25LC1024 DATA SHEET (05/24/2010) DOWNLOAD

25LC1024
1 Mbit SPI Bus Serial EEPROM
Device Selection Table
Part Number
VCC Range
Page Size
Temp. Ranges
Packages
25LC1024
2.5-5.5V
256 Byte
I,E
P, SM, MF
Features:
Description:
• 20 MHz max. Clock Speed
• Byte and Page-level Write Operations:
- 256 byte page
- 6 ms max. write cycle time
- No page or sector erase required
• Low-Power CMOS Technology:
- Max. Write current: 5 mA at 5.5V, 20 MHz
- Read current: 7 mA at 5.5V, 20 MHz
- Standby current: 1A at 2.5V
(Deep power-down)
• Electronic Signature for Device ID
• Self-Timed Erase and Write Cycles:
- Page Erase (6 ms max.)
- Sector Erase (10 ms max.)
- Chip Erase (10 ms max.)
• Sector Write Protection (32K byte/sector):
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• High Reliability:
- Endurance: 1M erase/write cycles
- Data Retention: >200 years
- ESD Protection: >4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40°C to +125°C
The Microchip Technology Inc. 25LC1024 is a 1024
Kbit serial EEPROM memory with byte-level and pagelevel serial EEPROM functions. It also features Page,
Sector and Chip erase functions typically associated
with Flash-based products. These functions are not
required for byte or page write operations. The memory
is accessed via a simple Serial Peripheral Interface
(SPI) compatible serial bus. The bus signals required
are a clock input (SCK) plus separate data in (SI) and
data out (SO) lines. Access to the device is controlled
by a Chip Select (CS) input.
 2010 Microchip Technology Inc.
The 25LC1024 is available in standard packages
including 8-lead PDIP and SOIJ, and advanced 8-lead
DFN package. All devices are Pb-free.
Package Types (not to scale)
DFN
PDIP/SOIJ
(MF)
SO 2
WP 3
VSS 4
(P, SM)
8
VCC
7
HOLD
6
5
CS
SO
1
2
SCK
WP
3
SI
VSS
4
25LC1024
CS 1
25LC1024
• Pb-Free and RoHS Compliant
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
8
7
VCC
HOLD
6
SCK
5
SI
DS22064D-page 1
25LC1024
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
D001
Sym.
Characteristic
TA = -40°C to +85°C
TA = -40°C to +125°C
Industrial (I):
Automotive (E):
Min.
Max.
Units
VCC = 2.5V to 5.5V
VCC = 2.5V to 5.5V
Test Conditions
VIH1
High-level input
voltage
.7 VCC
VCC +1
V
Low-level input
voltage
-0.3
0.3 VCC
V
VCC2.7V
-0.3
0.2 VCC
V
VCC < 2.7V
D002
VIL1
D003
VIL2
D004
VOL
Low-level output
voltage
—
0.4
V
IOL = 2.1 mA
D005
VOH
High-level output
voltage
VCC -0.2
—
V
IOH = -400 A
D006
ILI
Input leakage current
—
±1
A
CS = VCC, VIN = VSS or VCC
D007
ILO
Output leakage
current
—
±1
A
CS = VCC, VOUT = VSS or VCC
D008
CINT
Internal capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note)
D009
ICC Read
—
—
10
mA
5
mA
VCC = 5.5V; FCLK = 20.0 MHz;
SO = Open
VCC = 2.5V; FCLK = 10.0 MHz;
SO = Open
—
—
7
5
mA
mA
VCC = 5.5V
VCC = 2.5V
—
—
20
A
12
A
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, 125°C
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, 85°C
—
1
A
—
2
A
Operating current
D010
ICC Write
D011
ICCS
Standby current
D012
Note:
ICCSPD
Deep power-down
current
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, 85°C
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, 125°C
This parameter is periodically sampled and not 100% tested.
DS22064D-page 2
 2010 Microchip Technology Inc.
25LC1024
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
TA = -40°C to +85°C
TA = -40°C to +125°C
Min.
Max.
Units
VCC = 2.5V to 5.5V
VCC = 2.5V to 5.5V
Conditions
1
FCLK
Clock frequency
—
—
20
10
MHz
MHz
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
2
TCSS
CS setup time
25
50
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
3
TCSH
CS hold time
50
100
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
4
TCSD
CS disable time
50
—
ns
—
5
Tsu
Data setup time
5
10
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
6
THD
Data hold time
10
20
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
7
TR
CLK rise time
—
20
ns
(Note 1)
8
TF
CLK fall time
—
20
ns
(Note 1)
9
THI
Clock high time
25
50
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
10
TLO
Clock low time
25
50
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
11
TCLD
Clock delay time
50
—
ns
—
12
TCLE
Clock enable time
50
—
ns
—
13
TV
Output valid from clock low
—
—
25
50
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
14
THO
Output hold time
0
—
ns
(Note 1)
15
TDIS
Output disable time
—
—
25
50
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
16
THS
HOLD setup time
10
20
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
17
THH
HOLD hold time
10
20
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
18
THZ
HOLD low to output
High-Z
15
30
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
(Note 1)
19
THV
HOLD high to output valid
15
30
—
—
ns
ns
4.5V VCC 5.5V (I)
2.5V VCC 5.5V (I, E)
20
TREL
CS High to Standby mode
—
100
s
—
21
TPD
CS High to Deep powerdown
—
100
s
—
22
TCE
Chip erase cycle time
—
10
ms
—
23
TSE
Sector erase cycle time
—
10
ms
—
24
TWC
Internal write cycle time
—
6
ms
Byte or Page mode and Page
Erase
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from Microchip’s web site at www.microchip.com.
 2010 Microchip Technology Inc.
DS22064D-page 3
25LC1024
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Param.
No.
25
Sym.
—
Characteristic
Endurance
TA = -40°C to +85°C
TA = -40°C to +125°C
Min.
Max.
1M
—
Units
VCC = 2.5V to 5.5V
VCC = 2.5V to 5.5V
Conditions
E/W Page mode, 25°C, 5.5V (Note 2)
Cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization and qualification. For endurance
estimates in a specific application, please consult the Total Endurance™ Model which can be obtained
from Microchip’s web site at www.microchip.com.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
VLO = 0.2V
—
VHI = VCC - 0.2V
(Note 1)
VHI = 4.0V
(Note 2)
CL = 30 pF
—
Timing Measurement Reference Level
Input
0.5 VCC
Output
0.5 VCC
Note 1: For VCC  4.0V
2: For VCC > 4.0V
DS22064D-page 4
 2010 Microchip Technology Inc.
25LC1024
FIGURE 1-1:
HOLD TIMING
CS
17
16
17
16
SCK
18
SO
n+2
SI
n+2
n+1
n
19
High-Impedance
n
5
Don’t Care
n+1
n-1
n
n
n-1
HOLD
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
7
Mode 1,1
8
3
12
11
SCK Mode 0,0
5
SI
6
MSB in
LSB in
High-Impedance
SO
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
3
10
Mode 1,1
SCK
Mode 0,0
13
SO
14
MSB out
SI
 2010 Microchip Technology Inc.
15
LSB out
Don’t Care
DS22064D-page 5
25LC1024
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
BLOCK DIAGRAM
STATUS
Register
The 25LC1024 is a 131,072 byte Serial EEPROM
designed to interface directly with the Serial Peripheral
Interface (SPI) port of many of today’s popular
microcontroller families, including Microchip’s PIC®
microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using
discrete I/O lines programmed properly in firmware to
match the SPI protocol.
The 25LC1024 contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
I/O Control
Logic
Memory
Control
Logic
EEPROM
Array
X
Dec
Page Latches
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25LC1024 in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
TABLE 2-1:
HV Generator
VCC
VSS
INSTRUCTION SET
Instruction Name
Instruction Format
READ
0000 0011
Read data from memory array beginning at selected address
WRITE
0000 0010
Write data to memory array beginning at selected address
WREN
0000 0110
Set the write enable latch (enable write operations)
WRDI
0000 0100
Reset the write enable latch (disable write operations)
RDSR
0000 0101
Read STATUS register
WRSR
0000 0001
Write STATUS register
PE
0100 0010
Page Erase – erase one page in memory array
SE
1101 1000
Sector Erase – erase one sector in memory array
CE
1100 0111
Chip Erase – erase all sectors in memory array
RDID
1010 1011
Release from Deep power-down and read electronic signature
DPD
1011 1001
Deep Power-Down mode
DS22064D-page 6
Description
 2010 Microchip Technology Inc.
25LC1024
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 25LC1024
followed by the 24-bit address, with seven MSBs of the
address being “don’t care” bits. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin.
FIGURE 2-1:
The data stored in the memory at the next address can
be read sequentially by continuing to provide clock
pulses. The internal Address Pointer is automatically
incremented to the next higher address after each byte
of data is shifted out. When the highest address is
reached (1FFFFh), the address counter rolls over to
address, 00000h, allowing the read cycle to be continued indefinitely. The read operation is terminated by
raising the CS pin (Figure 2-1).
READ SEQUENCE
CS
0
1
0
0
2
3
4
5
6
0
1
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
0
24-bit Address
1 23 22 21 20
2
1
0
Data Out
High-Impedance
SO
 2010 Microchip Technology Inc.
7
6
5
4
3
2
1
0
DS22064D-page 7
25LC1024
2.2
Write Sequence
Note:
Prior to any attempt to write data to the 25LC1024, the
write enable latch must be set by issuing the WREN
instruction (Figure 2-4). This is done by setting CS low
and then clocking out the proper instruction into the
25LC1024. After all eight bits of the instruction are
transmitted, the CS must be brought high to set the
write enable latch. If the write operation is initiated
immediately after the WREN instruction without CS
being brought high, the data will not be written to the
array because the write enable latch will not have been
properly set.
A write sequence includes an automatic, self timed
erase cycle. It is not required to erase any portion of the
memory prior to issuing a Write command.
Once the write enable latch is set, the user may
proceed by setting the CS low, issuing a WRITE instruction, followed by the 24-bit address, with seven MSBs
of the address being “don’t care” bits, and then the data
to be written. Up to 256 bytes of data can be sent to the
device before a write cycle is necessary. The only
restriction is that all of the bytes must reside in the
same page.
Note:
When doing a write of less than 256 bytes
the data in the rest of the page is refreshed
along with the data bytes being written.
This will force the entire page to endure a
write cycle, for this reason endurance is
specified per page.
FIGURE 2-2:
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’), and end at addresses that are
integer multiples of page size – 1. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the nth data byte has been clocked in. If CS is
brought high at any other time, the write operation will
not be completed. Refer to Figure 2-2 and Figure 2-3
for more detailed illustrations on the byte write
sequence and the page write sequence, respectively.
While the write is in progress, the STATUS register may
be read to check the status of the WPEN, WIP, WEL,
BP1 and BP0 bits (Figure 2-6). A read attempt of a
memory array location will not be possible during a
write cycle. When the write cycle is completed, the
write enable latch is reset.
BYTE WRITE SEQUENCE
CS
Twc
0
1
2
0
0
0
3
4
8
5
6
7
9 10 11
0
1
0 23 22 21 20
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
24-bit Address
Data Byte
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
DS22064D-page 8
 2010 Microchip Technology Inc.
25LC1024
FIGURE 2-3:
PAGE WRITE SEQUENCE
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
0
0
24-bit Address
0 1
0 23 22 21 20
Data Byte 1
2
1
0
7
6
5
4
3
2
1
0
CS
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
SCK
Data Byte 2
SI
7
6
5
4
 2010 Microchip Technology Inc.
3
2
Data Byte n (256 max)
Data Byte 3
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS22064D-page 9
25LC1024
2.3
Write Enable (WREN) and Write
Disable (WRDI)
The following is a list of conditions under which the
write enable latch will be reset:
•
•
•
•
•
•
•
The 25LC1024 contains a write enable latch. See
Table 2-4 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WREN instruction will set the
latch, and the WRDI will reset the latch.
