINPP (MIN) from a 50% duty cycle clock source. All loading with an external RL = 50 W to VCC − 2.0 V. Input edge rates
40 ps (20% − 80%).
11. Duty cycle skew is measured between differential outputs using the deviations of the sum of Tpw− and Tpw+ @ 0.5GHz.
12. Device to device skew is measured between outputs under identical transition @ 0.5 GHz.
13. Additive RMS jitter with 50% duty cycle clock signal.
14. Input and output voltage swing is a single−ended measurement operating in differential mode.
800
700
600
500
400
300
200
100
0
0
1
2
3
4
fout, CLOCK OUTPUT FREQUENCY (GHz)
Figure 3. Output Voltage Amplitude (VOUTPP) versus Output
Frequency at Ambient Temperature (Typical)
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NB6L611
Figure 4. Typical Phase Noise Plot at
fcarrier = 311.04 MHz
Figure 5. Typical Phase Noise Plot at
fcarrier = 622.08 MHz
Figure 6. Typical Phase Noise Plot at
fcarrier = 1 GHz
Figure 7. Typical Phase Noise Plot at
fcarrier = 2 GHz
device (integrated between 12 kHz and 20 MHz; as shown
in the shaded region of the plot) at each of the frequencies
is 44 fs, 11 fs, 8 fs and 6 fs respectively. The input source
used for the phase noise measurements is Agilent E8663B.
The above phase noise plots captured using Agilent
E5052A show additive phase noise of the NB6L611 device
at frequencies 311.04 MHz, 622.08 MHz, 1 GHz and 2 GHz
respectively at an operating voltage of 3.3 V in room
temperature. The RMS Phase Jitter contributed by the
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NB6L611
VTD
VCC
50 W
RC
RC
D
I
D
50 W
VTD
Figure 8. Input Structure
VCC
Vthmax
D
VIH
VIHmax
VILmax
Vth
VIH
Vth
VIL
Vth
VIL
Vthmin
D
Vth
Figure 10. Vth Diagram
D
D
D
D
VIHD(MAX)
VIHD
VILD
D
VILD(MAX)
VINPP = VIH(D) − VIL(D)
D
VIHD
VID = VIHD − VILD
Q
VILD
VOUTPP = VOH(Q) − VOL(Q)
Q
VIHD(MIN)
GND
VID = |VIHD(D) − VILD(D)|
Figure 12. Differential Inputs Driven
Differentially
Figure 11. Differential Inputs
Driven Differentially
VCMR
VILmin
VEE
Figure 9. Differential Input Driven
Single−Ended
VCC
VIHmin
tPD
tPD
VILD(MIN)
Figure 13. VCMR Diagram
Figure 14. AC Reference Measurement
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NB6L611
VCC
VCC
VCC
NB6L611
ZO = 50 W
LVPECL
Driver
VCC
ZO = 50 W
D
50 W
VT = VCC − 2 V
ZO = 50 W
LVDS
Driver
50 W
NB6L611
D
50 W
VT = Open
ZO = 50 W
D
50 W
D
VEE
VEE
VEE
VEE
Figure 15. LVPECL Interface
Figure 16. LVDS Interface
VCC
VCC
NB6L611
ZO = 50 W
CML
Driver
D
50 W
VT = VCC
ZO = 50 W
50 W
D
VEE
VEE
Figure 17. Standard 50 W Load CML Interface
VCC
VCC
VCC
ZO = 50 W
Differential
Driver
NB6L611
ZO = 50 W
D
50 W
VT = VREFAC*
ZO = 50 W
Single−Ended
Driver
50 W
D
VEE
VCC
Figure 18. Capacitor−Coupled
Differential Interface
(VT Connected to VREFAC)
NB6L611
D
50 W
VT = VREFAC*
50 W
D
VEE
VEE
*VREFAC bypassed to ground with a 0.01 mF capacitor
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8
Figure 19. Capacitor−Coupled
Single−Ended Interface
(VT Connected to VREFAC)
(Open)
VEE
NB6L611
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 20. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping†
NB6L611MNG
QFN−16
(Pb−free)
123 Units / Rail
NB6L611MNR2G
QFN−16
(Pb−free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NB6L611
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE D
D
PIN 1
LOCATION
ÇÇÇ
ÇÇÇ
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉ
ÉÉ
EXPOSED Cu
0.15 C
TOP VIEW
0.15 C
DETAIL B
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
L
L
A
B
ÉÉ
ÉÉ
ÇÇ
A3
MOLD CMPD
A1
DETAIL B
(A3)
ALTERNATE
CONSTRUCTIONS
A
16 X
SEATING
PLANE
0.08 C
SIDE VIEW
16X
L
A1
5
NOTE 5
8
4
16X
0.575
0.022
e
EXPOSED PAD
3.25
0.128
0.30
0.012
EXPOSED PAD
9
E2
K
12
1
16
16X
e
1.50
0.059
3.25
0.128
13
b
0.10 C A B
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
0.00
0.15
SOLDERING FOOTPRINT*
C
D2
DETAIL A
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
BOTTOM VIEW
0.50
0.02
NOTE 3
0.30
0.012
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
The products described herein (NB6L611), may be covered by U.S. patents including 6,362,644. There may be other patents pending.
ECLinPS MAX is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your
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NB6L611/D