here

VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
FTDI Chip
VM810C Datasheet
Embedded Video Engine
Credit Card Board
General Purpose Multi Media Controller
1 Introduction
1.1 Features
The VM810C is a development module for
FTDI’s FT810, which is used to develop and
demonstrate the functionality of the FT810
Embedded Video Engine, EVE. This module
behaves as an SPI slave, and requires a SPI
Master for proper micro-controller interfacing
and system integration.
VM810C modules support 5.0” LCD panel
size options. Users can also connect to
different LCD screens as long as they meet
the FT810 technical specification and fit the
VM810C LCD connector.

VM810C50A-D,
3.3/5V
microcontroller adaptor card with 5.0” LCD

VM810C50A-N,
3.3/5V
microcontroller adaptor card, with 4.3/5.0”
LCD connector but no display
The VM810C utilises the FTDI FT810
Embedded Video Engine. Graphic, audio and
touch features of the FT810 can be accessed
with the VM810C. For a full list of the FT810’s
features please see the FT810 datasheet.
The VM810C has the following features:

Ready to use LCD module

Options with or without 5” LCDs supporting
resistive touch with pressure sensing

On board LCD backlight LED Driver

Supports mono audio output

On board audio power amplifier and micro
speaker

Flexible power supply. Powering the
VM810C using SPI host connector, or via
USB Micro-B port, or via a 2.0mm JST
connector

5 V tolerant buffers when used with a 5V
SPI Master.
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or
reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its
documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made
or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result
of use or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use
in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in
personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to
use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices
International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered
Company Number: SC136640
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
2 Ordering Information
Note that the kits below require a 5V/1A power supply. It is NOT provided in the development kit, but is
offered as an optional accessory, as is the USB to SPI cable, with the following part types:
Part No.
Description
VM810C50A-N
Credit Card Size VM810C module, supports 3.3/5v MCU Adapter
Board, with FPC/FFC 40 LCD connector. No display is provided.
VM810C50A-D
Credit Card Size VM810C module, supports 3.3/5v MCU Adapter
Board, with FPC/FFC 40 LCD connector. Includes 5 inch 800x480 TFT
LCD display with resistive touch panel.
VA-PSU-UK1
Accessory - UK Model 5V/1A USB Power Supply (Mfr # JX-B0520C-1-B)
VA-PSU-US1
Accessory - US Model 5V/1A USB Power Supply (Mfr # JX-B0520B-1-B)
VA-PSU-EU1
Accessory - EU Model 5V/1A USB Power Supply (Mfr # JX-B0520A-1-B)
VA800A-SPI
Accessory - High Speed Micro USB to SPI adapter for BASIC boards
based on FT232H MPSSE design
VA-FC-1M-BKW
Accessory - Flat USB A to Micro B Cable 1M- Black and White
VA-FC-1M-BLW
Accessory - Flat USB A to Micro B Cable 1M- Blue and White
VA-FC-STYLUS1
Accessory - Resistive Touch Screen Pen Stylus
Table 2-1 – Ordering information
2
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
Table of Contents
1
Introduction .................................................................... 1
1.1 Features ...................................................................................... 1
2
Ordering Information ...................................................... 2
3
Hardware Description ..................................................... 4
3.1
VM810C board ........................................................................... 4
3.2
Physical Descriptions ................................................................ 5
3.2.1 PCB layout ................................................................................................................... 5
3.2.2 VM810C Connectors ...................................................................................................... 6
4
Board Schematics ............................................................ 9
5
Hardware Setup Guide .................................................. 12
5.1
Power Configuration ............................................................... 12
5.2
Backlight LED current Configuration ....................................... 12
5.3
MPSSE Setup ........................................................................... 12
6
Mechanical Dimensions ................................................. 15
7
Specifications ................................................................ 16
7.1
8
Optical Specification ............................................................... 16
Contact Information ...................................................... 17
Appendix A – References ................................................... 17
Document References ..................................................................... 17
Acronyms and Abbreviations ........................................................... 17
Appendix B - List of Figures and Tables ............................. 18
List of Figures ................................................................................. 18
List of Tables ................................................................................... 18
Appendix C – Revision History ........................................... 19
3
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
3 Hardware Description
Please refer to section 0 for connector settings. Some VM810C jumpers must be set to work properly
with your system.
3.1 VM810C board
Figure 3-1 – VM810C board top view
The VM810C module is intended for direct use into existing applications that require a display. This
module is suitable for interfacing with an external microcontroller that has a SPI Master channel.
The main functions of the VM810C are as follows:

Micro USB, SPI connector or 2-pin connector for power supply

3.3V regulator : Takes 5V input and outputs 3.3V for on-board circuits

WVGA(800x480) TFT LCD touch screen panel (for the VM810C50A-D module)

LCD backlight driver. On board back light driver has over voltage protection (OVP) of 34V, and
drive current 60mA.

