NTS10100EMFS D

NTS10100EMFS,
NRVTS10100EMFS
Very Low Leakage
Trench-based Schottky
Rectifier
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Features
• Fine Lithography Trench−based Schottky Technology for Very Low
•
•
•
•
•
•
•
Leakage
Fast Switching with Exceptional Temperature Stability
Low Power Loss and Lower Operating Temperature
Higher Efficiency for Achieving Regulatory Compliance
Low Thermal Resistance
High Surge Capability
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free and Halide−Free Devices
• Switching Power Supplies including Notebook / Netbook Adapters,
ATX and Flat Panel Display
High Frequency and DC−DC Converters
Freewheeling and OR−ing diodes
Reverse Battery Protection
LED Lighting
Instrumentation
•
April, 2014 − Rev. 1
A
A
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
A
C
TE1010
AYWWZZ
C
Not Used
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
Case: Epoxy, Molded
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
© Semiconductor Components Industries, LLC, 2014
MARKING
DIAGRAM
TE1010
A
Y
W
ZZ
Mechanical Characteristics:
•
•
•
•
5,6
1,2,3
1
Typical Applications
•
•
•
•
•
TRENCH SCHOTTKY
RECTIFIERS
10 AMPERES
100 VOLTS
1
Device
Package
Shipping†
NTS10100EMFST1G
NRVTS10100EMFST1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NTS10100EMFST3G
NRVTS10110EMFST3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTS10100EMFS/D
NTS10100EMFS, NRVTS10100EMFS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
Average Rectified Forward Current
(Rated VR, TC = 165°C)
IF(AV)
10
A
Peak Repetitive Forward Current,
(Rated VR, Square Wave, 20 kHz, TC = 163°C)
IFRM
20
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
200
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature
TJ
−55 to +175
°C
EAS
100
mJ
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)
V
ESD Rating (Human Body Model)
3B
ESD Rating (Machine Model)
M4
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)
Symbol
Typ
Max
Unit
RθJC
2.0
−
°C/W
0.540
0.650
−
0.720
0.500
0.570
−
0.610
1.4
5.0
−
50
mA
mA
1.6
3.8
−
15
mA
mA
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(iF = 5 A, TJ = 25°C)
(iF = 10 A, TJ = 25°C)
vF
(iF = 5 A, TJ = 125°C)
(iF = 10 A, TJ = 125°C)
Instantaneous Reverse Current (Note 1)
(VR = 70 V, TJ = 25°C)
(Rated dc Voltage, TJ = 25°C)
iR
(VR = 70 V, TJ = 125°C)
(Rated dc Voltage, TJ = 125°C)
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
NTS10100EMFS, NRVTS10100EMFS
TYPICAL CHARACTERISTICS
100.0
iF, INSTANTANEOUS FORWARD
CURRENT (A)
TA = 125°C
TA = 150°C
10.0
10.0
TA = 175°C
TA = 25°C
1.0
TA = −55°C
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
TA = 25°C
1.0
TA = −55°C
0.1
1.0
TA = 175°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
1.E+00
TA = 150°C
1.E−01
TA = 150°C
TA = 175°C
1.E−01
TA = 175°C
1.E−02
TA = 125°C
1.E−02
TA = 125°C
1.E−03
1.E−03
1.E−04
1.E−04
1.E−05
1.E−05
TA = 25°C
1.E−06
1.E−07
TA = 125°C
TA = 150°C
IR, INSTANTANEOUS REVERSE CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100.0
0
10
20
30
40
50
TA = 25°C
1.E−06
60
70
80
90
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
100
1.E−07
0
10
20
30
40
50
70
80
90 100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
10,000
25
RqJC = 2.0°C/W
IF(AV), AVERAGE FORWARD
CURRENT (A)
C, JUNCTION CAPACITANCE (pF)
TJ = 25°C
1,000
100
0.1
60
1
10
100
20
DC
15
Square Wave
10
5
0
80
90
100
110
120
130
140
150
VR, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
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3
160
170
NTS10100EMFS, NRVTS10100EMFS
TYPICAL CHARACTERISTICS
20
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IPK/IAV = 10
IPK/IAV = 20
18
TJ = 150°C
16
14
IPK/IAV = 5
12
10
8
6
Square Wave
4
DC
2
0
0
1
2
3
4
5
6
7
8
9
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
100
R(t) (°C/W)
10
1
0.1
0.01
50% Duty Cycle
20%
10%
5%
2%
1%
Assumes 25°C ambient and soldered to
a 600 mm2 − oz copper pad on PCB
Single Pulse
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1
10
100
1000
PULSE TIME (sec)
Figure 8. Thermal Characteristics
10
R(t) (°C/W)
1
50% Duty Cycle
20%
0.1
10%
5%
2%
1%
Single Pulse
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
Figure 9. Typical Transient Thermal Characteristics, Junction−to−Case
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4
1000
NTS10100EMFS, NRVTS10100EMFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE H
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
2
A
B
D1
2X
0.20 C
4X
E1
2
3
q
E
2
1
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
c
A1
4
TOP VIEW
C
3X
e
0.10 C
SEATING
PLANE
DETAIL A
A
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10 C
SIDE VIEW
8X
3X
C A B
0.05
c
0.750
4X
1.000
e/2
L
1
4
0.965
K
G
4X
1.270
b
0.10
PIN 5
(EXPOSED PAD)
SOLDERING FOOTPRINT*
DETAIL A
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.70
4.90
5.10
3.80
4.00
4.20
6.15 BSC
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0_
−−−
12 _
1.330
2X
0.905
2X
E2
L1
M
0.495
4.530
3.200
0.475
D2
2X
BOTTOM VIEW
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NTS10100EMFS/D