64R QF N HL SOT903-1 plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HLQFN64R Package type industry code HLQFN64R Package style descriptive code HLQFN (thermal enhanced low profile quad flatpack; no leads) Package style suffix code R (resin based) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 14-11-2007 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 8.9 - 9 9.1 mm E package width 8.9 - 9 9.1 mm A seated height [tbd] - 1.6 1.7 mm A2 package height [tbd] - 1.6 [tbd] mm n2 actual quantity of termination - - 64 - SOT903-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 2. Package outline HLQFN64R; plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 × 9 × 1.6 mm B D terminal 1 index area SOT903-1 A E A detail X C e1 L e L1 v w b 1/2 e 17 32 M M y1 C C A B C y 33 16 e Em Ej El En Eh e2 Ek 1/2 e 1 terminal 1 index area 48 64 49 Dh X Dj Dk Dl Dm 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) L1 v w y y1 0.18 0.08 0.1 0.05 0.05 0.1 UNIT A max b D Dh Dj Dk Dl Dm E Eh Ej Ek El Em En e e1 e2 L mm 1.7 0.3 0.2 9.1 8.9 2.92 2.82 0.86 0.76 3.32 3.22 1.79 1.69 2.16 2.06 9.1 8.9 0.31 0.21 0.69 0.59 1.79 1.69 0.79 0.69 2.63 2.53 2.02 1.92 0.5 7.5 7.5 0.45 0.40 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT903-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 06-03-29 07-11-14 Fig. 1. Package outline HLQFN64R (SOT903-1) SOT903-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT903-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 3. Soldering Hx D P 1/2 P C Vd 0.065 Vd1 Vx 0.12 Hy SLy1 Vy3 SPy1 Vy2 SPy By Ay SLy Vy1 SPx SPx2 SPx1 SLx1 SLx Bx Ax solder lands solder paste solder resist occupied area SPy1 Vd Vd1 Vx Vy1 Vy2 Vy3 0.3 0.35 0.5 0.8 0.9 0.8 0.9 DIMENSIONS in mm P Ax Ay Bx By C D Hx Hy SLx SLx1 SLy SLy1 SPx SPx1 SPx2 SPy 0.500 9.000 9.000 7.880 7.880 0.555 0.250 9.500 9.500 4.610 1.740 3.220 0.640 0.800 2.065 0.3 0.7 Fig. 2. Reflow soldering footprint for HLQFN64R (SOT903-1) SOT903-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT903-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT903-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT903-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT903-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5