Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT resin Glass fiber Cu Ni Soldermask Au Subtotal Sn Ag Cu Subtotal BGA 27 X 27 676 SnAgCu 0.60 mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 1.20 E+00 8.38 E-02 8.38 E-02 2.09 E-02 4.19 E-03 1.40 E+00 PPM 390798 27202 27202 6800 1360 453362 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Weight (g) 2.88 E-01 2.66 E-01 1.92 E-01 1.17 E-01 1.17 E-01 8.53 E-02 1.07 E+00 PPM 93454 86531 62302 38074 38074 27690 346125 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 5.46 E-01 1.70 E-02 2.83 E-03 5.66 E-01 PPM 177348 5514 919 183781 Die Attach Paste Bond Wires % of Wire 99.99 Weight (g) 6.69 E-03 PPM Au Si Chip % of Chip 100 Weight (g) 3.82 E-02 PPM 12397 Weight (g) 4.40 E-03 1.10 E-03 4.13 E-04 4.13 E-04 1.65 E-04 1.65 E-04 6.66 E-03 PPM Item Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3060A & EPA 7196A. UV-VIS EPA 3540C/3550C. GC/MS EPA 3540C/3550C. GC/MS 2173 1429 358 134 134 54 54 2162 Package Totals Weight (g) PPM 3.08 E+00 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-BC-J