a A1 BALL CORNER 400-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-400-1) Dimensions shown in millimeters 17.20 17.00 SQ 16.80 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 A C E G 15.20 BSC SQ J L N 0.80 BSC R U W TOP VIEW B D F H K M P T V Y BOTTOM VIEW DETAIL A 1.70 MAX DETAIL A 0.65 MIN 0.25 MIN *0.50 COPLANARITY 0.12 0.45 0.40 BALL DIAMETER *COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH THE EXCEPTION TO PACKAGE BALL THICKNESS. 072908-A SEATING PLANE