5V tolerant buffers between the SPI master interface and the Slave interface of the FT810
o
SPI timing requirements can be referenced in the FT810 datasheet. The on board level
converter buffers introduce additional delay. The actual maximum SPI clock frequency
depends on the host system timing and connection cable length to the VM810C.

3 stage audio filter and power amplifier

8Ω speaker

Audio line out option
4
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
3.2 Physical Descriptions
3.2.1 PCB layout
The VM810C is an 85.6mm x 54.1mm, four-layer printed circuit board. Board thickness is
approximately 1.6mm.
Figure 3-2 – VM810C board top layer
Figure 3-3 – VM810C board bottom layer
5
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
3.2.2 VM810C Connectors
Connectors and jumpers are described in the following sections.

CN1- 2-pin power connector
2 pin JST connector for 5V/3.3V power input to the board. Alternative to Micro USB connector.

Pin No.
Name
Type
1
VCC
P
2
GND
Description
5V power supply
P
Ground
Table 3-1 – CN1 Pinout
CN2- Micro USB Receptical
This receptical is strictly for 5V input to power the board. There is no USB Functionality

Pin No.
Name
Type
Description
1
VBUS
P
2
NC
NA
No connection
3
NC
NA
No connection
4
NC
NA
No connection
5
GND
5V power supply
P
Ground
Table 3-2 – CN2 Pinout
J1- LCD Flex Cable connector
This connector is the interface between the FT810 IC and the LCD Module.
Signal
Pin No
Description
LED K
1
LED-
LED A
2
LED+
DISP
31
HSYNC
32
VSYNC
33
DCLK
30
LCD Pixel Clock
DE
34
LCD Data Enable
R2
7
Bit 2 of Red RGB signals
R3
8
Bit 3 of Red RGB signals
R4
9
Bit 4 of Red RGB signals
R5
10
Bit 5 of Red RGB signals
R6
11
Bit 6 of Red RGB signals
R7
12
Bit 7 of Red RGB signals
G2
15
Bit 2 of Green RGB signals
G3
16
Bit 3 of Green RGB signals
LCD Display Enable
LCD Horizontal Sync
LCD Vertical Sync
6
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464

Signal
Pin No
Description
G4
17
Bit 4 of Green RGB signals
G5
18
Bit 5 of Green RGB signals
G6
19
Bit 6 of Green RGB signals
G7
20
Bit 7 of Green RGB signals
B2
23
Bit 2 of Blue RGB signals
B3
24
Bit 3 of Blue RGB signals
B4
25
Bit 4 of Blue RGB signals
B5
26
Bit 5 of Blue RGB signals
B6
27
Bit 6 of Blue RGB signals
B7
28
Bit 7 of Blue RGB signals
XP
37
touch panel X right
YM
38
touch panel Y down
XM
39
touch panel X left
YP
40
touch panel Y up
3V3
4
GND
3,5,6,13,14,21,22,29,36
NC
35
3V3 Power
Ground
No connect
Table 3-3 – J1 Pinout
J2 - Selection between lineout or loop back into the power amplifier.
Selection between audio lineout or loop back into the power amplifier. (Footprint only, JP2 next to J2
is connected by default for on board amplifier and on board mini speaker). If J2 is soldered and used
for audio output selection, JP2 needs to be removed.
Pin

Name
Description
1
Audio line out
Use pin 1 and 3 for FT810 audio line out to external speaker
2
Audio line in
Short pin1 and 2 to loopback FT810 audio into the on-board power amplifier
3
Audio GND
Audio GND
Table 3-4 – J2 Pin Options
J3 – SP+
Audio speaker +ve from the onboard amplifier.

J4 – SPAudio speaker -ve from the onboard amplifier.

J5- SPI Interface
This is the interface where the SPI control and data signals are routed. There is also power and
ground pins on this interface. Note J5 is not soldered on the VM810C board by default.
Pin No.
Name
Type
1
SCLK
I
Description
SPI Clock input
7
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464

Pin No.
Name
Type
Description
2
MOSI
I
Master Out Slave in
3
MISO
O
Master In Slave out
4
CS#
I
Chip select , active low
5
INT#
OD
6
PD#
I
Active low power down input.
7
5V
P
5V power supply
8
3.3V
P
3.3V power supply
9
GND
P
Ground
10
GND
Host interrupt open drain output, active low.
On board 47kΩ pull-up to 3.3V.
P
Ground
Table 3-5 – J5 Pinout
JP1- Audio Amplifier Power Select
This jumper provides the option to select the power supply voltage for the onboard power amplifier.
Pin No.
Name
1-2
3V3 selected (default, recommended)
2-3
5V selected
Table 3-6 – JP1 Pin options
*This needs to be configured before audio can be heard.

JP2 – On board amplifier enable
Solder connection fitted by default.

JP3 - On board amplifier mute
Solder connection not fitted by default. Do not fit this solder connection.

SW1 – Power source select
Pin No.
Name
1-2
Power from CN1
2-3
Power from CN2
Table 3-7 – JP1 Pin options
8
Copyright © 2015 Future Technology Devices International Limited
2.2nF
3V3
R3
Y1
12MHz
GND
C3
27pF
GND
C4
4.7uF
3V3
0.1uF
C5
GND
C6
4.7uF
VCORE
13
14
15
16
17
18
19
20
21
22
23
24
X1/CLK
X2
GND
VCC
VOUT1V2
VCC
XP
YP
XM
YM
GND
BACKLIGHT
EP
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
FT_CS#
FT_PD#
FT_MOSI
FT_SCK
27pF
7
VCC
U3
74LCX125
47k
OE4
OE3
OE2
OE1
A4
A3
A2
A1
GND
13
10
4
1
12
9
5
2
7
14
11
8
6
3
GND
3V3
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
DCLK
DISP
HSYNC
VSYNC
DE
LEDK
LEDA
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
DCLK
DISP
HSYNC
VSYNC
DE
Copyright © 2015 Future Technology Devices International Limited
VCC
Y4
Y3
Y2
Y1
OE4
OE3
OE2
OE1
Y4
Y3
Y2
Y1
2
3V3
14
11
8
6
3
13
10
4
1
A4
A3
A2
A1
GND
VIN
3
C8
0.1uF
R1
R0
1R6
GND
G1
G0
R5
4k7
B1
B0
C11
12
9
5
2
SW
VOUT
EN
5V
AUDIO_L
C2
L1
NR3015T220M
FT_SCK
FT_MISO
FT_MOSI
FT_CS#
GND
12
11
10
9
8
7
6
5
4
3
2
1
D1
AUDIO_SHDN#
GND
U4
MIC2289-34YML
CS#
GND
PD_N
INT_N
GPIO2
VCCIO1
GPIO1/IO3
GPIO0/IO2
CS_N
MOSI/IO0
MISO/IO1
SCK
GND
AUDIO_L
R7
DE
VSYNC
HSYNC
DISP
DCLK
B7
B6
B5
B4
B3
B2
GND
10k/1%
FT_INT#
FT_PD#
25
26
27
28
29
30
31
32
33
34
35
36
R6
7
FB
AGND
PGND
EP
FT_MISO
FT_INT#
0.22uF
1
6
4
8
9
BCKL
XP
YM
XM
YP
0
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
10uF
C10
LEDA
YM
XM
YP
XP
0
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0.1uF
LEDK
AUDIO_L
AUDIO_SHDN#
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SCK
MOSI
PD#
CS#
INT#
MISO
C9
CS#
PD#
MOSI
SCK
GND
[Top]Y2
[Left]X2
[Bottom]Y1
[Right]X1
GND
NC
DE
VSYNC
HSYNC
DISP
PCLK
GND
B7
B6
B5
B4
B3
B2
B1
B0
G7
G6
G5
G4
G3
G2
G1
G0
R7
R6
R5
R4
R3
R2
R1
R0
VDD
GND
VLED+
VLED-
GND
MISO
INT#
GND
ILED=95mV/R7=60mA
LED Current Sense R7
GND
BCKL
GND
AUDIO_SHDN#
AUDIO_L
VM810C EVE2 CREDIT CARD MODULE
Document No.: FT_001225 Clearance No.: FTDI#464
Version 1.1
4 Board Schematics
C7
0.1uF
U2
74LCX125
1N4148
GND
3V3
C12
R1
47k
R2
47k
R4
47k
VCORE
C1
3V3
U1
FT810
49
48
47
46
45
44
43
42
41
40
39
38
37
0.1uF
GND
GND
3V3
J1
0.5B-40PBS
LCD1
Figure 4-1 - FT810 and LCD circuit
9
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
47k
47k
47k
47k
47k
R26
R27
R28
R29
R30
3V3
47k
5V
R25
3V3
J5
R19
R20
R21
R22
R23
R24
1
2
3
4
5
6
7
8
9
10
33R
33R
33R
33R
33R
33R
SCK
MOSI
MISO
CS#
INT#
PD#
SCK
MOSI
MISO
CS#
INT#
PD#
C27 C28 C29 C30 C31 C32
6x10pF
GND
GND
XL2
To bypass 3.3V
regulator place jumper
Shunt 0.1" on pins J5-7 and J5-8.
VBUS
SW1
SS-1290AP
VBUS
DD+
ID
GND
1
2
3
4
5
5V
U7
AP1117E33G-13
3 Vin Vout 2
