STNRGxxxA Digital controller for power conversion applications with up to 6 programmable PWM generators, 96 MHz PLL Datasheet - production data – Data memory: 1 Kbyte true data E2PROM; data retention:15 years at 85 °C after 100 kcycles at 85 °C – RAM: 6 Kbytes Features Up to 6 programmable PWM generators (SMED - “State Machine Event Driven”) – 10 ns event detection and reaction – Max.1.3 ns PWM resolution – Single, coupled and two coupled operational modes – Up to 3 internal/external events per SMED 4 analog comparators – 4 internal 4-bit references – Up to 4 external references – Less than 50 ns propagation time – Continuous comparison cycle – Configurable hysteresis voltage levels ADCs (up to 8 channels) – 10-bit precision, with operational amplifier to extend resolution to 12-bit equivalent – Sequencer functionality – Input impedance: 1 M – Configurable gain value: x1 and x4 Integrated microcontroller – Advanced STM8® core with Harvard architecture and 3-stage pipeline – Max. fCPU: 16 MHz This is information on a product in full production. Basic peripherals – System, auxiliary and basic timers – IWDG/WWDG watchdog, AWU, ITC Reset and supply management – Multiple low power modes (wait, slow, autowakeup, Halt) with user definable clock gating – Low consumption power-on and powerdown reset I/O – Multifunction bidirectional GPIO with highly robust design, immune against current injection – Fast digital input DIGIN, with configurable pull-up Communication interfaces – UART asynchronous with SW flow control and bootloader support – I2C master/slave fast-slow speed rate Operating temperature: -40 °C up to 105 °C. Table 1. Device summary Memories – Flash and E2PROM with read while write (RWW) and error correction code (ECC) – Program memory: 32 Kbytes Flash; data retention 15 years at 85 °C after 10 kcycles at 25 °C April 2015 Clock management – Internal 96 MHz PLL – Low power oscillator circuit for external crystal resonator or direct clock input – Internal, user-trimmable 16 MHz RC and low power 153.6 kHz RC oscillators – Clock security system with clock monitor Part number Package STNRG388A TSSOP38 STNRG328A VFQFPN32 STNRG288A TSSOP28 DocID027799 Rev 1 1/130 www.st.com Contents STNRGxxxA Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 STNRG family features list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 Introducing SMED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 System architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.1 5.2 5.3 5.4 2/130 SMED (state machine event driven): configurable PWM generator . . . . . 17 5.1.1 SMED coupling schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1.2 Connection matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Internal controller (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.1 Architecture and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.2 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.3 Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.4 Single wire interface module (SWIM) . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2.5 Debug module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Basic peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3.1 Vectored interrupt controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3.2 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3.3 Flash program and data E2PROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3.4 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3.5 Write protection (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3.6 Protection of user boot code (UBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3.7 Read-out protection (ROP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Clock controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.4.1 Internal 16 MHz RC oscillator (HSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.4.2 Internal 153.6 kHz RC oscillator (LSI) . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.4.3 Internal 96 MHz PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.4.4 External clock input/crystal oscillator (HSE) . . . . . . . . . . . . . . . . . . . . . 26 DocID027799 Rev 1 STNRGxxxA 6 7 Contents 5.5 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.6 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.6.1 Universal asynchronous receiver/transmitter (UART) . . . . . . . . . . . . . . 28 5.6.2 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.7 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.8 Analog comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 6.3 Input/output specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 I/O multifunction signal configuration . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.1 Multifunction configuration policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.2 Port P0 I/O multifunction configuration signal . . . . . . . . . . . . . . . . . . . . . 37 7.3 7.4 7.5 7.6 7.2.1 Alternate function P0 configuration signals . . . . . . . . . . . . . . . . . . . . . . 37 7.2.2 Port P0 diagnostic signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 7.2.3 Port P0 I/O functional multiplexing signal . . . . . . . . . . . . . . . . . . . . . . . 39 7.2.4 P0 interrupt capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.2.5 P0 programmable pull-up and speed feature . . . . . . . . . . . . . . . . . . . . 39 Port P1 I/O multifunction configuration signal . . . . . . . . . . . . . . . . . . . . . 40 7.3.1 Port P1 I/O multiplexing signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.3.2 P1 interrupt capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.3.3 P1 programmable pull-up feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Port P2 I/O multifunction configuration signal . . . . . . . . . . . . . . . . . . . . . 41 7.4.1 P2 ADC hardware trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.4.2 P2 interrupt capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.4.3 P2 programmable pull-up feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Port P3 analog signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.5.1 P3 ADC conversion request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.5.2 P3 interrupt capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Multifunction port configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . 44 MSC_IOMXP0 (Port P1 I/O MUX control register). . . . . . . . . . . . . . . . . . . . . . . . . 44 MSC_IOMXP1 (Port P1 I/O MUX control register). . . . . . . . . . . . . . . . . . . . . . . . . 45 MSC_IOMXP2 (Port P2 I/O MUX control register). . . . . . . . . . . . . . . . . . . . . . . . . 46 MSC_INPP2AUX1 (INPP aux register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 DocID027799 Rev 1 3/130 130 Contents 8 STNRGxxxA Memory and register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 8.1 Memory map overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 8.2 Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 8.2.1 General purpose I/O GPIO0 register map . . . . . . . . . . . . . . . . . . . . . . . 49 8.2.2 General purpose I/O GPIO1 register map . . . . . . . . . . . . . . . . . . . . . . . 49 8.2.3 Miscellaneous registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 8.2.4 Flash and E2PROM non-volatile memories . . . . . . . . . . . . . . . . . . . . . . 53 8.2.5 Reset register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.2.6 Clock controller register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 8.2.7 WWDG timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 8.2.8 IWDG timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 8.2.9 AWU timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 8.2.10 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 8.2.11 Universal asynchronous receiver/transmitter (UART) . . . . . . . . . . . . . . 56 8.2.12 System timer registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.2.13 Auxiliary timer registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.2.14 Basic timer0 registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 8.2.15 Basic timer1 registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 8.2.16 Digital addressable lighting interface (DALI) . . . . . . . . . . . . . . . . . . . . . 58 8.2.17 DALI noise rejection filter registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 8.2.18 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 8.2.19 State machine event driven (SMEDs) . . . . . . . . . . . . . . . . . . . . . . . . . . 60 8.2.20 CPU register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 8.2.21 Global configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 8.2.22 Interrupt controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 8.2.23 SWIM control register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 9 Interrupt table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 10 Option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 4/130 10.1 Option byte register overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 10.2 Option byte register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 10.2.1 ROP (memory read-out protection register) . . . . . . . . . . . . . . . . . . . . . 70 10.2.2 UBC (UBC user boot code register) . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 10.2.3 nUBC (UBC user boot code register protection) . . . . . . . . . . . . . . . . . . 71 10.2.4 GENCFG (general configuration register) . . . . . . . . . . . . . . . . . . . . . . . 71 10.2.5 nGENCFG (general configuration register protection) . . . . . . . . . . . . . . 72 DocID027799 Rev 1 STNRGxxxA Contents 10.2.6 MISCUOPT (miscellaneous configuration register) . . . . . . . . . . . . . . . . 72 10.2.7 nMISCUOPT (miscellaneous configuration register protection) . . . . . . 73 10.2.8 CLKCTL (CKC configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . 73 10.2.9 nCLKCTL (CKC configuration register protection) . . . . . . . . . . . . . . . . . 74 10.2.10 HSESTAB (HSE clock stabilization register) . . . . . . . . . . . . . . . . . . . . . 74 10.2.11 nHSESTAB (HSE clock stabilization register protection) . . . . . . . . . . . . 75 10.2.12 ENHFEAT (EXP features configuration register) . . . . . . . . . . . . . . . . . . 75 10.2.13 nENHFEAT (EXP features configuration register) . . . . . . . . . . . . . . . . . 76 10.2.14 WAITSTATE (Flash wait state register) . . . . . . . . . . . . . . . . . . . . . . . . . 76 10.2.15 nWAITSTATE (Flash wait state register protection) . . . . . . . . . . . . . . . . 77 10.2.16 AFR_IOMXP0 (alternative Port0 configuration register) . . . . . . . . . . . . 77 10.2.17 nAFR_IOMXP0 (alternative Port0 configuration register protection) . . . 78 10.2.18 AFR_IOMXP1 (alternative Port1 configuration register) . . . . . . . . . . . . 78 10.2.19 nAFR_IOMXP1 (alternative Port1 configuration register protection) . . . 79 10.2.20 AFR_IOMXP2 (alternative Port2 configuration register) . . . . . . . . . . . . 79 10.2.21 nAFR_IOMXP2 (alternative Port2 configuration register protection) . . . 80 10.2.22 MSC_OPT0 (miscellaneous configuration reg0) . . . . . . . . . . . . . . . . . . 80 10.2.23 nMSC_OPT0 (miscellaneous configuration reg0 protection) . . . . . . . . . 81 10.2.24 OPTBL (option byte bootloader) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 10.2.25 nOPTBL (option byte boot loader protection) . . . . . . . . . . . . . . . . . . . . 82 11 12 Device identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 11.1 Unique ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 11.2 Device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1.4 Typical current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 12.1.5 Loading capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 12.1.6 Pin output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 12.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 12.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 12.3.1 VOUT external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 12.3.2 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 DocID027799 Rev 1 5/130 130 Contents STNRGxxxA 12.3.3 Low power mode wake-up time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 12.3.4 External clock sources and timing characteristics . . . . . . . . . . . . . . . . . 99 12.3.5 Internal clock sources and timing characteristics . . . . . . . . . . . . . . . . 102 12.3.6 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 12.3.7 I/O port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 12.3.8 Typical output level curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 12.3.9 Reset pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 12.3.10 I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 12.3.11 10-bit SAR ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 12.3.12 Analog comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 12.3.13 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 12.4 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 12.4.1 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 12.4.2 Static latch-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 13 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 14 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 14.1 TSSOP38 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 14.2 VFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 14.3 TSSOP28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 15 STNRG development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 16 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 6/130 DocID027799 Rev 1 STNRGxxxA List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 STNRG family features list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Connection matrix interconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Multifunction configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 P0 internal multiplexing signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Port P1 I/O multiplexing signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Port P2 I/O multiplexing signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 MSC_IOMXP0 (Port P1 I/O MUX control register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 MSC_IOMXP1 (Port P1 I/O MUX control register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 MSC_IOMXP2 (Port P2 I/O MUX control register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 MSC_INPP2AUX1 (INPP aux register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Internal memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 General purpose I/O GPIO0 register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 General purpose I/O GPIO0 register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Miscellaneous direct register address mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Miscellaneous indirect register address mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Non-volatile memory register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 RST_SR register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Clock controller register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 WWDG timer register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 IWDG timer register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 AWU timer register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 I2C register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 UART register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 System timer register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Auxiliary timer register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Basic timer0 register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Basic timer1 register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 DALI register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 DALI filter register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 ADC register map and reset value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 SMED register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 CPU register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 CFG_GCR register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Interrupt software priority register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 SWIM register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Interrupt vector exception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Option byte register overview - STNRG388A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Option byte register overview - STNRG328A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Option byte register overview - STNRG288A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 ROP (memory read-out protection register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 UBC (UBC user boot code register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 nUBC (UBC user boot code register protection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 GENCFG (general configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 nGENCFG (general configuration register protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 MISCUOPT (miscellaneous configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 nMISCUOPT (miscellaneous configuration register protection) . . . . . . . . . . . . . . . . . . . . . 73 DocID027799 Rev 1 7/130 130 List of tables Table 49. Table 50. Table 51. Table 52. Table 53. Table 54. Table 55. Table 56. Table 57. Table 58. Table 59. Table 60. Table 61. Table 62. Table 63. Table 64. Table 65. Table 66. Table 67. Table 68. Table 69. Table 70. Table 71. Table 72. Table 73. Table 74. Table 75. Table 76. Table 77. Table 78. Table 79. Table 80. Table 81. Table 82. Table 83. Table 84. Table 85. Table 86. Table 87. Table 88. Table 89. Table 90. Table 91. Table 92. Table 93. Table 94. Table 95. Table 96. Table 97. Table 98. Table 99. Table 100. 8/130 STNRGxxxA CLKCTL (CKC configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 nCLKCTL (CKC configuration register protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 HSESTAB (HSE clock stabilization register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 nHSESTAB (HSE clock stabilization register protection) . . . . . . . . . . . . . . . . . . . . . . . . . . 75 ENHFEAT (EXP features configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 nENHFEAT (EXP features configuration protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 WAITSTATE (Flash wait state register) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 nWAITSTATE (Flash wait state protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 AFR_IOMXP0 (alternative Port0 configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 nAFR_IOMXP0 (alternative Port0 configuration register protection) . . . . . . . . . . . . . . . . . 78 AFR_IOMXP1 (alternative Port1 configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 nAFR_IOMXP1 (alternative Port1 configuration register protection) . . . . . . . . . . . . . . . . . 79 AFR_IOMXP2 (alternative Port2 configuration register) . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 nAFR_IOMXP2 (alternative Port2 configuration register protection) . . . . . . . . . . . . . . . . . 80 MSC_OPT0 (miscellaneous configuration reg0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 nMSC_OPT0 (miscellaneous configuration reg0 protection) . . . . . . . . . . . . . . . . . . . . . . . 81 OPTBL (option byte bootloader) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 nOPTBL (option byte boot loader protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Unique ID register overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Dev ID register overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Device revision model overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Operating conditions at power-up/power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Supply base current consumption at VDD/VDDA = 3.3/5 V . . . . . . . . . . . . . . . . . . . . . . . . . 91 Supply low power consumption at VDD/VDDA = 3.3/5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Peripheral supply current consumption at VDD/VDDA = 3.3 V . . . . . . . . . . . . . . . . . . . . . . . 93 Peripheral supply current consumption at VDD/VDDA = 5 V . . . . . . . . . . . . . . . . . . . . . . . . 95 Wake-up times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 HSE user external clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 HSE crystal/ceramic resonator oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 HSI RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 LSI RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 PLL internal source clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Flash program memory/data E2PROM memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Voltage DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Current DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Operating frequency characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 ADC accuracy characteristics at VDD/VDDA 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 ADC accuracy characteristics at VDD/VDDA 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Analog comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Analog comparator hysteresis at VDD/VDDA 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Analog comparator hysteresis at VDD/VDDA 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Electrical sensitivity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 DocID027799 Rev 1 STNRGxxxA Table 101. Table 102. Table 103. Table 104. Table 105. List of tables TSSOP38 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 VFQFPN32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 TSSOP28 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 DocID027799 Rev 1 9/130 130 List of figures STNRGxxxA List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. 10/130 STNRG internal design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Coupled SMED overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SMED subsystem overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Flash and E2PROM internal memory organizations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 STNRG388A - TSSOP38 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 STNRG328A - VFQFPN32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 STNRG288A - TSSOP28 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Port P0 I/O functional multiplexing scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Port P1 I/O multiplexing scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Supply current measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 External capacitor CVOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 PWM current consumption with fSMED = PLL fPWM = 0.5 MHz at VDD/VDDA = 3.3 V . . . . . 97 PWM current consumption with fSMED = PLL fPWM = 0.5 MHz at VDD/VDDA = 5 V . . . . . . 97 PWM current consumption with fSMED = HSI fPWM = 0.5 MHz at VDD/VDDA = 3.3 V . . . . . 98 PWM current consumption with fSMED = HSI fPWM = 0.5 MHz at VDD/VDDA = 5 V. . . . . . . 98 HSE external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 HSE oscillator circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 VOH standard pad at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 VOL standard pad at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 VOH standard pad at 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 VOL standard pad at 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 VOH fast pad at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 VOL fast pad at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 VOH fast pad at 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 VOL fast pad at 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 VOH high speed pad at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 VOL high speed pad at 3.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 VOH high speed pad at 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 VOL high speed pad at 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 ADC equivalent input circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 ADC conversion accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 TSSOP38 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 VFQFPN32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 TSSOP28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 DocID027799 Rev 1 STNRGxxxA 1 Description Description STNRG devices are a part of the STNRG family of STMicroelectronics® digital devices designed for advanced power conversion applications. The STNRG improves the design of the successful STLUX™ family, now integrated in a wide range of LED driver architectures, to support industrial power conversion applications such as PFC+LLC, interleaved LC DC/DC, interleaved PFC for smart power supplies as well as the full bridge for pilot line drivers for electric vehicles. DocID027799 Rev 1 11/130 130 STNRG family features list 2 STNRGxxxA STNRG family features list All devices of the STNRG family provide the following features: Table 2. STNRG family features list Device Feature list STNRG388A STNRG328A STNRG288A Package TSSOP38 VFQFPN32 TSSOP28 Pin count 38 32 28 SMED numbers 6 6 6 SMED PWM output pins 6 5 4 Fast digital inputs pins 6 5(1) 3(2) Positive comparator input pin 4 4 4(3) Negative comparator input pins 3(4) 1 1(3) Comparator hysteresis Yes Yes Yes Internal DACs 4 4 4 ADC input pins 8 6 6 x1 - x4 x1 x1 Yes Yes Yes 6 4 4 Yes Yes Yes Yes Yes Yes Yes Yes Yes System timer 1 1 1 Auxiliary timer 1 1 1 Basic timer 2 2 2 1 1 1 Window watchdog timer 1 1 1 Independent watchdog timer 1 1 1 Flash program memory 32 Kbytes 32 Kbytes 32 Kbytes EEPROM data memory 1 Kbytes 1 Kbytes 1 Kbytes RAM 6 Kbytes 6 Kbytes 6 Kbytes Mixed Mixed Mixed ADC gain ADC hardware trigger GPIO Port 0 pins Communication UART peripheral I 2C peripheral HSE function Timers Auto-wakeup timer Watchdog SWIM pin 1. DIGIN2 - DIGIN3 are connected to the same pin. 2. DIGIN0 - DIGIN1, DIGIN2 - DIGIN3 and DIGIN4 - DIGIN5 are connected to the same pin. 3. CPP2 and CPM3are connected to the same pin. 4. Some CPM pin is shared with other signals. 