Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn MQFP 14 X 20 100 Pb-Free Molding Compound % of Compound Weight (g) 10 1.23 E-01 84 1.03 E+00 5.5 6.77 E-02 0.5 6.16 E-03 PPM 62821 527697 34552 3141 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 4.34 E-01 1.35 E-02 2.93 E-03 6.77 E-04 PPM 221415 6905 1496 345 Internal Leadframe Plating % of Plating Weight (g) 3.00 E-03 100 PPM 1530 External Leadframe Plating Weight (g) % of Plating 100 2.11 E-02 PPM 10743 Au Bond Wires % of Wire 99.99 Weight (g) 2.76 E-03 PPM 1410 Si Chip % of Chip 100 Weight (g) 2.33 E-01 PPM 118907 Weight (g) 4.07 E-03 1.36 E-02 PPM 2079 6959 Item Resin Ag Filler Die Attach % of Die Attach 23 77 Item Pb Cd Hg Cr+6 PPM 4.40 <2.0 <2.0 <2.0 Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 2.0 Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A Package Totals Weight (g) PPM 1000000 1.96 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Item Cu Ni Si Mg MQFP 14 X 20 100 Sn/Pb Plating Molding Compound % of Compound Weight (g) 10 1.23 E-01 84 1.03 E+00 5.5 6.77 E-02 0.5 6.16 E-03 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 4.34 E-01 1.35 E-02 2.93 E-03 6.77 E-04 PPM 62821 527697 34552 3141 PPM 221415 6905 1496 345 Internal Leadframe Plating % of Plating Weight (g) 3.00 E-03 100 PPM Ag PPM Sn Pb External Leadframe Plating Weight (g) % of Plating 85 1.79 E-02 15 3.16 E-03 Item Bond Wires % of Wire 99.99 Au Item Pb Cd Hg Cr+6 PPM 4.40 <2.0 <2.0 <2.0 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 2.0 Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A 1530 9132 1611 Weight (g) 2.76 E-03 PPM Weight (g) 2.33 E-01 PPM 118907 Weight (g) 4.07 E-03 1.36 E-02 PPM 1410 Chip % of Chip Si 100 Item Resin Ag Filler Die Attach % of Die Attach 23 77 2079 6959 Package Totals Weight (g) PPM 1000000 1.96 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary