View detail for Radiation Tolerant SRAM for SPACE Applications

ANM052
Radiation Tolerant SRAM for SPACE Applications
Introduction
The purpose of this document is to analyze the selection
criteria for memory chips to be used in Spacecraft
computers.
A general trend is to implement more autonomous
functions in Spacecraft, making use of increased
processor performances, but requiring larger embedded
flight software sizes and larger storage on board.
This note provides an introduction to the current
organization of European Spacecraft On-Board Data
Handling systems and identifies the criticality of
Spacecraft computer based functions.
It recalls the constraints on memory planes linked to the
Space environments, and gives examples of memory
banks designs for typical sizes.
In order to introduce the context of Space projects, the
following figure represents a logic flow diagram of a
typical Phase A /Phase B for a Spacecraft, where the most
important trade-offs in term of Data Handling
architecture and components selection have to be
performed.
Both Hardware and Software activities are represented,
due to a strong interaction of both designs necessary to
achieve the most appropriate processing system. Design
of current Spacecraft on board data handling subsystems.
Starting from an approved mission concept, the
Spacecraft has to be designed to meet a number of
operational and environmental constraints.
The software functions are then detailed to size more
precisely the necessary resources to fulfil the Spacecraft
mission, and an interactive work at subsystem level is
necessary to match hardware and software functions.
The Spacecraft design is then reviewed at system level to
check that it will meet the mission objectives, especially
taking into account Space environment.
Issues are then identified (mass, reliability, thermal
aspects...) and corrective actions taken as necessary for
each equipment or subsystem.
For that concern RAM banks, they have a particular
importance at system level, since they contain most of
flight software functions. Single event upsets have now
been identified since early 80s and corrective hardware
methods have been implemented to avoid catastrophic
effects. The main effect remains some degradation of the
Spacecraft availability, whose impacts on the mission
have to be assessed.
To summarize, the steps in the selection process for
memories in Space applications, are:
D
D
D
D
PRELIMINARY ARCHITECTURE
SIZING OF COMPUTER RESOURCES
ANALYSIS OF SEU EFFECTS ON MISSION
HARDENING STRATEGY
A preliminary On-Board Data Handling architecture is
defined, based on the experience gained by the industry,
with a parallel allocation of hardware and software
functions.
This phase A work relies on existing hardware,
re-utilization of standard functions and typical software
figures.
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ANM052
2
ORBIT
PARAMETERS
SPACECRAFT
FUNCTIONS
MISSION
INDUSTRY
PROCESSING
ARCHITECTURE
Existing
HARDWARE
AVAILABLE
COMPONENTS
ENVIRONMENT
MARGINS
COMPUTER
Function Allocation
RELIABILITY
AVAILABILITY
Preliminary SOFTWARE
definition
Preliminary HARDWARE definition
SOFTWARE functions
REPRESENTATION OF
RAM MEMORY TRADE OFF
LOGIC DURING A SPACECRAFT
PHASE A / PHASE B
FAULT
Estimate of
COMPUTING
POWER
Estimate of
RAM/ROM
SIZES
Estimate of total
RAM/ROM
SIZES
Input
ROM
Micro- RAM
Output processor memory memory
Theoretical RAM
UPSET RATES
Estimate of total
COMPUTING
POWER
MISSION
Impacts
Theoretical MICRO
UPSET RATES
ANALYSIS OF
COST IMPACTS
Microprocessor
frequency
HARDENING
POWER
STRATEGY
Rev. C (11 March 97)
DIMENSIONS
SELECTION OF
SOLUTION
HARDWARE &
SOFTWARE
UPDATES
ANM052
The following figure shows the most general architecture for a European Spacecraft:
TC
GROUND
CCSDS/PUS
Communication
Standards
Central
Terminal
Unit
TM
OBDH bus
Intelligent
Control
Unit
MACS bus
Remote
Terminal
Unit
1553 bus
ICU
RTU
ICU
A Central Terminal Unit interfaces with the
Telecommunication subsystem and drives the Spacecraft
bus on which terminals are computers (ICU for Intelligent
Computer Units dedicated to the management of an
instrument or to the Spacecraft Attitude and Orbit
Control) or acquisition Units (such as the RTU, remote
Terminal Units).
A certain level of standardization has been achieved in the
data transfer on-board and between the Ground and Flight
segments.
Communication systems for spacecraft follow the
recommendations of the CCSDS (Consultative
Committee for Space Data Systems). This ensures a
certain level of inter-operability between the main
International Space Organizations.
This architecture can be now considered as stable, with a
number of Space qualified ASICs supporting the
protocols.
The allocations of functions in a Spacecraft are also
almost standardized.
On-Board, data transfer buses are mainly the ESA
On-Board Data Handling (OBDH) standard or 1553 bus.
A specific bus for Attitude and Orbit Control subsystems
(MACS bus) is also used.
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ANM052
The functions are generally split according to the following hierarchy:
Table 1:
Location
Spacecraft Bus
Payload
Type of Computer
Typical Functions
Central Computer
Ground–Board interface
Operational sequences storage and execution
Telemetry storage during non visibility periods
Attitude and Orbit
Control Subsystem
Computer
Interface with the Central Computer
Spacecraft Manoeuvres execution
S/C attitude control laws
AOCS monitoring and re–configuration
Survival/safety mode attitude
Paymoad Controller
Interface with the Central Computer
Payload operational sequences storage and execution
Payload monitoring
Scientific Telemetry storage
Instrument processors
Signal or image processing
Data compression
Instrument or equipment activation or positioning control loops
As a general trend, data storage becomes more
decentralized, especially in the Payload controllers, due
to a change in the Telemetry system organization.
In previous systems, the TM bandwidth allocation used to
be fixed, the telemetry system was based on a cyclic
acquisition scheme within the Spacecraft.
Packet Telemetry systems nowadays allow a dynamic
bandwidth
allocation,
which
implies
storage
requirements for the computers generating the source
packets.
As a general trend for European Spacecraft, the
availability of Space qualified component in Europe for
the 90s should show the following type of computers.
Table 2:
Location
Spacecraft Bus
Payload
Type of Computer
Typical Components
Central Computer
Processor Mil Std 1750
(MAS 281, MA 31750...)
Memory 128 to 256 Kbytes
Attitude and Orbit
Control Subsystem
Computer
Processor Mil Std 1750
(MAS 281, MA 31750...)
Memory 128 Kbytes
Payload Computer
Processor Mil Std 1750
(MAS 281, MA 31750...)
Memory 128 Kbytes
Instrument
processors
Digital Signal Processors
Motorola 68xxx
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ANM052
A typical example of such a Spacecraft is the XMM
satellite, whose Data Handling Architecture should be
close to the following one:
These are current data, and one can predict the use of
RISCs for re-entry vehicles as well as Digital Signal
Processors for Guidance, Navigation and Control
associated with image processing. The following
computer configurations can be considered as typical for
space applications:
Table 3:
Microprocessor type
Selected chip
Memory size in Kbytes
8 bit microcontroller
Atmel WM 80C32Ε
64
16 bit microprocessor
MA 31750
256
32 bit RISC
Atmel WM TSC691E
1024
For what concerns the memory type selection, the
designer can select Rad Hard SRAMs or radiation tolerant
SRAMs which are available on the market.
The following diagram represents the availability of the
various technologies, along several years.
Memory integration
Technology
RH 6T
SRAM
RT 6T
SRAM
4T
SRAM
64K
256K
64K
256K
256K
1M
1M
90
91
4M
92
93
94
95
Time
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OPTICAL MONITOR
REFLECTION GRATING SPECTROMETER
MACS bus
DIGITAL PROCESSOR
UNIT
4 DSP 56001+local RAM+
Program memory +
11 Megabytes SRAM
DBU
Optical Monitor ICU
RGS DATA UNIT
RGS DATA UNIT
1750
MA 31750
48 Kword ROM
128 Kword RAM
MA 31750
48 Kword ROM
128 Kword RAM
512 Kword RAM
DBU
CENTRAL UNIT
DBU
DBU
Service
Module
RTU
AOCS
RTU
OBDH BUS
1750
48 Kword ROM
128 Kword RAM
DBU
ATTITUDE CONTROL
UNIT
1750
48 Kword ROM
128 Kword RAM
MACS bus
Rev. C (11 March 97)
DBU
DBU
EPIC Data Handling Unit
EPIC Data Handling Unit
EDHU
EDHU
1750
48 Kword ROM
128 Kword RAM
1750
48 Kword ROM
128 Kword RAM
1750
48 Kword ROM
128 Kword RAM
1750
48 Kword ROM
128 Kword RAM
CONTROLLER
CONTROLLER
CONTROLLER
68000
48 Kword ROM
128 Kword RAM
68000
48 Kword ROM
128 Kword RAM
68000
48 Kword ROM
128 Kword RAM
EUROPEAN PHOTON IMAGING CAMERA
POSSIBLE ON BOARD DATA HANDLING CONFIGURATION FOR THE XMM SPACECRAFT
DBU
DBU
RADIATION MONITOR
Payload
RTU
ANM052
1.1. Analysis of single event upsets effects on a mission
Single event upsets may cause malfunctions in several
sensitive functions: microprocessors are affected by bit
flips in the microprocessor registers, with immediate
effects during the execution of an instruction.
Memory bit flips in the programme code have similar
effects.
Bit flips in Input/Output registers may corrupt an address
or data in transmitted messages, which is normally
detected during protocol verifications.
In terms of criticality, the service interruption of the
Spacecraft computers can be described as follows,
according to the computer class.
Bit flips in the data area may have effects on a longer term
if no automatic detection and correction are performed.
Table 4:
Function
SEU Effects
Corrective action
Prevention in the design
Instrument
processors
Not critical :
interruption in an
instrument operation
loss of mission data
Reconfiguration of
processor
possible need for
instrument
recalibrations
Protection by EDAC of
programme code area is
recommended
Payload
processor
Not critical :
interruption in a major
instrument or several
instruments
loss of mission data
Reconfiguration of
processor
HW watchdog
protection by EDAC of
programme and data area
is recommended
AOCS
processor
Highly critical :
loss of nominal AOCS
possible loss of
Spacecraft safe mode
Interruption of
mission
possible automatic
protection of sensitive
instruments
HW watchdog
Software in ROM,
dumped and executed in
RAM with EDAC
Hardware survival logic
in backup
Central
processor
Critical :
interruption of the
mission
need for the S/C to enter
a safety mode
Interruption of
mission operations
HW watchdog
protection by EDAC of
programme and data
area
Up to now, Spacecraft design have been efficient enough
to limit the SEU effects to mission interruptions only.
Bit flips occurring in microprocessors or code create
immediate crashes, which are generally detected by
hardware watchdogs.
There is no additional feature required for SEU, since this
function is implemented to monitor both hardware and
software behavior.
The watchdog effect is generally a computer restart.
In order to avoid complete software reloading, the flight
software code is often resident in ROM, and copied on to
RAM for execution.
This implementation offers the advantage of allowing
executable code modifications during the mission.
The implementation choice between Rad Hard chips and
Radiation Tolerant components associated to Error
Detection and Correction devices (EDACs) depends on
several criteria which have to be weighted according to
each mission context. The following criteria can be
identified:
D
D
D
D
D
D
D
D
D
Reliability
Mass
Size
Power consumption
Speed
Sensitivity to heavy ion
Error detection capability
Availability
Cost
The following chapter details technical design aspects,
which allow to establish comparison for these criteria
between
three
implementations
for
typical
microcontroller and microprocessor applications (from
64 to 256 Kbytes memory size).
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1.2. Solution
For embedded computer applications where high
reliability and autonomy is indispensable, protection of
the RAM memory contents is of paramount importance.
Such protection is achieved by using Error Detection and
Correction (EDAC) circuitry in the hardware design.
EDACs are integrated circuits to be connected to the data
bus. The characteristics of an EDAC is to detect and
correct single bit errors, and to detect double bit errors
(present in one same data word) - this at the expense of so
called check bits added to each data word and a minimum
of additional processing.
The Atmel Static RAM design separates the cells that
represent the different dataword bits. This feature
virtually eliminates the risk for one impact to provoke
dual bit upsets, leaving only a minute risk for single bit
upsets - an error that can be detected and corrected by an
EDAC.
Figure 1. Atmel Static RAM Design
8 bytes
cells for bits 0..7 of one byte
an impact here
does not upset these cells
The additional processing associated with an EDAC
protected solution is the initialization of the checkbit
RAM and a refresh procedure that performs read-write
operations on the protected memory (“scrubbing”). The
initialization of the checkbit RAM does not introduce an
overhead since most spaceborne applications move their
code from ROM to RAM at reset, and automatically
initialize the check bit RAM at the same time. The
scrubbing - performed during processor idle time - is
necessary to eliminate the risk for two separate impacts
to generate a dual bit upset in one same dataword.
However, if a dual bit upset in one same data word should
occur it would still be detected and signalled by the
EDAC.
1.3. EDAC System Configurations
In a “Correct-Always” system all data passes through the
EDAC, where check bits are generated for each write
operation and read data is always corrected. To reduce the
additional amount of circuitry necessary to implement
this type of system, a flow-through EDAC (separate data
buses for CPU and RAM) should be selected.
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ANM052
Figure 2. “Correct-Always” system with flow-through EDAC
Address
Address
Flow
Through
EDAC
CPU
CHECKBIT
RAM
Check Bits
CODE
and
DATA
RAM
Data
Data
Address
Read/Write/Control
In a “Bus-Watch” system all write data is fed to RAM and
to the EDAC, where check bits are generated. Read data
is always checked by the EDAC, and data errors are
signalled to the CPU. Flow-through EDACs as well as
regular EDACs are suitable for this type of system. The
address with error and the syndrome should be latched to
allow correction.
Figure 3. “Bus-Watch” system
Address
Check Bits
Interrupt or Waitstate
CODE
and
DATA
RAM
EDAC
CPU
CHECKBIT
RAM
Data
latch
Data
Read/Write/Control
The “Bus-Watch” system is suitable for very fast systems,
but implies more overhead in the error handling hardware
and software. With respect to the processor speeds used
in spaceborne systems, the propagation delay of
flow-through EDACs is fast enough and therefore the
“Correct-Always” solution has been used for the
examples below.
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ANM052
1.4. An 8 bit Microcontroller Application
In 8 bit systems, error correction schemes become
relatively expensive with respect to the check bits that
have to be added - virtually twice the normal memory is
required. This example uses the Atmel 80C32Ε, capable
of speeds up to 30 MHz, together with Atmel EDAC &
RAMs including 64k x 6 bits of additional Check Bit
RAM.
The timing diagram shows the External Code Memory
Read cycle (fetch) which is more critical than the Data
memory read and write cycles.
Table 5: Power & board space consumption for protection of 8 bit application (64 Kbytes)
Part count
Flatpack size
(mm2)
– 30 MHz µC 6
ICCOP / iccsb1 (mA)
EDAC : SMKS–29C516E
1
362
20 / 0.02
SRAM 32Kx8RT : SMDP–65656FV–45
4
190
170 / 0.1
Total for 1st Atmel solution 3)
5
1122
360 1)
EDAC: SMKS-29C516E
1
362
20 / 0.2
SRAM 128Kx8RT: SMDI-65608EV-45
2
220
60 / 0.3
Total for 2nd Atmel solution 3)
3
802
140 2)
EDAC: SMKS-29C516E
1
362
20 / 0.02
SRAM 32Kx8RH: (45 ns)
4
421
122 / 2
Total for Rad Hard solution 3)
5
2046
268 1)
Type of Component
1)
2)
3)
Two RAMs in operation, two in standby. EDAC
Two RAMs in operation. EDAC
Not taking into account space board design rules
Figure 4. Atmel 80C32E at 30 MHz with Atmel 29C516E and SMDP–65656FV–45 (Instr.Read)
CLK
ALE
tPLIV<65ns
tLLPL=25ns
PSEN
tLLIV<100ns
Latched Address
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏ
tGLQV=20ns
RAM Dout
t4=34ns
Corrected Data
EDAC16 Data Out
2.5 ns
tLLPL : 80C32E ALE low to PSEN low 0.20.53
tPLIV : 80C32E PSEN low to valid instruction available
Read
Interval
tLLIV : 80C32E ALE low to valid instruction available
tGLQV : RAM Output Enable Access time
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ANM052
1.5. Application with 16 bit microprocessor and 64k Words RAM
The example for this application is built around the space
qualified MA31750 16 bit microprocessor at 9 or 16
MHz, and Atmel EDAC & RAMs including 64K x 6 bits
of additional Check Bit RAM.
