NCV8669 Very Low Iq 150 mA LDO Regulator with Reset and Early Warning The NCV8669 is 150 mA LDO regulator with integrated reset and early warning functions dedicated for microprocessor applications. Its robustness allows NCV8669 to be used in severe automotive environments. The NCV8669 utilizes precise 1 MW internal resistor divider for Early Warning function which significantly reduces overall application quiescent current and number of external components. Very low quiescent current as low as 42 mA typical for NCV8669 makes it suitable for applications permanently connected to battery requiring very low quiescent current with or without load. The NCV8669 contains protection functions as current limit and thermal shutdown. • • • • • • MARKING DIAGRAM 14 14 1 SO−14 D SUFFIX CASE 751A y z xx Features • • • • http://onsemi.com V8669yzxxG AWLYWW 1 = Timing and Reset Threshold Option* = Early Warning Option* = Voltage Option 5.0 V (xx = 50) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package Output Voltage Options: 5 V Output Voltage Accuracy: ±2 % A Output Current up to 150 mA WL Very Low Quiescent Current: Typ 42 mA (Including Internal Early Y WW Warning Resistor Divider Current) G Very Low Dropout Voltage *See APPLICATION INFORMATION section. Early Warning Threshold Accuracy: $10% Over Temperature Range (Using RSI_ext External Resistor with $1% 100 ppm/°C) ORDERING INFORMATION Microprocessor Compatible Control Functions: See detailed ordering and shipping information in ♦ Reset with Adjustable Power−on Delay dimensions section on page 13 of this data sheet. ♦ Early Warning Wide input voltage operation range: up to 40 V Typical Applications Protection Features: • Body Control Module ♦ Current Limitation ♦ Thermal Shutdown • Instruments and Clusters These are Pb−Free Devices • Occupant Protection and Comfort • Powertrain VBAT Vout Vin Cin 0.1 mF * RSI_ext Vout the VDD Cout 2.2 mF SI Microprocessor NCV8669yz** DT *RSI_ext is optional ** z is 1, 2, 3, ... , n SO I/O RO RESET GND Figure 1. Application Circuit © Semiconductor Components Industries, LLC, 2011 July, 2011 − Rev. 1 1 Publication Order Number: NCV8669/D NCV8669 Vin Vout RSI1 RSI2 Driver with Current Limit RO Thermal Shutdown TIMING CIRCUIT and RESET OUTPUT DRIVER and SENSE OUTPUT DRIVER Vref SO SI DT V ref * GND *Pull−down Resistor (typ 150 kW) active only in Reset State. Figure 2. Simplified Block Diagram NC 1 14 SI Vin DT GND GND GND GND GND GND GND Vout SO RO SO−14 Figure 3. Pin Connections (Top View) PIN FUNCTION DESCRIPTION Pin No. SO−14 Pin Name 1 NC Not Connected. Reset Delay Time Select. Short to GND or connect to Vout to select time. Description 2 DT 3, 4, 5, 6, 10, 11, 12 GND 7 RO Reset Output. 30 kW internal Pull−Up resistor connected to Vout. RO goes Low when Vout drops by more than 7% (typ.) from its nominal value. 8 SO Early Warning Output. 30 kW internal Pull−Up resistor connected to Vout. It can be used to provide early warning of an impending reset condition. Leave open if not used. 9 Vout Regulated Output Voltage. Connect 2.2 mF capacitor with ESR < 100 W to ground. 13 Vin Positive Power Supply Input. Connect 0.1 mF capacitor to ground. 