FIGURE 2-4:
Power-up
WRDI instruction successfully executed
WRSR instruction successfully executed
WRITE instruction successfully executed
PE instruction successfully executed
SE instruction successfully executed
CE instruction successfully executed
WRITE ENABLE SEQUENCE (WREN)
CS
0
1
2
3
4
5
6
7
SCK
0
SI
0
0
0
1
1
0
High-Impedance
SO
FIGURE 2-5:
0
WRITE DISABLE SEQUENCE (WRDI)
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
1
10
0
High-Impedance
SO
DS22064D-page 10
 2010 Microchip Technology Inc.
25LC1024
2.4
Read Status Register Instruction
(RDSR)
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch and is read-only. When set to
a ‘1’, the latch allows writes to the array, when set to a
‘0’, the latch prohibits writes to the array. The state of
this bit can always be updated via the WREN or WRDI
commands regardless of the state of write protection
on the STATUS register. These commands are shown
in Figure 2-4 and Figure 2-5.
The Read Status Register instruction (RDSR) provides
access to the STATUS register. The STATUS register
may be read at any time, even during a write cycle. The
STATUS register is formatted as follows:
TABLE 2-2:
STATUS REGISTER
7
6 5 4
3
2
1
W/R
– – – W/R W/R
R
WPEN X X X BP1 BP0 WEL
W/R = writable/readable. R = read-only.
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSR instruction. These
bits are nonvolatile and are shown in Table 2-3.
0
R
WIP
See Figure 2-6 for the RDSR timing sequence.
The Write-In-Process (WIP) bit indicates whether the
25LC1024 is busy with a write operation. When set to
a ‘1’, a write is in progress, when set to a ‘0’, no write
is in progress. This bit is read-only.
FIGURE 2-6:
READ STATUS REGISTER TIMING SEQUENCE (RDSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
0
High-Impedance
SO
 2010 Microchip Technology Inc.
1
0
1
Data from STATUS register
7
6
5
4
3
2
DS22064D-page 11
25LC1024
2.5
Write Status Register Instruction
(WRSR)
The Write-Protect Enable (WPEN) bit is a nonvolatile
bit that is available as an enable bit for the WP pin. The
Write-Protect (WP) pin and the Write-Protect Enable
(WPEN) bit in the STATUS register control the
programmable hardware write-protect feature. Hardware write protection is enabled when WP pin is low
and the WPEN bit is high. Hardware write protection is
disabled when either the WP pin is high or the WPEN
bit is low. When the chip is hardware write-protected,
only writes to nonvolatile bits in the STATUS register
are disabled. See Table 2-4 for a matrix of functionality
on the WPEN bit.
The Write Status Register instruction (WRSR) allows the
user to write to the nonvolatile bits in the STATUS
register as shown in Table 2-2. The user is able to
select one of four levels of protection for the array by
writing to the appropriate bits in the STATUS register.
The array is divided up into four segments. The user
has the ability to write-protect none, one, two, or all four
of the segments of the array. The partitioning is
controlled as shown in Table 2-3.
See Figure 2-7 for the WRSR timing sequence.
TABLE 2-3:
ARRAY PROTECTION
BP1
BP0
Array Addresses
Write-Protected
Array Addresses
Unprotected
0
0
none
All (Sectors 0, 1, 2 & 3)
(00000h-1FFFFh)
0
1
Upper 1/4 (Sector 3)
(18000h-1FFFFh)
Lower 3/4 (Sectors 0, 1 & 2)
(00000h-17FFFh)
1
0
Upper 1/2 (Sectors 2 & 3)
(10000h-1FFFFh)
Lower 1/2 (Sectors 0 & 1)
(00000h-0FFFFh)
1
1
All (Sectors 0, 1, 2 & 3)
(00000h-1FFFFh)
none
FIGURE 2-7:
WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
Data to STATUS register
0
0
0
1
7
6
5
4
3
2
High-Impedance
SO
DS22064D-page 12
 2010 Microchip Technology Inc.
25LC1024
2.6
Data Protection
2.7
The following protection has been implemented to
prevent inadvertent writes to the array:
• The write enable latch is reset on power-up
• A write enable instruction must be issued to set
the write enable latch
• After a byte write, page write or STATUS register
write, the write enable latch is reset
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
TABLE 2-4:
Power-On State
The 25LC1024 powers on in the following state:
• The device is in low-power Standby mode
(CS = 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low-level transition on CS is required to
enter active state
WRITE-PROTECT FUNCTIONALITY MATRIX
WEL
(SR bit 1)
WPEN
(SR bit 7)
WP
(pin 3)
Protected Blocks
Unprotected Blocks
STATUS Register
0
x
x
Protected
Protected
Protected
1
0
x
Protected
Writable
Writable
1
1
0 (low)
Protected
Writable
Protected
1
1
1 (high)
Protected
Writable
Writable
x = don’t care
 2010 Microchip Technology Inc.
DS22064D-page 13
25LC1024
2.8
PAGE ERASE
The Page Erase function will erase all bits (FFh) inside
the given page. A Write Enable (WREN) instruction
must be given prior to attempting a Page Erase. This
is done by setting CS low and then clocking out the
proper instruction into the 25LC1024. After all eight
bits of the instruction are transmitted, the CS must be
brought high to set the write enable latch.
CS must then be driven high after the last bit if the
address or the Page Erase will not execute. Once the
CS is driven high, the self-timed Page Erase cycle is
started. The WIP bit in the STATUS register can be
read to determine when the Page Erase cycle is
complete.
If a Page Erase function is given to an address that
has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The Page Erase function is entered by driving CS low,
followed by the instruction code (Figure 2-8), and
three address bytes. Any address inside the page to
be erased is a valid address.
FIGURE 2-8:
PAGE ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31
SCK
Instruction
SI
0
1
0
0
0
24-bit Address
0
1
0 23 22 21 20
2
1
0
High-Impedance
SO
DS22064D-page 14
 2010 Microchip Technology Inc.
25LC1024
2.9
SECTOR ERASE
CS must then be driven high after the last bit if the
address or the Sector Erase will not execute. Once the
CS is driven high, the self-timed Sector Erase cycle is
started. The WIP bit in the STATUS register can be
read to determine when the Sector Erase cycle is
complete.
The Sector Erase function will erase all bits (FFh)
inside the given sector. A Write Enable (WREN) instruction must be given prior to attempting a Sector Erase.
This is done by setting CS low and then clocking out
the proper instruction into the 25LC1024. After all eight
bits of the instruction are transmitted, the CS must be
brought high to set the write enable latch.
If a SECTOR ERASE instruction is given to an address
that has been protected by the Block Protect bits (BP0,
BP1) then the sequence will be aborted and no erase
will occur.
The Sector Erase function is entered by driving CS
low, followed by the instruction code (Figure 2-9), and
three address bytes. Any address inside the sector to
be erased is a valid address.
FIGURE 2-9:
See Table 2-3 for Sector Addressing.
SECTOR ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31
SCK
Instruction
SI
1
1
0
1
1
24-bit Address
0
0
0 23 22 21 20
2
1
0
High-Impedance
SO
 2010 Microchip Technology Inc.
DS22064D-page 15
25LC1024
2.10
CHIP ERASE
The Chip Erase function will erase all bits (FFh) in the
array. A Write Enable (WREN) instruction must be given
prior to executing a Chip Erase. This is done by setting
CS low and then clocking out the proper instruction
into the 25LC1024. After all eight bits of the instruction
are transmitted, the CS must be brought high to set
the write enable latch.
The CS pin must be driven high after the eighth bit of
the instruction code has been given or the Chip Erase
function will not be executed. Once the CS pin is
driven high, the self-timed Chip Erase function begins.
