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a
164-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-164-1)
Dimensions shown in millimeters
12.00 BSC SQ
A1 BALL
CORNER
14
12
13
10
11
8
9
6
7
4
5
2
3
1
A
B
C
D
E
10.40
BSC SQ
F
G
H
J
0.80
BSC
K
L
M
N
P
*1.30
1.22
1.14
0.80
REF
BOTTOM VIEW
DETAIL A
0.65
REF
DETAIL A
0.38
0.33
0.28
0.24
REF
SEATING
PLANE
0.96
0.89
0.82
0.53
COPLANARITY
0.08
0.48
0.43
BALL DIAMETER
*COMPLIANT TO JEDEC STANDARDS MO-219 WITH THE EXCEPTION
TO PACKAGE HEIGHT.
111808-A
TOP VIEW