Table 6: Power and board space consumption for protection of 16 bit application
(64 KWords / 128 KBytes)
Part
count
Flatpack
size (mm2)
- 9 MHz µP ICCOP / ICCSB1
(mA)
- 16 MHz µP ICCOP / ICCSB1
(mA)
EDAC: SMKS-29C516E
1
362
20 / 0.02
20 / 0.02
SRAM 32Kx8RT: SMDP-65656FV-45
6
190
65 / 0.1
100 / 0.1
Total for 1st Atmel solution 3)
7
1502
215 1)
320 1)
EDAC: SMKS-29C516E
1
362
20 / 0.02
20 / 0.02
SRAM 128Kx8RT: SMDI-65608EV-45
3
220
36 / 0.3
45 / 0.3
Total for 2nd Atmel solution 3)
4
1022
128 2)
155 2)
EDAC: SMKS-29C516E
1
362
20 / 0.02
20 / 0.02
SRAM 32Kx8RH: (55 ns)
6
421
93 / 2
120 / 2
Total for Rad Hard solution 3)
7
2888
305 2)
386 2)
Type of Component
1)
Three RAMs in operation, three in standby. EDAC
Three RAMs in operation. EDAC
3) Not taking into account space board design rules
2)
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ANM052
1.6. No wait state limits clock to 9 MHz
Figure 5. MA31750 at 9MHz with Atmel 29C516E and SMDP–65656FV–45 (Read, No wait state)
ÇÇ
ÇÇ
ÉÉ
ÉÉ
CLK
AS
A0–A15
RDN
ÏÏÏ
ÏÏÏ
ÏÏÏÏÏ
ÏÏÏÏÏ
RD/WN
tGLQV=20ns
RAM Dout
t4=34ns
EDAC–16 Data Out
MA31750
data valid required
5ns
Corrected Data
Read
tGLQV : RAM Output Enable Access time
t4 : EDAC “RAM data in” to “user data out”
propagation time
Interval
(0 w.s)
Figure 6. MA31750 at 9MHz with Atmel 29C516E and SMDP–65656FV–45 (Write, No wait state)
ÇÇ
ÇÇ
ÉÉ
ÉÉ
CLK
AS
WRN
A0–A15
ÏÏÏÏÏ
t12=15ns
MA31750 D[0..16]
t12+=45ns
ÂÂÂÂÂ
ÏÏÏÏ
ÂÂÂÂÂÏÏÏÏ
RD/WN
t22=19ns
EDAC Data and
Checkbits Out
t3=26ns
t12 : 31750 WRN low to data low.Z
t12+ : 31750 WRN low to data out valid
5ns
t22 : EDAC write enable to RAM data active
tDVWH>20ns
Write
Interval
(0 w.s)
t3 : EDAC RAM data active to checkbits valid
tDVWH : RAM data setup time
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ANM052
21.7. 16 MHz clock speed requires one wait state
Timing analysis at 16 MHz shows that one wait state must
be inserted for each memory access cycle with 32K x 8
Atmel RAMs - H-65656FV-45.
The increase in execution time due to one wait state in the
memory access cycle is estimated to be in the order of 6%.
Figure 7. MA31750 at 16MHz with Atmel 29C516E and SMDP–65656FV–45 (Read, 1 wait state)
CLK
ÇÇ
ÇÇ
AS
A0–A15
ÉÉ
ÉÉ
RDN
RD/WN
tGLQV=20ns
ÏÏÏ
ÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
RAM Dout
t4=34ns
EDAC–16 Data Out
MA31750
data valid required
5ns
tGLQV : RAM Output Enable Access time
Read
Interval
(0 w.s)
Corrected Data
Read
Interval
(1 w.s)
t4 : EDAC “RAM data in” to “user data out”
propagation time
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ANM052
Figure 8. MA31750 at 16MHz with Atmel 29C516E and SMDP–65656FV–45 (Write, 1 wait state)
CLK
ÇÇ
ÇÇ
ÉÉ
ÉÉ
AS
WRN
A0–A15
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏ
t12=15ns
MA31750 D[0..16]
t12+=45ns
RD/WN
t22=19ns
EDAC Data and
Checkbits Out
5ns
t3=26ns
t12 : 31750 WRN low to data low.Z
t12+ : 31750 WRN low to data out valid
Read
Interval
(0 w.s)
tDVWH>20ns
Read
Interval
(1 w.s)
t22 : EDAC write enable to RAM data active
t3 : EDAC RAM data active to checkbits valid
tDVWH : RAM data setup time
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ANM052
1.8. Application with 16 bit microprocessor and extended memory
The example for this application is built around the space
qualified MA31750 16 bit microprocessor and MA31751
memory management unit (MMU) at 16 MHz, Atmel
EDAC & Atmel RAMs including 128Kx6 bits of
additional Check Bit RAM.
