View detail for Atmel AT11009: Migration from ATxmega64D3/128D3/192D3/256D3 Revision E to Revision I

APPLICATION NOTE
AT11009: Migration from ATxmega64D3/128D3/192D3/256D3
Revision E to Revision I
Atmel AVR XMEGA
Introduction
This application note lists out the differences and changes between Revision E
and Revision I of ATxmega64D3/128D3/192D3/256D3 devices.
For complete device details, always refer to the most recent version of the
®
ATxmega64D3/128D3/192D3/256D3 datasheet and the Atmel XMEGA D
manual. Errata differences are not listed in this document, only in the device
datasheet.
In addition to the differences described in this document, other typical
characteristics could be different. Check the latest datasheets for details. The new
configuration options and functions available in Revision I of
ATxmega64D3/128D3/192D3/256D3 are a superset of existing functions, and this
means that existing code for these revisions will work on the new revision without
changing existing configurations or enabling new functions. The new options and
functions are still listed in this application note for customers, who wish to consider
using new functions, in addition to the migration process.
Features
• Enhancements and added functions
• Memories
• System clock and clock options
• Reset system
• I/O ports
• Registers
• Changes in electrical characteristics
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1
Enhancements and Added Functions
In this chapter, we summarize the list of enhancements or added features available in Revision I.
1.1
Clock System
•
•
•
•
•
•
Alternate pin location for TOSC1 and TOSC2 pins for 32.768kHz crystal connection on devices with shared
TOSC and XTAL location
A divide-by-two option for the PLL output that enables output frequency down to 10MHz
PLL lock failure detection with optionally Non-Maskable Interrupt (NMI), for improved safety and
robustness
Non-prescaled Real Time Counter clock source options: External clock from TOSC1, 32.768kHz from
TOSC, and the 32.768kHz from the 32.768kHz Internal Oscillator
Higher drive option for external crystal oscillator to support crystals with higher load
The 32MHz Internal Oscillator can be tuned to run at any frequency between 30MHz and 55MHz
1.2
I/O Ports
1.3
Two-wire Interface
1.4
Analog to Digital Converter
1.5
Analog Comparator
1.6
CRC16/CRC32 Generator
1.7
16-bit Timer/Counter 0
1.8
High Resolution Extension
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Alternate pin locations for Timer/Counter 0 Compare Channels, USART0, and SPI
Alternate pin locations for the Peripheral Clock and Event output functions
The Real Time Counter clock can be output to a port pin
Any Event Channel can be output to a port pin
The SDA Hold time can be increased and configured in order to be SMBUS compliant
Automatic input channel scan
VCC/2 voltage reference option
1/2x (divide-by-two) gain stage setting
Internal Ground can be used as negative input in differential mode with and without gain
Sample time is configurable
Analog Comparator 1 can be output on a port pin
A constant current source
®
A CRC16/CRC32 Generator Module that supports CRC16 (RC-CCITT) and CRC-32 (IEEE 802.3)
Split mode that enables two 8-bit Timer/Counters with four PWM channels each
Hi-Res+ option to allow PWM resolution to be increased with 8x (3-bit).
1.9
Power Management
Possibility to enable sequential start of the components used for analog modules ADC and Analog Comparator in
order to reduce start-up current.
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Memories
2.1
NVM Controller
For Atmel ATxmega64D3/128D3/192D3/256D3 Revision E devices, the chip erase time is about 40ms. The chip
erase time of ATxmega64D3/128D3/192D3/256D3 Revision I is longer.
The typical chip erase time of ATxmega64D3/128D3/192D3/256D3 Revision I devices are in Table 2-1.
Table 2-1.
ATxmega64D3/128D3/192D3/256D3 Revision I Chip Erase Time
Product
Flash and Boot Code Size
Chip Erase Time
ATxmega64D3
64KB + 4KB
55ms
ATxmega128D3
128KB + 8KB
75ms
ATxmega192D3
192KB + 8KB
90ms
ATxmega256D3
256KB + 8KB
105ms
To ensure that the flash chip erase is finished correctly, no flash access should be done during the chip erase
time.
In the user code, it is always needed to check the FBUSY bit in the Non-Volatile Memory Status Register to see
when the chip erase is finished.
CRC32 is automatically used instead of existing CRC module if the new CRC16/CRC32 module is enabled.
