Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TQFP 7 X 7 X 1.0 64 100 Sn MS010619B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 88.00 11.50 0.50 100.00 880000 115000 5000 1000000 43.01 5.62 0.24 48.88 1.25E-01 1.64E-02 7.11E-04 1.42 E-01 PPM 430144 56212 2444 488801 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 35.02 0.84 0.04 0.01 35.92 1.02 E-01 2.46 E-03 1.25 E-04 3.14 E-05 1.05 E-01 PPM 350241 8442 431 108 359221 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.31 9.14 E-04 PPM 3140 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 6.23 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.14 PPM 21422 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 2.56 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.88 PPM 8792 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 2.95 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 10.15 PPM 101528 Die Attach Component Level Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Package Totals Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Weight (g) 3.66 E-03 3.66 E-04 3.66 E-04 1.46 E-04 1.46 E-04 1.46 E-04 1.46 E-04 4.97 E-03 Weight (g) 2.91 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 1.26 0.13 0.13 0.05 0.05 0.05 0.05 1.71 Percentage (%) 100 PPM 12572 1257 1257 503 503 503 503 17096 PPM 1000000