Application Notes

AN11734
Maximum RF Input Power BGU6101
Rev. 1 — 10 September 2015
Application note
Document information
Info
Content
Keywords
BGU6101, MMIC LNA, Maximum RF Input Power
Abstract
This document provides RF and DC test results by applying large RF
input power.
AN11734
NXP Semiconductors
Maximum RF Input Power Test
Revision history
Rev
Date
Description
1
First publication
20150910
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
AN11734
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 September 2015
© NXP B.V. 2015. All rights reserved.
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AN11734
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Maximum RF Input Power Test
1. Introduction
This document provides application examples and measurement results for large RF
input signals using the BGU6101.
2. RF input power test on BGU6101
The test circuit shown in this document is using the BGU6101 and the input is matched
between 1.8 – 2.2GHz (output is not matched). The Supply voltage is 4V and the bias
current is set to 6mA. The test is done with and without series resistor of 50 ohm (MMIC
Vcc is 3.7V) in the Vsupply line.
The input power is swept at 1.9 GHz from -20dBm up to 15dBm and kept for 2 hours at
15dBm in gain (Venable=Vcc) and 2 hours in off mode (Venable=0V).
After the test with 15dBm input power at 1.9GHz (17dB input return loss) the MMIC is
tested on the Network analyzer on functionality.
AN11734
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 September 2015
© NXP B.V. 2015. All rights reserved.
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Maximum RF Input Power Test
Fig 1.
BGU6101 maximum RF input power test circuit +15dBm @ 1.9 GHz
The input of the BGU6101 is matched on the test frequency (RL in > 10dB), output is not
matched.
Additional resistor (R2) is used to reduce the current caused by self-biasing at large input
power.
AN11734
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Maximum RF Input Power Test
BOM BGA6101 input match at 2GHz
COMPONENT Value
Function
C1
N.C.
C2
2.2pF
matching
C3
1.8pF
matching
C4
4.7nF
decoupling
C5
4.7nF
decoupling
C6
47pF
dc-block
L1
3.3nH
matching
L2
27nH
bias
R1
5k
Rbias
R2
50R
Icc limit
Fig 2.
AN11734
Application note
BGU6101 BOM for 2GHz input matching
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Maximum RF Input Power Test
3. Test results with R2 = 50 ohm
BGU6101 Pin vs Pout & Icc (Vsupply =4V ; Vcc=3.7V ; Icc=6mA)
Test frequency 1.9GHz
Test frequency 2GHz
Pin [dBm] Pout [dBm] Icc [mA] Vcc [V] Pout [dBm] Icc [mA] Vcc [V]
-30
-13.4
6
3.7
-14.2
6
3.7
-25
-8.5
6
3.7
-9.2
6
3.7
-20
-3.8
6
3.7
-4.5
6
3.7
-16
-0.5
6.1
3.7
-1.2
6.1
3.7
-15
0.1
6.1
3.7
-0.5
6.1
3.7
-10
2.6
6.6
3.7
2.2
6.5
3.7
-5
4.6
7.5
3.6
4.3
7.5
3.6
0
6.8
9.2
3.5
6.5
9.2
3.5
5
12.2
19.1
3
11.5
16.9
3.1
10
14.4
36.7
2.2
14.3
34.7
2.3
15
14.5
44.3
1.8
14.5
42.2
1.9
AN11734
Application note
Fig 3.
BGU6101 maximum RF input power versus Pout and Icc test results (P1dB in red)
Fig 4.