There are no changes in the commands.
2.2
Fuses and Lock Bits
BOD levels are different in ATxmega64D3/128D3/192D3/256D3 Revision I. Refer Section 4.1 Brown-out
Detection for detailed information.
3
System Clock and Clock Options
3.1
Clock Failure
The PLLDFIF flag, indicating if the PLL looses lock, is no longer automatically cleared, but must be done from
software.
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4
Reset System
4.1
Brown-out Detection
The programmable BODLEVEL settings are different in ATxmega64D3/128D3/192D3/256D3 Revision I. See
Table 4-1 for details. Refer to the device datasheet regarding tolerance for the brown-out levels.
Table 4-1.
Brown-out Levels
VBOT – Revision E
VBOT – Revision I
BOD LEVEL
Minimum
Typical
Maximum
Minimum
Typical
Maximum
111
1.62
1.63V
1.7
1.4
1.6V
1.7
110
1.9V
1.8V
101
2.17V
2.0V
100
2.43V
2.2V
011
2.68V
2.4V
010
2.96V
2.6V
001
3.22V
2.8V
000
3.49V
3.0V
Until Revision E, the BOD is forced on for all Non-Volatile Memory (NVM) programming. In the new Revision I,
the BOD is forced on only during chip erase and when the PDI is enabled. For other NVM programming
operations, the POR threshold voltage (VPOT+) is the limit for aborting.
5
I/O Ports
The I/O port pins are LV-TTL and LVCOMS compatible for ATxmega64D3/128D3/192D3/256D3 Revision I. The
minimum “Input High Voltage” is never higher than 2.0V for VCC > 2.7V.
In the Atmel ATxmega64D3/128D3/192D3/256D3 revision E, the minimum “Input High Voltage” is 0.7 VCC, and
could be higher than 2.0V for VCC > 2.86V.
5.1
I/O Pin Behavior when Disabling TX in USART
When the transmitter is disabled in USART peripheral, it will no longer override the TxDn pin, and the pin
direction is set as input automatically by hardware, even if it was configured as output by the user. This behavior
as mentioned in the XMEGA D Manual is valid after Revision E. In the older revision the pin direction does not get
changed to input automatically.
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Registers
6.1
Added Registers and Bits
Table 6-1 lists the registers and bits, which are added in ATxmega64D3/128D3/192D3/256D3 Revision I.
Table 6-1.
Register Bits and Functionality added in the ATxmega64D3/128D3/192D3/256D3 Revision I
Register Name
Bit
Function
SAMPCTRL
Bit[5:0] - SAMPVAL[5:0]
Sampling time control register
The SAMPVAL bits control the ADC sampling time in number of half ADC prescaled clock cycles (depends on
ADC_PRESCALER value), thus controlling the ADC input impedance. Sampling time is set according to the
formula:
Sampling time = (SAMPVAL+1)*(ClkADC/2)
6.2
Removed Registers and Bits
Table 6-2 lists the registers and bits, which exist in Atmel ATxmega64D3/128D3/192D3/256D3 Revision E but
not in ATxmega64D3/128D3/192D3/256D3 Revision I.
Table 6-2.
6.3
Register Bits and Functionality that does not exist in ATxmega64D3/128D3/192D3/256D3 Revision I
Register Name
Bit
Function
COMP0
COMP[7:0]
Oscillator Compare Register 0
CALH Register not Applicable
For the ATxmega64D3/128D3/192D3/256D3 Revision I, CALH is not applicable hence it cannot be written.
When read, the CALH register will return zero. This new design ATxmega64D3/128D3/192D3/256D3 ADC
requires only one calibration byte (only 8 bit value, not 12 bit value). For coding compatibility, dependent registers
like CALH, CALL, ADC CAL0, and ADC CAL1 has been kept same as the older design.
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6.4
MUXNEG Configuration in ADC Channel MUX Control Register
In Revision E of ATxmega64D3/128D3/192D3/256D3 devices, Bit 2 of the MUXNEG configuration in ADC
Channel MUX Control registers is reserved. This bit is now available for configuration in Revision I.
Below is the configuration available in the older and later revisions:
Revision E:
Bit
7
+0x01
-
Read/Write
R
R/W
R/W
R/W
R/W
R
R/W
R/W
Initial Value
0
0
0
0
0
0
0
0
Table 6-3.
Table 6-4.
6
6
5
4
3
MUXPOS[3:0]
2
1
-
0
MUXNEG[1:0]
MUXCTRL
ADC MUXNEG Configuration, INPUTMODE[1:0] = 10, Differential without Gain
MUXNEG[1:0]
Group Configuration
Analog Input
00
PIN0
ADC0 pin
01
PIN1
ADC1 pin
10
PIN2
ADC2 pin
11
PIN3
ADC3 pin
ADC MUXNEG Configuration, INPUTMODE[1:0] = 11, Differential with Gain
MUXNEG[1:0]
Group Configuration
Analog Input
00
PIN4
ADC4 pin
01
PIN5
ADC5 pin
10
PIN6
ADC6 pin
11
PIN7
ADC7 pin
AT11009: Migration from ATxmega64D3/128D3/192D3/256D3 Revision E to Revision I
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Revision I:
Bit
7
+0x01
-
Read/Write
R
R/W
R/W
R/W
R/W
R
R/W
R/W
Initial Value
0
0
0
0
0
0
0
0
Table 6-5.
Table 6-6.
6
5
4
3
2
MUXPOS[3:0]
1
0
MUXNEG[2:0]
ADC MUXNEG Configuration, INPUTMODE[1:0] = 10, Differential without Gain
MUXNEG[2:0]
Group Configuration
Analog Input
000
PIN0
ADC0 pin
001
PIN1
ADC1 pin
010
PIN2
ADC2 pin
011
PIN3
ADC3 pin
100
-
Reserved
101
GND
PAD ground
110
-
Reserved
111
INTGND
Internal ground
ADC MUXNEG Configuration, INPUTMODE[1:0] = 11, Differential with Gain
MUXNEG[2:0]
Group Configuration
Analog Input
000
PIN4
ADC4 pin
001
PIN5
ADC5 pin
010
PIN6
ADC6 pin
011
PIN7
ADC7 pin
100
INTGND
Initial ground
101
-
Reserved
110
-
Reserved
111
GND
PAD ground
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7
Changes in Electrical Characteristics
7.1
Reduced Current Consumption in Active and Idle Mode
Table 7-1 trough Table 7-4 list the typical and maximum current consumption details in Revision E and Revision
I devices.
Table 7-1.
Current Consumption Details of ATxmega64D3
Revision E
Parameter
Condition
32kHz, ext. clk.
Active power
consumption
1MHz, ext. clk.
2MHz, ext. clk.
Min.
Reset power
consumption
8
Typ.
Max.
25
50
VCC = 3.0V
71
130
VCC = 1.8V
317
215
VCC = 3.0V
697
475
VCC = 1.8V
613
800
445
600
VCC = 3.0V
1.3
1.8
0.95
1.5
15.7
18
7.8
12
2.8
VCC = 3.0V
6.9
3
VCC = 1.8V
112
46
VCC = 3.0V
215
92
VCC = 1.8V
224
350
93
225
430
650
184
350
32MHz, ext. clk.
6.9
8
2.9
5
T = 25°C
0.1
3
0.07
1
1.75
5
1.3
5
WDT and sampled BOD
enabled, T = 25°C
1
6
1.4
2
WDT and sampled BOD
enabled, T = 85°C
2.7
10
2.6
6
1MHz, ext. clk.
T = 85°C
VCC = 3.0V
VCC = 1.8V
0.5
1.7
VCC = 3.0V
0.7
1.8
RTC from 1.024kHz low
power 32.768kHz TOSC,
T = 25°C
VCC = 1.8V
0.5
4
0.5
2
VCC = 3.0V
0.7
4
0.7
2
RTC from low power
32.768kHz TOSC,
T = 25°C
VCC = 1.8V
na
na
0.9
3
VCC = 3.0V
1.16
na
1.2
3
VCC = 3.0V
1300
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mA
µA
RTC from ULP clock,
WDT and sampled BOD
enabled, T = 25°C
Current through RESET
pin subtracted
Units
µA
3.6
2MHz, ext. clk.
Power-save
power consumption
Min.
VCC = 1.8V
32kHz, ext. clk.
Power-down
power consumption
Max.
VCC = 1.8V
32MHz, ext. clk.
Idle power consumption
Typ.
Revision I
mA
µA
Table 7-2.
