Data Sheet

BGU7052
SiGe:C Low Noise High Linearity Amplifier
Rev. 2 — 21 February 2012
Product data sheet
1. Product profile
1.1 General description
The BGU7052 is a low noise high linearity amplifier for wireless infrastructure
applications. The LNA has a high input and output return loss and is designed to operate
between 1.5 GHz and 2.5 GHz. It is housed in a 3  3  0.85 mm3 10-terminal plastic thin
small outline package. The LNA is ESD protected on all terminals.
1.2 Features and benefits








Low Noise Figure (NF) = 0.76 dB at 1900 MHz
High linearity performance, IP3O = 35 dBm at 1900 MHz
High input and output return loss
Unconditionally stable
110 GHz transit frequency - SiGe:C technology
Supply voltage 3.3 V
Small 10-terminal leadless package 3  3  0.85 mm3
Moisture sensitivity level 1
1.3 Applications
 LNA for wireless infrastructure applications (1.5 GHz to 2.5 GHz)
 Low noise applications
1.4 Quick reference data
Table 1.
Quick reference data
f = 1900 MHz; Tamb = 25 C; input and output 50 ; unless otherwise specified.
Min
Typ Max Unit
VCC
Symbol Parameter
supply voltage
Conditions
3.0
3.3
3.6
V
ICC
supply current
63
80
95
mA
Gass
associated gain
18.5 20
NF
noise figure
-
0.76 0.95 dB
PL(1dB)
output power at 1 dB gain
compression
13
14.5 -
dBm
IP3O
output third-order intercept point
32
35
dBm
21.5 dB
-
BGU7052
NXP Semiconductors
SiGe:C Low Noise High Linearity Amplifier
2. Pinning information
2.1 Pinning
terminal 1
index area
n.c.
1
10 n.c.
VCC1
2
9
VCC2
GND
3
8
GND
RF_IN
4
7
RF_OUT
GND
5
6
GND
BGU7052
aaa-002089
Transparent top view
Fig 1.
Pin configuration
2.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
n.c.
1, 10
not connected
GND
3, 5, 6, 8
ground
RF_IN
4
RF input
RF_OUT
7
RF output
VCC
2, 9
supply voltage
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
BGU7052
BGU7052
Product data sheet
Description
Version
HVSON10 plastic thermal enhanced very thin small outline
package; no leads; 10 terminals; body 3 x 3 x 0.85 mm
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Rev. 2 — 21 February 2012
SOT650-1
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SiGe:C Low Noise High Linearity Amplifier
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max
Unit
0
5
V
-
300
mW
-
20
dBm
VCC
supply voltage
Ptot
total power dissipation
Pi(RF)CW
continuous waveform
RF input power
Tstg
storage temperature
65 +150 C
Tj
junction temperature
-
150
C
Tamb
ambient temperature
40 +85
C
VESD
electrostatic discharge
voltage
Human Body Model (HBM);
According JEDEC standard 22-A114E
-
4
kV
Charged Device Model (CDM);
According JEDEC standard 22-C101B
-
2
kV
Typ
Unit
20
K/W
VCC = 3.3 V
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
6. Characteristics
Table 6.
Characteristics
VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are
measured at the device RF in and RF output terminals.
Symbol Parameter
ICC
supply current
Gass
associated gain
NF
PL(1dB)
IP3O
BGU7052
Product data sheet
Conditions
noise figure
output power at 1 dB gain compression
output third-order intercept point
Min
Typ
Max Unit
63
80
95
f = 1750 MHz
-
21.5 -
f = 1900 MHz
18.5 20
f = 1950 MHz
-
19.7 -
dB
f = 1750 MHz
-
0.76 -
dB
dB
21.5 dB
f = 1900 MHz
-
0.76 0.95 dB
f = 1950 MHz
-
0.79 -
dB
f = 1750 MHz
-
15.5 -
dBm
f = 1900 MHz
13
14.5 -
dBm
f = 1950 MHz
-
14.5 -
dBm
f = 1750 MHz
-
36.8 -
dBm
f = 1900 MHz
32
35.3 -
dBm
f = 1950 MHz
-
35.1 -
dBm
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Rev. 2 — 21 February 2012
mA
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SiGe:C Low Noise High Linearity Amplifier
Table 6.
Characteristics …continued
VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are
measured at the device RF in and RF output terminals.
Symbol Parameter
Conditions
Min
Typ
Max Unit
RLin
f = 1750 MHz
-
23
-
dB
f = 1900 MHz
-
23
-
dB
f = 1950 MHz
-
22
-
dB
f = 1750 MHz
-
22
-
dB
f = 1900 MHz
-
22
-
dB
input return loss
output return loss
RLout
ISL
isolation
K
Rollett stability factor
f = 1950 MHz
-
21
-
dB
f = 1750 MHz
-
28.5 -
dB
f = 1900 MHz
-
27.5 -
dB
f = 1950 MHz
-
27
-
dB
0 GHz  f  25 GHz
1
-
-
6.1 Performance curves
6
G%
DDD
6
G%
DDD
I0+]
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Input reflection coefficient as a function of
frequency
BGU7052
Product data sheet
I0+]
VCC = 3.3 V.
