Data Sheet

BGU7044
1 GHz wideband low-noise amplifier
Rev. 1 — 2 January 2012
Product data sheet
1. Product profile
1.1 General description
The BGU7044 MMIC is a 3.3 V wideband amplifier with internal biasing. It is designed
specifically for high linearity, low-noise applications over a frequency range of 40 MHz to
1 GHz. It is especially suited for Set-Top Box applications.
The LNA is housed in a 6-pin SOT363 plastic SMD package.
1.2 Features and benefits








Voltage supply of 3.3 V
Internally biased
Gain of 14 dB
Flat gain between 40 MHz and 1 GHz
Noise figure of 2.8 dB
High linearity with an IP3O of 29 dBm
75  input and output impedance
ESD protection > 2 kV Human Body Model (HBM) and > 1.5 kV Charged Device
Model (CDM) on all pins
1.3 Applications




Terrestrial Silicon and cable Set-Top Boxes (STB)
Silicon and “Can” tuners
Personal Video Recorders (PVR) and Digital Video Recorders (DVR)
Home networking and in-house signal distribution
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 C; typical values at VCC = 3.3 V; ZS = ZL = 75 ; Rbias = 18 ; 40 MHz  f1  1000 MHz.
Symbol Parameter
Conditions
Min
Typ Max Unit
RF input AC coupled
3.1
3.3
3.5
V
VCC
supply voltage
ICC(tot)
total supply current
30
34
38
mA
Tamb
ambient temperature
40
-
+85
C
NF
noise figure
-
2.8
-
dB
PL(1dB)
output power at 1 dB gain
compression
-
13
-
dBm
IP3O
output third-order intercept point
-
29
-
dBm
[1]
1 GHz
[1]
The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2  f2  f1, where
f2 = f1  1 MHz. Input power Pi = 10 dBm.
2. Pinning information
Table 2.
Pinning
Pin
Description
1
RF_OUT
2
VCC
3
n.c.
4
n.c.
5
GND
6
RF_IN
Simplified outline
6
5
Graphic symbol
3
4
2
6
1
2
3
1
5
4
sym141
3. Ordering information
Table 3.
Ordering information
Type number
BGU7044
Package
Name
Description
Version
-
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking
Type number
Marking code
Description
BGU7044
LJ*
* = p : made in Hong Kong
* = W : made in China
* = t : made in Malaysia
BGU7044
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
2 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min Max
Unit
VCC
supply voltage
RF input AC coupled
0.6 3.5
V
-
60
mA
-
250
mW
-
20
dBm
ICC(tot)
total supply current
configurable with external resistor
Ptot
total power dissipation
Tsp  100 C
Pi
input power
single tone
Tstg
storage temperature
65
+150
C
[1]
Tj
junction temperature
-
150
C
Tamb
ambient temperature
40
+85
C
VESD
electrostatic discharge
voltage
Human Body Model (HBM);
according to JEDEC standard
22-A114E
2
-
kV
Charged Device Model (CDM);
according to JEDEC standard
22-C101B
1.5
-
kV
Typ
Unit
240
K/W
[1]
Tsp is the temperature at the solder point of the ground lead.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
7. Characteristics
Table 7.
Characteristics
Tamb = 25 C; typical values at VCC = 3.3 V; ZS = ZL = 75 ; Rbias = 18 ; 40 MHz  f1  1000 MHz.
Symbol Parameter
Product data sheet
Min
Typ
Max Unit
RF input AC coupled
3.1
3.3
3.5
V
total supply current
30
34
38
mA
insertion power gain
-
14
supply voltage
ICC(tot)
s212
dB
SLsl
slope straight line
-
1
-
dB
FL
flatness of frequency response
-
0.2
-
dB
NF
noise figure
-
2.8
-
dB
RLin
input return loss
-
20
-
dB
RLout
output return loss
PL(1dB)
output power at 1 dB gain
compression
IP3O
output third-order intercept point
[1]
BGU7044
Conditions
VCC
1 GHz
[1]
-
12
-
dB
-
13
-
dBm
-
29
-
dBm
The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2  f2  f1, where
f2 = f1  1 MHz. Input power Pi = 10 dBm.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
3 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
8. Application information
Other applications are possible. Please contact your local sales representative for more
information. Application notes are available on the NXP website.
8.1 Application circuit
VCC
C4
C3
R1 = Rbias
n.c.
3
X1
L1
2
C1
6
RF_IN
C2
1
X2
RF_OUT
4
5
n.c.
001aam382
Components are listed inTable 8.
Fig 1.
BGU7044 application circuit
All control and supply lines must be decoupled properly. The decoupling capacitors must
be placed as close to the device as possible.
GND
VCC
GND
GND
8.2 Application circuit board layout
VCC
X1
GAIN
CTRL
BP CTRL
VER.2
C4
X2
C3
C1
RF_IN
R1
IN
75 OHM
RF_OUT
C2
L1
OUT
001aao235
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm  30 mm.
r = 4.5; thickness of copper layer = 35 m.
Components are listed in Table 8
Fig 2.
BGU7044
Product data sheet
BGU7044 application circuit board layout
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
4 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
Table 8.
List of components
See Figure 1 and Figure 2
Component
Description
Value
C1, C2
capacitor
10 nF
DC blocking
C3
capacitor
10 nF
decoupling
C4
capacitor
10 F
chip ferrite bead
1.5 k
R1
resistor
18 
[1]
X1, X2
connector
75 
[1]
Product data sheet
Function
decoupling
[1]
L1
BGU7044
Remarks
Murata BLM18HE152SN1DF
RF choke
Rbias
bias setting
F-connector, edge mount PCB
reflow type, Bomar 861V509ERG
input/output
L1 and R1 must have a power rating of 0.1 W or higher.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
5 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
9. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT363
Fig 3.
JEDEC
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Package outline SOT363
BGU7044
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
6 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
10. Abbreviations
Table 9.
Abbreviations
Acronym
Description
AC
Alternating Current
DC
Direct Current
ESD
ElectroStatic Discharge
LNA
Low-Noise Amplifier
MMIC
Monolithic Microwave Integrated Circuit
PCB
Printed-Circuit Board
RF
Radio Frequency
SMD
Surface-Mounted Device
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU7044 v.1
20120102
Product data sheet
-
-
BGU7044
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
7 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU7044
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
8 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGU7044
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 January 2012
© NXP B.V. 2012. All rights reserved.
9 of 10
BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4
Application circuit board layout . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 January 2012
Document identifier: BGU7044