Materials Declaration Package Body Size Ball Count Option Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound Mini BGA 9X9 148 Pb-Free Molding Compound % of Compound 7 85 6.5 0.5 1 Weight (g) 6.59 E-03 8.00 E-02 6.12 E-03 4.70 E-04 9.41 E-04 PPM 32249 391597 29946 2304 4607 Weight (g) 28 1.73 E-02 25 1.54 E-02 19 1.17 E-02 11 6.79 E-03 7.8 4.82 E-03 9.35 5.77 E-03 Confidential Not Determined PPM 84632 75564 57429 33248 23576 28261 Laminate % of Laminate Solder Ball % of Plating Sn Ag Cu 96.5 3 0.5 Weight (g) 1.70 E-02 5.27 E-04 8.79 E-05 PPM 83076 2583 430 Au Bond Wires % of Wire 99.99 Weight (g) 1.74 E-03 PPM 8504 100 Weight (g) 1.41 E-02 PPM 68941 24 76 Weight (g) 3.58 E-03 1.13 E-02 PPM 17533 55521 Chip % of Chip Si Item Resin Ag Filler Die Attach % of Die Attach Item Pb Cd Hg Cr+6 PPM <2.0 <2.0 <2.0 <2.0 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES Package Totals PPM Weight (g) 1000000 2.04 E-01 STS-BC-I Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/10/04 Materials Declaration Package Body Size Ball Count Option Item Silica Epoxy resin Phenol resin Antimony trioxide Bromine Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound Mini BGA 9X9 148 SnPbAg Molding Compound % of Compound 90 4.8 3.91 0.69 0.6 Weight (g) 8.29 E-02 4.42 E-03 3.60 E-03 6.36 E-04 5.53 E-04 PPM 459218 24492 19950 3521 3061 Weight (g) 28 1.73 E-02 25 1.54 E-02 19 1.17 E-02 11 6.79 E-03 7.8 4.82 E-03 9.35 5.77 E-03 Confidential Not Determined PPM 95748 85489 64972 37615 26673 31973 Laminate % of Laminate Solder Ball % of Plating Sn Pb Ag 62 36 2 Weight (g) 1.09 E-02 6.33 E-03 3.52 E-04 PPM 60386 35063 1948 Bond Wires % of Wire 99.99 Weight (g) 1.74 E-03 PPM Au 100 Weight (g) 6.34 E-03 PPM 35098 Weight (g) 2.15 E-04 7.19 E-04 PPM 23 77 Chip % of Chip Si Item Resin Ag Filler Die Attach % of Die Attach Item Cd PPM <5 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Molding Compound Method BS EN 1122:2001B (ICPaes) Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES 9621 1189 3981 Package Totals PPM Weight (g) 1000000 1.81 E-01 STS-BC-D Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/10/04