EMC1428 DATA SHEET (03/14/2014) DOWNLOAD

EMC1428
1°C Multiple Temperature Sensor with HW
Thermal Shutdown & Hottest of Thermal Zones
PRODUCT FEATURES
Data Sheet
General Description
Features
The EMC1428 is a high accuracy, low cost, System
Management Bus (SMBus) temperature sensor.
Advanced features such as Resistance Error Correction
(REC), Beta Compensation (to CPU diodes requiring the
BJT or transistor model) and automatic diode type
detection combine to provide a robust solution for
complex environmental monitoring applications.

— triggers dedicated SYS_SHDN pin
— hardware configured range 65°C to 127°C in 1°C steps
— cannot be disabled or modified by software
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Additionally, the EMC1428 provides a hardware
programmable system shutdown feature that is
programmed at part power-up via a single TRIP_SET
voltage channel that cannot be masked or corrupted
through the SMBus.
The EMC1428 provides ±1° accuracy for external diode
temperatures and ±2°C accuracy for the internal diode
temperature. The device monitors up to eight
temperature channels (up to seven external and one
internal).
Applications
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Hardware Thermal Shutdown
Supports diodes requiring the BJT or transistor model
Resistance Error Correction (up to 100 Ohms)
Up to seven External Temperature Monitors
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±1°C Accuracy (60°C < TDIODE < 100°C)
0.125°C Resolution
Supports up to 2.2nF filter capacitor
Anti-parallel diodes for extra diode support and
compact design

Internal Temperature Monitor
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3.3V Supply Voltage
Available in a 16-pin 4mm x 4mm QFN RoHS
Compliant package
Programmable temperature limits for ALERT
— ±2°C accuracy
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Notebook Computers
Desktop Computers
Industrial
Embedded Applications
Block Diagram
 2014 Microchip Technology Inc.
DS20005275A-page 1
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
ORDER NUMBERS:
DIODE MODES
SUPPORTED
SMBUS
ADDRESS
Up to 7 external diodes. “Hottest Of”
temperature comparison. Hardware
set Critical / Thermal shutdown,
ALERT output
Intel CPU and
3904
1001_100(r/w)
16-pin QFN
(RoHS Compliant)
Up to 7 external diodes. “Hottest Of”
temperature comparison. Hardware
set Critical / Thermal shutdown,
ALERT output
Intel CPU and
3904
1001_101(r/w)
16-pin QFN
(RoHS Compliant)
Up to 7 external diodes. “Hottest Of”
temperature comparison. Hardware
set Critical / Thermal shutdown,
ALERT output
Intel CPU and
3904
Selected by
pull-up resistor
on SYS_SHDN
pin
ORDERING NUMBER
PACKAGE
FEATURES
EMC1428-1-AP-TR
16-pin QFN
(RoHS Compliant)
EMC1428-6-AP-TR
EMC1428-7-AP-TRCB7
Reel Size is 4,000 pieces
This product meets the halogen maximum concentration values per IEC61249-2-21
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected]. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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DS20005275A-page 2
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table of Contents
Chapter 1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 SMBus Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 3 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Write Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Read Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 Send Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Receive Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Alert Response Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7 SMBus Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8 SMBus Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 4 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1 ALERT Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1.1 ALERT Pin Interrupt Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1.2 ALERT Pin Comparator Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 SYS_SHDN Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 TRIP_SET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 Consecutive Alerts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5 Temperature Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.1 Resistance Error Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.2 Beta Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.3 Digital Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.4 “Hottest Of” Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.5 Conversion Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.6 Dynamic Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6 Diode Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6.1 Diode Faults. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 5 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 Data Read Interlock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 Conversion Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6 Limit Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7 Therm Hysteresis Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8 Therm Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.9 External Diode Fault Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.10 TRIP_SET Reading Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.11 Software Thermal Shutdown Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.12 Hardware Critical / Thermal Shutdown Limit Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.13 Channel Interrupt Mask Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 2014 Microchip Technology Inc.
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DS20005275A-page 3
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.14 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15 Beta Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16 Hottest Temperature Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.17 Hottest Temperature Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.18 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.19 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.20 THERM Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.21 REC Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.22 Hottest Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.23 Channel Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.24 Filter Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.25 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.26 Manufacturer ID Register (FEh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.27 Revision Register (FFh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.1 EMC1428 Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.2 Package Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.2.1 EMC1428-X-AP (16-Pin QFN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Chapter 7 Data Sheet Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
DS20005275A-page 4
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
List of Figures
Figure 1.1
Figure 3.1
Figure 4.1
Figure 4.2
Figure 4.3
Figure 4.4
Figure 6.1
Figure 6.2
Figure 6.3
EMC1428 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SMBus Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
System Diagram for EMC1428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Block Diagram of Hardware Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Vset Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Diode Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16-Pin QFN 4mm x 4mm Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
16-Pin QFN 4mm x 4mm Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
16-Pin QFN 4mm x 4mm PCB Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
 2014 Microchip Technology Inc.
DS20005275A-page 5
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
List of Tables
Table 1.1 EMC1428 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 1.2 Pin Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2.2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2.3 SMBus Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3.1 Protocol Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3.2 Write Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3.3 Read Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3.4 Send Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3.5 Receive Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3.6 Alert Response Address Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3.7 Address Select Decode on SYS_SHDN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4.1 VTRIP Resistor Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4.2 Supply Current vs. Conversion Rate for EMC1428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 5.1 Register Set in Hexadecimal Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 5.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 5.3 Temperature Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 5.4 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 5.5 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 5.6 Conversion Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 5.7 Conversion Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 5.8 Maximum Conversion Rate Per Temperature Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 5.9 Temperature Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 5.10 Therm Hysteresis Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.11 Therm Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5.12 External Diode Fault Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 5.13 TRIP_SET Reading Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 5.14 Software Thermal Shutdown Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 5.15 Hardware Thermal Shutdown Limit Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.16 Channel Interrupt Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 5.17 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5.18 Consecutive Alert Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5.19 Beta Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 5.20 Beta Compensation Look Up Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 5.21 Hottest Temperature Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 5.22 Hottest Temperature Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 5.23 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 5.24 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5.25 THERM Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 5.26 REC Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 5.27 Hottest Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 5.28 Channel Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5.29 Filter Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 5.30 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 5.31 Manufacturer ID Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 5.32 Revision Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 7.1 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
DS20005275A-page 6
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 1 Pin Description
Figure 1.1 EMC1428 Pin Diagram
Table 1.1 EMC1428 Pin Description
PIN NUMBER
NAME
FUNCTION
TYPE
1
DP1
DP1 - External Diode 1 positive
(anode) connection.
AIO
2
DN1
External Diode 1 negative (cathode)
connection.
AIO
3
DP2 / DN3
External Diode 2 positive (anode)
connection and External Diode 3
negative (cathode) connection
AIO
4
DN2 / DP3
External diode 2 negative (cathode)
connection and External Diode 3
positive (anode) connection
AIO
5
TRIP_SET
Voltage input to set Critical / Thermal
Shutdown temperature
AIO
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DS20005275A-page 7
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 1.1 EMC1428 Pin Description (continued)
PIN NUMBER
NAME
FUNCTION
TYPE
6
SYS_SHDN
Active low System Shutdown output
signal - requires pull-up resistor
EMC1428-7 - The pull-up resistor is
used to determine SMBus address
OD (5V)
7
ALERT
Active low interrupt - requires pull-up
resistor
OD (5V)
8
GND
Ground Connection
Power
9
DN4 / DP5
External diode 4 negative (cathode)
connection and External Diode 5
positive (anode) connection
AIO
10
DP4 / DN5
External Diode 4 positive (anode)
connection and External Diode 5
negative (cathode) connection
AIO
11
SMDATA
SMBus Data input/output - requires
pull-up resistor
DIOD (5V)
12
SMCLK
SMBus Clock input - requires pull-up
resistor
DI (5V)
13
N/C
Not used - connect to Ground - see
EMC1428 Anomaly Sheet
n/a
14
DN6 / DP7
External diode 6 negative (cathode)
connection and External Diode 7
positive (anode) connection
AIO
15
DP6 / DN7
External Diode 6 positive (anode)
connection and External Diode 7
negative (cathode) connection
AIO
16
VDD
Power supply
Power
The pin types are described below. All pins labelled (5V) are 5V tolerant.
APPLICATION NOTE: For the 5V tolerant pins that have a pull-up resistor, the voltage difference between VDD and
the pull-up voltage must never exceed 3.6V.
Table 1.2 Pin Type
PIN TYPE
Power
FUNCTION
Used to supply either VDD or GND to the device
DI
5V tolerant digital input
OD
5V tolerant Open drain digital output. Requires a pull-up resistor
DIOD
AIO
DS20005275A-page 8
5V tolerant bi-directional digital input / open-drain output. Requires a pull-up
resistor.
Analog input / output used for external diodes or analog inputs
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 2 Electrical Specifications
2.1
Absolute Maximum Ratings
Table 2.1 Absolute Maximum Ratings
DESCRIPTION
RATING
UNIT
Supply Voltage (VDD)
-0.3 to 4.0
V
Voltage on 5V tolerant pins (V5VT_pin)
-0.3 to 5.5
V
Voltage on 5V tolerant pins (|V5VT_pin - VDD|) (see Note 2.1)
-0.3 to 3.6
V
-0.3 to VDD +0.3
V
Operating Temperature Range
-40 to +125
°C
Storage Temperature Range
-55 to +150
°C
Voltage on any other pin to Ground
Lead Temperature Range
Refer to JEDEC Spec. J-STD020
Package Thermal Characteristics for QFN-16
Thermal Resistance (j-a)
ESD Rating, All pins HBM
50
°C/W
2000
V
Note: Stresses at or above those listed could cause permanent damage to the device. This is a stress
rating only and functional operation of the device at any other condition above those indicated
in the operation sections of this specification is not implied. When powering this device from
laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be
exceeded or device failure can result. Some power supplies exhibit voltage spikes on their
outputs when the AC power is switched on or off. In addition, voltage transients on the AC
power line may appear on the DC output. If this possibility exists, it is suggested that a clamp
circuit be used.
Note 2.1
2.2
For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed
3.6V when the device is unpowered.
Electrical Specifications
Table 2.2 Electrical Specifications
VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values at TA = 27°C unless otherwise noted.
CHARACTERISTIC
SYMBOL
MIN
TYP
MAX
UNITS
CONDITIONS
DC Power
Supply Voltage
VDD
 2014 Microchip Technology Inc.
3.0
3.3
3.6
V
DS20005275A-page 9
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 2.2 Electrical Specifications (continued)
VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values at TA = 27°C unless otherwise noted.
CHARACTERISTIC
SYMBOL
MIN
TYP
MAX
UNITS
CONDITIONS
Supply Current
IDD
450
600
uA
1 conversion / sec, dynamic
averaging disabled
Supply Current
IDD
900
1200
uA
4 conversions / sec, dynamic
averaging enabled
Internal Temperature Monitor
Temperature Accuracy
±0.25
Temperature Resolution
±1
°C
0°C < TA < 100°C
±2
°C
-40°C < TA < 125°C
0.125
°C
External Temperature Monitor
Temperature Accuracy
Temperature Resolution
±0.25
±1
°C
+40°C < TDIODE < +110°C
0°C < TA < 110°C
±0.5
±2
°C
-40°C < TDIODE < 127°C
0.125
°C
ms
default settings
2.7
nF
Connected across external diode
100