Table 7: Power and board space consumption for protection of 16 bit application
(128 KWords / 256 KBytes)
Part count
Flatpack size
(mm2)
- 16 MHz µP -ICCOP / ICCSB1
(mA)
EDAC: SMKS-29C516E
1
362
20 / 0.02
SRAM 32Kx8RT: SMDP-65656FV-45
12
190
100 / 0.1
Total for 1st Atmel solution 3)
13
2642
321 1)
EDAC: SMKS-29C516E
1
362
20 / 0.02
SRAM 128Kx8RT: SMDI-65608EV-45
3
220
45 / 0.3
Total for 2nd Atmel solution 3)
4
1022
155 2)
EDAC: SMKS-29C516E
1
362
20 / 0.02
SRAM 32Kx8RH: (45ns)
12
421
120 / 2
Total for Rad Hard solution 3)
13
5414
398 1)
Type of Component
1)
Three RAMs in operation, nine in standby. EDAC
Three RAMs in operation. EDAC
3) Not taking into account space board design rules
2)
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ANM052
1.9. 16 MHz clock requires two wait states
At 16 MHz clock speed, the use of the MMU requires one
wait state in the write cycle and two wait states in the read
cycle.
The increase in execution time due to the MMU wait
states is estimated to be in the order of 20%.
Figure 9. MA31750/51 at 16MHz with Atmel 29C516E and SMDP–65656FV–45 (Read, 2 wait states)
ÇÇ
ÇÇ
ÉÉÉ
ÉÉÉ
ÇÇ
ÇÇ
CLK
AS
ÄÄÄÄÄ
ÄÄÄÄÄ
ÂÂÂÂÂ
ÂÂÂÂÂ
A0–A15
MMU EAS
MMU EAS and PA
RDN
ÏÏÏÏÏ
ÏÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
RD/WN
tAVQV=45ns
RAM Dout
t4=34ns
EDAC Data Out
Corrected Data
MA31750
data valid required
5ns
Read
Interval
(0 w.s)
Read
Interval
(1 w.s)
Read
Interval
(2 w.s)
tAVQV : RAM Address Access time
t4 : EDAC “RAM data in” to “user data out”
propagation time
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Rev. C (11 March 97)
ANM052
Figure 10. MA31750 at 16MHz with Atmel 29C516E and SMDP–65656FV–45 (Write, 1 or 2 wait states)
CLK
ÉÉ
ÉÉ
AS
WRN
A0–A15
MMU EAS
MMU EAS and PA
ÉÉÉÉÉ
ÉÉÉÉÉ
ÂÂÂÂÂ
ÂÂÂÂÂ
ÏÏÏ
ÏÏÏ
ÉÉ
ÉÉ
t12=15ns
MA31750 D[0..16]
t12+=45ns
RD/WN
tAVWH (1w.s.)>40ns
ÂÂÂ
ÏÏÏÏ
ÂÂÂÏÏÏÏ
t22=19ns
EDAC Data and
Checkbits Out
5ns
t12 : 31750 WRN low to data low.Z
t12+ : 31750 WRN low to data out valid
t22 : EDAC write enable to RAM data active
t3=26ns
tAVWH (2w.s.)>20ns
tDVWH (1w.s.)>20ns
tAVWH (2w.s.)>20ns
Read
Interval
(0 w.s)
Read
Interval
(1 w.s)
Read
Interval
(2 w.s)
t3 : EDAC RAM data active to checkbits valid
tAVWH : RAM address setup time
tDVWH : RAM data setup time
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ANM052
1.10. Examples of bit flip predictions for typical computers
Theoretical bit flips for a memory plane based on 256 Kbits memory chips (M-65656F) are the following for a shielding
of 5mm (cf RD10 and attached annexes).