While the device is executing the Chip Erase function
the WIP bit in the STATUS register can be read to
determine when the Chip Erase function is complete.
The Chip Erase function is entered by driving the CS
low, followed by the instruction code (Figure 2-10)
onto the SI line.
The Chip Erase function is ignored if either of the
Block Protect bits (BP0, BP1) are not 0, meaning ¼,
½, or all of the array is protected.
FIGURE 2-10:
CHIP ERASE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
1
0
0
0
1
1
1
High-Impedance
SO
DS22064D-page 16
 2010 Microchip Technology Inc.
25LC1024
2.11
DEEP POWER-DOWN MODE
Deep Power-Down mode of the 25LC1024 is its lowest
power consumption state. The device will not respond
to any of the Read or Write commands while in Deep
Power-Down mode, and therefore it can be used as an
additional software write protection feature.
All instructions given during Deep Power-Down mode
are ignored except the Read Electronic Signature
Command (RDID). The RDID command will release
the device from Deep power-down and outputs the
electronic signature on the SO pin, and then returns
the device to Standby mode after delay (TREL)
The Deep Power-Down mode is entered by driving CS
low, followed by the instruction code (Figure 2-11) onto
the SI line, followed by driving CS high.
Deep Power-Down mode automatically releases at
device power-down. Once power is restored to the
device, it will power-up in the Standby mode.
If the CS pin is not driven high after the eighth bit of the
instruction code has been given, the device will not
execute Deep power-down. Once the CS line is driven
high, there is a delay (TDP) before the current settles
to its lowest consumption.
FIGURE 2-11:
DEEP POWER-DOWN SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
1
0
1
1
1
0
0
1
High-Impedance
SO
 2010 Microchip Technology Inc.
DS22064D-page 17
25LC1024
2.12
RELEASE FROM DEEP
POWER-DOWN AND READ
ELECTRONIC SIGNATURE
Release from Deep Power-Down mode and Read
Electronic Signature is entered by driving CS low,
followed by the RDID instruction code (Figure 2-12)
and then a dummy address of 24 bits (A23-A0). After
the last bit of the dummy address is clocked in, the
8-bit Electronic signature is clocked out on the SO
pin.
Once the device has entered Deep Power-Down
mode all instructions are ignored except the release
from Deep Power-down and Read Electronic Signature command. This command can also be used when
the device is not in Deep Power-down, to read the
electronic signature out on the SO pin unless another
command is being executed such as Erase, Program
or Write STATUS register.
FIGURE 2-12:
After the signature has been read out at least once,
the sequence can be terminated by driving CS high.
The device will then return to Standby mode and will
wait to be selected so it can be given new instructions.
If additional clock cycles are sent after the electronic
signature has been read once, it will continue to output
the signature on the SO line until the sequence is
terminated.
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
SI
1
0
1
0
24-bit Address
1
0
1 23 22 21 20
1
2
1
0
Electronic Signature Out
High-Impedance
7
SO
0
6
5
4
3
2
1
0
0
1
0
1
0
0
1
Manufacturers ID 0x29
Driving CS high after the 8-bit RDID command, but before the Electronic Signature has been transmitted, will still
ensure the device will be taken out of Deep Power-Down mode. However, there is a delay TREL that occurs before the
device returns to Standby mode (ICCS), as shown in Figure 2-13.
FIGURE 2-13:
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE
CS
0
1
2
3
4
5
6
0
1
7
TREL
SCK
Instruction
SI
1
0
1
0
1
1
High-Impedance
SO
DS22064D-page 18
 2010 Microchip Technology Inc.
25LC1024
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Name
Pin Number
CS
1
Chip Select Input
SO
2
Serial Data Output
WP
3
Write-Protect Pin
VSS
4
Ground
SI
5
Serial Data Input
SCK
6
Serial Clock Input
HOLD
7
Hold Input
VCC
8
Supply Voltage
3.1
Function
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After powerup, a low level on CS is required prior to any sequence
being initiated.