3V3
GND
C24
19108
1
VBUS
CN2
CN1
1
2
0.1uF
GND
GND
GND
C25
C26
0.1uF
10uF
GND
GND
R18
USB Micro-B
0R
GND
Figure 4-2 – SPI Interface Circuit
10
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
AUD_3V3
AUDIO_L
AUDIO_L
R8
33R
5
U5
2
4 R9
R11
1k
C13
4.7nF
3
AUD_3V3
C17
R10
1k
OE
1
C16
1k
C14
4.7nF
AUDIO_L_out
0.47uF
C15
4.7nF
JP2
J2
AGND
SN74LVC1G125DBVR
0.1uF
AGND
AGND
AGND
AGND
R12
10k/1%
JP3
AUD_3V3
R13
AUDIO_SHDN#
AUDIO_SHDN#
R16
33R
1
2
ININ+
JP3-Audio Amp. Mute
Header 0.1"
20k/1%
U6
4
3
JP2-Audio Amp. Enabled
1
2
3
AGND
VDD
VO+
VOSHDN GND
BYPASS GND
SP1
6
5
8
7
9
SP+
SP-
J3
J4
1W/8Ohm
TPA6205A1
R15 20k/1%
R14
10k/1%
R17
47k
AGND
5V
3V3
XL1
Shunt 2.0mm
C18
0.47uF
AGND
C20
C19
0.22uF
AGND
1uF
AGND AGND
AUD_3V3
JP1
1
2
3
Jumper 2.0mm
FB1
600R/1A
FB2
C21
100uF
C22
0.1uF
C23
10nF
600R/1A
GND
AGND
Max peak current ~400mA for 8-ohm speaker
Figure 4-3 – Audio Circuit
11
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
5 Hardware Setup Guide
5.1 Power Configuration
There are 3 methods of powering the VM810C board.
1) USB Power(5V) - Connect USB power through micro-USB cable to CN2
2) DC IN(5V) - Connect 5V to CN1
3) J5 Power(5V) - Connect 5V to J5 pin 7
The following table summarise how to power the VM810C board using the various methods.
Power Method
CN2
CN1
J5 Pin 7
SW1
USB Power
5V
N/C
N/C
Short pin 2-3
DC IN(5V)
N/C
5V
N/C
Short pin 1-2
J5 Power(5V)
N/C
N/C
5V
Any Position
Table 5-1 – Board power configuration
5.2 Backlight LED current Configuration
The VM810C module has backlight LED driver circuit on-board. The driver takes 5V as input power
source, and regulator the output voltage so that the total output current drawn by the backlight LED
chain is 60mA. This works fine with the 5” WVGA LCD provided with the VM810C50-D module (18 white
LED organized at 3 sets of 6 series LED).
If the user selects their own LCD panel to use with the VM810C board, the backlight LED current may
need to be re-configured to suite the LCD panel. By replacing the resistor R7 on VM810C PCB the
backlight LED current can be changed. The value of R7 is determined by following formula:
R7 = 95mV / ILED
5.3 MPSSE Setup
To give a quick start with the VM810C development board, a Windows based Sample Application and
demo applications are provided for users to experiment and experience the FT810 in the VM810C system.
The following paragraphs provide a short description for development procedures.
MPSSE is a “multi-purpose synchronous serial engine” interface available in some FTDI device (e.g.
FT2232D, FT232H, FT2232H and FT4232H). This engine allows users to bridge from a USB port on a PC
to an SPI interface. Sample code is available for driving the FT810 over this interface with a FT232H
device that has been integrated into a cable. This device is available in the VA800A-SPI board, or
C232HM-EDHSL-0(5V) cable or C232HM-DDHSL-0(3.3V) cable.
VA800A-SPI is a MPSSE module accessory which can connect to the VM810C modules directly. Detailed
information of VA800A-SPI can be found at:
http://www.ftdichip.com/Support/Documents/DataSheets/Modules/DS_VA800A-SPI_MPSSE_Module.pdf.
More information about MPSSE cables may be found at:
http://www.ftdichip.com/Support/Documents/DataSheets/Cables/DS_C232HM_MPSSE_CABLE.pdf.
12
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
In this section it is assumed the 5V version of the MPSSE cable (FTDI part no C232HM-EDHSL-0) is used.
If the 3.3V version of the MPSSE cable (FTDI part no C232HM-DDHSL-0) is available, the setup is similar
except for the power pin connection which requires an additional 5V power source to connect to CN2 or
CN1. Refer to table 5-1 for board power configuration.
Figure 5-1 – VM810C connects to PC via VA800A-SPI or MPSSE cable.
Hardware Setup VA800A-SPI