Table 8:
Bit flip prediction per bit
and per day due to Heavy
Ions
Bit flip prediction per bit
and per day due
to Protons
Total Bit flip prediction
per bit and per day
Low Earth Orbit
6.7 E-11
1.6 E-7
1.6 E-7
Polar Orbit
1.6 E-7
4.9E-7
6.5 E-7
Deep Space
or Geostationary Orbit
6.2 E-7
Orbit type
6.2 E-7
Table 9: Recalling the two computers detailed in this document
Computer
Microprocessor type
Selected chip
Memory size in Kbytes
A
8 bit microcontroller
Atmel 80C32Ε
64
B
16 bit microprocessor
MA 31750
256
The bit flips probability to be considered are as follows for inactive and powered chips:
Table 10:
Computer
Memory size in
Kilobits
SEU in LEO
SEU in
Polar orbit
SEU in
Geosynchronous
Orbit
A
512
1 per 12.2 days
1 per 3 days
1 per 3 days
B
2048
1 per 3 days
1 per 18 hours
1 per 19 hours
Those figures are for inactive chips, and correspond to the probability of mission interruptions in the absence of
any corrective design.
For Low Earth Orbit missions which do not cross the
South Atlantic Anomalia (SAA), the M-65656F can be
used as such and no need for protection is actually needed.
For all applications in low Earth, Polar and
Geo-synchronous orbits, protective devices are necessary
to limit the impact of SEU on the spacecraft mission.
If an EDAC correction device is added, the necessary
memory size is increased due to the correction code
implementation, so the EDAC activation probability is
increased.
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Rev. C (11 March 97)
ANM052
The SEU probability is given hereunder :
Table 11:
Computer
Memory size in
Kilobits
SEU in
LEO
SEU in
Polar orbit
SEU in
Geosynchronous
Orbit
A
896
1 per 7 days
1 per 1.7 days
1 per 1.8 days
B
2816
1 per 2.2 days
1 per 13 hours
1 per 14 hours
In terms of occurrence, there is no major difference, but the corrective design based on memory scrubbing has to
be performed with a slightly higher frequency.
1.11. Conclusion
The previous analysis allows to conclude that M-65656F
can be used for Space applications.
For the most current applications in low earth Orbit, Polar
Orbit and Geo-synchronous Orbit, (MA 31750 at 16 MHz
using 128 KWords of memory), the use of Atmel SRAM
(M-65656F or M-65608E) with an EDAC (29C516E)
appears as a valid solution from a system point of view,
at the expense of one additional wait state.
If the processing unit power happened to be actually an
issue in an early state of a project, one should consider
that a system problem does exist, which is not likely to be
solved at the level of memory chip selection.
For 8 bit microcontrollers in polar Orbit and
Geo-synchronous Orbit, using an EDAC means
practically to double the memory size, which might have
a significant impact on the design. But for such
applications, which are non critical, parts costs and
availability have to be considered.
1.12. Reference documents
This application note is based on a study done by THARSYS in 1994.
(RD1)
(RD2)
(RD3)
(RD4)
(RD5)
(RD6)
(RD7)
(RD8)
(RD9)
(RD10)
High Reliability Products, Military and Aerospace Components Data Book, Temic (Atmel)
8 Bit Microcontrollers, Data Book, Temic (Atmel), 1997
80C32/80C52, Data Sheet, Temic (Atmel)
SOS Radiation Hard, Hi-Rel IC and ASIC Handbook, GEC Plessey Semiconductor, 1993
16 Bits EDAC, Product Specification, Saab Ericsson Space, 1993
Detect/Correct Errors to improve data reliability, A. Hegde (IDT),Electronic Design, Vol 40, No
12, 11/6/1992
Designing with the IDT49C460 and IDT39C60 Error Detection and Correction Units, Application
Note AN-24, Integrated Device Technology, Inc., 1989
High Performance Logic, Data Book, Integrated Device Technology, Inc., 1992
Radiation Hardened 32kx8 SOI CMOS Static RAM, Data Sheet, Harris Semiconductor, 12/1992
Evaluation of Heavy Ions and Protons induced upset rates of HM-65664E and M-65656F static
RAMs (HIREX Technical Note, HRX/93.276, 26/11/93).
19
Rev. C (11 March 97)