In series with DP and DN lines
Conversion Time all
Channels
tCONV
190
Capacitive Filter
CFILTER
2.2
Resistance Error
Correction
RSERIES
TRIP_SET Measurement
Decoded Temperature
Accuracy
TSET
0.5
°C
RSET = 1% resistor
(see Note 2.2)
ALERT and SYS_SHDN pins
Output Low Voltage
VOL
0.4
V
ISINK = 8mA
Leakage Current
ILEAK
±5
uA
powered or unpowered
TA < 85°C
pull-up voltage < 3.6V
Power Up Timing
First conversion ready
tCONV_f
300
ms
Time after power up before all
channels updated with valid data
SMBus delay
tSMB_d
15
ms
Delay before SMBus
communications should be sent by
host
Note 2.2
DS20005275A-page 10
If a 1% resistor is used for RSET, then it is guaranteed to decode as shown in Table 4.1.
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
2.3
SMBus Electrical Characteristics
Table 2.3 SMBus Electrical Specifications
VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values are at TA = 27°C unless otherwise noted.
CHARACTERISTIC
SYMBOL
MIN
TYP
MAX
UNITS
CONDITIONS
SMBus Interface
Input High Voltage
VIH
2.0
VDD
V
5V Tolerant
Input Low Voltage
VIL
-0.3
0.8
V
5V Tolerant
Input High/Low Current
IIH / IIL
±5
uA
Powered or unpowered
TA < 85°C
Hysteresis
Input Capacitance
CIN
Output Low Sink Current
IOL
8.2
420
mV
5
pF
15
mA
SMDATA = 0.4V
SMBus Timing
Clock Frequency
fSMB
Spike Suppression
tSP
Bus free time Start to
Stop
tBUF
1.3
us
Hold Time: Start
tHD:STA
0.6
us
Setup Time: Start
tSU:STA
0.6
us
Setup Time: Stop
tSU:STP
0.6
us
Data Hold Time
tHD:DAT
0.3
us
Data Setup Time
tSU:DAT
100
ns
Clock Low Period
tLOW
1.3
us
Clock High Period
tHIGH
0.6
us
Clock/Data Fall time
tFALL
300
ns
Min = 20+0.1CLOAD ns
Clock/Data Rise time
tRISE
300
ns
Min = 20+0.1CLOAD ns
fSMB > 100kHz
Clock/Data Rise time
tRISE
1000
ns
Min = 20+0.1CLOAD ns
fSMB < 100kHz
Capacitive Load
CLOAD
400
pF
per bus line
 2014 Microchip Technology Inc.
10
400
kHz
50
ns
DS20005275A-page 11
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 3 System Management Bus Interface Protocol
3.1
System Management Bus Interface Protocol
The EMC1428 communicate with a host controller, such as a Microchip SIO, through the SMBus. The
SMBus is a two-wire serial communication protocol between a computer host and its peripheral
devices. A detailed timing diagram is shown in Figure 3.1.
Figure 3.1 SMBus Timing Diagram
The EMC1428 are SMBus 2.0 compatible and support Send Byte, Read Byte, Write Byte, Receive
Byte, and the Alert Response Address as valid protocols as shown below.
All of the below protocols use the convention in Table 3.1.
Table 3.1 Protocol Format
DATA SENT
TO DEVICE
DATA SENT TO
THE HOST
Attempting to communicate with the EMC1428 SMBus interface with an invalid slave address or invalid
protocol will result in no response from the device and will not affect its register contents. Stretching
of the SMCLK signal is supported, provided other devices on the SMBus control the timing.
3.2
Write Byte
The Write Byte is used to write one byte of data to the registers as shown below Table 3.2:
Table 3.2 Write Byte Protocol
START
SLAVE
ADDRESS
WR
ACK
REGISTER
ADDRESS
ACK
REGISTER
DATA
ACK
STOP
1 -> 0
1001_100
0
0
XXh
0
XXh
0
0 -> 1
DS20005275A-page 12
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
3.3
Read Byte
The Read Byte protocol is used to read one byte of data from the registers as shown in Table 3.3.
Table 3.3 Read Byte Protocol
START
SLAVE
ADDRESS
WR
ACK
REGISTER
ADDRESS
ACK
START
SLAVE
ADDRESS
RD
ACK
REGISTER
DATA
NACK
STOP
1-> 0
1001_100
0
0
XXh
0
0 -> 1
1001_100
1
0
XXh
1
0 -> 1
3.4
Send Byte
The Send Byte protocol is used to set the internal address register pointer to the correct address
location. No data is transferred during the Send Byte protocol as shown in Table 3.4.
Table 3.4 Send Byte Protocol
START
SLAVE
ADDRESS
WR
ACK
REGISTER
ADDRESS
ACK
STOP
1 -> 0
1001_100
0
0
XXh
0
1 -> 0
3.5
Receive Byte
The Receive Byte protocol is used to read data from a register when the internal register address
pointer is known to be at the right location (e.g. set via Send Byte). This is used for consecutive reads
of the same register as shown in Table 3.5.
Table 3.5 Receive Byte Protocol
START
SLAVE
ADDRESS
RD
ACK
REGISTER DATA
NACK
STOP
1 -> 0
1001_100
1
0
XXh
1
1 -> 0
3.6
Alert Response Address
The ALERT output can be used as a processor interrupt or as an SMBus Alert.
When it detects that the ALERT pin is asserted, the host will send the Alert Response Address (ARA)
to the general address of 000_1100b. All devices with active interrupts will respond with their client
address as shown in Table 3.6.
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Data Sheet
Table 3.6 Alert Response Address Protocol
START
ALERT
RESPONSE
ADDRESS
RD
ACK
DEVICE
ADDRESS
NACK
STOP
1 -> 0
0001_100
1
0
1001_1000
1
1 -> 0
The EMC1428 will respond to the ARA in the following way:
1. Send Slave Address and verify that full slave address was sent (i.e. the SMBus communication
from the device was not prematurely stopped due to a bus contention event).
2. Set the MASK bit to clear the ALERT pin.
APPLICATION NOTE: The ARA does not clear the Status Register and if the MASK bit is cleared prior to the Status
Register being cleared, the ALERT pin will be reasserted.
3.7
SMBus Address
The EMC1428-1 devices respond to the 7-bit slave address 1001_100xb.
The EMC1428-6 will respond to the 7-bit slave address 1001_101xb.
The EMC1428-7 slave address is determined at power up via the pull-up resistor on the SYS_SHDN
pin as shown in Table 3.7.
Table 3.7 Address Select Decode on SYS_SHDN Pin
PULL UP
RESISTOR
SMBUS
ADDRESS
4.7k Ohm ±5%
1001_000xb
6.8k Ohm ±5%
1001_001xb
10k Ohm ±5%
1001_010xb
15k Ohm ±5%
1001_011xb
22k Ohm ±5%
1001_100xb
33k Ohm ±5%
1001_101xb
Note: Other addresses are available. Contact Microchip for more information.
3.8
SMBus Timeout
The EMC1428 support SMBus Timeout. If the clock line is held low for longer than 30ms, the device
will reset its SMBus protocol. This function can be enabled by setting the TIMEOUT bit in the
Consecutive Alert Register (see Section 5.14).
DS20005275A-page 14
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 4 Product Description
The EMC1428 is an SMBus temperature sensor with Hardware Critical / Thermal Shutdown support.
The EMC1428 monitors up to seven (7) external diodes and one internal diode.
Thermal management is performed in cooperation with a host device. This consists of the host reading
the temperature data of both the external and internal temperature diodes of the EMC1428 and using
that data to control the speed of one or more fans.
The EMC1428 device has two levels of monitoring. The first provides a maskable ALERT signal to the
host when measured temperatures meet or exceed user programmable limits. This allows the
EMC1428 to be used as an independent thermal watchdog to warn the host of temperature hot spots
without constant monitoring by the host.
The second level of monitoring asserts the SYS_SHDN pin when the External Diode 1 temperature
meets or exceeds a hardware specified threshold temperature. Additionally, any of the external diode
channels can be configured to assert the SYS_SHDN pin when the measured temperature meets or
exceeds user programmable limits.
Because the EMC1428 automatically corrects for temperature errors due to series resistance in
temperature diode lines, there is greater flexibility in where external diodes are positioned and better
measurement accuracy than previously available devices without resistance error correction. As well,
the automatic beta detection feature means that there is no need to program the device according to
which type of diode is present. Therefore, the device can power up ready to operate for any system
configuration including those diodes that require the BJT or transistor model.
Figure 4.1 shows a system level block diagram of the EMC1428.
.
Figure 4.1 System Diagram for EMC1428
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
4.1
ALERT Output
The ALERT pin is an open drain output and has two modes of operation: interrupt mode and
comparator Mode. The mode of the ALERT output is selected via the ALERT / COMP bit in the
Configuration Register.
4.1.1
ALERT Pin Interrupt Mode
When configured to operate in interrupt mode, the ALERT pin asserts low when an out of limit
measurement (> high limit or < low limit) is detected on any diode or when a diode fault is detected.
The ALERT pin will remain asserted as long as an out-of-limit condition remains. Once the out-of-limit
condition has been removed, the ALERT pin will remain asserted until the appropriate status bits are
cleared. Each channel is subject to the fault queue (see Section 5.14).
The ALERT pin can be masked by setting the MASK bit. Once the ALERT pin has been masked, it
will be de-asserted and remain de-asserted until the MASK bit is cleared by the user. Any interrupt
conditions that occur while the ALERT pin is masked will update the Status Register normally.
The ALERT pin is used as an interrupt signal or as an SMBus Alert signal that allows an SMBus slave
to communicate an error condition to the master. One or more ALERT outputs can be hard-wired
together.
4.1.2
ALERT Pin Comparator Mode
When the ALERT pin is configured to operate in comparator mode it will be asserted if any of the