Current Consumption Details of ATxmega128D3
Revision E
Parameter
Condition
32kHz, ext. clk.
1MHz, ext. clk.
Active power
consumption
2MHz, ext. clk.
Min.
Max.
25
55
VCC = 3.0V
71
135
VCC = 1.8V
317
237
VCC = 3.0V
697
515
VCC = 1.8V
613
800
425
700
VCC = 3.0V
1.3
1.8
0.9
1.5
15.7
18
8.3
12
VCC = 3.0V
6.9
3.1
VCC = 1.8V
112
47
VCC = 3.0V
215
95
VCC = 1.8V
224
350
94
200
430
650
190
400
32MHz, ext. clk.
6.9
8
3
7
T = 25°C
0.1
3
0.1
1
1.75
5
1.9
4
WDT and sampled BOD
enabled, T = 25°C
1
6
1.5
2
WDT and sampled BOD
enabled, T = 85°C
2.7
10
3
8
T = 85°C
VCC = 3.0V
mA
µA
RTC from ULP clock,
WDT and sampled BOD
enabled, T = 25°C
VCC = 1.8V
0.5
1.3
VCC = 3.0V
0.7
1.4
RTC from 1.024kHz low
power 32.768kHz TOSC,
T = 25°C
VCC = 1.8V
0.5
4
0.7
2
VCC = 3.0V
0.7
4
0.8
2
RTC from low power
32.768kHz TOSC,
T = 25°C
VCC = 1.8V
na
na
0.9
3
VCC = 3.0V
1.16
na
1.1
3
VCC = 3.0V
1300
Current through RESET
pin subtracted
Units
µA
2.8
2MHz, ext. clk.
Reset power
consumption
Typ.
3.6
1MHz, ext. clk.
Power-save
power consumption
Min.
VCC = 1.8V
32kHz, ext. clk.
Power-down
power consumption
Max.
VCC = 1.8V
32MHz, ext. clk.
Idle power consumption
Typ.
Revision I
mA
µA
145
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Table 7-3.
Current Consumption Details of ATxmega192D3
Revision E
Parameter
Condition
32kHz, ext. clk.
Active power
consumption
1MHz, ext. clk.
2MHz, ext. clk.
Min.
Reset power
consumption
10
Typ.
Max.
25
60
VCC = 3.0V
71
140
VCC = 1.8V
317
245
VCC = 3.0V
697
550
VCC = 1.8V
613
800
440
700
VCC = 3.0V
1.3
1.8
0.9
1.5
15.7
18
9
15
3
VCC = 3.0V
6.9
3.5
VCC = 1.8V
112
55
VCC = 3.0V
215
110
VCC = 1.8V
224
350
105
350
430
650
215
650
32MHz, ext. clk.
6.9
8
3.4
8
T = 25°C
0.1
3
0.1
1
1.75
5
3.5
6
WDT and sampled BOD
enabled, T = 25°C
1
6
1.5
2
WDT and sampled BOD
enabled, T = 85°C
2.7
10
5.8
10
1MHz, ext. clk.
T = 85°C
VCC = 3.0V
VCC = 1.8V
0.5
1.3
VCC = 3.0V
0.7
1.4
RTC from 1.024kHz low
power 32.768kHz TOSC,
T = 25°C
VCC = 1.8V
0.5
4
0.7
2
VCC = 3.0V
0.7
4
0.8
2
RTC from low power
32.768kHz TOSC,
T = 25°C
VCC = 1.8V
na
na
0.9
3
VCC = 3.0V
1.16
na
1.1
3
VCC = 3.0V
1300
AT11009: Migration from ATxmega64D3/128D3/192D3/256D3 Revision E to Revision I
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mA
µA
RTC from ULP clock,
WDT and sampled BOD
enabled, T = 25°C
Current through RESET
pin subtracted
Units
µA
3.6
2MHz, ext. clk.
Power-save
power consumption
Min.
VCC = 1.8V
32kHz, ext. clk.
Power-down
power consumption
Max.
VCC = 1.8V
32MHz, ext. clk.
Idle power consumption
Typ.
Revision I
mA
µA
Table 7-4.
Current Consumption Details of ATxmega256D3
Revision E
Parameter
Condition
32kHz, ext. clk.
1MHz, ext. clk.
Active power
consumption
2MHz, ext. clk.
Min.
Max.