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the
25LC1024. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.
3.3
The WP pin function is blocked when the WPEN bit in
the STATUS register is low. This allows the user to
install the 25LC1024 in a system with WP pin grounded
and still be able to write to the STATUS register. The
WP pin functions will be enabled when the WPEN bit is
set high.
3.4
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
3.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25LC1024. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
3.6
Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25LC1024 while in the middle of a serial sequence
without having to retransmit the entire sequence again.
It must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-tolow transition. The 25LC1024 must remain selected
during this sequence. The SI, SCK and SO pins are in
a high-impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Pulling the HOLD line
low at any time will tri-state the SO line.
Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
STATUS register to prohibit writes to the nonvolatile
bits in the STATUS register. When WP is low and
WPEN is high, writing to the nonvolatile bits in the
STATUS register is disabled. All other operations
function normally. When WP is high, all functions,
including writes to the nonvolatile bits in the STATUS
register, operate normally. If the WPEN bit is set, WP
low during a STATUS register write sequence will
disable writing to the STATUS register. If an internal
write cycle has already begun, WP going low will have
no effect on the write.
 2010 Microchip Technology Inc.
DS22064D-page 19
25LC1024
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead DFN
XXXXXXX
T/XXXXX
YYWW
NNN
Example:
5LC1024
I/MF e3
0328
1L7
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
25LC1024
I/P e3 1L7
0328
8-Lead SOIJ
Example:
XXXXXXXX
T/XXXXXX
YYWWNNN
25LC1024
I/SM e3
07281L7
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Note:
DS22064D-page 20
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2010 Microchip Technology Inc.
25LC1024
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 2010 Microchip Technology Inc.
DS22064D-page 21
25LC1024
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DS22064D-page 22
 2010 Microchip Technology Inc.
25LC1024
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±
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 2010 Microchip Technology Inc.
DS22064D-page 23
25LC1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22064D-page 24
 2010 Microchip Technology Inc.
25LC1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2010 Microchip Technology Inc.
DS22064D-page 25
25LC1024
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22064D-page 26
 2010 Microchip Technology Inc.
25LC1024
APPENDIX A:
REVISION HISTORY
Revision A (10/2007)
Original release.
Revision B (5/2008)
Modified parameter D006 in Table 1-1; Revised
Package Marking Information; Replaced Package
Drawings.
Revision C (10/08)
Updated Package Drawings.
Revision D (05/10)
Revised Table 1-2, Param. No. 25 Conditions; Revised
Section 2.2, added note; Updated SOIJ package
drawings.
 2010 Microchip Technology Inc.
DS22064D-page 27
25LC1024
NOTES:
DS22064D-page 28
 2010 Microchip Technology Inc.
25LC1024
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
 2010 Microchip Technology Inc.
DS22064D-page 29
25LC1024
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: 25LC1024
Y
N
Literature Number: DS22064D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS22064D-page 30
 2010 Microchip Technology Inc.
25LC1024
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
Device
Tape & Reel
–
X
/XX
Temp Range
Package
Examples:
a)
b)
Device:
25LC1024
1 Mbit, 2.5V, SPI Serial EEPROM
Tape & Reel:
Blank
T
=
=
Standard packaging (tube)
Tape & Reel
Temperature
Range:
I
E
=
=
-40C to+85C
-40C to+125C
Package:
MF
P
SM
=
=
=
Micro Lead Frame (6 x 5 mm body), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIJ (5.28 mm), 8-lead
 2010 Microchip Technology Inc.
25LC1024-I/P = 1 Mbit, 2.5V Serial EEPROM,
Industrial temp., P-DIP package
25LC1024T-E/MF = 1 Mbit, 2.5V Serial
EEPROM, Extended temp., Tape & Reel, DFN
package
DS22064D-page 31
25LC1024
NOTES:
DS22064D-page 32
 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-228-1
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2010 Microchip Technology Inc.
DS22064D-page 33
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/05/10
DS22064D-page 34
 2010 Microchip Technology Inc.
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