measured temperatures meets or exceeds the respective high limit or drops below the respective low
limit. The ALERT pin will remain asserted until all temperatures drop below the corresponding high
limit minus the THERM Hysteresis value.
When the ALERT pin is asserted in comparator mode, the corresponding status bits will be set.
Reading these bits will not clear them until the ALERT pin is deasserted. Once the ALERT pin is
deasserted, the status bits will be automatically cleared.
The MASK bit will not block the ALERT pin in this mode, however the individual channel masks (see
Section 5.13) will prevent the respective channel from asserting the ALERT pin. In addition, each
channel is subject to the fault queue (see Section 5.14).
4.2
SYS_SHDN Output
The SYS_SHDN output is asserted independently of the ALERT output and cannot be masked. If the
External Diode 1 temperature exceeds the Hardware Critical / Thermal Shutdown Limit for the
programmed number of consecutive measurements, then the SYS_SHDN pin is asserted.
The Hardware Critical / Thermal Shutdown Limit is defined by the TRIP_SET pin as described in
Section 4.3.
In addition to External Diode 1 channel triggering the SYS_SHDN pin when the measured temperature
exceeds to the Hardware Critical / Thermal Shutdown Limit, each of the temperature measurement
channels can be configured to assert the SYS_SHDN pin when they exceed the corresponding
THERM Limit.
When the SYS_SHDN pin is asserted, it will not release until the External Diode 1 temperature drops
below the Hardware Thermal Shutdown Limit minus 10°C and all other measured temperatures drop
below the THERM Limit minus the THERM Hysteresis value (when linked to SYS_SHDN).
DS20005275A-page 16
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
The External Diode 1 channel and any software enabled channels are subject to the fault queue such
that the error must exceed the threshold for one to four consecutive measurements before the
SYS_SHDN pin is asserted.
Figure 4.2 shows a block diagram of the interaction between the input channels and the SYS_SHDN
pin.
Figure 4.2 Block Diagram of Hardware Thermal Shutdown
4.3
TRIP_SET Pin
The EMC1428’s TRIP_SET pin is an input to the Critical / Thermal Shutdown logic block which sets
the Critical / Thermal shutdown temperature. The system designer creates a voltage level at this input
through a simple resistor connected to GND as shown in Figure 4.3. The value of this resistor is used
to create an input voltage on the TRIP_SET pin which is translated into a temperature ranging from
65°C to 127°C as enumerated in Table 4.1.
APPLICATION NOTE: Current only flows when the TRIP_SET pin is being monitored. At all other times, the internal
reference voltage is removed and the TRIP_SET pin will be pulled down to ground.
APPLICATION NOTE: The TRIP_SET pin circuitry is designed to use a 1% resistor externally. Using a 1% resistor
will result in the Thermal / Critical Shutdown temperature being decoded correctly. If a 5%
resistor is used, then the Thermal / Critical Shutdown temperature may be decoded with as
much as ±1°C error.
APPLICATION NOTE: Note that an open condition on the TRIP_SET pin will be decoded as a minimum
temperature threshold level.
 2014 Microchip Technology Inc.
DS20005275A-page 17
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Figure 4.3 Vset Circuit
Table 4.1 VTRIP Resistor Settings
TEMP (°C)
RSET()
TEMP (°C)
RSET()
65
0.0
97
1240.0
66
28.7
98
1330.0
67
48.7
99
1400.0
68
69.8
100
1500.0
69
90.9
101
1580.0
70
113.0
102
1690.0
71
137.0
103
1820.0
72
158.0
104
1960.0
73
182.0
105
2050.0
74
210.0
106
2210.0
75
237.0
107
2370.0
76
261.0
108
2550.0
77
294.0
108
2740.0
78
324.0
110
2940.0
79
348.0
111
3160.0
80
383.0
112
3480.0
DS20005275A-page 18
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 4.1 VTRIP Resistor Settings (continued)
4.4
TEMP (°C)
RSET()
TEMP (°C)
RSET()
81
412.0
113
3740.0
82
453.0
114
4120.0
83
487.0
115
4530.0
84
523.0
116
4990.0
85
562.0
117
5490.0
86
604.0
118
6040.0
87
649.0
119
6810.0
88
698.0
120
7870.0
89
750.0
121
9090.0
90
787.0
122
10700.0
91
845.0
123
12700.0
92
909.0
124
15800.0
93
953.0
125
20500.0
94
1020.0
126
29400.0
95
1100.0
127
49900.0
96
1150.0
65
Open
Consecutive Alerts
The EMC1428 contains multiple consecutive alert counters. One set of counters applies to the ALERT
pin and the second set of counters applies to the SYS_SHDN pin. Each temperature measurement
channel has a separate consecutive alert counter for each of the interrupt conditions (High, Low, Diode
fault). All counters are user programmable and determine the number of consecutive measurements
that a temperature channel(s) must be out-of-limit or reporting a diode fault before the corresponding
status bit is set or pin is asserted.
See Section 5.14 for more details on the consecutive alert function.
4.5
Temperature Monitoring
The EMC1428 can monitor the temperature of up to seven (7) externally connected diodes as well as
the internal or ambient temperature. Each channel is configured with the following features enabled or
disabled based on user settings and system requirements.
APPLICATION NOTE: When measuring a 45nm CPU diode, the reported temperature has an error of approximately
+1.5C at 100°C. This error is related to non-perfect ideality in the CPU diode.
 2014 Microchip Technology Inc.
DS20005275A-page 19
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
4.5.1
Resistance Error Correction
The EMC1428 includes active Resistance Error Correction to remove the effect of up to 100 ohms of
series resistance. Without this automatic feature, voltage developed across the parasitic resistance in
the remote diode path causes the temperature to read higher than the true temperature is. The error
induced by parasitic resistance is approximately +0.7°C per ohm. Sources of series resistance include
bulk resistance in the remote temperature transistor junctions, series resistance in the CPU, and
resistance in the printed circuit board traces and package leads. Resistance error correction in the
EMC1428 eliminates the need to characterize and compensate for parasitic resistance in the remote
diode path.
4.5.2
Beta Compensation
The forward current gain, or beta, of a transistor is not constant as emitter currents change. As well,
it is not constant over changes in temperature. The variation in beta causes an error in temperature
reading that is proportional to absolute temperature. Compensating for this error is also known as
implementing the BJT or transistor model for temperature measurement.
For discrete transistors configured with the collector and base shorted together, the beta is generally
sufficiently high such that the percent change in beta variation is very small. For example, a 10%
variation in beta for two forced emitter currents with a transistor whose ideal beta is 50 would contribute
approximately 0.25°C error at 100°C. However for substrate transistors where the base-emitter junction
is used for temperature measurement and the collector is tied to the substrate, the proportional beta
variation will cause large error. For example, a 10% variation in beta for two forced emitter currents
with a transistor whose ideal beta is 0.5 would contribute approximately 8.25°C error at 100°C.
The Beta Compensation circuitry in the EMC1428 corrects for this beta variation to eliminate any error
which would normally be induced. It automatically detects the appropriate beta setting to use.
4.5.3
Digital Averaging
To reduce the effect of noise and temperature spikes on the reported temperature, all of the external
diode channels use digital averaging. This averaging acts as a running average using the previous four
measured values.
The default setting is to have digital averaging disabled for all channels. It can be enabled for each
channel individually by the Filter Control Register (see Section 5.24).
4.5.4
“Hottest Of” Comparison
At the end of every measurement cycle, the EMC1428 compares all of the user selectable External
Diode channels to determine which of these channels is reporting the hottest temperature. The hottest
temperature is stored in the Hottest Temperature Registers and the appropriate status bit in the Hottest
Status Register is set. As an optional feature, the EMC1428 can also flag an event if the hottest
temperature channel changes. For example, suppose that External Diode channels 1, 3, and 4 are
programmed to be compared in the “Hottest Of” Comparison. If the External Diode 1 channel reports
the hottest temperature of the three, its temperature is copied into the Hottest Temperature Registers
(in addition to the External Diode 1 Temperature registers) and it is flagged in the Hottest Status bit.
If, on the next measurement, the External Diode 3 channel temperature has increased such that it is
now the hottest temperature, the EMC1428 can flag this event as an interrupt condition and assert the
ALERT pin.
DS20005275A-page 20
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
4.5.5
Conversion Rates
The EMC1428 may be configured for different conversion rates based on the system requirements.
The conversion rate is configured as described in Section 5.5. The default conversion rate is 4
