Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant PDIP 300 mils 20 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 8.24 E-01 4.70 E-02 4.70 E-02 1.88 E-02 2.82 E-03 9.40 E-01 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 4.30 E-01 1.00 E-02 5.57 E-04 1.07 E-04 4.41 E-01 Homogeneous Material Level Percentage (%) PPM 87.7 877000 5.0 50000 5.0 50000 2.0 20000 0.3 3000 100 1000000 Percentage (%) 58.30 3.32 3.32 1.33 0.20 66.47 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Percentage (%) 30.43 0.71 0.04 0.01 31.19 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 0.07 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 1.56 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Percentage (%) 0.02 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 0.64 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Percentage (%) 0.04 0.01 0 00 0.00 0.05 PPM Percentage (%) 100.00 PPM Component Level PPM 582962 33236 33236 13294 1994 664723 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus Component Level PPM 304309 7108 394 76 311886 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 9.21 E-04 Component Level PPM 652 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 2.21 E-02 Component Level PPM 15600 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 2.46 E-04 Component Level PPM 174 Chip Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 9.08 E-03 Component Level PPM 6422 Die Attach Description Precious metals Thermosets Others Subtotal Package Totals Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 6.14 E-04 1.15 E-04 3 83 E-05 3.83 7.67 E-04 Weight (g) 1.41 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level 434 81 27 542 1000000 Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant PDIP 300 mils 20 85Sn15Pb No No Yes Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 8.24 E-01 4.70 E-02 4.70 E-02 1.88 E-02 2.82 E-03 9.40 E-01 Homogeneous Material Level Percentage (%) PPM 87.7 877000 5.0 50000 5.0 50000 2.0 20000 0.3 3000 100 1000000 Component Level Percentage (%) PPM 58.30 582962 3.32 33236 3.32 33236 1.33 13294 0.20 1994 66.47 664723 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 1000000 100.00 Component Level Percentage (%) PPM 30.43 304309 0.71 7108 0.04 394 0.01 76 31.19 311886 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.07 652 Homogeneous Material Level Percentage (%) PPM 85.0 850000 15.0 150000 100.0 1000000 Component Level Percentage (%) PPM 1.33 0.23 1.56 13260 2340 15600 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.02 174 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.64 6422 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.04 0.01 0.00 0.05 434 81 27 542 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 4.30 E-01 1.00 E-02 5.57 E-04 1.07 E-04 4.41 E-01 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 9.21 E-04 External Leadframe Plating Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# Weight (g) 7440-31-5 7439-92-1 1.87 E-02 3.31 E-03 2.21 E-02 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 2.46 E-04 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 9.08 E-03 Die Attach Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 6.14 E-04 1.15 E-04 3.83 E-05 7.67 E-04 Weight (g) 1.41 E+00 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000