2 Line EMI Filter with ESD Protection

NUF2240W1
2 Line EMI Filter with ESD
Protection
This device is a 2 line EMI filter array for wireless applications.
Greater than −20 dB attenuation is obtained at 800 MHz. It also offers
ESD protection−clamping transients from static discharges.
ESD protection is provided across all capacitors.
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Features
• EMI Filtering and ESD Protection
• Integration of 11 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
Pin 6
Output(1)
Pin 5
VCC
Pin 4
Output(2)
Pin 1
Input(1)
Pin 2
GND
Pin 3
Input(2)
> 8.0 kV (Contact)
• SC−88/SOT−363 Package
• Moisture Sensitivity Level 1
• ESD Ratings:
Machine Model = C
•
Human Body Model = 3B
This is a Pb−Free Device
MARKING
DIAGRAM
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings in a
6
SC−88/SOT−363 Package
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
1
SC−88
CASE 419B
Filter Response
1
• Integrated Solution Improves System Reliability
24 = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Applications
•
•
•
•
•
24 M G
G
EMI Filtering and ESD Protection for Data Lines
Wireless Phones
PDAs and Handheld Products
Notebook Computers
LCD Displays
ORDERING INFORMATION
Device
Package
Shipping†
NUF2240W1T1G
SC−88
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 1
1
Publication Order Number:
NUF2240W1/D
NUF2240W1
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Parameter
ESD Discharge IEC61000−4−2
Value
VPP
Unit
kV
Air Discharge
Contact Discharge
15
8.0
Steady−State Power per Resistor
PR
mW
Steady−State Power per Package
PT
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
VRWM
Unit
5.0
V
1.0
A
115
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.0 V
Resistance
RA
IR = 20 mA
Capacitance (Notes 1 and 2)
Cd
VR = 2.5 V, f = 1.0 MHz
17
pF
Cut−Off Frequency (Note 3)
f3dB
Above this frequency,
appreciable attenuation occurs
125
MHz
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
6.0
Max
85
7.0
100
V
NUF2240W1
2
NORMALIZED CAPACITANCE
0
−5
−15
−20
−25
−30
1.E+06
1
0.5
0
1.E+07
1.E+08
1.E+09
1.E+10
0
1
2
3
4
FREQUENCY (Hz)
REVERSE VOLTAGE (V)
Figure 1. Insertion Loss Characteristic
(50 W Source and 50 W Lead Termination)
Figure 2. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
110
108
106
RESISTANCE ()
S21 (dB)
−10
1.5
104
102
100
98
96
94
92
90
−40
−20
0
20
40
60
TEMPERATURE (°C)
Figure 3. Typical Resistance over Temperature
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3
80
5
NUF2240W1
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE V
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
e
6
5
4
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
1
2
3
b 6 PL
0.2 (0.008)
M
E
M
A3
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
SC−88/SC70−6/SOT−363
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
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For additional information, please contact your
local Sales Representative.
NUF2240W1/D
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