conversions per second. Other available conversion rates are shown in Table 5.7.
4.5.6
Dynamic Averaging
Dynamic averaging causes the EMC1428 to measure the external diode channels for an extended time
based on the selected conversion rate. This functionality can be disabled for increased power savings
at the lower conversion rates (see Section 5.5). When dynamic averaging is enabled, the device will
automatically adjust the sampling and measurement time for the external diode channels. This allows
the device to average 2x or 4x longer than the normal 11 bit operation (nominally 21ms per channel)
while still maintaining the selected conversion rate. The benefits of dynamic averaging are improved
noise rejection due to the longer integration time as well as less random variation of the temperature
measurement.
When enabled, the dynamic averaging will affect the average supply current based on the chosen
conversion rate as shown in Table 4.2 for EMC1428.
Table 4.2 Supply Current vs. Conversion Rate for EMC1428
AVERAGE SUPPLY CURRENT
AVERAGING FACTOR (BASED ON
11-BIT OPERATION)
CONVERSION RATE
DYNAMIC
AVERAGING
ENABLED
(DEFAULT)
DYNAMIC
AVERAGING
DISABLED
DYNAMIC
AVERAGING
ENABLED
(DEFAULT)
DYNAMIC
AVERAGING
DISABLED
1 / sec
715uA
450uA
4x
1x
2 / sec
750uA
550uA
2x
1x
4 / sec (default)
900uA
815uA
1x
1x
Continuous (see Table 5.8)
950uA
950uA
0.5x
0.5x
4.6
Diode Connections
The diode connection for the External Diode 1 channel is determined based on the selected device.
For the EMC1428, this channel can support a diode-connected transistor (such as a 2N3904) or a
substrate transistor (such as those found in an CPU or GPU) as shown in Figure 4.4. Anti-parallel
diodes are not supported on the External Diode 1 channel.
 2014 Microchip Technology Inc.
DS20005275A-page 21
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Figure 4.4 Diode Connections
4.6.1
Diode Faults
The EMC1428 actively detects an open and short condition on each measurement channel. When a
diode fault is detected, the temperature data MSByte is forced to a value of 80h and the FAULT bit is
set in the Status Register. When an external diode channel is configured to operate in APD mode, the
circuitry will detect independent open fault conditions, however a short condition will be shared
between the APD channels.
DS20005275A-page 22
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 5 Register Description
The registers shown in Table 5.1 are accessible through the SMBus. An entry of ‘-’ indicates that the
bit is not used and will always read ‘0’.
Table 5.1 Register Set in Hexadecimal Order
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
DEFAULT
VALUE
PAGE
00h
R
Internal Diode Data
High Byte
Stores the integer data for the
Internal Diode
00h
Page 28
01h
R
External Diode 1
Data High Byte
Stores the integer data for the
External Diode 1
00h
Page 28
02h
R-C
Status
Stores the status bits for the
Internal Diode and External Diodes
00h
Page 30
03h
R/W
Configuration
Controls the general operation of
the device (mirrored at address
09h)
00h
Page 30
04h
R/W
Conversion Rate
Controls the conversion rate for
updating temperature data
(mirrored at address 0Ah)
06h
(4/sec)
Page 31
05h
R/W
Internal Diode High
Limit
Stores the 8-bit high limit for the
Internal Diode (mirrored at address
0Bh)
55h
(85°C)
Page 32
06h
R/W
Internal Diode Low
Limit
Stores the 8-bit low limit for the
Internal Diode (mirrored at address
0Ch)
00h
(0°C)
Page 32
07h
R/W
External Diode 1
High Limit High Byte
Stores the integer portion of the
high limit for the External Diode 1
(mirrored at register 0Dh)
55h
(85°C)
Page 32
08h
R/W
External Diode 1 Low
Limit High Byte
Stores the integer portion of the
low limit for the External Diode 1
(mirrored at register 0Eh)
00h
(0°C)
Page 32
09h
R/W
Configuration
Controls the general operation of
the device (mirrored at address
03h)
00h
Page 30
0Ah
R/W
Conversion Rate
Controls the conversion rate for
updating temperature data
(mirrored at address 04h)
06h
(4/sec)
Page 31
0Bh
R/W
Internal Diode High
Limit
Stores the 8-bit high limit for the
Internal Diode (mirrored at address
05h)
55h
(85°C)
Page 32
0Ch
R/W
Internal Diode Low
Limit
Stores the 8-bit low limit for the
Internal Diode (mirrored at address
06h)
00h
(0°C)
Page 32
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DS20005275A-page 23
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.1 Register Set in Hexadecimal Order (continued)
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
0Dh
R/W
External Diode 1
High Limit High Byte
Stores the integer portion of the
high limit for the External Diode 1
(mirrored at register 07h)
55h
(85°C)
Page 32
0Eh
R/W
External Diode 1 Low
Limit High Byte
Stores the integer portion of the
low limit for the External Diode 1
(mirrored at register 08h)
00h
(0°C)
Page 32
10h
R
External Diode 1
Data Low Byte
Stores the fractional data for the
External Diode 1
00h
Page 28
13h
R/W
External Diode 1
High Limit Low Byte
Stores the fractional portion of the
high limit for the External Diode 1
00h
Page 32
14h
R/W
External Diode 1 Low
Limit Low Byte
Stores the fractional portion of the
low limit for the External Diode 1
00h
Page 32
15h
R/W
External Diode 2
High Limit High Byte
Stores the integer portion of the
high limit for External Diode 2
55h
(85°C)
Page 32
16h
R/W
External Diode 2 Low
Limit High Byte
Stores the integer portion of the
low limit for External Diode 2
00h
(0°C)
Page 32
17h
R/W
External Diode 2
High Limit Low Byte
Stores the fractional portion of the
high limit External Diode 2
00h
Page 32
18h
R/W
External Diode 2 Low
Limit Low Byte
Stores the fractional portion of the
low limit for External Diode 2
00h
Page 32
19h
R/W
External Diode 1
THERM Limit
Stores the 8-bit critical temperature
limit for the External Diode 1
55h
(85°C)
Page 35
1Ah
R/W
External Diode 2
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 2
55h
(85°C)
Page 35
1Bh
R-C
External Diode Fault
Stores status bits indicating which
external diode detected a diode
fault
00h
Page 36
1Ch
R
TRIP_SET Voltage
Voltage measured on the
TRIP_SET pin to determine the
Critical / Thermal shutdown
threshold
00h
Page 36
1Dh
R/W
SYS_SHDN
Configuration
Controls which software channels,
if any, are linked to the
SYS_SHDN pin
00h
Page 36
1Eh
R
Hardware Thermal
Shutdown Limit
When read, returns the selected
Hardware Thermal Shutdown Limit
N/A
Page 37
1Fh
R/W
Interrupt Mask
Register
Controls the masking of individual
channels
F0h
Page 37
20h
R/W
Internal Diode
THERM Limit
Stores the 8-bit critical temperature
limit for the Internal Diode
55h
(85°C)
Page 35
DS20005275A-page 24
DEFAULT
VALUE
PAGE
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.1 Register Set in Hexadecimal Order (continued)
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
DEFAULT
VALUE
21h
R/W
THERM Hysteresis
Stores the 8-bit hysteresis value
that applies to all THERM limits
0Ah
(10°C)
Page 35
22h
R/W
Consecutive ALERT
Controls the number of out-of-limit
conditions that must occur before
the status bit is asserted
70h
Page 38
23h
R
External Diode 2
Data High Byte
Stores the integer data for External
Diode 2
00h
Page 28
24h
R
External Diode 2
Data Low Byte
Stores the fractional data for
External Diode 2
00h
Page 28
25h
R
External Diode 1
Beta Configuration
Stores the Beta Compensation
circuitry settings for External Diode
1
08h
Page 40
26h
R/W
External Diode 2
Beta Configuration
Stores the Beta Compensation
circuitry settings for External Diode
2
08h
Page 40
29h
R
Internal Diode Data
Low Byte
Stores the fractional data for the
Internal Diode
00h
Page 28
2Ah
R
External Diode 3
High Byte
Stores the integer data for External
Diode 3
00h
Page 28
2Bh
R
External Diode 3 Low
Byte
Stores the fractional data for
External Diode 3
00h
Page 28
2Ch
R/W
External Diode 3
High Limit High Byte
Stores the integer portion of the
high limit for External Diode 3
55h
(85°C)
Page 32
2Dh
R/W
External Diode 3 Low
Limit High Byte
Stores the integer portion of the
low limit for External Diode 3
00h
(0°C)
Page 32
2Eh
R/W
External Diode 3
High Limit Low Byte
Stores the fractional portion of the
high limit for External Diode 3
00h
Page 32
2Fh
R/W
External Diode 3 Low
Limit Low Byte
Stores the fractional portion of the
low limit for External Diode 3
00h
Page 32
30h
R/W
External Diode 3
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 3
55h
(85°C)
Page 35
32h
R
Hottest Diode High
Byte
Stores the integer data for the
hottest temperature
00h
Page 41
33h
R
Hottest Diode Low
Byte
Stores the fractional data for the
hottest temperature
00h
Page 41
34h
R-C
Hottest Status
Status bits indicating which
external diode is hottest
00h
Page 41
35h
R-C
High Limit Status
Status bits for the High Limits
00h
Page 42
36h
R-C
Low Limit Status
Status bits for the Low Limits
00h
Page 43
 2014 Microchip Technology Inc.
PAGE
DS20005275A-page 25
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.1 Register Set in Hexadecimal Order (continued)
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
DEFAULT
VALUE
PAGE
37h
R
THERM Limit Status
Status bits for the THERM Limits
00h
Page 43
39h
R/W
REC Configuration
Controls REC for all channels
00h
Page 44
3Ah
R/W
Hottest Config
Controls which external diode
channels are used in the “hottest
of “comparison
00h
Page 44
3Bh
R/W
Channel Config
