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Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LGA - ADIS16203
16
Au
Materials Declaration
PWB
Description
Composite
Substance
PCB
CAS#
Weight (g)
Proprietary
9.42 E-02
Homogeneous Material Level
Percentage (%)
PPM
100.00
1000000
Percentage (%)
15.08
Component Level
Homogeneous Material Level
PPM
Percentage (%)
100.00
1000000
Percentage (%)
7.39
Homogeneous Material Level
PPM
Percentage (%)
950000
95.00
50000
5.00
100.0
1000000
Percentage (%)
11.20
0.59
11.79
Homogeneous Material Level
PPM
Percentage (%)
100.0
1000000
Percentage (%)
5.58
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
6.28
Homogeneous Material Level
PPM
Percentage (%)
49.90
499000
Percentage (%)
0.09
PPM
150833
Board Frame
Description
Composite
Substance
Board Frame
CAS#
Weight (g)
Proprietary
4.61 E-02
Component Level
PPM
73855
Solder Paste
Substance
Description
Tin and its alloys
Tin and its alloys
Subtotal
Tin
Antimony
CAS#
Weight (g)
7440-31-5
7440-36-0
6.99 E-02
3.68 E-03
7.36 E-02
CAS#
Weight (g)
7440-21-3
3.48 E-02
Component Level
PPM
112015
5896
117911
Chip
Description
Inorganic silicon
Substance
Doped Silicon
Component Level
PPM
55783
Bond Wires
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440-57-5
3.92 E-02
Component Level
PPM
62832
Die Attach
Description
Substance
Component Level
CAS#
Weight (g)
Other inorganic materials
Silicon Dioxide
14808-60-7
5.39 E-04
Organic materials
Reaction product: bisphenol-F(epichlorhydrin); epoxy resin (number
average molecular weight <= 700)
9003-36-5
2.16 E-04
20.00
200000
0.03
346
Organic materials
Others
Glass
1,4-bis(2,3-epoxypropoxy)butane
Aromatic Amine
Glass
2425-79-8
Proprietary
65997-17-3
2.16 E-04
5.40 E-05
5.40 E-05
20.00
5.00
5.00
200000
50000
50000
0.03
0.01
0.009
346
87
87
Organic materials
Reaction product: bisphenol-A(epichlorhydrin); epoxy resin (number
average molecular weight <= 700)
25068-38-6
1.08 E-06
0.10
1000
0.0002
1.08 E-03
100.00
1000000
0.17
Subtotal
PPM
863
2
1730
Underfill
Description
Substance
CAS#
Weight (g)
Homogeneous Material Level
PPM
Percentage (%)
73.40
260395
15.00
53214
7.50
26607
Component Level
Percentage (%)
3.07
0.63
0.31
PPM
Other Inorganic materials
Other organic materials
Other organic materials
Silica
hexahydromethylphthalic anhydride
1,6-Naphthalenediol diglycidyl ether
60676-86-0
25550-51-0
27610-48-6
1.92 E-02
3.92 E-03
1.96 E-03
Other organic materials
Bisphenol-A epichlorhydrin resin MW
<= 700
25068-38-6
7.83 E-04
3.00
10643
0.13
1255
Other organic materials
4,4'-Methylene diphenyl diglycidyl
ether
1675-54-3
1.44 E-04
0.55
1951
0.02
230
Other organic materials
Bisphenol-F epichlorhydrin resin;
MW<700
9003-36-5
1.44 E-04
0.55
1951
0.02
230
2.61 E-02
100.0
1000000
4.18
41830
Subtotal
30703
6275
3137
Label
Description
Other organic materials
Others
Other organic materials
Others
Subtotal
Substance
Static Dissipative Adhesive
Topcoat Mixture
Polyimide Film
Primer Mixture
Homogeneous Material Level
Percentage (%)
PPM
506500
50.65
236000
23.60
204500
20.45
53000
5.30
100.0
1000000
Percentage (%)
9.18
4.28
3.71
0.96
18.12
Component Level
Homogeneous Material Level
PPM
Percentage (%)
Percentage (%)
CAS#
Weight (g)
Proprietary
Proprietary
Proprietary
Proprietary
5.73 E-02
2.67 E-02
2.31 E-02
5.99 E-03
1.13 E-01
CAS#
Weight (g)
1304-28-5
13463-67-7
Proprietary
1.56 E-02
7.82 E-03
2.61 E-03
2.61 E-02
60.00
30.00
10.00
100.00
600000
300000
100000
1000000
2.51
1.25
0.42
4.18
25071
12535
4178
41785
7440-50-8
5.96 E-03
100.00
1000000
0.95
9542
7631-86-9
1303-86-2
5.29 E-04
1.32 E-04
6.62 E-04
4.37 E-03
7.26 E-04
3.78 E-02
80.00
20.00
100.00
100.00
100.00
800000
200000
1000000
167702
27835
0.08
0.02
0.11
0.70
0.12
6.06
848
212
1060
7007
1163
60558
PPM
91774
42761
37054
9603
181192
Capacitor 1
Description
Ceramics
Ceramics
Ceramics
Copper and its alloys
Glass
Glass
Nickel and its alloys
Tin and its alloys
Subtotal
Substance
Ceramic
Barium oxide
Titanium dioxide
Misc
Subtotal
Outer Electrode
Copper
Silicon dioxide
Diboron trioxide
Subtotal
Nickel
Tin
7440-02-0
7440-31-5
Component Level
PPM
LCC Package
Description
Ceramics
Ceramics
Ceramics
Ceramics
Ceramics
Subtotal
Other inorganic materials
Nickel & its alloys
Precious metals
Subtotal
Precious metals
Nickel & its alloys
Subtotal
Tin & its alloys
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Aluminum & its alloys
Aluminum & its alloys
Subtotal
Polymer
Other inorganic materials
Subtotal
Substance
Homogeneous Material Level
Percentage (%)
PPM
Component Level
CAS#
Weight (g)
Ceramic Base
Alumina
Chromium oxide
Silicon dioxide
Titanium dioxide
Molybdenum
1344-28-1
1308-38-9
7631-86-9
13463-67-7
7439-98-7
9.70 E-02
4.09 E-03
3.80 E-03
1.05 E-03
2.76 E-04
1.06 E-01
91.32
3.85
3.58
0.99
0.26
100.00
913200
38500
35800
9900
2600
1000000
15.54
0.66
0.61
0.17
0.04
17.01
155370
6550
6091
1684
442
170138
Terminals
Tungsten
Nickel
Gold
7440-33-7
7440-02-0
7440-57-5
9.11 E-03
1.17 E-03
6.26 E-04
1.09 E-02
83.55
10.71
5.74
100.00
835500
107100
57400
1000000
1.46
0.19
0.10
1.75
14590
1870
1002
17462
Metal Lid
Iron
Nickel
7439-89-6
7440-02-0
1.46 E-02
1.06 E-02
2.52 E-02
58.0
42.0
100.0
579900
420100
1000000
2.34
1.70
4.04
23421
16967
40388
Solder Seal
Lead
Tin
Silver
Indium
7439-92-1
7440-31-5
7440-22-4
7440-74-6
2.01 E-03
1.39 E-04
2.79 E-05
2.77 E-05
2.20 E-03
91.14
6.33
1.27
1.26
100.0
911400
63300
12700
12600
1000000
0.32
0.02
0.00
0.00
0.35
3212
223
45
44
3525
Bond Wires
Aluminum
Silicon
7429-90-5
7440-21-3
3.00 E-05
3.03 E-07
3.03 E-05
99.0
1.0
100.0
990000
10000
1000000
0.00
0.0000
0.00
Die Attach
Polymer
Chip
Doped Silicon
Percentage (%)
PPM
48
0
49
Proprietary
3.29 E-03
100
1000000
0.53
5263
7440-21-3
6.00 E-03
1.54 E-01
100
1000000
0.96
24.64
9612
246436
CAS#
Weight (g)
Ceramics
Aluminum oxide ; Alumina; Corundum;
Silica; Silicon dioxide
Magnesium oxide
Calcium oxide
1344-28-1
7631-86-9
1309-48-4
1305-78-8
1.33 E-03
2.90 E-05
1.38 E-05
4.14 E-06
1.38 E-03
96.60
2.10
1.00
0.30
100.00
966000
21000
10000
3000
1000000
0.21
0.00
0.002
0.001
0.22
Top Terminal
Silver
Palladium
Lead(II) oxide; Lead oxide (PbO); C.I.