Solder a 10 position single row pin header to J5 footprint of the VM810C board

Connect VA800A-SPI to the VM810C module in the correct orientation (pin1 to pin1 aligned).

Connect USB cable (e.g. FTDI accessory VA-FC-1M-BKW or VA-FC-1M-BLW) from the VA800A-SPI
to the PC USB host port.

VA800A-SPI will supply power to VM810C after MPSSE driver is properly loaded and the USB host
completed USB device configuration.
Hardware Setup MPSSE Cable

Solder a 10 position single row pin header to J5 footprint of the VM810C board

Connect MPSSE leads to VM810C board’s J5( SPI interface) in accordance with Table 5-2

Plug MPSSE cable to PC USB host port
Software Setup

Download PC based MPSSE software libraries. MPSSE cable and driver information can be found at
http://www.ftdichip.com/Products/Cables/USBMPSSE.htm.

Launch the Sample Application based on MPSSE from the PC
13
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464

For more information on utilizing the VM810C development system with the MPSSE cable and Sample
Application, refer to AN_245. Note the procedure is the same as for previous generation VM800C
modules.
Further documentation associated with the VM810C development system and design flow
at following link: http://www.ftdichip.com/Products/Modules/VM810C.html
can be found
The FT81x Programming Guide describes the programming code and formats used by the FT810. The
Sample Application is a well-formatted and documented program that illustrates the Programming Guide,
and provides numerous design examples and reference code demonstrations.
J5 Pin number
J5 Signal
MPSSE pin number
MPSSE Signal
MPSSE Lead Color
1
SCK
2
SK
ORANGE
2
MOSI
3
DO
YELLOW
3
MISO
4
DI
GREEN
4
CS#
5
CS
BROWN
5
INT#
7
GPIOL1
PURPLE
6
PD#
9
GPIOL3
BLUE
7
5V
1
VCC
RED
8
3.3V
-
-
-
9
GND
10
GND
Black
10
GND
-
-
-
Table 5-2 – MPSSE cable (C232HM-EDHSL-0) connection
14
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
6 Mechanical Dimensions
Figure 6-1 – PCB mechanical dimensions
Figure 6-2 – 5” WVGA LCD dimensions
15
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
7 Specifications
7.1 Optical Specification
Table 7-1 – 5” TFT Optical Specification
16
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
8 Contact Information
Head Office – Glasgow, UK
Branch Office – Tigard, Oregon, USA
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
E-Mail (Sales)
E-Mail (Support)
E-Mail (General Enquiries)
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
Branch Office – Taipei, Taiwan
Branch Office – Shanghai, China
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8797 1330
Fax: +886 (0) 2 8751 9737
Room 1103, No. 666 West Huaihai Road,
Changning District, Shanghai, 200052
China
Tel: +86 (0)21 6235 1596
Fax: +86 (0)21 6235 1595
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
E-mail (Sales)
E-mail (Support)
E-mail (General Enquiries)
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
Web Site
http://ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales
representative(s) in your country.
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices
International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance
requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other
materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer
confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI
devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify a nd hold
harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without
notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole
nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material
or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Un it 1, 2
Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
17
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
Appendix A – References
Document References
For module documentations, please refer to URL below:
http://www.ftdichip.com/Products/Modules/VM810C.html
FT810 datasheet: DS_FT81x
FT810 software programming guide: FT81x_Programmer_Guide
C232HM-DDHSL-0 datasheet:
http://www.ftdichip.com/Support/Documents/DataSheets/Cables/DS_C232HM_MPSSE_CABLE.pdf
D2xx Programmers Guide:
http://www.ftdichip.com/Support/Documents/ProgramGuides/D2XX_Programmer's_Guide(FT_000071).p
df
AN_108: Command Processor for MPSSE and MCU Host Bus Emulation Modes
http://www.ftdichip.com/Support/Documents/AppNotes/AN_108_Command_Processor_for_MPSSE_and_
MCU_Host_Bus_Emulation_Modes.pdf
Acronyms and Abbreviations
Terms
EVE
IC
Description
Embedded Video Engine
Integrated Circuit
LCD
Liquid Crystal Display
LED
Light Emitting Diode
MPSSE
OVP
Multi Purpose Synchronous Serial Engine
Over Voltage Protection
PC
Personal Computer
SPI
Serial Peripheral Interface
TFT
Thin Film Transistor
USB
Universal Serial Bus
WVGA
Wide Video Graphics Array
17
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
Appendix B - List of Figures and Tables
List of Figures
Figure 3-1 – VM810C board top view ............................................................................................... 4
Figure 3-2 – VM810C board top layer .............................................................................................. 5
Figure 3-3 – VM810C board bottom layer......................................................................................... 5
Figure 4-1 - FT810 and LCD circuit.................................................................................................. 9
Figure 4-2 – SPI Interface Circuit .................................................................................................. 10
Figure 4-3 – Audio Circuit ............................................................................................................ 11
Figure 5-1 – VM810C connects to PC via VA800A-SPI or MPSSE cable. .............................................. 13
Figure 6-1 – PCB mechanical dimensions ....................................................................................... 15
Figure 6-2 – 5” WVGA LCD dimensions .......................................................................................... 15
List of Tables
Table 2-1 – Ordering information .................................................................................................... 2
Table 3-1 – CN1 Pinout.................................................................................................................. 6
Table 3-2 – CN2 Pinout.................................................................................................................. 6
Table 3-3 – J1 Pinout .................................................................................................................... 7
Table 3-4 – J2 Pin Options ............................................................................................................. 7
Table 3-5 – J5 Pinout .................................................................................................................... 8
Table 3-6 – JP1 Pin options ............................................................................................................ 8
Table 3-7 – JP1 Pin options ............................................................................................................ 8
Table 5-1 – Board power configuration .......................................................................................... 12
Table 5-2 – MPSSE cable (C232HM-EDHSL-0) connection................................................................... 14
Table 7-1 – 5” TFT Optical Specification ......................................................................................... 16
18
Copyright © 2015 Future Technology Devices International Limited
VM810C EVE2 CREDIT CARD MODULE
Version 1.1
Document No.: FT_001225 Clearance No.: FTDI#464
Appendix C – Revision History
Document Title:
VM810C EVE2 Credit Card Module
Document Reference No.:
FT_001225
Clearance No.:
FTDI#464
Product Page:
http://www.ftdichip.com/eve.htm
Document Feedback:
Send Feedback
Revision
Changes
Date
1.1
Initial Datasheet Released
2015-09-29
19
Copyright © 2015 Future Technology Devices International Limited