Controls which channels are
enabled
00h
Page 45
40h
R/W
Filter Control
Controls the digital filter setting for
the External Diode 1 channel
00h
Page 46
41h
R
External Diode 4
Data High Byte
Stores the integer data for the
External Diode 4 channel
00h
Page 28
42h
R
External Diode 4
Data Low Byte
Stores the fractional data for the
External Diode 4 channel
00h
Page 28
43h
R
External Diode 5
Data High Byte
Stores the integer data for the
External Diode 5 channel
00h
Page 28
44h
R
External Diode 5
Data Low Byte
Stores the fractional data for the
External Diode 5 channel
00h
Page 28
45h
R
External Diode 6
Data High Byte
Stores the integer data for the
External Diode 6 channel
00h
Page 28
46h
R
External Diode 6
Data Low Byte
Stores the fractional data for the
External Diode 6 channel
00h
Page 28
47h
R
External Diode 7
Data High Byte
Stores the integer data for the
External Diode 7 channel
00h
Page 28
48h
R
External Diode 7
Data Low Byte
Stores the fractional data for the
External Diode 7 channel
00h
Page 28
50h
R/W
External Diode 4
High Limit High Byte
Stores the integer data for the high
limit for the External Diode 4
channel
55h
(85°C)
Page 32
51h
R/W
External Diode 4 Low
Limit High Byte
Stores the integer data for the low
limit for the External Diode 4
channel
00h
(0°C)
Page 32
52h
R/W
External Diode 4
HIgh Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 4
channel
00h
Page 32
53h
R/W
External Diode 4 Low
Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 4
channel
00h
Page 32
54h
R/W
External Diode 5
High Limit High Byte
Stores the integer data for the high
limit for the External Diode 5
channel
55h
(85°C)
Page 32
DS20005275A-page 26
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.1 Register Set in Hexadecimal Order (continued)
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
55h
R/W
External Diode 5 Low
Limit High Byte
Stores the integer data for the low
limit for the External Diode 5
channel
00h
(0°C)
Page 32
56h
R/W
External Diode 5
HIgh Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 5
channel
00h
Page 32
57h
R/W
External Diode 5 Low
Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 5
channel
00h
Page 32
58h
R/W
External Diode 6
High Limit High Byte
Stores the integer data for the high
limit for the External Diode 6
channel
55h
(85°C)
Page 32
59h
R/W
External Diode 6 Low
Limit High Byte
Stores the integer data for the low
limit for the External Diode 6
channel
00h
(0°C)
Page 32
5Ah
R/W
External Diode 6
HIgh Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 6
channel
00h
(0°C)
Page 32
5Bh
R/W
External Diode 6 Low
Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 6
channel
00h
(0°C)
Page 32
5Ch
R/W
External Diode 7
High Limit High Byte
Stores the integer data for the high
limit for the External Diode 7
channel
55h
(85°C)
Page 32
5Dh
R/W
External Diode 7 Low
Limit High Byte
Stores the integer data for the low
limit for the External Diode 7
channel
00h
(0°C)
Page 32
5Eh
R/W
External Diode 7
HIgh Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 7
channel
00h
Page 32
5Fh
R/W
External Diode 7 Low
Limit Low Byte
Stores the fractional data for the
low limit for the External Diode 7
channel
00h
Page 32
64h
R/W
External Diode 4
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 4
55h
(85°C)
Page 32
65h
R/W
External Diode 5
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 5
55h
(85°C)
Page 32
66h
R/W
External Diode 6
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 6
55h
(85°C)
Page 32
67h
R/W
External Diode 7
THERM Limit
Stores the 8-bit critical temperature
limit for External Diode 7
55h
(85°C)
Page 32
 2014 Microchip Technology Inc.
DEFAULT
VALUE
PAGE
DS20005275A-page 27
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.1 Register Set in Hexadecimal Order (continued)
REGISTER
ADDRESS
R/W
REGISTER NAME
FUNCTION
DEFAULT
VALUE
PAGE
71h
R/W
External Diode 4
Beta Configuration
Stores the Beta Compensation
circuitry settings for External Diode
4
08h
Page 40
72h
R/W
External Diode 6
Beta Configuration
Stores the Beta Compensation
circuitry settings for External Diode
6
08h
Page 40
FDh
R
Product ID EMC1428
Stores a fixed value that identifies
each product
29h
Page 46
FEh
R
Manufacturer ID
Stores a fixed value that
represents Microchip
5Dh
Page 46
FFh
R
Revision
Stores a fixed value that
represents the revision number
01h
Page 47
5.1
Data Read Interlock
When any temperature channel high byte register is read, the corresponding low byte is copied into
an internal ‘shadow’ register. The user is free to read the low byte at any time and be guaranteed that
it will correspond to the previously read high byte. Regardless if the low byte is read or not, reading
from the same high byte register again will automatically refresh this stored low byte data.
5.2
Temperature Data Registers
Table 5.2 Temperature Data Registers
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
00h
R
Internal Diode
High Byte
Sign
64
32
16
8
4
2
1
00h
29h
R
Internal Diode
Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
01h
R
External Diode
1 High Byte
Sign
64
32
16
8
4
2
1
00h
10h
R
External Diode
1 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
23h
R
External Diode
2 High Byte
Sign
64
32
16
8
4
2
1
00h
24h
R
External Diode
2 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
2Ah
R
External Diode
3 High Byte
Sign
64
32
16
8
4
2
1
00h
2Bh
R
External Diode
3 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
DS20005275A-page 28
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.2 Temperature Data Registers (continued)
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
41h
R
External Diode
4 High Byte
Sign
64
32
16
8
4
2
1
00h
42h
R
External Diode
4 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
43h
R
External Diode
5 High Byte
Sign
64
32
16
8
4
2
1
00h
44h
R
External Diode
5 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
45h
R
External Diode
6 High Byte
Sign
64
32
16
8
4
2
1
00h
46h
R
External Diode
6 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
47h
R
External Diode
7 High Byte
Sign
64
32
16
8
4
2
1
00h
48h
R
External Diode
7 Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
All temperatures are stored as an 11-bit value with the high byte representing the integer value and
the low byte representing the fractional value left justified to occupy the MSBits. The data format is
standard 2’s complement from -64°C to 127.875°C as shown in Table 5.3.
Table 5.3 Temperature Data Format
BINARY
HEX (AS READ BY
REGISTERS)
Diode Fault
1000_0000_000b
80_00h
-64
1100_0000_000b
C0_00h
-63.875
1100_0000_001b
C0_20h
-1
1111_1111_000b
FF_00h
-0.125
1111_1111_111b
FF_E0h
0
0000_0000_000b
00_00h
0.125
0000_0000_001b
00_20h
1
0000_0001_000b
01_00h
63
0011_1111_000b
3F_00h
64
0100_0000_000b
40_00h
127
0111_1111_000b
7F_00h
127.875
0111_1111_111b
7F_E0h
TEMPERATURE (°C)
 2014 Microchip Technology Inc.
DS20005275A-page 29
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.3
Status Register
Table 5.4 Status Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
02h
R
Status
BUSY
HOT
TEST
-
HIGH
LOW
FAULT
SW_
SYS
HWSD
00h
The Status Register reports general error conditions. To identify specific channels, refer to Section 5.9,
Section 5.18, Section 5.19, and Section 5.20. The individual Status Register bits (except HOTTEST)
are cleared when the appropriate High Limit, Low Limit, or THERM Limit register has been read or
cleared.
Bit 7 - BUSY - This bit indicates that the ADC is currently converting. This bit does not cause the
ALERT pin to be asserted.
Bit 6 - HOTTEST - This bit is set if the REM_HOT bit (see Section 5.23) is set and the hottest channel
changes. This bit is cleared when the register is read.
Bit 4 - HIGH - This bit is set when any of the temperature channels meets or exceeds its programmed
high limit. See the High Limit Status Register for specific channel information (Section 5.18). When set,
this bit will assert the ALERT pin.
Bit 3 - LOW - This bit is set when any of the temperature channels drops below its programmed low
limit. See the Low Limit Status Register for specific channel information (Section 5.19). When set, this
bit will assert the ALERT pin.
Bit 2 - FAULT - This bit is asserted when a diode fault is detected on any of the external diode
channels. See the External Diode Fault Register for specific channel information (Section 5.9). When
set, this bit will assert the ALERT pin.
Bit 1 - SW_SYS - This bit is set when any of the external diode channels meet or exceed the respected
THERM Limits. See the Therm Status Register for specific channel information (Section 5.20)
Bit 0 - HWSD - This bit is set when the External Diode 1 Temperature meets or exceeds the Hardware
Critical / Thermal Shutdown Limit. When set, this bit will assert the SYS_SHDN pin. This bit is cleared
when read if the SYS_SHDN pin has been released.
5.4
Configuration Register
Table 5.5 Configuration Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
03h
R/W
Config
MASK_
ALL
-
ALERT/
COMP
-
-
-
DAVG_
DIS
-
00h
09h
The Configuration Register controls the basic operation of the device. This register is fully accessible
at either address.
DS20005275A-page 30
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Bit 7 - MASK_ALL - Masks the ALERT pin from asserting.

