25AA1024 1 Mbit SPI Bus Serial EEPROM Device Selection Table Part Number 25AA1024 VCC Range Page Size Temp. Ranges Packages 1.8-5.5V 256 Byte I P, SM, MF Features Description • 20 MHz Maximum Clock Speed • Byte and Page-level Write Operations: - 256 byte page - 6 ms maximum write cycle time - No page or sector erase required • Low-Power CMOS Technology: - Maximum Write current: 7 mA at 5.5V - Maximum Read current: 10 mA at 5.5V, 20 MHz - Standby current: 1 µA at 2.5V, 85°C (Deep Power-down) • Electronic Signature for Device ID • Self-Timed Erase and Write Cycles: - Page Erase (6 ms maximum) - Sector Erase (10 ms maximum) - Chip Erase (10 ms maximum) • Sector Write Protection (32K byte/sector): - Protect none, 1/4, 1/2 or all of array • Built-in Write Protection: - Power-on/off data protection circuitry - Write enable latch - Write-protect pin • High Reliability: - Endurance: 1M erase/write cycles - Data Retention: >200 years - ESD Protection: 4000V • Temperature Ranges Supported: - Industrial (I):-40°C to +85°C • RoHS Compliant The Microchip Technology Inc. 25AA1024 is a 1024 Kbit serial EEPROM memory with byte-level and page-level serial EEPROM functions. It also features Page, Sector and Chip erase functions typically associated with Flash-based products. These functions are not required for byte or page write operations. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled by a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 25AA1024 is available in standard packages including 8-lead PDIP and SOIJ, and advanced 8-lead DFN package. All devices are RoHS compliant. Package Types (not to scale) DFN PDIP/SOIJ SO 2 WP 3 VSS 4 (P, SM) 8 VCC 7 HOLD CS 1 SO 2 6 SCK WP 3 5 SI VSS 4 25AA1024 CS 1 25AA1024 (MF) 8 7 VCC 6 SCK 5 SI HOLD Pin Function Table Name Function CS Chip Select Input SO Serial Data Output WP Write-Protect VSS Ground SI Serial Data Input SCK Serial Clock Input HOLD Hold Input VCC Supply Voltage 2007-2015 Microchip Technology Inc. DS20001836J-page 1 25AA1024 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature .................................................................................................................................-65°C to 150°C Ambient temperature under bias ...............................................................................................................-40°C to 125°C ESD protection on all pins ..........................................................................................................................................4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability. TABLE 1-1: DC CHARACTERISTICS DC CHARACTERISTICS Param. No. Sym. D001 VIH1 D002 VIL1 D003 VIL2 D004 VOL D005 VOL D006 VOH D007 ILI D008 ILO D009 CINT D010 ICCREAD Characteristic Max. Units High-level Input Voltage 0.7 VCC VCC +1 V Low-level Input Voltage -0.3 0.3 VCC V -0.3 0.2 VCC V VCC < 2.7V Low-level Output Voltage — 0.4 V IOL = 2.1 mA — 0.2 V IOL = 1.0 mA, VCC < 2.5V High-level Output Voltage VCC -0.2 — V IOH = -400 µA Input Leakage Current — ±1 µA CS = VCC, VIN = VSS or VCC Output Leakage Current — ±1 µA CS = VCC, VOUT = VSS or VCC Internal Capacitance (all inputs and outputs) — 7 pF TA = 25°C, CLK = 1.0 MHz, VCC = 5.0V (Note) — 10 mA VCC = 5.5V; FCLK = 20.0 MHz; SO = Open — 5 mA VCC = 2.5V; FCLK = 10.0 MHz; SO = Open — 7 mA VCC = 5.5V — 5 mA VCC = 2.5V Standby Current — 12 A CS = VCC = 5.5V, Inputs tied to VCC or VSS, 85°C Deep Power-down Current — 1 µA CS = VCC = 2.5V, Inputs tied to VCC or VSS, 85°C ICCWRITE D012 ICCS D013 ICCSPD Note: VCC = 1.8V to 5.5V VCC = 2.0V to 5.5V Min. Operating Current D011 Industrial (I)*: TA = 0°C to +85°C Industrial (I): TA = -40°C to +85°C * Limited industrial temperature range. Test Conditions VCC≥ 2.7V This parameter is periodically sampled and not 100% tested. DS20001836J-page 2 2007-2015 Microchip Technology Inc. 25AA1024 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. No. Sym. 1 FCLK 2 TCSS 3 TCSH Characteristic Clock Frequency CS Setup Time CS Hold Time Industrial (I)*: TA = 0°C to +85°C Industrial (I): TA = -40°C to +85°C *Limited industrial temperature range. VCC = 1.8V to 5.5V VCC = 2.0V to 5.5V Min. Max. Units Conditions — 20 MHz 4.5 ≤ VCC ≤ 5.5 — 10 MHz 2.5 ≤ VCC < 4.5 — 2 MHz 