14 SI Early Warning Adjust Input; connect RSI_ext against GND to adjust Input Voltage Early Warning Threshold or leave unconnected. See Electrical Characteristics Table and Application Information sections for more information. Power Supply Ground. http://onsemi.com 2 NCV8669 ABSOLUTE MAXIMUM RATINGS Rating Symbol Min Max −0.3 − 40 45 Iin −5 − Output Voltage (Note 2) Vout −0.3 5.5 V Output Current Iout −3 Current Limited mA Sense Input Voltage DC DC Transient, t < 100 ms VSI −0.3 − 40 45 Sense Input Current Range ISI −1 1 DT (Reset Delay Time Select) Voltage VDT −0.3 5.5 V DT (Reset Delay Time Select) Current IDT −1 1 mA Reset Output Voltage VRO −0.3 5.5 V Reset Output Current IRO −3 3 mA Sense Output Voltage VSO −0.3 5.5 V Sense Output Current ISO −3 3 mA Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C Input Voltage DC (Note 1) DC Transient, t < 100 ms Vin Input Current Unit V mA V mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. 5.5 or (Vin + 0.3 V), whichever is lower ESD CAPABILITY (Note 3) Rating Symbol Min Max Unit ESD Capability, Human Body Model ESDHBM −2 2 kV ESD Capability, Machine Model ESDMM −200 200 V ESD Capability, Charged Device Model ESDCDM −1 1 kV Min Max Unit 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101) LEAD SOLDERING TEMPERATURE AND MSL (Note 4) Rating Symbol Moisture Sensitivity Level MSL Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions TSLD 1 − − 265 peak °C 4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS (Note 5) Rating Thermal Characteristics Thermal Resistance, Junction−to−Air (Note 6) Thermal Reference, Junction−to−Lead (Note 6) Symbol Value RqJA RψJL 94 18 5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. http://onsemi.com 3 Unit °C/W NCV8669 OPERATING RANGES (Note 7) Rating Symbol Min Max Unit Input Voltage (Note 7) Vin 5.5 40 V Junction Temperature TJ −40 150 °C 7. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 8. Minimum Vin = 5.5 V or (Vout + VDO), whichever is higher. ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VDT = GND, RSI_ext not used, Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40°C to 150°C; unless otherwise noted. (Notes 9 and 10) Test Conditions Parameter Symbol Min Typ Max 4.9 4.9 (−2%) 5.0 5.0 5.1 5.1 (+2%) 4.9 (−2%) 5.0 5.1 (+2%) Unit REGULATOR OUTPUT Output Voltage (Accuracy %) Vin = 5.6 V to 40 V, Iout = 0.1 mA to 100 mA Vin = 5.8 V to 16 V, Iout = 0.1 mA to 150 mA Vout Output Voltage (Accuracy %) TJ = −40 °C to 125 °C Vin = 5.8 V to 28 V, Iout = 0 mA to 150 mA Line Regulation Vin = 6 V to 28 V, Iout = 5 mA Regline −20 0 20 mV Load Regulation Iout = 0.1 mA to 150 mA Regload −40 10 40 mV − − 225 300 450 600 2.2 0.01 − − 100 100 − − 42 49 50 Dropout Voltage (Note 11) Output Capacitor for Stability (Note 12) Vout V VDO Iout = 100 mA Iout = 150 mA Iout = 0 mA to 150 mA Cout ESR V mV mF W QUIESCENT CURRENT Quiescent Current, Iq = Iin − Iout (Note 13) Iout = 0.1 mA, TJ = 25°C Iout = 0.1 mA to 150 mA, TJ ≤ 125°C Iq mA CURRENT LIMIT PROTECTION Current Limit Vout = 0.96 x Vout_nom ILIM 205 − 525 mA Short Circuit Current Limit Vout = 0 V ISC 205 − 525 mA PSRR − 60 − dB − 2 − − 0.8 − − − 1 90 93 96 − 2.0 − 1.75 − − PSRR Power Supply Ripple Rejection (Note 12) f = 100 Hz, 0.5 Vpp DT (Reset Delay Time Select) Vth(DT) DT Threshold Voltage Logic Low Logic High DT Input Current VDT = 5 V IDT V mA RESET OUTPUT RO Output Voltage Reset Threshold (Note 14) Vout decreasing Vin > 5.5 V VRT Reset Hysteresis VRH Maximum Reset Sink Current Vout = 4.5 V, VRO = 0.25 V IROmax %Vout %Vout mA 9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V. 12. Values based on design and/or characterization. 13. Iq for Preset EW Threshold Options is measured when RSI_ext is not used. For typical values of Iq vs RSI_ext see Figure 23. 14. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options http://onsemi.com 4 NCV8669 ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VDT = GND, RSI_ext not used, Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40°C to 150°C; unless otherwise noted. (Notes 9 and 10) Parameter Test Conditions Symbol Min Typ Max Unit VROL − 0.15 0.25 V 4.5 − − 15 30 50 12.8 25.6 16 32 19.2 38.4 16 25 38 RESET OUTPUT RO Reset Output Low Voltage Vout > 1 V, IRO < 200 mA Reset Output High Voltage VROH Integrated Reset Pull Up Resistor RRO Reset Delay Time (Note 14) tRD DT connected to GND DT connected to Vout Reset Reaction Time (see Figure 24) tRR V kW ms ms EARLY WARNING (SI and SO) Early Warning Input Voltage Threshold (Preset EW Threshold Values) NCV8669y2 High Low RSI1 = 480 kW, RSI2 = 520 kW (internal resistor divider values, see ) RSI_ext = 150 kW (±1%, ±100 ppm/°C) (external resistor value, see Figure 22) Integrated Sense Output Pull Up Resistor Sense Output Low Voltage RSO Vin < Vin_EW(th)_Low_Min, ISO < 200 mA, Vout > 1 V Sense Output High Voltage Maximum Sense Output Sink Current Vin_EW(th) VSOL VSOH VSO = 0.25 V Vin < Vin_EW(th)_Low_Min Vout = 4.5 V V 5.67 5.30 6.30 5.89 6.92 6.47 15 30 50 − 0.15 0.25 4.5 − − ISOmax kW V V mA 1.75 − − THERMAL SHUTDOWN Thermal Shutdown Temperature (Note 12) TSD 150 175 195 °C Thermal Shutdown Hysteresis (Note 12) TSH − 25 − °C 9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V. 12. Values based on design and/or characterization. 13. Iq for Preset EW Threshold Options is measured when RSI_ext is not used. For typical values of Iq vs RSI_ext see Figure 23. 14. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options http://onsemi.com 5 NCV8669 TYPICAL CHARACTERISTICS 300 44 Iq, QUIESCENT CURRENT (mA) Iq, QUIESCENT CURRENT (mA) 45 43 42 41 40 39 38 Vin = 13.2 V Iout = 100 mA RSI_ext not used 37 36 35 −40 −20 250 200 150 100 50 0 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) Iout = 0 mA TJ = 25°C RSI_ext not used 0 Figure 4. Quiescent Current vs. Temperature 43 Vout, OUTPUT VOLTAGE (V) TJ = 150°C TJ = −40°C 42 41 TJ = 25°C 40 39 38 37 Vin = 13.2 V RSI_ext not used 36 25 50 75 100 125 35 5.05 5.00 4.95 0 20 40 60 80 100 120 140 160 Iout, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C) Figure 6. Quiescent Current vs. Output Current Figure 7. Output Voltage vs. Temperature 6 500 Iout = 1.0 mA 5 4 3 TJ = 25°C 2 1 TJ = −40°C TJ = 150°C 0 1 2 3 4 5 6 7 40 Vin = 13.2 V Iout = 100 mA 4.90 −40 −20 150 VDO, DROPOUT VOLTAGE (mV) Iq, QUIESCENT CURRENT (mA) 5.10 44 35 0 Vout, OUTPUT VOLTAGE (V) 10 15 20 25 30 Vin, INPUT VOLTAGE (V) Figure 5. Quiescent Current vs. Input Voltage 45 0 5 400 TJ = 25°C 200 100 0 0 8 TJ = 150°C 300 TJ = −40°C 25 50 75 100 125 Vin, INPUT VOLTAGE (V) Iout, OUTPUT CURRENT (mA) Figure 8. Output Voltage vs. Input Voltage Figure 9. Dropout vs. Output Current http://onsemi.com 6 150 NCV8669 TYPICAL CHARACTERISTICS 400 400 ILIM, ISC, CURRENT LIMIT (mA) VDO, DROPOUT VOLTAGE (mV) 500 Iout = 150 mA 300 Iout = 100 mA 200 100 0 −40 −20 0 20 40 60 80 ILIM @ Vout = 4.8 V 200 100 0 5 10 15 20 25 30 35 TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 10. Dropout vs. Temperature Figure 11. Output Current Limit vs. Input Voltage 400 100 Vin = 13.2 V ESR, STABILITY REGION (W) ILIM, ISC, CURRENT LIMIT (mA) 300 0 100 120 140 160 TJ = 25°C ISC @ Vout = 0 V 350 ISC @ Vout = 0 V 300 ILIM @ Vout = 4.8 V 250 200 −40 −20 0 20 40 60 80 Vin = 13.2 V TJ = −40°C to 150°C Cout = 2.2 mF − 100 mF 10 STABLE REGION 1 0.1 0.01 100 120 140 160 40 0 50 100 150 200 250 300 350 TJ, JUNCTION TEMPERATURE (°C) Iout, OUTPUT CURRENT (mA) Figure 12. Output Current Limit vs. Temperature Figure 13. Cout ESR Stability vs. Output Current 14.2 V Vin (1 V/div) TJ = 25°C I Iout = 1 mA Cout = 10 mF trise/fall = 1 ms (Vin) 13 V Iout (100 mA/div) TJ = 25°C Vin = 13.2 V Cout = 10 mF trise/fall = 1 ms (Iout) 150 mA 12.2 V 0.1 mA 5.16 V 5.09 V 5V Vout (50 mV/div) 5V Vout (200 mV/div) 4.97 V 4.77 V TIME (100 ms/div) TIME (20 ms/div) Figure 14. Line Transients Figure 15. Load Transients http://onsemi.com 7 NCV8669 TYPICAL CHARACTERISTICS 100 TJ = 25°C RSI_ext = 150 kW Rout = 5 kW Vin (5 V/div) TJ = 25°C Vin = 13.2 V $0.5 VPP Cout = 2.2 mF Iout = 1 mA 90 80 70 60 PSRR (dB) Vout (5 V/div) 50 40 VRO (5 V/div) 30 VSO (5 V/div) 10 20 0 TIME (100 ms/div) 10 100 4.80 3500 3000 VRT, RESET THRESHOLD (V) TJ = 25°C Vin = 12.5 V Cout = 2.2 mF Iout = 1 mA 4000 2500 2000 1500 1000 500 0 10 100 1000 10000 f, FREQUENCY (Hz) 100000 Figure 17. PSRR vs. Frequency 4500 NOISE DENSITY (nV/√Hz) 10000 f, FREQUENCY (Hz) Figure 16. Power Up and Down Transient 100000 Vin = 13.2 V 4.75 4.70 4.65 4.60 −40 −20 Figure 18. Noise Density vs. Frequency 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) Figure 19. Reset Threshold vs. Temperature 6.5 Vin = 13.2 V 35 VDT = Vout 30 25 20 VDT = GND 15 10 −40 −20 0 20 40 60 80 INPUT VOLTAGE EW THRESHOLD (V) 40 tRD, RESET DELAY TIME (ms) 1000 100 120 140 160 6.4 Vin_EW(th),H (Vin increasing) 6.3 6.2 6.1 6.0 5.9 Vin_EW(th),L (Vin decreasing) 5.8 5.7 5.6 RSI_ext = 150 kW 5.5 −40 −20 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 20. Reset Delay Times vs. Temperature Figure 21. Vin EW Thresholds vs. Temperature http://onsemi.com 8 NCV8669 TYPICAL CHARACTERISTICS 55 11 10 9 8 7 Vin_EW(th),H (Vin decreasing) 6 5 4 50 75 100 125 150 175 RSI_ext, (kW) 200 225 Vin = 13.2 V TJ = 25°C 54 53 52 51 (mA) TJ = 25°C Iq&RSI_ext, QUIESCENT CURRENT INPUT VOLTAGE EW THRESHOLD LOW (V) 12 50 49 48 47 46 45 50 250 Figure 22. Input Voltage EW Threshold Low vs. RSI_ext (Calculated Using E24 Series) 75 100 125 150 175 RSI_ext, (kW) 200 225 250 Figure 23. Quiescent Current vs. RSI_ext (Including IRSI_ext, Calculated Using E24 Series) http://onsemi.com 9 NCV8669 Vin t Vout <tRR VRT+VRH VRT VRO t tRR tRD VROH VROL t Figure 24. Reset Function and Timing Diagram Vin Vin_EW(th)_L t V out V RT t V RO t VSO tWarning t Figure 25. Input Voltage Early Warning Function Diagram DEFINITIONS General Line Regulation All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature. The change in output voltage for a change in input voltage measured for specific output current over operating ambient temperature range. Output Voltage Load Regulation The output voltage parameter is defined for specific temperature, input voltage and output current values or specified over Line, Load and Temperature ranges. The change in output voltage for a change in output current measured for specific input voltage over operating ambient temperature range. http://onsemi.com 10 NCV8669 Dropout Voltage Line Transient Response The input to output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Load Transient Response Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between low−load and high−load conditions. Quiescent Current Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the output load current. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Current Limit and Short Circuit Current Limit Current Limit is value of output current by which output voltage drops below 96% of its nominal value. It means that the device is capable to supply minimum 200 mA without sending Reset signal to microprocessor. Short Circuit Current Limit is output current value measured with output of the regulator shorted to ground. Maximum Package Power Dissipation The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower. PSRR Power Supply Rejection Ratio is defined as ratio of output voltage and input voltage ripple. It is measured in decibels (dB). APPLICATIONS INFORMATION between 0.8 V and 2 V. The default condition for an open DT pin is the faster Reset time (DT = GND condition). Times are in pairs and are highlighted in the table below. Consult factory for availability. The Delay Time select (DT) pin is logic level controlled and provides Reset Delay time per the table. Note the DT pin is sampled only when RO is low, and changes to the DT pin when RO is high will not effect the reset delay time. The NCV8669 regulator is self−protected with internal thermal shutdown and internal current limit. Typical characteristics are shown in Figures 4 to 25. Input Decoupling (Cin) A ceramic or tantalum 0.1 mF capacitor is recommended and should be connected close to the NCV8669 package. Higher capacitance and lower ESR will improve the overall line and load transient response. If extremely fast input voltage transients are expected then appropriate input filter must be used in order to decrease rising and/or falling edges below 50 V/ms for proper operation. The filter can be composed of several capacitors in parallel. Reset Operation A reset signal is provided on the Reset Output (RO) pin to provide feedback to the microprocessor of an out of regulation condition. The timing diagram of reset function is shown in Figure 24. This is in the form of a logic signal on RO. Output voltage conditions below the RESET threshold cause RO to go low. The RO integrity is maintained down to Vout = 1.0 V. The Reset Output (RO) circuitry includes internal pull−up connected to the output (Vout) No external pull−up is necessary. Output Decoupling (Cout) The NCV8669 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. Stability region of ESR versus Output Current is shown in Figure 13. The minimum output decoupling value is 2.2 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load transient response. RESET DELAY AND RESET THRESHOLD OPTIONS Reset Delay Time Select Part Number DT = GND Reset Time DT = Vout Reset Time Reset Threshold NCV86695z 16 ms 32 ms 93% NOTE: Selection of the NCV8669yz devices and the state of the DT pin determines the available Reset Delay times. The part is designed for use with DT tied to ground or OUT, but may be controlled by any logic signal which provides a threshold http://onsemi.com 11 The timing values can be selected from following list: 8, 16, 32, 64, and 128 ms. The reset threshold values can be selected from following list: 90% and 93%. Contact factory for other timing and reset thresholds combinations not included in the table. NCV8669 Sense Input (SI) / Sense Output (SO) Voltage Monitor Thermal Considerations An on−chip comparator is available to provide early warning to the microprocessor of a possible reset signal (Figure 25). The Sense Output is from an open drain driver with an internal 30 kW pull up resistor to Vout. The reset signal typically turns the microprocessor