‘0’ (default) - The ALERT pin is not masked. If any of the appropriate status bits are set the ALERT
pin will be asserted.

‘1’ - The ALERT pin is masked. It will not be asserted for any interrupt condition. The Status
Registers will be updated normally.
Bit 5 - ALERT/COMP - Controls the operation of the ALERT pin.

‘0’ (default) - The ALERT pin acts as described in Section 4.1.1.

‘1’ - The ALERT pin acts in comparator mode as described in Section 4.1.2. In this mode the
MASK_ALL bit is ignored.
Bit 1 - DAVG_DIS - Disables the dynamic averaging feature on all temperature channels (see
Section 4.5.6).
5.5

‘0’ (default) - The dynamic averaging feature is enabled. All temperature channels will be converted
with an averaging factor that is based on the conversion rate as shown in Table 4.2.

‘1’ - The dynamic averaging feature is disabled. All temperature channels will be converted with a
maximum averaging factor of 1x (equivalent to 11-bit conversion). For higher conversion rates (i.e.
more conversions per second), this averaging factor will be reduced as shown in Table 4.2.
Conversion Rate Register
Table 5.6 Conversion Rate Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
04h
R/W
Conversion
Rate
-
-
-
-
B3
B2
B1
B0
CONV[2:0]
DEFAULT
06h
(4/sec)
0Ah
The Conversion Rate Register controls how often the temperature measurement channels are updated
and compared against the limits. This register is fully accessible at either address.
Bits 3-0 - CONV[3:0] - Determines the conversion rate as shown in Table 5.7.
Table 5.7 Conversion Rate
CONV[2:0]
2
1
0
CONVERSIONS / SECOND
1
0
0
1
1
0
1
2
1
1
0
4 (default)
1
1
1
Continuous
All Others
4
The actual conversion rate for Continuous conversions will depend on the number of diode channels
enabled and is shown in Table 5.8.
 2014 Microchip Technology Inc.
DS20005275A-page 31
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.8 Maximum Conversion Rate Per Temperature Channels
NUMBER OF EXTERNAL DIODE CHANNELS
MAX CONVERSION RATE
4
12 / sec
5
11 / sec
6
10 / sec
7
9 / sec
5.6
Limit Registers
Table 5.9 Temperature Limit Registers
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
05h
R/W
Internal Diode
High Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
R/W
Internal Diode
Low Limit
Sign
64
32
16
8
4
2
1
00h
(0°C)
R/W
External
Diode 1 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
13h
R/W
External
Diode 1 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
08h
R/W
External
Diode 1 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
14h
R/W
External
Diode 1 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
15h
R/W
External
Diode 2 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
16h
R/W
External
Diode 2 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
0Bh
06h
0Ch
07h
0Dh
0Eh
DS20005275A-page 32
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.9 Temperature Limit Registers (continued)
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
17h
R/W
External
Diode 2 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
18h
R/W
External
Diode 2 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
2Ch
R/W
External
Diode 3 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
2Dh
R/W
External
Diode 3 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
2Eh
R/W
External
Diode 3 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
2Fh
R/W
External
Diode 3 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
50h
R/W
External
Diode 4 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
51h
R/W
External
Diode 4 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
52h
R/W
External
Diode 4 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
53h
R/W
External
Diode 4 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
54h
R/W
External
Diode 5 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
55h
R/W
External
Diode 5 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
 2014 Microchip Technology Inc.
DS20005275A-page 33
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.9 Temperature Limit Registers (continued)
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
56h
R/W
External
Diode 5 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
57h
R/W
External
Diode 5 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
58h
R/W
External
Diode 6 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
59h
R/W
External
Diode 6 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
5Ah
R/W
External
Diode 6 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
5Bh
R/W
External
Diode 6 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
5Ch
R/W
External
Diode 7 High
Limit High
Byte
Sign
64
32
16
8
4
2
1
55h
(85°C)
5Dh
R/W
External
Diode 7 Low
Limit High
Byte
Sign
64
32
16
8
4
2
1
00h
(0°C)
5Eh
R/W
External
Diode 7 High
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
5Fh
R/W
External
Diode 7 Low
Limit Low
Byte
0.5
0.25
0.125
-
-
-
-
-
00h
The device contains both high and low limits for all temperature channels. If the measured temperature
meets or exceeds the high limit, then the corresponding status bit is set and the ALERT pin is asserted.
Likewise, if the measured temperature is less than the low limit, the corresponding status bit is set and
the ALERT pin is asserted.
The limit registers with multiple addresses are fully accessible at either address.
DS20005275A-page 34
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.7
Therm Hysteresis Register
Table 5.10 Therm Hysteresis Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
21h
R/W
THERM
Hysteresis
-
64
32
16
8
4
2
1
0Ah
(10°C)
The THERM Hysteresis is used in conjunction with the THERM Limit Registers to assert the
SYS_SHDN pin. In addition, the THERM Hysteresis Register is used with the High Limit Registers
when the ALERT pin is configured to act as a comparator (see Section 4.1.2).
5.8
Therm Limit Registers
Table 5.11 Therm Limit Registers
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
19h
R/W
External
Diode 1
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
1Ah
R/W
External
Diode 2
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
20h
R/W
Internal Diode
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
30h
R/W
External
Diode 3
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
64h
R/W
External
Diode 4
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
65h
R/W
External
Diode 5
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
66h
R/W
External
Diode 6
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
67h
R/W
External
Diode 7
THERM Limit
Sign
64
32
16
8
4
2
1
55h
(85°C)
The THERM Limit Registers are used to set the threshold for the software inputs to the Critical /
Thermal Shutdown circuitry. If the measured channel is linked to the Critical / Thermal Shutdown
circuitry and meets or exceeds this limit, then the SYS_SHDN pin will be asserted.
 2014 Microchip Technology Inc.
DS20005275A-page 35
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.9
External Diode Fault Register
Table 5.12 External Diode Fault Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
1Bh
R-C
External
Diode Fault
E7FLT
E6FLT
E5FLT
E4FLT
E3FLT
E2FLT
E1FLT
-
00h
The External Diode Fault Register indicates which of the external diodes caused the FAULT bit in the
Status Register to be set. These bits are cleared when read if the error condition has been removed.
Bit 7 - E7FLT - This bit is set if the External Diode 7 channel reported a diode fault.
Bit 6 - E6FLT - This bit is set if the External Diode 6 channel reported a diode fault.
Bit 5 - E5FLT - This bit is set if the External Diode 5 channel reported a diode fault.
Bit 4 - E4FLT - This bit is set if the External Diode 4 channel reported a diode fault.
Bit 3 - E3FLT - This bit is set if the External Diode 3 channel reported a diode fault.
Bit 2 - E2FLT - This bit is set if the External Diode 2 channel reported a diode fault.
Bit 1 - E1FLT - This bit is set if the External Diode 1 channel reported a diode fault.
5.10
TRIP_SET Reading Register
Table 5.13 TRIP_SET Reading Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
1Ch
R
TRIP_SET
Reading
752.9
376.5
188.2
94.12
47.1
23.53
11.76
5.88
00h
The TRIP_SET Reading Register stores the voltage measured on the TRIP_SET pin. The bit weighting
represents mV above 0V.
5.11
Software Thermal Shutdown Configuration Register
Table 5.14 Software Thermal Shutdown Configuration Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
1Dh
R/W
Software Thermal
Shutdown
Configuration
E7
SYS
E6
SYS
E5
SYS
E4
SYS
E3
SYS
E2
SYS
E1
SYS
INT
SYS
00h
The Software Thermal Shutdown Configuration Register controls whether any of the software channels
will assert the SYS_SHDN pin. If a channel is enabled, the temperature is compared against the
DS20005275A-page 36
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
corresponding THERM Limit. If the measured temperature meets or exceeds the THERM Limit, then
the SYS_SHDN pin is asserted. This functionality is in addition to the Hardware Shutdown circuitry.
Bits 7-1 - ExSYS - configures the External Diode X channel to assert the SYS_SHDN pin based on
it’s respective THERM Limit (see Section 5.20 for details on the ExTHERM status bits).

‘0’ (default) - the External Diode X channel is not linked to the SYS_SHDN pin. If the temperature
meets or exceeds it’s THERM Limit, the ExTHERM status bit is set but the SYS_SHDN pin is not
asserted.

‘1’ - the External Diode X channel is linked to the SYS_SHDN pin. If the temperature meets or
exceeds it’s THERM Limit, the ExTHERM status bit is set and the SYS_SHDN pin is asserted. It
will remain asserted until the temperature drops below it’s THERM Limit minus the THERM
Hysteresis.
Bit 0 - INTSYS - configures the Internal Diode channel to assert the SYS_SHDN pin based on it’s
respective THERM Limit (see Section 5.20 for details on the ITHERM status bit).
5.12

‘0’ (default) - the Internal Diode channel is not linked to the SYS_SHDN pin. If the temperature
meets or exceeds it’s THERM Limit, the ITHERM status bit is set but the SYS_SHDN pin is not
asserted.

‘1’ - the Internal Diode channel is linked to the SYS_SHDN pin. If the temperature meets or
exceeds it’s THERM Limit, the ITHERM status bit is set and the SYS_SHDN pin is asserted. It will
remain asserted until the temperature drops below it’s THERM Limit minus the THERM Hysteresis.
Hardware Critical / Thermal Shutdown Limit Register
Table 5.15 Hardware Thermal Shutdown Limit Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
1Eh
R
Hardware
Thermal
Shutdown Limit
-
64
32
16
8
4
2
1
N/A
This read only register returns the Hardware Thermal Shutdown Limit selected by the TRIP_SET
voltage. The data represents the hardware set temperature in °C. See Table 5.2 for the data format.
When the External Diode 1 Temperature meets or exceeds this limit, the SYS_SHDN pin is asserted
and will remain asserted until the External Diode 1 Temperature drops below this limit minus 10°C.
5.13
Channel Interrupt Mask Register
Table 5.16 Channel Interrupt Mask Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
1Fh
R/W
Channel
Mask
E7_
MSK
E6_
MSK
E5_
MSK
E4_
MSK
E3_
MSK
E2_
MSK
E1_
MSK
INT_
MSK
F0h
The Channel Interrupt Mask Register controls individual channel masking. When a channel is masked,
the ALERT pin will not be asserted when the masked channel reads a diode fault or out of limit error.
The channel mask does not mask the SYS_SHDN pin.
 2014 Microchip Technology Inc.
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1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Bits 7-4 - Ex_MSK - Prevents the ALERT pin from being asserted when the External Diode X channel
is out of limit or reports a diode fault. If the EXT6_APD bit is not set (see Section 5.23), then the
EXT7_MSK bit is ignored. Likewise, if the EXT4_APD bit is not set, then the EXT5_MSK bit is ignored.

‘0’ - The External Diode X channel will cause the ALERT pin to be asserted if it is out of limit or
reports a diode fault.

‘1’ (default) - The External Diode X channel will not cause the ALERT pin to be asserted if it is out
of limit or reports a diode fault.
Bits 3-1- Ex_MSK - Prevents the ALERT pin from being asserted when the External Diode X channel
is out of limit or reports a diode fault. If the EXT2_APD bit is not set (see Section 5.23), then the
EXT3_MSK bit is ignored.

‘0’ - (default) The External Diode X channel will cause the ALERT pin to be asserted if it is out of
limit or reports a diode fault.

‘1’ - The External Diode X channel will not cause the ALERT pin to be asserted if it is out of limit
or reports a diode fault.
Bit 0 - INT_MSK- Prevents the ALERT pin from being asserted when the Internal Diode temperature
is out of limit.
5.14

‘0’ (default) - The Internal Diode channel will cause the ALERT pin to be asserted if it is out of limit.

‘1’ - The Internal Diode channel will not cause the ALERT pin to be asserted if it is out of limit.
Consecutive ALERT Register
Table 5.17 Consecutive ALERT Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
22h
R/W
Consecutive
ALERT
TIME
OUT
CTHE
RM2
CTHE
RM1
CTHE
RM0
CAL
RT2
CAL
RT1
CAL
RT0
-
70h
The Consecutive ALERT Register determines how many times an out-of-limit error or diode fault must
be detected in consecutive measurements before the interrupt status registers are asserted.
Each out of limit error and diode fault condition has its own counter associated with it. Each counter
is incremented whenever the corresponding channel exceeds the appropriate limit. Additionally, each
counter is reset if the condition has been removed. (i.e. if External Diode 1 exceeds its high limit, it
will increment the high counter. If, on the next measurement, it experiences a diode fault, the high limit
counter will be reset and the diode fault counter will be incremented).
When the ALERT pin is configured as an interrupt and the consecutive alert counter reaches its
programmed value then the STATUS bit(s) for that channel and the error condition will be set to ‘1’
and the ALERT pin will be asserted. Measurements will continue normally.
When the ALERT pin is configured as a comparator, the consecutive alert counter will ignore diode
fault and low limit errors and only increment if the measured temperature meets or exceeds the High
Limit. Additionally, once the consecutive alert counter reaches the programmed limit, the ALERT pin
will be asserted, but the counter will not be reset. It will remain set until the temperature drops below
the High Limit minus the THERM Hysteresis value.
For example, if the CALRT[2:0] bits are set for 4 consecutive alerts on an EMC1428 device, the high
limits are set at 70°C, and none of the channels are masked, then the status bits will be asserted after
the following four measurements:
DS20005275A-page 38
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
1. Internal Diode reads 71°C and both external diodes read 69°C. Consecutive alert counter for INT
is incremented to 1.
2. Both the Internal Diode and the External Diode 1 read 71°C and External Diode 2 reads 68°C.
Consecutive alert counter for INT is incremented to 2 and for EXT1 is set to 1.
3. The External Diode 1 reads 71°C and both the Internal Diode and External Diode 2 read 69°C.
Consecutive alert counter for INT and EXT2 are cleared and EXT1 is incremented to 2.
4. The Internal Diode reads 71°C and both external diodes read 71°C. Consecutive alert counter for
INT is set to 1, EXT2 is set to 1, and EXT1 is incremented to 3.
5. The Internal Diode reads 71°C and both the external diodes read 71°C. Consecutive alert counter
for INT is incremented to 2, EXT2 is set to 2, and EXT1 is incremented to 4. The HIGH status bit
are set for EXT1 and the ALERT pin is asserted. The EXT1 counter is reset to 0 and all other
counters hold the last value until the next temperature measurement.
Bit 7 - TIMEOUT - Determines whether the SMBus Timeout function is enabled.

‘0’ (default) - The SMBus Timeout feature is disabled. The SMCLK line can be held low indefinitely
without the device resetting its SMBus protocol.

‘1’ - The SMBus Timeout feature is enabled. If the SMCLK line is held low for more than 30ms,
then the device will reset the SMBus protocol.
Bits 6-4 CTHRM[2:0] - Determines the number of consecutive measurements that must exceed the
corresponding THERM Limit and Hardware Thermal Shutdown Limit before the SYS_SHDN pin is
asserted. All temperature channels use this value to set the respective counters. The consecutive
THERM counter is incremented whenever any of the measurements exceed the corresponding
THERM Limit or if the External Diode 1 measurement meets or exceeds the Hardware Thermal
Shutdown Limit.
If the temperature drops below the THERM limit or Hardware Thermal Shutdown Limit, then the
counter is reset. If the programmed number of consecutive measurements exceed the THERM Limit
or Hardware Thermal Shutdown Limit, and the appropriate channel is linked to the SYS_SHDN pin,
then the SYS_SHDN pin will be asserted low.
Once the SYS_SHDN pin is asserted, the consecutive THERM counter will not reset until the
corresponding temperature drops below the appropriate limit minus the corresponding hysteresis.
The bits are decoded as shown in Table 5.18. The default setting is 4 consecutive out of limit
conversions.
Bits 3-1 - CALRT[2:0] - Determine the number of consecutive measurements that must have an out of
limit condition or diode fault before the STATUS bits is asserted. All temperature channels use this
value to set the respective counters. The bits are decoded as shown in Table 5.18. The default setting
is 1 consecutive out of limit conversion.
APPLICATION NOTE: If one of the fault queues is not cleared and the CALRT[2:0] (or CTHRM[2:0]) bits are
updated, the update won’t take affect until fault queue is cleared. All the fault queues are
independent so those that are empty will be updated immediately.
Table 5.18 Consecutive Alert Settings
2
1
0
NUMBER OF CONSECUTIVE OUT OF LIMIT
MEASUREMENTS
0
0
0
1 (default for CALRT[2:0])
0
0
1
2
 2014 Microchip Technology Inc.
DS20005275A-page 39
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.18 Consecutive Alert Settings (continued)
2
1
0
NUMBER OF CONSECUTIVE OUT OF LIMIT
MEASUREMENTS
0
1
1
3
1
1
1
4 (default for CTHRM[2:0])
All Others
5.15
1 (CALRT[2:0]),
4 (CTHRM[2:0])
Beta Configuration Register
Table 5.19 Beta Configuration Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
25h
R
External Diode 1
Beta Configuration
-
-
-
-
AUTO1
BETA1[2:0]
08h
26h
R/W
External Diode 2
Beta Configuration
-
-
-
-
AUTO2
BETA2[2:0]
08h
71h
R/W
External Diode 4
Beta Configuration
-
-
-
-
AUTO4
BETA4[2:0]
08h
72h
R/W
External Diode 6
Beta Configuration
-
-
-
-
AUTO6
BETA6[2:0]
07h
These registers are used to set the Beta Compensation factor that is used for the External Diode
channels.
Bit 3 - AUTOx - Enables the Beta Compensation factor autodetection function.

‘0’ - The Beta Compensation Factor autodetection circuitry is disabled. The External Diode will
always use the Beta Compensation factor set by the BETAx[2:0] bits.

‘1’ (default) - The Beta Compensation factor autodetection circuitry is enabled. At the beginning of
every conversion, the optimal Beta Compensation factor setting will be determined and applied.
The BETAx[2:0] bits will be automatically updated to indicate the current setting.
Bit 2-0 - BETAx[2:0] - These bits always reflect the current beta configuration settings. These bits will
be updated automatically and writing to these bits will have no effect.
Table 5.20 Beta Compensation Look Up Table
BETAX[2:0]
2
1
0
MINIMUM BETA
0
0
0
< 0.08
0
0
1
< 0.111
0
1
0
< 0.176
DS20005275A-page 40
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Table 5.20 Beta Compensation Look Up Table (continued)
BETAX[2:0]
5.16
2
1
0
MINIMUM BETA
0
1
1
< 0.29
1
0
0
< 0.48
1
0
1
< 0.9
1
1
0
< 2.33
1
1
1
Disabled
Hottest Temperature Registers
Table 5.21 Hottest Temperature Registers
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
32h
R
Hottest
Temperature
High Byte
Sign
64
32
16
8
4
2
1
80h
33h
R
Hottest
Temperature
Low Byte
0.5
0.25
0.125
-
-
-
-
-
00h
The Hottest Temperature Registers store the measured hottest temperature of all the selected external
diode channels (see Section 5.22). If no External diodes are selected then the High Byte Register will
read 80h. The data format is the same as the temperature channels.
5.17
Hottest Temperature Status Register
Table 5.22 Hottest Temperature Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
34h
R
Hottest
Temperature
Status
EXT7
EXT6
EXT5
EXT4
EXT3
EXT2
EXT1
INT
00h
The Hottest Temperature Status Register flags which external diode temperature is hottest. If multiple
temperature channels measure the same temperature and are equal to the hottest temperature, then
hottest status will be based on the measurement order.
Bit 7 - EXT7 - The External Diode 7 channel is the hottest.
Bit 6 - EXT6 - The External Diode 6 channel is the hottest.
Bit 4 - EXT5 - The External Diode 5 channel is the hottest.
 2014 Microchip Technology Inc.
DS20005275A-page 41
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Bit 3 - EXT4 - The External Diode 4 channel is the hottest.
Bit 3 - EXT3 - The External Diode 3 channel is the hottest.
Bit 2 - EXT2 - The External Diode 2 channel is the hottest.
Bit 1 - EXT1 - The External Diode 1 channel is the hottest.
Bit 0 - INT - The Internal Diode channel is the hottest.
5.18
High Limit Status Register
Table 5.23 High Limit Status Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
35h
R-C
High Limit
Status
E7
HIGH
E6
HIGH
E5
HIGH
E4
HIGH
E3
HIGH
E2
HIGH
E1
HIGH
I
HIGH
00h
The High Limit Status Register contains the status bits that are set when a temperature channel high
limit is exceeded for a number of consecutive readings as set by the consecutive alert counts (see
Section 5.14). If any of these bits are set, then the HIGH status bit in the Status Register is set.
Reading from the High Limit Status Register will clear all bits if the error condition has been removed.
Reading from the register will also clear the HIGH status bit in the Status Register.
The ALERT pin will be set if any of these status bits are set.
Bit 7 - E7HIGH - This bit is set when the External Diode 7 channel meets or exceeds its programmed
high limit.
Bit 6 - E6HIGH - This bit is set when the External Diode 6 channel meets or exceeds its programmed
high limit.
Bit 5 - E5HIGH - This bit is set when the External Diode 5 channel meets or exceeds its programmed
high limit.
Bit 4 - E4HIGH - This bit is set when the External Diode 4 channel meets or exceeds its programmed
high limit.
Bit 3 - E3HIGH - This bit is set when the External Diode 3 channel meets or exceeds its programmed
high limit.
Bit 2 - E2HIGH - This bit is set when the External Diode 2 channel meets or exceeds its programmed
high limit.
Bit 1 - E1HIGH - This bit is set when the External Diode 1 channel meets or exceeds its programmed
high limit.
Bit 0 - IHIGH - This bit is set when the Internal Diode channel meets or exceeds its programmed high
limit.
DS20005275A-page 42
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.19
Low Limit Status Register
Table 5.24 Low Limit Status Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
36h
R-C
Low Limit
Status
E7
LOW
E6
LOW
E5
LOW
E4
LOW
E3
LOW
E2
LOW
E1
LOW
ILOW
00h
The Low Limit Status Register contains the status bits that are set when a temperature channel drops
below the low limit for a number of consecutive readings as set by the consecutive alert counts (see
Section 5.14). If any of these bits are set, then the LOW status bit in the Status Register is set. Reading
from the Low Limit Status Register will clear all bits if the error condition has been removed. Reading
from the register will also clear the LOW status bit in the Status Register.
The ALERT pin will be set if any of these status bits are set.
Bit 7 - E7LOW - This bit is set when the External Diode 7 channel drops below its programmed low
limit.
Bit 6 - E6LOW - This bit is set when the External Diode 6 channel drops below its programmed low
limit.
Bit 5- E5LOW - This bit is set when the External Diode 5 channel drops below its programmed low limit.
Bit 4 - E4LOW - This bit is set when the External Diode 4 channel drops below its programmed low
limit.
Bit 3 - E3LOW - This bit is set when the External Diode 3 channel drops below its programmed low
limit.
Bit 2 - E2LOW - This bit is set when the External Diode 2 channel drops below its programmed low
limit.
Bit 1 - E1LOW - This bit is set when the External Diode 1 channel drops below its programmed low
limit.
Bit 0 - ILOW - This bit is set when the Internal Diode channel drops below its programmed low limit.
5.20
THERM Limit Status Register
Table 5.25 THERM Limit Status Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
37h
R-C
THERM
Limit Status
E7
THERM
E6
THERM
E5
THERM
E4
THERM
E3
THERM
E2
THERM
E1
THERM
I
THERM
00h
The THERM Limit Status Register contains the status bits that are set when a temperature channel
THERM Limit is exceeded for a number of consecutive readings as set by the consecutive therm
counts (see Section 5.14). If any of these bits are set, then the THERM status bit in the Status Register
is set. Reading from the THERM Limit Status Register will not clear the status bits. Once the
temperature drops below the THERM Limit minus the THERM Hysteresis, the corresponding status
 2014 Microchip Technology Inc.
DS20005275A-page 43
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
bits will be automatically cleared. The THERM bit in the Status Register will be cleared when all
individual channel THERM bits are cleared.
Bit 7 - E7THERM - This bit is set when the External Diode 7 channel meets or exceeds it’s
programmed THERM Limit.
Bit 6 - E6THERM - This bit is set when the External Diode 6 channel meets or exceeds it’s
programmed THERM Limit.
Bit 5 - E5THERM - This bit is set when the External Diode 5 channel meets or exceeds it’s
programmed THERM Limit.
Bit 4 - E4THERM - This bit is set when the External Diode 4 channel meets or exceeds it’s
programmed THERM Limit.
Bit 3 - E3THERM - This bit is set when the External Diode 3 channel meets or exceeds it’s
programmed THERM Limit.
Bit 2 - E2THERM - This bit is set when the External Diode 2 channel meets or exceeds it’s
programmed THERM Limit.
Bit 1 - E1THERM - This bit is set when the External Diode 1 channel meets or exceeds it’s
programmed THERM limit.
Bit 0- ITHERM - This bit is set when the Internal Diode channel meets or exceeds it’s programmed
THERM limit.
5.21
REC Configuration Register
Table 5.26 REC Configuration Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
39h
R/W
REC Config
E7
REC_n
E6_
REC_n
E5_
REC_n
E4_
REC_n
E3_
REC_n
E2_
REC_n
E1_
REC_n
-
00h
The REC Control Register controls the Resistance Error Correction circuitry for each of the external
diode channels.
Bits 7 -0- EX_REC_n - Disables the Resistance Error Correction (REC) for the External Diode X
channel.
5.22