Silica; Silicon dioxide
7440-22-4
7440-05-3
1317-36-8
7631-86-9
1.69 E-05
1.22 E-06
2.40 E-07
1.59 E-07
1.85 E-05
91.23
6.61
1.30
0.86
100.00
912300
66100
13000
8600
1000000
0.00270
0.00020
0.00004
0.00003
0.00296
27
2
0.4
0.3
30
Bottom Terminal
Silver
Lead(II) oxide; Lead oxide (PbO); C.I.
Silica; Silicon dioxide
7440-22-4
1317-36-8
7631-86-9
2.33 E-05
3.60 E-07
2.40 E-07
2.39 E-05
97.49
1.50
1.00
100.00
974937
15038
10025
1000000
0.00374
0.00006
0.00004
0.00384
37
1
0.4
38
Resistive Element
Ruthenium(IV) oxide
Lead(II) oxide; Lead oxide (PbO); C.I.
Silica; Silicon dioxide
Boron oxide
Manganese dioxide
12036-10-1
1317-36-8
7631-86-9
1303-86-2
1313-13-9
7.56 E-06
4.87 E-06
3.53 E-06
1.25 E-06
4.25 E-07
1.76 E-05
42.88
27.60
20.00
7.11
2.41
100.00
428800
276000
200000
71100
24100
1000000
0.00121
0.00078
0.00057
0.00020
0.00007
0.00283
12
8
6
2
1
28
First Protective Coating
Lead(II) oxide; Lead oxide (PbO); C.I.
Silica; Silicon dioxide
Boron oxide
Zinc oxide
Chromium(III) oxide; Pigment green 17
1317-36-8
7631-86-9
1303-86-2
1314-13-2
1308-38-9
9.70 E-06
4.52 E-06
2.28 E-06
7.41 E-07
4.07 E-07
1.76 E-05
54.97
25.61
12.91
4.20
2.31
100.00
549700
256100
129100
42000
23100
1000000
0.00155
0.00072
0.00036
0.00012
0.00007
0.00283
16
7
4
1
1
28
Second Protective Coating
Epichlorohydrin, o-cresol, formaldehyde
Silicon dioxide
Carbon black
29690-82-2
7631-86-9
1333-86-4
1.93 E-05
6.43 E-06
2.23 E-06
2.79 E-05
68.99
23.01
8.00
100.00
689900
230100
80000
1000000
0.00309
0.00103
0.00036
0.00
31
10
4
45
Side Terminal
Bisphenol A, epichlorohydrin polymer;
Silver
Carbon black
25068-38-6
7440-22-4
1333-86-4
7.25 E-05
7.25 E-05
1.45 E-05
1.60 E-04
45.45
45.45
9.10
100.00
454511
454474
91015
1000000
0.01162
0.01162
0.00233
0.03
116
116
23
256
7440-02-0
1.29 E-04
100.00
1000000
0.02067
207
7440-31-5
1.20 E-04
100.00
1000000
0.01922
192
0.30347
3035
Resistor
Description
Ceramics
Ceramics
Ceramics
Ceramics
Subtotal
Precious metals
Precious metals
Glass
Glass
Subtotal
Precious metals
Glass
Glass
Subtotal
Glass
Glass
Glass
Glass
Glass
Subtotal
Glass
Glass
Glass
Glass
Glass
Subtotal
Other organic materials
Other inorganic materials
Other inorganic materials
Subtotal
Other organic materials
Precious metals
Other inorganic materials
Subtotal
Nickel and its alloys
Tin and its alloys
Subtotal
Substance
Middle Terminal
Nickel
Outer Terminal
Tin
1.89 E-03
Homogeneous Material Level
PPM
Percentage (%)
Component Level
Percentage (%)
PPM
2136
46
22
7
2211
Capacitor 2
Description
Ceramics
Copper and its alloys
Nickel and its alloys
Tin and its alloys
Others
Subtotal
Package Totals
Substance
Barium Titanate
Copper
Nickel
Tin
Others
CAS#
Weight (g)
12047-27-7
7440-50-8
7440-02-0
7440-31-5
Proprietary
1.10 E-03
8.00 E-04
5.00 E-04
6.00 E-05
4.00 E-05
2.50 E-03
Weight (g)
6.24 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Homogeneous Material Level
Percentage (%)
PPM
440000
44.00
320000
32.00
200000
20.00
24000
2.40
16000
1.60
1000000
100.00
Component Level
Percentage (%)
0.18
0.13
0.08
0.01
0.01
0.40
PPM
Percentage (%)
100.00
PPM
1762
1282
801
96
64
4005
1000000