off instantaneously. This can cause unpredictable results with the microprocessor. The signal received from the SO pin will allow the microprocessor time (tWarning) to complete its present task before shutting down. The actual trip point of input voltage is programmed by internal resistor divider and external resistor RSI_ext. If RSI_ext is not used following Preset Early Warning Threshold would apply: As power in the NCV8669 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCV8669 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCV8669 can handle is given by: P D(MAX) + EARLY WARNING PRESET OPTIONS Part Number NCV8669y2 NOTE: RSI1 (Internal) RSI2 (Internal) Input Voltage Early Warning Threshold Low (Typ) (RSI_ext not used) 480 kW 520 kW 2.37 V P D [ V inǒI q@I outǓ ) I outǒV in * V outǓ ȡ ȧR Ȣ R SI2 SI2 ǒVin_EW(th)_Low I outǓ I out ) I q (eq. 5) PCB 1 oz Cu 110 100 ȧ Ȥ (eq. 1) R ȣ ȧ * 0.25Ǔ * 1.1 10 Ȥ R SI_ext P D(MAX) ) ǒV out 120 ǒRSI2 ) RSI_extǓȣ R SI1 R SI_ext + 1.1 V in(MAX) [ RqJA, THERMAL RESISTANCE (°C/W) R SI1 (eq. 4) or Practically only preset options above 4.5 V can be used without RSI_ext due to minimum operating input voltage value limitation. For other preset options the trip point has to be adjusted externally using RSI_ext resistor connected between input monitor SI and GND (see Figure 1). For other preset options RSI_ext has to be used to achieve Vin_EW(th) > 5.5 V (minimum operating input voltage value). The value for RSI_ext is recommended to be selected in range from 50 kW to 250 kW and the trip point can be shifted according to Figure 22. The higher is RSI_ext the lower is overall Quiescent Current of the application (see Figure 23). General formulas for calculation of Vin_EW(th)Low or RSI_ext for selected preset Early Warning options are described by Equations 1 and 2. ȡ ȧ Ȣ (eq. 3) R qJA Since TJ is not recommended to exceed 150°C, then the NCV8669 soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 1.33 W when the ambient temperature (TA) is 25°C. See Figure 26 for RthJA versus PCB area. The power dissipated by the NCV8669 can be calculated from the following equations: Contact factory for other EW Preset Options combinations not included in the table. V in_EW(th)_Low + 1.1 1 ) ƪTJ(MAX) * TAƫ ) 0.25 SI2 90 PCB 2 oz Cu 80 70 60 0 100 200 300 400 500 600 COPPER HEAT SPREADER AREA (mm2) 700 Figure 26. Thermal Resistance vs. PCB Copper Area 6 Hints (eq. 2) Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV8669 and make traces as short as possible. Where: RSI1,RSI2 − internal EW divider resistors (see Figure 2) (select values from Early Warning Preset Options table) RSI−ext − external resistor connected between SI and GND (recommended to be selected from 50 kW to 250 kW) http://onsemi.com 12 NCV8669 ORDERING INFORMATION Device Output Voltage Reset Delay Time DT = GND/Vout Reset Threshold (Typ) Input Voltage Early Warning Threshold Low (Typ) RSI_ext = 150 kW Marking Package Shipping† NCV866952D250R2G 5.0 V 16 / 32 ms 93% 5.89 V V86695250G SO−14 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D http://onsemi.com 13 NCV8669 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE J −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 7 1 G −T− 0.25 (0.010) M T B S A DIM A B C D F G J K M P R J M K D 14 PL F R X 45 _ C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. S MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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