BGU6101 S-parameter before and after 2 hours +15dBm RF input power test
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Maximum RF Input Power Test
4. Test results with R2=0 ohm (not recommended) and R1=6 kohm
BGU6101 Pin vs Pout & Icc (Vsupply =4V; Icc=6mA; @1.9GHz)
Gain mode (Venable=Vcc)
OFF mode (Venable =0V)
Pin [dBm] Pout [dBm] Icc [mA] Vcc [V] Pout [dBm] Icc [mA] Vcc [V]
-30
-12.9
6
4
-57
0.004
4
-25
-8
6
4
-52
0.004
4
-20
-3.4
6
4
-47
0.004
4
-17
-1
6
4
-15
0.3
6.1
4
-42
0.004
4
-10
2.6
6.5
4
-37
0.004
4
-5
4.3
7.5
4
-32.5
0.004
4
0
6.6
9.2
4
-27.6
0.004
4
5
12.3
18.9
4
10.6
13.7
4
10
16.2
44.8
4
16
41.8
4
15
17.9
64.5
4
17.7
61.5
4
AN11734
Application note
Fig 5.
BGU6101 maximum RF input power versus Pout and Icc test results (P1dB in red)
Fig 6.
BGU6101 S-parameter before and after 2 hours +15dBm RF input power test in
gain (Venable=Vcc) and off mode (Venable=0V)
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5. Conclusion
After 2 hours stress with 15dBm at RF input using the input matched BGU6101, no
changes on S-parameter and DC-biasing observed.
The test is done with R2=50 ohm and R2=0 ohm series resistor at the Vcc in gain
and OFF mode.
To minimize the self-biasing (increase of Icc) we recommend additional series
resistor R2 at the Vsupply, for details see the test schematic Fig.1.
In case of using the 50ohm series resistor at the Vsupply and different control
voltage at the Venable can lead to voltage difference between Vcc and Venable
higher than 1.8V (Venable max = Vcc + 1.8V) and internal ESD protection diodes
can start to conduct.
To protect the ESD diodes we recommend to use series resistor to limit the current
on the Venable pin to max 20mA (5mA recommended) or limit the Venable voltage
for gain mode to max. 2V (min. 1.2V).
AN11734
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 September 2015
© NXP B.V. 2015. All rights reserved.
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Maximum RF Input Power Test
6. Legal information
6.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
6.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
AN11734
Application note
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express,
implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire
risk as to the quality, or arising out of the use or performance, of this product
remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be
liable to customer for any special, indirect, consequential, punitive or
incidental damages (including without limitation damages for loss of
business, business interruption, loss of use, loss of data or information, and
the like) arising out the use of or inability to use the product, whether or not
based on tort (including negligence), strict liability, breach of contract, breach
of warranty or any other theory, even if advised of the possibility of such
damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by
customer for the product or five dollars (US$5.00). The foregoing limitations,
exclusions and disclaimers shall apply to the maximum extent permitted by
applicable law, even if any remedy fails of its essential purpose.
6.3 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 September 2015
© NXP B.V. 2015. All rights reserved.
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AN11734
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Maximum RF Input Power Test
7. List of figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
BGU6101 maximum RF input power test circuit
+15dBm @ 1.9 GHz .......................................... 4
BGU6101 BOM for 2GHz input matching ......... 5
BGU6101 maximum RF input power versus
Pout and Icc test results (P1dB in red) .............. 6
BGU6101 S-parameter before and after 2 hours
+15dBm RF input power test ............................ 6
BGU6101 maximum RF input power versus
Pout and Icc test results (P1dB in red) .............. 7
BGU6101 S-parameter before and after 2 hours
+15dBm RF input power test in gain
(Venable=Vcc) and off mode (Venable=0V) ..... 7
AN11734
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 September 2015
© NXP B.V. 2015. All rights reserved.
10 of 11
AN11734
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Maximum RF Input Power Test
8. Contents
1.
2.
3.
4.
5.
6.
6.1
6.2
6.3
7.
8.
Introduction ......................................................... 3
RF input power test on BGU6101....................... 3
Test results with R2 = 50 ohm ............................ 6
Test results with R2=0 ohm (not
recommended) and R1=6 kohm ......................... 7
Conclusion ........................................................... 8
Legal information ................................................ 9
Definitions .......................................................... 9
Disclaimers......................................................... 9
Trademarks ........................................................ 9
List of figures..................................................... 10
Contents ............................................................. 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP B.V. 2015.
All rights reserved.
For more information, visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 September 2015
Document identifier: AN11734
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