25
60
VCC = 3.0V
71
140
VCC = 1.8V
317
245
VCC = 3.0V
697
550
VCC = 1.8V
613
800
440
700
VCC = 3.0V
1.34
1.8
0.9
1.5
15.7
18
9
15
VCC = 3.0V
6.9
3.5
VCC = 1.8V
112
55
VCC = 3.0V
215
110
VCC = 1.8V
224
350
105
350
430
650
215
650
32MHz, ext. clk.
6.9
8
3.4
8
T = 25°C
0.1
3
0.1
1
1.75
5
3.5
6
WDT and sampled BOD
enabled, T = 25°C
1
6
1.5
2
WDT and sampled BOD
enabled, T = 85°C
2.7
10
5.8
10
T = 85°C
VCC = 3.0V
mA
µA
RTC from ULP clock,
WDT and sampled BOD
enabled, T = 25°C
VCC = 1.8V
0.5
1.3
VCC = 3.0V
0.7
1.4
RTC from 1.024kHz low
power 32.768kHz TOSC,
T = 25°C
VCC = 1.8V
0.5
4
0.7
2
VCC = 3.0V
0.7
4
0.8
2
RTC from low power
32.768kHz TOSC,
T = 25°C
VCC = 1.8V
na
na
0.9
3
VCC = 3.0V
1.16
na
1.1
3
VCC = 3.0V
1300
Current through RESET
pin subtracted
Units
µA
3
2MHz, ext. clk.
Reset power
consumption
Typ.
3.6
1MHz, ext. clk.
Power-save
power consumption
Min.
VCC = 1.8V
32kHz, ext. clk.
Power-down
power consumption
Max.
VCC = 1.8V
32MHz, ext. clk.
Idle power consumption
Typ.
Revision I
mA
µA
170
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7.2
Increased ADC Maximum Samples Rate
The maximum ADC clock frequency and sample rate is increased, as shown in Table 7-5.
Table 7-5.
Changes in ADC Parameters of ATxmega64D3/128D3/192D3/256D3 Devices
Revision E
7.3
Parameter
Min.
ADC clock frequency
ADC sample rates
Typ.
Revision I
Max.
Min.
na
1400
na
200
Typ.
Max.
Units
100
1800
kHz
16
300
kSPS
Typ.
Max.
Units
na
Reduced Analog Comparator Propagation Delay
The Analog Comparator propagation delay is reduced, as shown in Table 7-6 and Table 7-7.
Table 7-6.
Propagation Delay of Analog Comparator in ATxmega64D3/128D3/192D3/256D3
Revision E Devices
Revision E
Table 7-7.
Parameter
Condition
Min.
Propagation delay
VCC = 3.0V, T = 85°C
na
Propagation delay
VCC = 1.6 – 3.6V, T = 25°C
175
ns
Propagation Delay of Analog Comparator in ATxmega64D3/128D3/192D3/256D3
Revision I Devices
Revision I
Note:
7.4
1.
Parameter
Condition
Min.
Typ.
Propagation delay
VCC = 3.0V, T = 85°C
20
Propagation delay
VCC = 3.0V, T = 25°C
17
Max.
40
Units
(1)
ns
For ATxmega128D3, the value is 90ns.
32kHz Internal ULP Oscillator Frequency
The frequency of the 32kHz internal ULP oscillator is increased to match its nominal frequency with guaranteed
accuracy. Refer Table 7-8.
Table 7-8.
Changes in 32kHz Internal ULP Oscillator Frequency of ATxmega64D3/128D3/192D3/256D3 Devices
Revision E
Parameter
Condition
Min.
Factory calibrated frequency
Factory calibration accuracy
Accuracy
12
Typ.
Revision I
Max.
Min.
26
VCC = 3.0V, T = 85°C
Typ.
Max.
32
kHz
na
na
-12
12
na
na
-30
30
AT11009: Migration from ATxmega64D3/128D3/192D3/256D3 Revision E to Revision I
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Units
%
8
Revision History
Doc Rev.
Date
42403A
02/2015
Comments
Initial document release.
AT11009: Migration from ATxmega64D3/128D3/192D3/256D3 Revision E to Revision I
[APPLICATION NOTE]
Atmel-42403A-Migration-from-ATxmega64D3-128D3-192D3-256D3-RevisionE-to-RevisionI-ApplicationNote_AT11009_022015
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