12/130 DocID027799 Rev 1 STNRGxxxA 3 Introducing SMED Introducing SMED The heart of the STNRG controller family is the SMED (state machine event driven) technology which allows the device to pilot six independently configurable PWM clocks with a maximum resolution of 1.3 ns. A SMED is a powerful autonomous state machine, which is programmed to react to both external and internal events and may evolve without any software intervention. The SMED reaction time can be as low as 10.4 ns, giving the STNRG the ability of operating in time critical applications. The SMEDs offer superior performances when compared to traditional, timer based, PWM generators. Each SMED is configured via the STNRG internal microcontroller. The integrated controller extends the STNRG reliability and guarantees more than 15 years of both operating lifetime and memory data retention for program and data memory after cycling. A set of dedicated peripherals complete the STNRG device: 4 analog comparators with configurable references and 50 ns max. propagation delay. It is ideal to implement zero current detection algorithms or detect current peaks. 10-bit ADC with configurable op amp and 8-channel sequencer. 96 MHz PLL for high output signal resolution. Documentation This datasheet contains the description of features, pinout, pin assignment, electrical characteristics, mechanical data and ordering information. For information on programming, erasing and protection of the internal Flash memory, please refer to the STM8S reference in the programming manual “How to program STM8S and STM8A Flash program memory and data EEPROM” (PM0051). For information on the debug and SWIM (single wire interface module) interface refer to the “STM8 SWIM communication protocol and debug module” user manual (UM0470). For information on the STM8 core, please refer to the “STM8 CPU programming manual” (PM0044). DocID027799 Rev 1 13/130 130 System architecture 4 STNRGxxxA System architecture The STNRG device generates and controls PWM signals by means of a state machine, called SMED (state machine event driven). Figure 1 gives an overview of the internal architecture. Figure 1. STNRG internal design 4.&%QPXFSDPOWFSTJPODPSF )4& -4* L)[ )4* .I[ $-, 1--.I[ Y 4.&%TTUBUF NBDIJOF )PME *OJU YDY PNQBSBUPST "OBMPH JOUFSOBM % "$ $PNQBSBUPS PSFYUFSOBMSFG 4 4 4 4 6QUP 18. YFWFOUT 18.T 6QUPEJHJUBMJOQVU T "%$USJHHFS 01". 1 4FSJBM *$ "%$XJUI TFRVFODFS $16 %FWJDFTVQFSWJTPS$16 ".W The core of the device is the SMED unit: a hardware state machine driven by system events. The SMED includes 4 states (S0, S1, S2 and S3) available during running operations. A special HOLD state is provided as well. The SMED allows the user to configure, for every state, which system events will trigger a transaction to a new state. During a transaction from one state to the other, the PWM output signal level can be updated. Once a SMED is configured and running, it becomes an autonomous unit, so no interaction is required since the SMED automatically reacts to system events. Thanks to the SMED's 96 MHz operating frequency and their automatic dithering function, the PWM maximum resolution is 1.3 ns. The STNRG family has 6 SMEDs available. Multiple SMEDs can operate independently from each other or they can be grouped together to form a more powerful state machine. The STNRG also integrates a low power STM8 microcontroller which is used to configure and monitor the SMED activity and to supply external communication such as the UART or I2C. The STM8 controller has full access to all the STNRG subsystems, including the 14/130 DocID027799 Rev 1 STNRGxxxA System architecture SMEDs. The STNRG family also features a sequential ADC, which can be configured to continuously sample up to 8 channels. Section : Block diagram illustrates the overall system block and shows how SMEDs have been implemented in the STNRG architecture. DocID027799 Rev 1 15/130 130 System architecture STNRGxxxA Block diagram Figure 2. Internal block diagram -4*JOUPTDJMMBUPS 3FTFUDPOUSPMMFS $MPD LDPOUSPMMFS 103 )4*JOUPTDJMMBUPS 1--.)[ )4&FYUPTDJMMBUPS $MPDLDPOUSPMMFS QPXFS NBOBHFNFOU .73 .-7% -73 %-7% 3FTFUDPOUSPM VOJU ,#'MBTI QSPHSBNNFNPSZ 1 ,#&¢130. EBUBNFNP SZ 6"35 ,#3". (1*0 * 0 ,#30. CPPUMPBEFS *$ .4$ .JTDSFHJTUFST *OUFSOBM DPOUSPMMFS "EESFTTBOE EBUB CVT 1 * O U %JHJUBMJOQVUMJOFT * 0 $PNQBSBUPS%"$ 48*.%. EFCVHNPEVMF # $POOFDUJPO#PY V T *5$ *OUFSSVQU$USM 4.&%18. "86 "VUPXBLFVQ 4 4.&%18. . & 4.&%18. % 4.&%18. 1 4.&%18. 0 4.&%18. 88%( 8JOXBUDIEPH *8%( *OEXBUDIEPH * (1*0 5*.&34 4ZTUFNUJNFS "VYUJNFS #BTJDUJNFS #BTJDUJNFS "%$XJUI01".1 ". 16/130 DocID027799 Rev 1 STNRGxxxA 5 Product overview Product overview Section 5.1 describes the features implemented in the product device. 5.1 SMED (state machine event driven): configurable PWM generator The SMED is an advanced programmable PWM generator signal. The SMED (state machine event driven) is a state machine device controllable by both external events (primary I/O signals) and internal events (counter timers), which generate an output signal (PWM) depending on the evolution of the internal state machine. The PWM signal generated by the SMED is therefore shaped by external events and not only by a simple timer. This mechanism allows to generate controlled high frequency PWM signals. The SMED is also autonomous: once it has been configured by the STNRG internal controller, the SMED can operate without any software interaction. The STNRG family provides 6 SMED units. Multiple SMEDs can operate independently from each other or they can be grouped together to form a more powerful state machine. The main features of a SMED are described here below: Configurable state machine generating a PWM signal More than 10.4 ns PWM native resolution Up to 1.3 ns PWM resolution when using SMED dithering 6 states available in each SMED: IDLE, S0, S1, S2, S3 plus a special HOLD state Transactions triggered by synchronous and asynchronous external events or an internal timer Each transaction can generate an interrupt Fifteen registers available to configure the state machine behavior Four 16-bit configurable time registers, one for each running state (T0, T1, T2, T3) Internal resources accessible through the processor interface Eight interrupt request lines Configurable ADC HW trigger request PWM pseudo open drain features configurable through GPIO1 registers DocID027799 Rev 1 17/130 130 Product overview 5.1.1 STNRGxxxA SMED coupling schemes The SMED coupling extends the capability of the single SMED, preserving the independence of each “Finite State Machine” (FSM) programmed state evolution. The coupling scheme allows the SMED pulse signals to be interleaved on their own PWM or on a merged single PWM output. The STNRG supports the following coupled configuration schemes: Single SMED configuration Synchronous coupled SMED Asynchronous coupled SMED Synchronous two coupled SMEDs Asynchronous two coupled SMEDs External controlled SMED The SMED units may be configured in different coupled schemes through the SMDx_GLBCONF and SMDx_DRVOUT bit fields of MSC_SMEDCFGxy registers. An outline of the SMED subsystem is shown in Figure 3. Figure 3. Coupled SMED overview 1. The PWM4 and PWM5 output pins are not present on all STNRG devices. 18/130 DocID027799 Rev 1 STNRGxxxA 5.1.2 Product overview Connection matrix The connection matrix extends the input connectivity of each SMED unit so that a SMED can receive events from a wide range of sources. Through the matrix, it's possible to connect the SMED inputs to various signal families such as digital inputs, comparator output signals, SW events, and three PWM internal feedback signals as shown in Figure 4. The list of the available event sources is the following: DIGIN [5:0] digital input lines CPM [3:0] analog comparator outputs PWM [5:0] output signals of SMEDs (only PWM 0, 1 and 5 are accessible) SW [5:0] software events Figure 4 shows the connection matrix and signal interconnections as they are implemented in the STNRG family. Figure 4. SMED subsystem overview 1. The CPP2 and CMP3 inputs are connected together in some STNRG devices. DocID027799 Rev 1 19/130 130 Product overview STNRGxxxA Connection matrix interconnection Every SMED unit has three input selection lines, one for each In_Sig input, configurable via the MSC_CBOXS (5:0) register. The selection lines choose the interconnection between one of possible four connection matrix signals for each SMED input event In_Sig (Y). Table 3 shows the layout of the connection matrix interconnection signals as implemented in the STNRG family. Table 3. Connection matrix interconnection Conb_s(x)_(y)(z) SMED number SMED input (x) (y) 00 01 10 11 0 0 CP0 DIG0 DIG2 DIG5 1 CP1 DIG0 DIG3 CP3 2 CP2 DIG1 DIG4 SW0 0 CP1 DIG1 DIG3 DIG0 1 CP2 DIG1 DIG4 CP3 2 CP0 DIG2 DIG5 SW1 0 CP2 DIG2 DIG4 DIG1 1 CP0 DIG2 DIG5 PWM0 2 CP1 DIG3 DIG0 SW2 0 CP0 DIG3 DIG5 DIG2 1 CP1 DIG3 DIG0 PWM1 2 CP2 DIG4 DIG1 SW3 0 CP1 DIG4 DIG0 DIG3 1 CP2 DIG4 DIG1 PWM5 2 CP0 DIG5 DIG2 SW4 0 CP2 DIG5 DIG1 DIG4 1 CP0 DIG5 DIG2 CP3 2 CP1 DIG0 DIG3 SW5 1 2 3 4 5 SMED input signal selection (z) Connection matrix legend: Note: 20/130 X represents the SMED [5:0] number Y represents the SMED input signal number (In_Sig [2:0]) Z represents the In_Sig (Y) selection signal Each SMED input has independent connection matrix selection signals. The DIG0 and DIG1 signal are interconnected together, the pin DIGIN [1_0] on the STNRG288A. The DIG2 and DIG3 signals are interconnected together, the pin DIGIN [3_2] on the STNRG328A and STNRG288A. DocID027799 Rev 1 STNRGxxxA Product overview The DIG4 and DIG5 signal are interconnected together, the pin DIGIN [5_4] on the STNRG288A. 5.2 Internal controller (CPU) The STNRG family integrates a programmable STM8 controller acting as a device supervisor. The STM8 is a modern CISC core and has been designed for code efficiency and performance. It contains 21 internal registers (six of them directly addressable in each execution context), 20 addressing modes including indexed indirect and relative addressing and 80 instructions. 5.2.1 Architecture and registers 5.2.2 5.2.3 5.2.4 Harvard architecture with 3-stage pipeline 32-bit wide program memory bus with single cycle fetching for most instructions X and Y 16-bit index registers, enabling indexed addressing modes with or without offset and read-modify-write type data manipulations 8-bit accumulator 24-bit program counter with 16 Mbyte linear memory space 16-bit stack pointer with access to a 64-Kbyte stack 8-bit condition code register with seven condition flags updated with the results of last executed instruction Addressing 20 addressing modes Indexed indirect addressing mode for lookup tables located in the entire address space Stack pointer relative addressing mode for efficient implementation of local variables and parameter passing Instruction set 80 instructions with 2-byte average instruction size Standard data movement and logic/arithmetic functions 8-bit by 8-bit multiplication 16-bit by 8-bit and 16-bit by 16-bit division Bit manipulation Data transfer between stack and accumulator (push/pop) with direct stack access Data transfer using the X and Y registers or direct memory-to-memory transfers Single wire interface module (SWIM) The single wire interface module (SWIM), together with the integrated debug module (DM), allows non-intrusive, real-time in-circuit debugging and fast memory programming. The interface can be activated in all device operation modes and can be connected to a running device (hot plugging).The maximum data transmission speed is 145 byte/ms. The SWIM pin is a multifunction signal. For further details refer to Table 7: Port P1 I/O multiplexing signal in Section 7.3 on page 40. DocID027799 Rev 1 21/130 130 Product overview 5.2.5 STNRGxxxA Debug module The non-intrusive debugging module is fully controllable through the external target emulator. Besides memory and peripheral operation, the CPU operation can also be monitored in real-time by means of shadow registers. 5.3 R/W of RAM and peripheral registers in real-time R/W for all resources when the application is stopped Breakpoints on all program-memory instructions (software breakpoints), except for the interrupt vector table Two advanced breakpoints and 23 predefined breakpoint configurations Basic peripherals Section 5.3.1 and Section 5.3.2 describe the basic peripherals accessed by the internal CPU controller. 5.3.1 5.3.2 Vectored interrupt controller Nested interrupts with three software priority levels 21 interrupt vectors with hardware priority Two vectors for 12 external maskable or un-maskable interrupt request lines Trap and reset interrupts Timers The STNRG family provides several timers which are used by software and do not interact directly with the SMED and the PWM generation. System timers The system timer consists of a 16-bit autoreload counter driven by a programmable prescaled clock and operating in one shoot or free running operating mode. The timer is used to provide the IC time base system clock, with an interrupt generation on timer overflow events. Basic timers The IC device includes two independent 6-bit timers programmable through the miscellaneous indirect register area. The time base frequency is configurable with different source clocks. The timers have the following functionalities: 22/130 Free running mode Timer prescaler 8-bits Counter register 6-bits Programmable time base clock (HSI, HSE, LSI, PLL) Interrupt timer capability: – Vectored interrupt – Interrupt IRQ/NMI or polling mode DocID027799 Rev 1 STNRGxxxA Product overview Auxiliary timer The auxiliary timer is a light timer with elementary functionality. The time base frequency is provided by the CCO clock logic (configurable with a different source clock and prescale division factors), while the interrupt functionality is supplied by an interrupt edge detection logic similarly to the solution adopted for the Port P0/P2. The timer has the following main features: Free running mode Up counter Timer prescaler 8-bit Interrupt timer capability: – Vectored interrupt – Interrupt IRQ/NMI or Polling mode Timer pulse configurable as a clock output signal via the CCO primary pin Thanks to the great configurability of the CCO frequency, the timer can cover a wide range of interval time to fit better the target application requirements. Auto-wakeup timer The AWU timer is used to cyclically wake-up the IC device from the active halt state. The AWU frequency time base fAWU can be selected between the following clock sources: LSI (153.6 kHz) and the external clock HSE scaled down to 128 kHz clock. By default the fAWU clock is provided by the LSI internal source clock. Watchdog timers The watchdog system is based on two independent timers providing a high level of robustness to the applications. The watchdog timer activity is controlled by the application program or by suitable option bytes. Once the watchdog is activated, it cannot be disabled by the user program without going through reset. Window watchdog timer The window watchdog is used to detect the occurrence of a software fault, usually generated by external interferences or by unexpected logical conditions, which causes the application program to break the normal operating sequence. The window function can be used to adjust the watchdog intervention period in order to match the application timing perfectly. The application software must refresh the counter before timeout and during a limited time window. If the counter is refreshed outside this time window, a reset is issued. Independent watchdog timer The independent watchdog peripheral can be used to solve malfunctions due to hardware or software failures. It is clocked by the 153.6 kHz LSI internal RC clock source. By properly setting the hardware watchdog feature associated option bits, the watchdog is automatically enabled at poweron, and generates a reset unless the key register is written by software before the counter reaches the end of the count. DocID027799 Rev 1 23/130 130 Product overview 5.3.3 STNRGxxxA Flash program and data E2PROM Embedded Flash and E2PROM with the memory ECC code correction and protection mechanism preventing embedded program hacking. 5.3.4 32 Kbyte of single voltage program Flash memory 1 Kbyte true (not emulated) data E2PROM Read while write: writing in the data memory is possible while executing code program memory The device setup is stored in a user option area in the non-volatile memory. Architecture Figure 5. Flash and E2PROM internal memory organizations 5.3.5 The memory is organized in blocks of 128 bytes each Read granularity: 1 word = 4 bytes Write/erase granularity: 1 word (4 bytes) or 1 block (128 bytes) in parallel Writing, erasing, word and block management is handled automatically by the memory interface. Write protection (WP) Write protection in application mode is intended to avoid unintentional overwriting of the memory. The write protection can be removed temporarily by executing a specific sequence in the user software. 5.3.6 Protection of user boot code (UBC) In STNRG devices a memory area of 32 Kbyte can be protected from overwriting at a user option level. In addition to the standard write protection, the UBC protection can be modified by the embedded program or via debug interface when the ROP protection is enabled. 24/130 DocID027799 Rev 1 STNRGxxxA Product overview The UBC memory area contains the reset and interrupt vectors and its size can be adjusted in increments of 512 bytes by programming the UBC and nUBC option bytes. Note: If users choose to update the boot code in the application programming (IAP), this has to be protected so to prevent unwanted modification. 5.3.7 Read-out protection (ROP) The STNRG family provides a read-out protection of the code and data memory which can be activated by an option byte setting. The read-out protection prevents reading and writing program memory, data memory and option bytes via the debug module and SWIM interface. This protection is active in all device operation modes. Any attempt to remove the protection by overwriting the ROP option byte triggers a global erase of the program and data memory contents. 