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 25 — ns 4.5 ≤ VCC ≤ 5.5 50 — ns 2.5 ≤ VCC < 4.5 250 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 50 — ns 4.5 ≤ VCC ≤ 5.5 100 — ns 2.5 ≤ VCC < 4.5 500 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C (Note 3) 4 TCSD CS Disable Time 50 — ns 5 TSU Data Setup Time 5 — ns 4.5 ≤ VCC ≤ 5.5 10 — ns 2.5 ≤ VCC < 4.5 50 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 6 THD Data Hold Time 10 — ns 4.5 ≤ VCC ≤ 5.5 20 — ns 2.5 ≤ VCC < 4.5 100 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 7 TR CLK Rise Time — 20 ns (Note 1) 8 TF CLK Fall Time — 20 ns (Note 1) 9 THI Clock High Time 25 — 10 TLO Clock Low Time 4.5 ≤ VCC ≤ 5.5 50 — ns 2.5 ≤ VCC < 4.5 250 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 25 — ns 4.5 ≤ VCC ≤ 5.5 50 — ns 2.5 ≤ VCC < 4.5 250 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 11 TCLD Clock Delay Time 50 — ns 12 TCLE Clock Enable Time 50 — ns 13 TV Output Valid from Clock Low — 25 ns 4.5 ≤ VCC ≤ 5.5 — 50 ns 2.5 ≤ VCC < 4.5 — 250 ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C Note 1: This parameter is periodically sampled and not 100% tested. 2: This parameter is not tested but established by characterization and qualification. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com. 3: Includes THI time. 2007-2015 Microchip Technology Inc. DS20001836J-page 3 25AA1024 TABLE 1-2: AC CHARACTERISTICS (CONTINUED) AC CHARACTERISTICS Param. No. Sym. 14 THO 15 TDIS 16 17 18 19 THS THH THZ THV Characteristic Industrial (I)*: TA = 0°C to +85°C Industrial (I): TA = -40°C to +85°C *Limited industrial temperature range. VCC = 1.8V to 5.5V VCC = 2.0V to 5.5V Min. Max. Units Output Hold Time 0 — ns (Note 1) Output Disable Time — 25 ns 4.5 ≤ VCC ≤ 5.5 — 50 ns 2.5 ≤ VCC < 4.5 — 250 ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C (Note 1) 10 — ns 4.5 ≤ VCC ≤ 5.5 20 — ns 2.5 ≤ VCC < 4.5 100 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 10 — ns 4.5 ≤ VCC ≤ 5.5 20 — ns 2.5 ≤ VCC < 4.5 100 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 15 — ns 4.5 ≤ VCC ≤ 5.5 30 — ns 2.5 ≤ VCC < 4.5 150 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C (Note 1) 15 — ns 4.5 ≤ VCC ≤ 5.5 HOLD Setup Time HOLD Hold Time HOLD Low to Output High Z HOLD High to Output Valid Conditions 30 — ns 2.5 ≤ VCC < 4.5 150 — ns 2.0 ≤ VCC < 2.5 1.8 ≤ VCC < 2.0, 0°C to +85°C 20 TREL CS High to Standby mode — 100 µs VCC = 1.8V to 5.5V 21 TPD CS High to Deep Power-down — 100 µs VCC = 1.8V to 5.5V 22 TCE Chip Erase Cycle Time — 10 ms VCC = 1.8V to 5.5V 23 TSE Sector Erase Cycle Time — 10 ms VCC = 1.8V to 5.5V 24 TWC Internal Write Cycle Time — 6 ms Byte or Page mode and Page Erase 25 — Endurance 1M — E/W Page mode, 25°C, 5.5V (Note 2) cycles Note 1: This parameter is periodically sampled and not 100% tested. 2: This parameter is not tested but established by characterization and qualification. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com. 3: Includes THI time. DS20001836J-page 4 2007-2015 Microchip Technology Inc. 25AA1024 TABLE 1-3: AC TEST CONDITIONS AC Waveform VLO = 0.2V — VHI = VCC - 0.2V (Note 1) VHI = 4.0V (Note 2) CL = 30 pF — Timing Measurement Reference Level Input 0.5 VCC Output 0.5 VCC Note 1: For VCC 4.0V 2: For VCC > 4.0V FIGURE 1-1: HOLD TIMING CS 17 16 17 16 SCK 18 SO n+2 n+1 n 19 High-Impedance n 5 Don’t Care n+2 SI n+1 n-1 n n n-1 HOLD FIGURE 1-2: SERIAL INPUT TIMING 4 CS 2 7 Mode 1,1 8 3 12 11 SCK Mode 0,0 5 SI 6 MSB in SO 2007-2015 Microchip Technology Inc. LSB in High-Impedance DS20001836J-page 5 25AA1024 FIGURE 1-3: SERIAL OUTPUT TIMING CS 9 3 10 Mode 0,0 SCK 13 SO SI DS20001836J-page 6 Mode 1,1 14 MSB out 15 LSB out Don’t Care 2007-2015 Microchip Technology Inc. 25AA1024 2.0 FUNCTIONAL DESCRIPTION 2.1 Principles of Operation BLOCK DIAGRAM STATUS Register The 25AA1024 is a 131,072 byte Serial EEPROM designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today’s popular microcontroller families, including Microchip’s PIC® microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using discrete I/O lines programmed properly in firmware to match the SPI protocol. The 25AA1024 contains an 8-bit instruction register. The device is accessed via the SI pin, with data being clocked in on the rising edge of SCK. The CS pin must be low and the HOLD pin must be high for the entire operation. Table 2-1 contains a list of the possible instruction bytes and format for device operation. All instructions, addresses and data are transferred MSB first, LSB last. I/O Control Logic Memory Control Logic EEPROM Array X Dec Page Latches SI SO Y Decoder CS SCK Sense Amp. R/W Control HOLD WP Data (SI) is sampled on the first rising edge of SCK after CS goes low. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input and place the 25AA1024 in ‘HOLD’ mode. After releasing the HOLD pin, operation will resume from the point when the HOLD was asserted. TABLE 2-1: HV Generator VCC VSS INSTRUCTION SET Instruction Name Instruction Format READ 0000 0011 Read data from memory array beginning at selected address WRITE 0000 0010 Write data to memory array beginning at selected address WREN 0000 0110 Set the write enable latch (enable write operations) WRDI 0000 0100 Reset the write enable latch (disable write operations) RDSR 0000 0101 Read STATUS register WRSR 0000 0001 Write STATUS register PE 0100 0010 Page Erase – erase one page in memory array SE 1101 1000 Sector Erase – erase one sector in memory array CE 1100 0111 Chip Erase – erase all sectors in memory array RDID 1010 1011 Release from Deep Power-down and Read Electronic Signature DPD 1011 1001 Deep Power-Down mode 2007-2015 Microchip Technology Inc. Description DS20001836J-page 7 25AA1024 Read Sequence The device is selected by pulling CS low. The 8-bit READ instruction is transmitted to the 25AA1024 followed by the 24-bit address, with seven MSBs of the address being “don’t care” bits. After the correct READ instruction and address are sent, the data stored in the memory at the selected address is shifted out on the SO pin. FIGURE 2-1: The data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses. The internal Address Pointer is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached (1FFFFh), the address counter rolls over to address, 00000h, allowing the read cycle to be continued indefinitely. The read operation is terminated by raising the CS pin (Figure 2-1). READ SEQUENCE CS 0 1 0 0 2 3 4 5 6 0 1 7 8 9 10 11 29 30 31 32 33 34 35 36 37 38 39 SCK Instruction SI 0 0 0 24-bit Address 1 23 22 21 20 2 1 0 Data Out High-Impedance SO DS20001836J-page 8 7 6 5 4 3 2 1 0 2007-2015 Microchip Technology Inc. 25AA1024 2.2 Write Sequence Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’), and end at addresses that are integer multiples of page size – 1. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. Note: Prior to any attempt to write data to the 25AA1024, the write enable latch must be set by issuing the WREN instruction (Figure 2-4). This is done by setting CS low and then clocking out the proper instruction into the 25AA1024. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write enable latch. If the write operation is initiated immediately after the WREN instruction without CS being brought high, the data will not be written to the array because the write enable latch will not have been properly set. A write sequence includes an automatic, self-timed erase cycle. It is not required to erase any portion of the memory prior to issuing a Write command. Once the write enable latch is set, the user may proceed by setting the CS low, issuing a WRITE instruction, followed by the 24-bit address, with seven MSBs of the address being “don’t care” bits, and then the data to be written. Up to 256 bytes of data can be sent to the device before a write cycle is necessary. The only restriction is that all of the bytes must reside in the same page. When doing a write of less than 256 bytes the data in the rest of the page is refreshed along with the data bytes being written. This will force the entire page to endure a write cycle, for this reason endurance is specified per page. Note: FIGURE 2-2: For the data to be actually written to the array, the CS must be brought high after the Least Significant bit (D0) of the nth data byte has been clocked in. If CS is brought high at any other time, the write operation will not be completed. Refer to Figure 2-2 and Figure 2-3 for more detailed illustrations on the byte write sequence and the page write sequence, respectively. While the write