(1) Tj = 40 C
Fig 2.
Fig 3.
Forward transmission coefficient as a function
of frequency
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SiGe:C Low Noise High Linearity Amplifier
6
G%
DDD
6
G%
DDD
I0+]
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Output reflection coefficient as a function of
frequency
Fig 5.
DDD
6SDUV
G%
.
I0+]
Reverse transmission coefficient as a function
of frequency
DDD
6
6
VCC = 3.3 V.
(1) Tj = 40 C
Fig 4.
6
6
I0+]
VCC = 3.3 V; Tamb = 25 C.
I*+]
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(3) Tj = 85 C
Fig 6.
Wideband s-parameters as a function of
frequency
BGU7052
Product data sheet
Fig 7.
Stability K-factor as a function of frequency
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NXP Semiconductors
SiGe:C Low Noise High Linearity Amplifier
aaa-002084
20
aaa-002085
50
PL(1dB)
(dBm)
IP3O
(dBm)
18
(1)
40
(1)
(2)
(2)
16
(3)
30
(3)
14
20
12
10
10
1700
1750
1800
1850
1900
0
1700
2000
1950
f (MHz)
VCC = 3.3 V.
1750
1850
1900
2000
1950
f (MHz)
VCC = 3.3 V.
(1) Tj = 40 C
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Fig 8.
1800
Output power at 1 dB gain compression as a
function of frequency
1)
G%
Fig 9.
Output third-order intercept point as a function
of frequency
I0+]
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(3) Tj = 85 C
Fig 10. Noise figure as function of frequency
BGU7052
Product data sheet
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SiGe:C Low Noise High Linearity Amplifier
7. Application information
Figure 11 shows the typical application circuit for the BGU7052. The device is internally
matched to 50 , and therefore does not need any external matching. The value of the
input and output DC blocking C1 and C2 are recommended to be 1 nF. DC decoupling
capacitors C3 and C4 should be located as close as possible to the BGU7052.
In case different system blocks are supplied via the same voltage rail, it is recommended
to use a bias choke in the bias line on the positions of R1 and R2. The value of this choke
is depending on the frequency that needs to be dececoupled.
R1
RF_INPUT
C7
C1
C5
C3
C4
VCC2
C9
R2
VCC1
VCC1
2
9
RF_IN 4
7 RF_OUT
3
5
6
C6
C2
C8
VCC2
C10
RF_OUTPUT
8
aaa-000479
See Table 7 for a list of components.
Fig 11. Schematics of application board
BGU7052
Product data sheet
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BGU7052
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X2
C2
X3
RFOUT
SiGe:C Low Noise High Linearity Amplifier
C8
C10
C4
V2
C5
R2
GND
R1
V1
C9
C6
C7
C3
RFIN
C1
X1
aaa-002088
See Table 7 for a list of components.
Fig 12. Layout of the evaluation board
Table 7.
List of components
See Figure 11 for schematics.
Component
Value
Size
Function
capacitor
[1]
1 nF
0402
DC block
C3, C4
capacitor
[1]
100 pF
0402
bias decoupling
C5, C6
capacitor
[1]
100 nF
0402
bias decoupling
C7, C8, C9, C10
capacitor
[2]
100 nF
0603
optional
R1, R2
resistor
0
0402
C1, C2
BGU7052
Product data sheet
Description
[1]
Murata GRM155 or capacitor of same quality.
[2]
Murata GRM188 or capacitor of same quality.
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Rev. 2 — 21 February 2012
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BGU7052
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SiGe:C Low Noise High Linearity Amplifier
8. Package outline
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
A
B
D
A
A1
E
c
detail X
terminal 1
index area
C
e1
terminal 1
index area
e
5
y
y1 C
v M C A B
w M C
b
1
L
Eh
6
10
Dh
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1)
Dh
E(1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.5
2
0.55
0.30
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT650-1
---
MO-229
---
EUROPEAN
PROJECTION
ISSUE DATE
01-01-22
02-02-08
Fig 13. Package outline SOT650-1 (HVSON10)
BGU7052
Product data sheet
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Rev. 2 — 21 February 2012
© NXP B.V. 2012. All rights reserved.
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NXP Semiconductors
SiGe:C Low Noise High Linearity Amplifier
9. Abbreviations
Table 8.
Abbreviations
Acronym
Description
AC
Alternating Current
ESD
ElectroStatic Discharge
HBM
Human Body Model
LNA
Low Noise Amplifier
PDA
Personal Digital Assistant
RF
Radio Frequency
SiGe:C
Silicon Germanium Carbon
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU7052 v.2
20120221
Product data sheet
-
BGU7052 v.1
Product data sheet
-
-
Modifications:
BGU7052 v.1
BGU7052
Product data sheet
•
Table 6: updated
20120214
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11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU7052
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 February 2012
© NXP B.V. 2012. All rights reserved.
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SiGe:C Low Noise High Linearity Amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGU7052
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 February 2012
© NXP B.V. 2012. All rights reserved.
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13. Contents
1
1.1
1.2
1.3
1.4
2
2.1
2.2
3
4
5
6
6.1
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Performance curves . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 February 2012
Document identifier: BGU7052