‘0’ (default) - REC is enabled.

‘1’ - REC is disabled.
Hottest Configuration Register
Table 5.27 Hottest Configuration Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
3Ah
R/W
Hottest
Config
E7HOT
E6HOT
E5HOT
E4HOT
E3HOT
E2HOT
E1HOT
IHOT
00h
DS20005275A-page 44
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
The Hottest Configuration Register determines which External Diode Channels (if any) are compared
during the “Hottest Of” comparison that is automatically performed at the end of every conversion
cycle.
Bits 7 - 0 - ExHOT - Controls whether the External Diode X temperature data is compared during the
“Hottest Of” comparison.

‘0’ (default) - The External Diode X channel is not compared during the “Hottest Of” Comparison.

‘1’ - The External Diode X channel temperature data is compared to all other indicated channels
during the “Hottest Of” Comparison.
Bit 0 - IHOT - Controls whether the Internal Diode temperature data is compared during the “Hottest
Of” comparison.
5.23

‘0’ (default) - The Internal Diode channel is not compared during the “Hottest Of” Comparison.

‘1’ - The Internal Diode channel temperature data is compared to all other indicated channels during
the “Hottest Of” Comparison.
Channel Configuration Register
Table 5.28 Channel Configuration Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
3Bh
R/W
Channel
Config
REM_
HOT
-
-
-
EXT6_
APD
EXT4_
APD
EXT2_
APD
-
00h
The Channel Configuration Register determines which external diode channels are active in the device.
Bit 7 - REM_HOT - Enables circuitry that will remember the last temperature channel that was
determined to be the Hottest and flag an error if the hottest temperature channel changes.

‘0’ (default) - The HOTTEST status bit will not be asserted if the hottest temperature channel
changes.

‘1’ - If the hottest temperature channel changes, then the HOTTEST status bit will be asserted.
Bit 3 - EXT6_APD - Enables the DP6 / DN7 and DN6 / DP7 pins to support two anti-parallel diode
connections versus a single diode connection.

‘0’ (default) - The DP6 / DN7 and DN6 / DP7 pins do not support two anti-parallel diode
connections. The pins will only monitor a single external diode (External Diode 6).

‘1’ - The DP6 / DN7 and DN6 / DP7 pins support two anti-parallel diode connections (External
Diode 6 and External Diode 7).
Bit 2 - EXT4_APD - Enables the DP4 / DN5 and DN4 / DP5 pins to support two anti-parallel diode
connections versus a single diode connection.

‘0’ (default) - The DP4 / DN5 and DN4 / DP5 pins do not support two anti-parallel diode
connections. The pins will only monitor a single external diode (External Diode 4).

‘1’ - The DP4 / DN5 and DN4 / DP5 pins support two anti-parallel diode connections (External
Diode 4 and External Diode 5).
 2014 Microchip Technology Inc.
DS20005275A-page 45
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Bit 1 - EXT2_APD- Enables the DP2 / DN3 and DN2 / DP3 pins to support two anti-parallel diode
connections versus a single diode connection.
5.24

‘0’ (default) - The DP2 / DN3 and DN2 / DP3 pins do not support two anti-parallel diode
connections. The pins will only monitor a single external diode (External Diode 2).

‘1’ - The DP2 / DN3 and DN2 / DP3 pins support two anti-parallel diode connections (External
Diode 2 and External Diode 3).
Filter Control Register
Table 5.29 Filter Control Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
40h
R/W
Filter Control
AVG7_
EN
AVG6_
EN
AVG5_
EN
AVG4_
EN
AVG3_
EN
AVG2_
EN
AVG1_
EN
-
00h
The Filter Configuration Register controls the digital filter on the external diode channels.
Bits 7 - 0 - AVGx_EN- Control the digital averaging that is applied to the External Diode X temperature
measurements.
5.25

‘0’ (default) - Digital Averaging is disabled.

‘1’ - Digital averaging is enabled as a 4x running average for the External Diode X channel.
Product ID Register
Table 5.30 Product ID Register
ADDR
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
FDh
R
Product ID
0
0
1
0
1
0
0
1
29h
EMC1428
The Product ID Register holds a unique value that identifies the device.
5.26
Manufacturer ID Register (FEh)
Table 5.31 Manufacturer ID Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
FEh
R
Manufacturer
ID
0
1
0
1
1
1
0
1
5Dh
The Manufacturer ID Register holds an 8-bit word that identifies Microchip.
DS20005275A-page 46
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
5.27
Revision Register (FFh)
Table 5.32 Revision Register
ADDR.
R/W
REGISTER
B7
B6
B5
B4
B3
B2
B1
B0
DEFAULT
FFh
R
Revision
0
0
0
0
0
0
0
1
01h
The Revision register contains an 8 bit word that identifies the die revision.
 2014 Microchip Technology Inc.
DS20005275A-page 47
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 6 Package Information
Note: For the most current package drawings, see the Microchip Packaging Specification at
http://www.microchip.com/packaging.
6.1
EMC1428 Package Drawing
Figure 6.1 16-Pin QFN 4mm x 4mm Package Dimensions
DS20005275A-page 48
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Figure 6.2 16-Pin QFN 4mm x 4mm Package Drawing
 2014 Microchip Technology Inc.
DS20005275A-page 49
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Figure 6.3 16-Pin QFN 4mm x 4mm PCB Footprint
6.2
Package Markings
6.2.1
EMC1428-X-AP (16-Pin QFN)
All devices will be marked on the first line of the top side with “1428” and “-X”. On they second line,
packages are marked with the Lot Number. On the third line, packages are marked with Functional
Revision code “B” and the Country Code (CC).
DS20005275A-page 50
 2014 Microchip Technology Inc.
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
Data Sheet
Chapter 7 Data Sheet Revision History
Table 7.1 Revision History
REVISION LEVEL AND
DATE
REV A
SECTION/FIGURE/ENTRY
CORRECTION
REV A replaces previous SMSC version Rev. 0.70 (04-19-13)
Rev. 0.70 (04-19-13)
Ordering Number
Corrected EMC1428-7 part number,
adding -CB7 as a suffix
Rev. 0.69 (06-29-09)
Table 1.1, "EMC1428 Pin Description"
Added “requires external pullup
resistor” to SMDATA and SMCLK in
function column
Table 1.1, "EMC1428 Pin Description"
Added the following application note
below table: “For the 5V tolerant pins
that have a pull-up resistor, the voltage
difference between VDD and the pullup voltage must never exceed 3.6V.”
Table 2.1, "Absolute Maximum
Ratings"
Updated voltage limits for 5V tolerant
pins with pull-up resistors.
Added the following note below table:
“For the 5V tolerant pins that have a
pull-up resistor, the pull-up voltage
must not exceed 3.6V when the device
is unpowered.”
Updated thetaJA from 40 to 50.
Rev. 0.67 (06-16-08)
 2014 Microchip Technology Inc.
Ordering Information
Added EMC1428-7
Section 3.7, "SMBus Address"
Added EMC1428-7 Address options
DS20005275A-page 51
1°C Multiple Temperature Sensor with Beta Compensation and Hottest of Multiple Zones
Data Sheet
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32
logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
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FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM,
MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and ZScale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
A more complete list of registered trademarks and common law trademarks owned by Standard Microsystems Corporation (“SMSC”)
is available at: www.smsc.com. The absence of a trademark (name, logo, etc.) from the list does not constitute a waiver of any
intellectual property rights that SMSC has established in any of its trademarks.
All other trademarks mentioned herein are property of their respective companies.
© 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781620779552
Microchip received ISO/TS-16949:2009 certification for its worldwide
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Tempe, Arizona; Gresham, Oregon and design centers in California
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are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005275A-page 52
 2014 Microchip Technology Inc.
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Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20005275A-page 53
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/28/13
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