is in progress, the STATUS register may be read to check the status of the WPEN, WIP, WEL, BP1 and BP0 bits (Figure 2-6). A read attempt of a memory array location will not be possible during a write cycle. When the write cycle is completed, the write enable latch is reset. BYTE WRITE SEQUENCE CS TWC 0 1 2 3 4 5 6 7 8 9 10 11 29 30 31 32 33 34 35 36 37 38 39 SCK Instruction SI 0 0 0 0 0 24-bit Address 0 1 0 23 22 21 20 Data Byte 2 1 0 7 6 5 4 3 2 1 0 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 9 25AA1024 FIGURE 2-3: PAGE WRITE SEQUENCE CS 0 1 2 0 0 0 3 4 5 6 7 8 9 10 11 29 30 31 32 33 34 35 36 37 38 39 SCK Instruction SI 0 0 24-bit Address 0 1 0 23 22 21 20 Data Byte 1 2 1 0 7 6 5 4 3 2 1 0 CS 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 SCK Data Byte 2 SI 7 6 DS20001836J-page 10 5 4 3 2 Data Byte n (256 max.) Data Byte 3 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 2007-2015 Microchip Technology Inc. 25AA1024 2.3 The following is a list of conditions under which the write enable latch will be reset: Write Enable (WREN) and Write Disable (WRDI) • • • • • • • The 25AA1024 contains a write enable latch. See Table 2-4 for the Write-Protect Functionality Matrix. This latch must be set before any write operation will be completed internally. The WREN instruction will set the latch, and the WRDI will reset the latch. FIGURE 2-4: Power-up WRDI instruction successfully executed WRSR instruction successfully executed WRITE instruction successfully executed PE instruction successfully executed SE instruction successfully executed CE instruction successfully executed WRITE ENABLE SEQUENCE (WREN) CS 0 1 2 3 4 5 6 7 SCK 0 SI 0 0 0 1 1 0 High-Impedance SO FIGURE 2-5: 0 WRITE DISABLE SEQUENCE (WRDI) CS 0 1 2 3 4 5 6 7 SCK SI 0 0 0 0 0 1 10 0 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 11 25AA1024 2.4 The Write Enable Latch (WEL) bit indicates the status of the write enable latch and is read-only. When set to a ‘1’, the latch allows writes to the array, when set to a ‘0’, the latch prohibits writes to the array. The state of this bit can always be updated via the WREN or WRDI commands regardless of the state of write protection on the STATUS register. These commands are shown in Figure 2-4 and Figure 2-5. Read Status Register Instruction (RDSR) The Read Status Register instruction (RDSR) provides access to the STATUS register. The STATUS register may be read at any time, even during a write cycle. The STATUS register is formatted as follows: TABLE 2-2: STATUS REGISTER 7 6 5 4 3 2 1 W/R – – – W/R W/R R WPEN X X X BP1 BP0 WEL W/R = writable/readable. R = read-only. The Block Protection (BP0 and BP1) bits indicate which blocks are currently write-protected. These bits are set by the user issuing the WRSR instruction. These bits are nonvolatile and are shown in Table 2-3. 0 R WIP See Figure 2-6 for the RDSR timing sequence. The Write-In-Process (WIP) bit indicates whether the 25AA1024 is busy with a write operation. When set to a ‘1’, a write is in progress, when set to a ‘0’, no write is in progress. This bit is read-only. FIGURE 2-6: READ STATUS REGISTER TIMING SEQUENCE (RDSR) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 0 SCK Instruction SI 0 0 0 0 0 High-Impedance SO DS20001836J-page 12 1 0 1 Data from STATUS register 7 6 5 4 3 2 2007-2015 Microchip Technology Inc. 25AA1024 2.5 The Write-Protect Enable (WPEN) bit is a nonvolatile bit that is available as an enable bit for the WP pin. The Write-Protect (WP) pin and the Write-Protect Enable (WPEN) bit in the STATUS register control the programmable hardware write-protect feature. Hardware write protection is enabled when the WP pin is low and the WPEN bit is high. Hardware write protection is disabled when either the WP pin is high or the WPEN bit is low. When the chip is hardware write-protected, only writes to nonvolatile bits in the STATUS register are disabled. See Table 2-4 for a matrix of functionality on the WPEN bit. Write Status Register Instruction (WRSR) The Write Status Register instruction (WRSR) allows the user to write to the nonvolatile bits in the STATUS register, as shown in Table 2-2. The user is able to select one of four levels of protection for the array by writing to the appropriate bits in the STATUS register. The array is divided up into four segments. The user has the ability to write-protect none, one, two, or all four of the segments of the array. The partitioning is controlled, as shown in Table 2-3. See Figure 2-7 for the WRSR timing sequence. TABLE 2-3: ARRAY PROTECTION BP1 BP0 Array Addresses Write-Protected Array Addresses Unprotected 0 0 none All (Sectors 0, 1, 2 & 3) (00000h-1FFFFh) 0 1 Upper 1/4 (Sector 3) (18000h-1FFFFh) Lower 3/4 (Sectors 0, 1 & 2) (00000h-17FFFh) 1 0 Upper 1/2 (Sectors 2 & 3) (10000h-1FFFFh) Lower 1/2 (Sectors 0 & 1) (00000h-0FFFFh) 1 1 All (Sectors 0, 1, 2 & 3) (00000h-1FFFFh) none FIGURE 2-7: WRITE STATUS REGISTER TIMING SEQUENCE (WRSR) CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 0 SCK Instruction SI 0 0 0 0 Data to STATUS register 0 0 0 1 7 6 5 4 3 2 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 13 25AA1024 2.6 Data Protection 2.7 The following protection has been implemented to prevent inadvertent writes to the array: • The write enable latch is reset on power-up • A write enable instruction must be issued to set the write enable latch • After a byte write, page write or STATUS register write, the write enable latch is reset • CS must be set high after the proper number of clock cycles to start an internal write cycle • Access to the array during an internal write cycle is ignored and programming is continued TABLE 2-4: Power-On State The 25AA1024 powers on in the following state: • The device is in low-power Standby mode (CS = 1) • The write enable latch is reset • SO is in high-impedance state • A high-to-low-level transition on CS is required to enter active state WRITE-PROTECT FUNCTIONALITY MATRIX WEL (SR bit 1) WPEN (SR bit 7) WP (pin 3) Protected Blocks Unprotected Blocks STATUS Register 0 x x Protected Protected Protected 1 0 x Protected Writable Writable 1 1 0 (low) Protected Writable Protected 1 1 1 (high) Protected Writable Writable x = don’t care DS20001836J-page 14 2007-2015 Microchip Technology Inc. 25AA1024 2.8 PAGE ERASE The Page Erase function will erase all bits (FFh) inside the given page. A Write Enable (WREN) instruction must be given prior to attempting a Page Erase. This is done by setting CS low and then clocking out the proper instruction into the 25AA1024. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write enable latch. CS must then be driven high after the last bit if the address or the Page Erase will not execute. Once the CS is driven high, the self-timed Page Erase cycle is started. The WIP bit in the STATUS register can be read to determine when the Page Erase cycle is complete. If a Page Erase function is given to an address that has been protected by the Block Protect bits (BP0, BP1) then the sequence will be aborted and no erase will occur. The Page Erase function is entered by driving CS low, followed by the instruction code (Figure 2-8), and three address bytes. Any address inside the page to be erased is a valid address. FIGURE 2-8: PAGE ERASE SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 10 11 29 30 31 SCK Instruction SI 0 1 0 0 0 24-bit Address 0 1 0 23 22 21 20 2 1 0 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 15 25AA1024 2.9 SECTOR ERASE CS must then be driven high after the last bit if the address or the Sector Erase will not execute. Once the CS is driven high, the self-timed Sector Erase cycle is started. The WIP bit in the STATUS register can be read to determine when the Sector Erase cycle is complete. The Sector Erase function will erase all bits (FFh) inside the given sector. A Write Enable (WREN) instruction must be given prior to executing a Sector Erase. This is done by setting CS low and then clocking out the proper instruction into the 25AA1024. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write enable latch. If a SECTOR ERASE instruction is given to an address that has been protected by the Block Protect bits (BP0, BP1) then the sequence will be aborted and no erase will occur. The Sector Erase function is entered by driving CS low, followed by the instruction code (Figure 2-9), and three address bytes. Any address inside the sector to be erased is a valid address. FIGURE 2-9: See Table 2-3 for Sector Addressing. SECTOR ERASE SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 10 11 29 30 31 SCK Instruction SI 1 1 0 1 1 24-bit Address 0 0 0 23 22 21 20 2 1 0 High-Impedance SO DS20001836J-page 16 2007-2015 Microchip Technology Inc. 25AA1024 2.10 CHIP ERASE The Chip Erase function will erase all bits (FFh) in the array. A Write Enable (WREN) instruction must be given prior to executing a Chip Erase. This is done by setting CS low and then clocking out the proper instruction into the 25AA1024. After all eight bits of the instruction are transmitted, the CS must be brought high to set the write enable latch. The CS pin must be driven high after the eighth bit of the instruction code has been given or the Chip Erase function will not be executed. Once the CS pin is driven high, the self-timed Chip Erase function begins. While the device is executing the Chip Erase function the WIP bit in the STATUS register can be read to determine when the Chip Erase function is complete. The Chip Erase function is entered by driving the CS low, followed by the instruction code (Figure 2-10) onto the SI line. The Chip Erase function is ignored if either of the Block Protect bits (BP0, BP1) are not 0, meaning ¼, ½, or all of the array is protected. FIGURE 2-10: CHIP ERASE SEQUENCE CS 0 1 2 3 4 5 6 7 SCK SI 1 1 0 0 0 1 1 1 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 17 25AA1024 2.11 DEEP POWER-DOWN MODE Deep Power-Down mode of the 25AA1024 is its lowest power consumption state. The device will not respond to any of the Read or Write commands while in Deep Power-Down mode, and therefore it can be used as an additional software write protection feature. All instructions given during Deep Power-Down mode are ignored except the Read Electronic Signature Command (RDID). The RDID command will release the device from Deep Power-down and outputs the electronic signature on the SO pin, and then returns the device to Standby mode after delay (TREL). The Deep Power-Down mode is entered by driving CS low, followed by the instruction code (Figure 2-11) onto the SI line, followed by driving CS high. Deep Power-Down mode automatically releases at device power-down. Once power is restored to the device, it will power-up in the Standby mode. If the CS pin is not driven high after the eighth bit of the instruction code has been given, the device will not execute Deep Power-down. Once the CS line is driven high, there is a delay (TDP) before the current settles to its lowest consumption. FIGURE 2-11: DEEP POWER-DOWN SEQUENCE CS 0 1 2 3 4 5 6 7 SCK SI 1 0 1 1 1 0 0 1 High-Impedance SO DS20001836J-page 18 2007-2015 Microchip Technology Inc. 25AA1024 2.12 RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE Once the device has entered Deep Power-Down mode, all instructions are ignored except the release from Deep Power-down and Read Electronic Signature command. This command can also be used when the device is not in Deep Power-down, to read the electronic signature out on the SO pin unless another command is being executed such as Erase, Program or Write STATUS register. FIGURE 2-12: Release from Deep Power-Down mode and Read Electronic Signature is entered by driving CS low, followed by the RDID instruction code (Figure 2-12) and then a dummy address of 24 bits (A23-A0). After the last bit of the dummy address is clocked in, the 8-bit electronic signature is clocked out on the SO pin. After the signature has been read out at least once, the sequence can be terminated by driving CS high. After a delay of TREL, the device will then return to Standby mode and will wait to be selected so it can be given new instructions. If additional clock cycles are sent after the electronic signature has been read once, it will continue to output the signature on the SO line until the sequence is terminated. RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE CS TREL 0 1 2 3 4 5 6 7 8 9 10 11 29 30 31 32 33 34 35 36 37 38 39 SCK Instruction SI 1 0 1 0 24-bit Address 1 0 1 1 23 22 21 20 2 1 0 Electronic Signature Out High-Impedance SO 7 6 0 0 5 4 3 2 1 0 1 0 1 0 0 1 Manufacturers ID 0x29 Driving CS high after the 8-bit RDID command, but before the electronic signature has been transmitted, will still ensure the device will be taken out of Deep Power-Down mode, as shown in Figure 2-13. FIGURE 2-13: RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE CS 0 1 2 3 4 5 6 0 1 7 TREL SCK Instruction SI 1 0 1 0 1 1 High-Impedance SO 2007-2015 Microchip Technology Inc. DS20001836J-page 19 25AA1024 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Name Pin Number CS 1 Chip Select Input SO 2 Serial Data Output WP 3 Write-Protect Pin VSS 4 Ground SI 5 Serial Data Input SCK 6 Serial Clock Input HOLD 7 Hold Input VCC 8 Supply Voltage 3.1 Function Chip Select (CS) A low level on this pin selects the device. A high level deselects the device and forces it into Standby mode. However, a programming cycle which is already initiated or in progress will be completed, regardless of the CS input signal. If CS is brought high during a program cycle, the device will go into Standby mode as soon as the programming cycle is complete. When the device is deselected, SO goes to the high-impedance state, allowing multiple parts to share the same SPI bus. A low-to-high transition on CS after a valid write sequence initiates an internal write cycle. After power-up, a low level on CS is required prior to any sequence being initiated. 3.2 Serial Output (SO) The SO pin is used to transfer data out of the 25AA1024. During a read cycle, data is shifted out on this pin after the falling edge of the serial clock. 3.3 The WP pin function is blocked when the WPEN bit in the STATUS register is low. This allows the user to install the 25AA1024 in a system with WP pin grounded and still be able to write to the STATUS register. The WP pin functions will be enabled when the WPEN bit is set high. 3.4 Serial Input (SI) The SI pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the serial clock. 3.5 Serial Clock (SCK) The SCK is used to synchronize the communication between a master and the 25AA1024. Instructions, addresses or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin is updated after the falling edge of the clock input. 3.6 Hold (HOLD) The HOLD pin is used to suspend transmission to the 25AA1024 while in the middle of a serial sequence without having to retransmit the entire sequence again. It must be held high any time this function is not being used. Once the device is selected and a serial sequence is underway, the HOLD pin may be pulled low to pause further serial communication without resetting the serial sequence. The HOLD pin must be brought low while SCK is low, otherwise the HOLD function will not be invoked until the next SCK high-to-low transition. The 25AA1024 must remain selected during this sequence. The SI, SCK and SO pins are in a high-impedance state during the time the device is paused and transitions on these pins will be ignored. To resume serial communication, HOLD must be brought high while the SCK pin is low, otherwise serial communication will not resume. Pulling the HOLD line low at any time will tri-state the SO line. Write-Protect (WP) This pin is used in conjunction with the WPEN bit in the STATUS register to prohibit writes to the nonvolatile bits in the STATUS register. When WP is low and WPEN is high, writing to the nonvolatile bits in the STATUS register is disabled. All other operations function normally. When WP is high, all functions, including writes to the nonvolatile bits in the STATUS register, operate normally. If the WPEN bit is set, WP low during a STATUS register write sequence will disable writing to the STATUS register. If an internal write cycle has already begun, WP going low will have no effect on the write. DS20001836J-page 20 2007-2015 Microchip Technology Inc. 25AA1024 4.0 PACKAGING INFORMATION 4.1 Package Marking Information Legend: XX...X T Y YY WW NNN e3 8-Lead DFN Example: XXXXXXX T/XXXXX YYWW NNN 5AA1024 I/MF e3 1509 1L7 8-Lead PDIP Example: XXXXXXXX T/XXXNNN YYWW 25AA1024 I/P e3 1L7 1509 8-Lead SOIJ Example: XXXXXXXX T/XXXXXX YYWWNNN 25AA1024 I/SM e3 15091L7 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) JEDEC® designator for Matte Tin (Sn) Note: For very small packages with no room for the JEDEC® designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2007-2015 Microchip Technology Inc. DS20001836J-page 21 25AA1024 /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH0)±[PP%RG\>')16@ 381&+ 6,1*8/$7(' 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D