Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal LFCSP 3 X 3 X 0.85 16 Halide-free, Pb-free Molding Compound % of Compound 86.9 12.8 0.3 Weight (g) 5.77 E-03 8.48 E-04 2.06 E-05 6.64 E-03 PPM 331321 48720 1182 381223 Weight (g) 8.91 E-03 2.15 E-04 1.10 E-05 2.74 E-06 9.14 E-03 PPM 511859 12351 632 157 525000 Internal Leadframe Plating % of Plating 100 Weight (g) 1.78 E-04 PPM 10226 Sn External Leadframe Plating % of Plating 100 Weight (g) 1.11 E-04 PPM 6377 Au Bond Wires % of Wire 99.99 Weight (g) 1.99 E-04 PPM 11432 Si Chip % of Chip 100 Weight (g) 9.71 E-04 PPM 55782 Weight (g) 1.27 E-04 3.18 E-05 4.77 E-06 4.77 E-06 4.77 E-06 1.73 E-04 PPM 7312 1828 274 274 274 9961 Item Cu Fe Zn P Ag Item Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Package Totals Weight (g) PPM 1000000 1.74 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option LFCSP 3 X 3 X 0.85 16 Halide-free, Sn/Pb Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal Molding Compound % of Compound 86.9 12.8 0.3 Cu Fe Zn P Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Ag Internal Leadframe Plating % of Plating 100 Item Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Weight (g) 5.77 E-03 8.48 E-04 2.06 E-05 6.64 E-03 PPM 331330 48722 1182 381234 Weight (g) 8.91 E-03 2.15 E-04 1.10 E-05 2.74 E-06 9.14 E-03 PPM 511874 12352 632 157 525015 Weight (g) 1.78 E-04 PPM 10226 Weight (g) 9.39 E-05 1.66 E-05 1.11 E-04 PPM Bond Wires % of Wire 99.99 Weight (g) 1.99 E-04 PPM 11432 Si Chip % of Chip 100 Weight (g) 9.71 E-04 PPM 55783 Weight (g) 1.27 E-04 3.18 E-05 4.77 E-06 4.77 E-06 4.77 E-06 1.73 E-04 PPM Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. 5394 954 6348 Au Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 7312 1828 274 274 274 9962 Package Totals Weight (g) PPM 1000000 1.74 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary