MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 3 March 2016, 14:13 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2009 [Approved on 3 March 2016, 14:12 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Chip (die)
Die attach
Encapsulation
Material group
Other inorganic
materials
Lead and Lead
alloys
EP (Epoxy resin)
% w/w des
Materials im
Artikel
0.53000%
0.04000%
26.14000%
Substances
in the
material
CAS Number
% w/w des
Stoffs im
Artikel
Nickel
7440-02-0
2.25000%
Gold
7440-57-5
10.25000%
Polydimethyl
63148-62-9
siloxane
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
1.50000%
Tin
7440-31-5
3.00000%
Lead
7439-92-1
95.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
TBBA
98-73-7
0.99000%
Epoxy resin
89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Leadfinish
Tin plating
2.56000%
Tin
7440-31-5
100.00000%
Leadframe
Copper (e.g. copper
amounts in cable
harnesses)
70.73000%
Copper
7440-50-8
100.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
D 3x12
Diode Axial
0.7
g
Page 1
Report generated: 3 March 2016, 14:13 GMT