e D1 L b N N K E E2 E1 EXPOSED PAD NOTE 1 2 2 1 1 NOTE 1 D2 TOP VIEW BOTTOM VIEW φ A2 A A1 A3 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ %DVH7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 0ROGHG3DFNDJH/HQJWK ' ([SRVHG3DG/HQJWK ' 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( ([SRVHG3DG:LGWK ( E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± 0RGHO'UDIW$QJOH7RS ± ± &RQWDFW:LGWK %6& %6& %6& %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS20001836J-page 22 2007-2015 Microchip Technology Inc. 25AA1024 /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH0)±[PP%RG\>')16@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D L b N N K E2 E EXPOSED PAD NOTE 1 1 2 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ %6& 6WDQGRII $ &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK ' ([SRVHG3DG:LGWK ( &RQWDFW:LGWK E &RQWDFW/HQJWK / %6& &RQWDFWWR([SRVHG3DG . ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ ± 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2007-2015 Microchip Technology Inc. DS20001836J-page 23 25AA1024 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS20001836J-page 24 2007-2015 Microchip Technology Inc. 25AA1024 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 2007-2015 Microchip Technology Inc. DS20001836J-page 25 25AA1024 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20001836J-page 26 2007-2015 Microchip Technology Inc. 25AA1024 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2007-2015 Microchip Technology Inc. DS20001836J-page 27 25AA1024 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001836J-page 28 2007-2015 Microchip Technology Inc. 25AA1024 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2007-2015 Microchip Technology Inc. DS20001836J-page 29 25AA1024 APPENDIX A: REVISION HISTORY Revision C (02/2007) Revised Features Section (Self-timed Erase and Write Cycles); Revised Table 1-1 (parameters D012 and D13); Table 1-2 (parameters 20-24); Revised Package Marking Information; Replaced Package Drawings; Revised Product ID System Section (SM package); Changed PICmicro to PIC. Revision D (07/2007) Revised Features; Revised Tables 1-1 and 1-2 (added Industrial temp. and revised parameters 22-23); Replaced Package Drawings (Rev. AP); Revised Product ID System; Changed Flash to EEPROM. Revision E (10/2007) Removed 25LC1024 part number; New data sheet created for 25LC1024 (DS22064); Revised Tables; Updates throughout. Revision F (05/2008) Modified parameter D006 in Table 1-1; Revised Package Marking Information; Replaced Package Drawings. Revision G (01/2010) Added 8-Lead (MF) DFN-S Land Pattern; Replaced 8-Lead (SM) SOIJ Land Pattern. Revision H (05/2010) Revised Table 1-2, Param. No 25 Conditions; Revised Section 2.2; Added note. Revision J (04/2015) Corrected Features section; Revised Table 1-2, updated ‘Conditions’; Revised Figure 2-12, added parameter TREL; Revised Section 2-12, clarified condition for existing Deep Power-Down mode. DS20001836J-page 30 2007-2015 Microchip Technology Inc. 25AA1024 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2007-2015 Microchip Technology Inc. DS20001836J-page 31 25AA1024 NOTES: DS20001836J-page 32 2007-2015 Microchip Technology Inc. 25AA1024 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) X /XX Device Tape and Reel Option Temperature Range Package Examples: a) b) 25AA1024 Device: Tape & Option: Reel Blank T 1 Mbit, 1.8V, 256-Byte Page SPI Serial EEPROM = = Standard packaging (tube) Tape & Reel Temperature Range: I = -40C to+85C Package: MF P SM = = = Micro Lead Frame (6 x 5 mm body), 8-lead Plastic DIP (300 mil body), 8-lead Plastic SOIJ (5.28 mm), 8-lead 2007-2015 Microchip Technology Inc. 25AA1024T-I/SM = 1 Mbit, 1.8V Serial EEPROM, Industrial temp., Tape & Reel, SOIJ package 25AA1024T-I/MF = 1 Mbit, 1.8V Serial EEPROM, Industrial temp., Tape & Reel, DFN package Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20001836J-page 33 25AA1024 NOTES: DS20001836J-page 34 2007-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2007-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-265-7 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2007-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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