Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 18 January 2016, 15:05 GMT Diotec Semiconductor AG DUNS-Nummer: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations Autorisiert durch: Udo Steinebrunner, Product Manager, - Deklaration gilt ab: 1 May 2004 [Approved on 18 November 2015, 13:31 GMT] Materialien und Stoffe Verwendung/Andordnung Chip (die) Die attach Encapsulation Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) % w/w des Materials im Artikel 1.90000% 0.40000% 51.40000% Leadfinish Tin plating Leadframe Copper (e.g. copper 44.60000% amounts in cable harnesses) Page 1 1.70000% Substances in the material CAS Number % w/w des Stoffs im Artikel Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Polydimethyl siloxane 63148-62-9 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% 3,5,3',5'TETRABROMOBISPHENOL A 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Tin 7440-31-5 100.00000% Copper 7440-50-8 100.00000% Report generated: 18 January 2016, 15:05 GMT Full Material Declaration for attached parts list Beigefügte Artikelliste Part number Artikelbezeichnung Artikelmasse Artikelmasse UoM DO-214AC/SMA Diode SMD 0.07 g Page 2 Report generated: 18 January 2016, 15:05 GMT