Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish Ball Size MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant CSPBGA 12 X 12 184 SnAgCu 0.45 MS011817B Yes Yes Yes Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.53 E-01 1.06 E-02 1.06 E-02 2.66 E-03 5.31 E-04 1.77 E-01 Substance CAS# Weight (g) Pre-preg Filler Pre-preg Resin Pre-preg Glass Cloth Core Glass Cloth Copper Foil Core Resin Core Filler Laminate Core Subtotal Barium Sulfate Epoxy Resin Dipropylene glycol monomethyl ether Solvent naphta (petroleum), Heavy arom Talc Morpholine Derivatives Silica Soldermask Subtotal Copper Nickel Gold Proprietary 7328-97-4 65997-17-3 65997-17-3 7440-50-8 Proprietary 7631-86-9 1.73 E-02 2.59 E-02 1.44 E-02 8.64 E-03 2.25 E-02 6.47 E-03 5.63 E-03 1.01 E-01 4.36 E-03 2.13 E-03 2.22 E-03 9.12 E-05 3.83 E-04 3.83 E-04 9.12 E-05 9.66 E-03 6.95 E-02 2.22 E-03 1.64 E-04 1.82 E-01 Substance CAS# Weight (g) 7440-31-5 7440-22-4 7440-50-8 6.28 E-02 1.95 E-03 3.25 E-04 6.51 E-02 CAS# Weight (g) 7440-57-5 2.83 E-03 Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Homogeneous Material Level Percentage (%) PPM 862000 86.20 60000 6.00 60000 6.00 15000 1.50 3000 0.30 100.00 1000000 Component Level Percentage (%) 34.83 2.42 2.42 0.61 0.12 40.40 PPM 348268 24241 24241 6060 1212 404023 Laminate Description Other inorganic materials Thermoset Composite Composite Copper & its alloys Thermoset Other inorganic materials Thermoset Other organic materials Other organic materials Other inorganic materials Other organic materials Other inorganic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal 7727-43-7 85954-11-6 34590-94-8 64742-94-5 14807-96-6 Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Homogeneous Material Level PPM Percentage (%) 94800 9.48 14.22 79000 7.90 4.74 47400 123200 12.32 3.55 35500 3.09 30900 410800 55.30 2.39 23900 1.17 11700 1.22 12200 0.05 500 0.21 2100 0.21 2100 0.05 500 5.30 53000 38.09 380900 1.22 12200 0.09 900 100.00 857800 Component Level Percentage (%) 3.94 PPM 39443 32869 19721 51259 14770 12856 170918 9944 4868 5076 208 874 874 208 22051 158478 5076 374 356898 3.29 1.97 5.13 1.48 1.29 17.09 0.99 0.49 0.51 0.02 0.09 0.09 0.02 2.21 15.85 0.51 0.04 35.69 Solder Ball Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Homogeneous Material Level PPM Percentage (%) 965000 96.50 30000 3.00 5000 0.50 100.0 1000000 Percentage (%) 14.32 0.45 0.07 14.84 Component Level Homogeneous Material Level PPM Percentage (%) 100.0 1000000 Percentage (%) 0.65 Homogeneous Material Level PPM Percentage (%) 100.0 1000000 Percentage (%) 2.33 Homogeneous Material Level PPM Percentage (%) 48.30 483000 31.25 312500 8.52 85200 8.52 85200 3.41 34100 100.00 1000000 Percentage (%) 0.08 0.05 0.01 0.01 0.01 0.17 PPM Percentage (%) 94.08 PPM PPM 143248 4453 742 148444 Bond Wires Substance Description Precious metals Gold Component Level PPM 6451 Chip Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 1.02 E-02 Component Level PPM 23273 Die Attach Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Package Totals Substance Silicon dioxide Bismaleimide monomer Acrylate monomer Epoxy resin Acryric resin CAS# Weight (g) 60676-86-0 TS #10049 TS #10050 TS #10042 TS #10051 3.70 E-04 2.39 E-04 6.53 E-05 6.53 E-05 2.61 E-05 7.66 E-04 Weight (g) 4.38 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level 844 546 149 149 60 1748 940836