Data Sheet

BGA2716
MMIC wideband amplifier
Rev. 3 — 8 September 2011
Product data sheet
1. Product profile
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 SMD plastic package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits







Internally matched to 50 
Wide frequency range (3.2 GHz at 3 dB bandwidth)
Flat 23 dB gain (1 dB up to 2.7 GHz)
9 dBm output power at 1 dB compression point
Good linearity for low current (IP3out = 22 dBm)
Low second harmonic; 38 dBc at PL = 5 dBm
Unconditionally stable (K  1.2).
1.3 Applications




LNB IF amplifiers
Cable systems
ISM
General purpose.
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VS
Conditions
Min
Typ
Max
Unit
DC supply voltage
-
5
6
V
IS
supply current
-
15.9
-
mA
s212
insertion power gain
f = 1 GHz
-
22.9
-
dB
NF
noise figure
f = 1 GHz
-
5.3
-
dB
PL(sat)
saturated load power
f = 1 GHz
-
11.6
-
dBm
BGA2716
NXP Semiconductors
MMIC wideband amplifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
VS
2, 5
GND2
3
RF_OUT
4
GND1
6
RF_IN
Simplified outline
6
5
Symbol
4
1
6
1
2
3
4
3
2, 5
sym052
3. Ordering information
Table 3.
Ordering information
Type number
BGA2716
Package
Name
Description
Version
-
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking
Type number
Marking code
BGA2716
B7-
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BGA2716
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VS
DC supply voltage
RF input AC
coupled
-
6
V
IS
supply current
-
30
mA
Ptot
total power dissipation
-
200
mW
Tsp  90 C
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
PD
maximum drive power
-
10
dBm
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2716
NXP Semiconductors
MMIC wideband amplifier
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-sp)
thermal resistance from junction
to solder point
Ptot = 200 mW;
Tsp  90 C
300
K/W
7. Characteristics
Table 7.
Characteristics
VS = 5 V; IS = 15.9 mA; Tj = 25 C; measured on demo board; unless otherwise specified.
Symbol
Parameter
IS
supply current
s212
insertion power
gain
Typ
Max
Unit
13
15.9
21
mA
21
22.1
23
dB
f = 1 GHz
22
22.9
24
dB
f = 1.8 GHz
22
23.1
25
dB
f = 2.2 GHz
21
22.8
24
dB
f = 2.6 GHz
20
22.1
24
dB
f = 3 GHz
19
20.8
22
dB
f = 1 GHz
15
17
-
dB
f = 2.2 GHz
10
12
-
dB
s222
output return
losses
f = 1 GHz
10
12
-
dB
f = 2.2 GHz
9
11
-
dB
s122
isolation
f = 1.6 GHz
30
31
-
dB
f = 2.2 GHz
33
35
-
dB
f = 1 GHz
-
5.3
5.4
dB
NF
noise figure
f = 2.2 GHz
-
5.5
5.6
dB
B
bandwidth
at s212 3 dB below flat
gain at 1 GHz
3
3.2
-
GHz
K
stability factor
f = 1 GHz
-
1.4
-
f = 2.2 GHz
-
1.9
-
PL(sat)
saturated load
power
f = 1 GHz
10
11.6
-
dBm
f = 2.2 GHz
6
7.5
-
dBm
load power
at 1 dB gain compression;
f = 1 GHz
8
8.9
-
dBm
at 1 dB gain compression;
f = 2.2 GHz
5
6.1
-
dBm
PL(1dB)
IM2
second order
at PL = 5 dBm;
intermodulation f0 = 1 GHz
product
36
38
-
dBc
IP3in
input, third
order intercept
point
f = 1 GHz
2
0.7
-
dBm
f = 2.2 GHz
8
6.9
-
dBm
output, third
order intercept
point
f = 1 GHz
21
22.2
-
dBm
f = 2.2 GHz
15
15.9
-
dBm
IP3out
Product data sheet
f = 100 MHz
Min
input return
losses
s112
BGA2716
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
3 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
8. Application information
Figure 1 shows a typical application circuit for the BGA2716 MMIC. The device is
internally matched to 50 , and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The nominal value of the RF choke L1 is 100 nH. At the frequencies below 100 MHz this
value should be increased. At frequencies above 1 GHz, a lower value can be used to
tune the output return loss. For optimal results, a good quality chip inductor or a
wire-wound SMD type should be chosen.
