AVX UT023D103MAC2D

UltraThin Ceramic Capacitors
UT Series
The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT
series was designed to meet the stringent thickness requirements of our customers. AVX
developed a new termination process (FCT - Fine Copper Termination) that provides
unbeatable flatness and repeatability. The series includes products < 0.35mm in height
and is targeted for applications such as Smart cards, Memory modules, High Density SIM
cards, Mobile phones, MP3 players, and embedded solutions.
HOW TO ORDER
UT
02
3
D
103
M
A
T
2
D
Style
Ultra
Thin
Case
Size
0402
Rated
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
Temperature
Characteristic
X5R
Coded
Cap
(in pF)
2 Significant
Digits + Number
of Zeros
Cap
Tolerance
± 20%
Termination
Style
Commercial
Termination
T = 100% Sn
C = Cu
Packaging
2 = 7" Reel
15,000 pcs
4 = 13" Reel
50,000 pcs
Thickness
D = 0.30mm max
E = 0.25mm max
F = 0.15mm max
(only availabe in
Cu Termination)
RECOMMENDED SOLDER
PAD DIMENSIONS (Sn Termination)
L
mm (inches)
BL
W
L
BL
End View
T
0.50
(0.020)
PART DIMENSIONS
D
E
F
1.70
(0.067)
TT
TT
10.0 ± 4.00
0.40 ± 0.16
Thickness
L
1.00 ± 0.10
(0.039±0.004)
1.00 ± 0.10
(0.039±0.004)
1.00 ± 0.10
(0.039±0.004)
0.60
(0.024)
Top View
Side View
TYPICAL Cu THICKNESS
µM
mil
0.50
(0.020)
inches (mm)
W
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
T
0.25 ± 0.05
(0.010 ± 0.002)
0.20 ± 0.05
(0.008 ± 0.002)
0.125 ± 0.025
(0.005 ± 0.001)
BL
0.27 ± 0.05
(0.0108 ± 0.002)
0.27 ± 0.05
(0.0108 ± 0.002)
0.27 ± 0.05
(0.0108 ± 0.002)
CAP RANGE (THICKNESS CODE)
Cap Code
103
223
6.3V
F
D
10V
E
D
16V
E
25V
D
1
UltraThin Ceramic Capacitors
UT Series Specifications and Test Methods – Cu Termination
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Insulation Resistance
100 MΩ - μF
Dielectric Strength
No breakdown or visual defects
Resistance to
Flexure
Stresses
Load Life
2
Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 3.0% for ≥ 25V DC rating
≤ 12.5% for ≤ 16V DC rating
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
90 mm
No visual defects
≤ ±20%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
Charge device with 1.5X rated voltage
in test chamber set at
85ºC ± 2ºC for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
UltraThin Ceramic Capacitors
UT Series Specifications and Test Methods – Sn Termination
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 3.0% for ≥ 25V DC rating
≤ 12.5% for ≤ 16V DC rating
Insulation Resistance
100 MΩ - μF
Dielectric Strength
No breakdown or visual defects
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Load Life
Load
Humidity
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± 0.2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
90 mm
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
Charge device with 1.5X rated voltage
in test chamber set at
85ºC ± 2ºC for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
3