Both the RF choke and the 22 nF supply decoupling capacitor C1 should be located as
close as possible to the MMIC.
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use
multiple via holes, located as close as possible to the MMIC.
VS
C1
L1
VS
C2
RF input
RF_OUT
RF_IN
GND1
C3
RF output
GND2
mgu436
Fig 1.
Typical application circuit.
Figure 2 shows the PCB layout, used for the standard demonstration board.
BGA2716
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2716
NXP Semiconductors
MMIC wideband amplifier
30 mm
PHILIPS
PH
30 mm
IN
OUT
V+
PHILIPS
PH
DUT
C3
C2
IN
L1
C1
OUT
V+
001aab256
Material = FR4; thickness = 0.6 mm, r = 4.6.
Fig 2.
PCB layout and demonstration board showing components.
8.1 Application examples
The excellent wideband characteristics of the MMIC make it an ideal building block in IF
amplifier such as LNBs (see Figure 3).
BGA2716
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution
(see Figure 4).
As driver amplifier in the TX path, the good linear performance and matched input/output
offer quick design solutions (see Figure 5).
mixer
to IF circuit
or demodulator
from
RF circuit
wideband
amplifier
oscillator
Fig 3.
mgu438
Application as IF amplifier.
mixer
to IF circuit
or demodulator
antenna
LNA
wideband
amplifier
oscillator
Fig 4.
mgu439
Application as RF amplifier.
mixer
from modulation
or IF circuit
to power
amplifier
wideband
amplifier
oscillator
Fig 5.
BGA2716
Product data sheet
mgu440
Application as driver amplifier.
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2716
NXP Semiconductors
MMIC wideband amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
100 MHz
180°
0
0.2
0.5
0.2
1
4 GHz
2
5
0°
0
−5
−0.2
−135°
10
−2
−0.5
−45°
−1
1.0
−90°
001aab257
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
Fig 6.
Input reflection coefficient (s11); typical values.
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
100 MHz
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
4 GHz
1
2
5
0°
0
−5
−0.2
−135°
10
−2
−0.5
−45°
−1
−90°
1.0
001aab258
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
Fig 7.
BGA2716
Product data sheet
Output reflection coefficient (s22); typical values.
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2716
NXP Semiconductors
MMIC wideband amplifier
001aab259
0
001aab260
30
|s21| 2
(dB)
|s12 | 2
(dB)
(2)
−20
20
(1)
(3)
−40
−60
10
0
0
1000
2000
3000
4000
0
1000
2000
3000
4000
f (MHz)
f (MHz)
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
PD = 35 dBm; Zo = 50 .
(1) IS = 19.5 mA; VS = 5.5 V.
(2) IS = 15.9 mA; VS = 5 V.
(3) IS = 12.4 mA; VS = 4.5 V.
(s122)
Fig 8.
Isolation
typical values.
as a function of frequency;
001aab261
20
PL
(dBm)
10
0
0
−10
−10
−20
−40
−30
−20
−10
001aab262
20
PL
(dBm)
(1)
(2)
(3)
10
Insertion gain (s212) as a function of
frequency; typical values.
Fig 9.
0
PD (dBm)
f = 1 GHz; Zo = 50 .
(1)
(2)
(3)
−20
−40
−30
(1) VS = 5.5 V.
(2) VS = 5 V.
(2) VS = 5 V.
(3) VS = 4.5 V.
(3) VS = 4.5 V.
Fig 10. Load power as a function of drive power at
1 GHz; typical values.
Product data sheet
−10
0
PD (dBm)
f = 2.2 GHz; Zo = 50 .
(1) VS = 5.5 V.
BGA2716
−20
Fig 11. Load power as a function of drive power at
2.2 GHz; typical values.
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
8 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
001aab263
8
001aab264
5
K
NF
(dB)
4
7
3
6
(1)
2
(2)
(3)
5
1
4
0
0
500
1000
1500
2000
2500
f (MHz)
Zo = 50 .
0
1000
2000
3000
4000
f (MHz)
IS = 15.9 mA; VS = 5 V; Zo = 50 .
(1) IS = 19.5 mA; VS = 5.5 V.
(2) IS = 15.9 mA; VS = 5 V.
(3) IS = 12.4 mA; VS = 4.5 V.
Fig 12. Noise figure as a function of frequency; typical
values.
BGA2716
Product data sheet
Fig 13. Stability factor as a function of frequency;
typical values.
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BGA2716
NXP Semiconductors
MMIC wideband amplifier
Table 8.
Scattering parameters
VS = 5 V; IS = 15.9 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 C.
f (MHz)
s11
s21
s12
s22
K-factor
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
100
0.182562
102.7794
12.69581
13.48682
0.029472
28.74955
0.39239
91.48628
1.3
200
0.123465
87.55274
13.13419
5.272917
0.035438
2.202361
0.267851
62.37296
1.2
400
0.107855
58.58513
13.47149
31.7377
0.035299
22.54301
0.227252
24.6455
1.2
600
0.114731
40.14071
13.57901
53.09631
0.033167
43.06353
0.227993
3.493572
1.3
800
0.130176
24.28555
13.67457
73.60665
0.033194
59.63503
0.234967
31.11084
1.3
1000
0.144984
9.657616
13.91705
94.01973
0.029047
76.09972
0.239818
60.54722
1.4
1200
0.160922
7.518892
14.10949
114.55
0.028188
88.34045
0.242141
91.56898
1.4
1400
0.179351
23.35989
14.2808
135.3117
0.025188
101.2729
0.243087
124.5484
1.4
1600
0.20199
41.01349
14.3825
156.7041
0.022257
110.3342
0.24499
158.6224
1.5
1800
0.218268
60.71294
14.26935
178.3843
0.019611
121.0192
0.255598
167.5983
1.7
2000
0.233965
81.48254
14.0667
160.1504
0.018087
127.6765
0.269829
136.117
1.8
2200
0.242904
103.1109
13.83968
138.2379
0.017203
137.8213
0.283613
106.0987
1.9
2400
0.246576
125.52
13.46447
115.7594
0.016318
138.8717
0.29058
77.95189
2.0
2600
0.249069
148.8707
12.74638
93.38644
0.015514
147.6622
0.281505
50.68612
2.2
2800
0.243665
172.646
11.87558
71.02792
0.014954
152.1988
0.25135
24.40624
2.5
3000
0.233266
163.9035
10.94049
50.42722
0.015522
163.8718
0.211425
0.674037
2.7
3200
0.222055
140.7754
10.05626
30.75908
0.016261
170.5637
0.165534
23.9944
2.9
3400
0.207486
117.0531
9.576357
11.98315
0.016664
176.5407
0.118726
46.28101
3.0
3600
0.191654
94.64431
9.199166
7.677643
0.016982
176.9385
0.083354
72.36691
3.2
3800
0.175783
71.9551
8.912598
27.73098
0.017094
165.8227
0.058549
109.9804
3.3
4000
0.163768
49.89436
8.618058
48.90874
0.017414
157.6095
0.055225
163.7132
3.3
BGA2716
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
10 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
9. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
c
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 14. Package outline; SOT363 (SC-88).
BGA2716
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
11 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA2716 v.3
20110908
Product data sheet
-
BGA2716 v.2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawings have been updated to the latest version.
BGA2716 v.2
(9397 750 13292)
20040924
Product data sheet
-
BGA2716_N v.1
BGA2716_N v.1
(9397 750 12827)
20040202
Preliminary data sheet
-
-
BGA2716
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
12 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BGA2716
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
13 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA2716
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
BGA2716
NXP Semiconductors
MMIC wideband amplifier
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Application examples . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 September 2011
Document identifier: BGA2716