5.4 Clock controller The clock controller distributes the system clock provided by different oscillators to the core and the peripherals. It also manages clock gating for low- power modes and ensures clock robustness. The main clock controller features are: Clock sources Internal 16 MHz and 153.6 kHz RC oscillators External source clock: – Crystal/resonator oscillator – External clock input Internal PLL at 96 MHz (not used as the fMASTER source clock) Reset: after the reset the microcontroller restarts by default with the HSI internal clock scaled at 2 MHz (16 MHz/8). The clock source and speed can be changed by the application program as soon as the code execution starts. Safe clock switching: clock sources can be changed safely on the fly in run mode through a configuration register. The clock signal is not switched until the new clock source is ready. The design guarantees glitch-free switching. Clock management: to reduce power consumption, the clock controller can stop the clock to the core or individual peripherals. Wakeup: In in case the device wakes up from low- power modes, the internal RC oscillator (16 MHz/8) is used for a quick startup. After a stabilization time, the device brings back the clock source that was selected before Halt mode was entered. Clock security system (CSS): the CSS permits monitoring of external clock sources and automatic switching to the internal RC (16 MHz/8) in case of a clock failure. Configurable main clock output (CCO): this feature permits to output an internal clock source signal for application usage. DocID027799 Rev 1 25/130 130 Product overview 5.4.1 STNRGxxxA Internal 16 MHz RC oscillator (HSI) The high speed internal (HSI) clock is the default master clock line, generated by an internal RC oscillator and with nominal frequency of 16 MHz. It has the following major features: 5.4.2 RC architecture Glitch-free oscillation 3-bit user calibration circuit. Internal 153.6 kHz RC oscillator (LSI) The low speed internal (LSI) clock is a low speed clock line provided by an internal RC circuit. It drives both the independent watchdog (IWDG) circuit and the auto-wakeup unit (AWU). It can also be used as a low power clock line for the master clock fMASTER. 5.4.3 Internal 96 MHz PLL The PLL provides a high frequency 96 MHz clock used to generate high frequency and accurate PWM waveforms. The input reference clock must be 16 MHz and may be sourced either by the internal HSI signal or by the external HSE auxiliary input crystal oscillator line. The internal PLL prescaled clock cannot be selected as fMASTER. Note: When the application requires a PWM signal with a custom defined long term stability it is suggested to use an external clock source connected to the HSE auxiliary clock line as the PLL input reference clock. In this case, the external clock source accuracy determines the PWM output stability. 5.4.4 External clock input/crystal oscillator (HSE) The high speed external clock (HSE) allows the connection of an external clock generated, for example, by a highly accurate crystal oscillator. The HSE is interconnected with the fMASTER clock line and to several peripherals. It allows users to provide a custom clock characterized by a high level of precision and stability to meet the application requirements. The HSE supports two possible external clock sources with a maximum of 24 MHz: Crystal/ceramic resonator interconnected with the HseOscin/HseOscout signals Direct drive clock interconnected with the HseOscin signal The HseOscin and HseOscout signals are multifunction pins configurable through the I/O multiplex mechanism; for further information refer to Section 6 on page 30. Note: 26/130 When the HSE is configured as the fMASTER source clock, the HSE input frequency cannot be higher than 16 MHz. When the HSE is the PLL input reference clock, then the HSE input frequency must be equal to 16 MHz. If the HSE is the reference for the SMED or the ADC logic, the input frequency can be configured up to 24 MHz. DocID027799 Rev 1 STNRGxxxA 5.5 Product overview Power management For efficient power management, the application can be put in one of four different lowpower modes. Users can configure each mode to obtain the best compromise between the lowest power consumption, the fastest startup time and available wakeup sources. Wait mode: in this mode, the CPU is stopped, but peripherals are kept running. The wakeup is triggered by an internal or external interrupt or reset. Active- halt mode with regulator on: in this mode, the CPU and peripheral clocks are stopped. An internal wakeup is generated at programmable intervals by the autowakeup unit (AWU). The main voltage regulator is kept powered on, so current consumption is higher than in the active-halt mode with the regulator off, but the wakeup time is faster. The wakeup is triggered by the internal AWU interrupt, external interrupt or reset. Active- halt mode with regulator off: this mode is the same as active- halt with the regulator on, except that the main voltage regulator is powered off, so the wakeup time is slower. Halt mode: in this mode the microcontroller uses the least power. The CPU and peripheral clocks are stopped, while the main voltage regulator is switched in poweroff. Wakeup is triggered by an external event or reset. In all modes the CPU and peripherals remain permanently powered on, the system clock is applied only to selected modules. The RAM content is preserved and the brownout reset circuit remains enabled. DocID027799 Rev 1 27/130 130 Product overview STNRGxxxA 5.6 Communication interfaces 5.6.1 Universal asynchronous receiver/transmitter (UART) UART is the asynchronous receiver/transmitter communication interface. SW flow control operating mode Full duplex, asynchronous communications High precision baud rate generator system Common programmable transmit and receive baud rates up to fMASTER/16 Programmable data word length (8 or 9-bit) Configurable stop bit - support for 1 or 2 stop bit Configurable parity control Separate enable bits for transmitter and receiver Interrupt sources: 5.6.2 – Transmit events – Receive events – Error detection flags 2 interrupt vectors: – Transmitter interrupt – Receiver interrupt Reduced power consumption mode Wakeup from mute mode (by idle line detection or address mark detection) 2 receiver wakeup modes: – Address bit (MSB) – Idle line. Inter-integrated circuit interface (I2C) The I2C (inter-integrated circuit) bus interface serves as an interface between the microcontroller and the serial I2C bus. It provides a multi-master capability, and controls all I2C bus-specific sequencing, protocol, arbitration and timing. It supports standard and fast speed modes. Parallel-bus/I2C protocol converter Multi-master capability: the same interface can act as master or slave I2C master features: 28/130 – Clock generation – Start and stop generation 2 I C slave features: – Programmable I2C address detection – Stop bit detection Generation and detection of 7-bit/10-bit addressing and general call Supports different communication speeds: – Standard speed (up to 100 kHz) – Fast speed (up to 400 kHz) DocID027799 Rev 1 STNRGxxxA Product overview Status flags: – Transmitter/receiver mode flag – End-of-byte transmission flag – I2C busy flag Error flags: – Arbitration lost condition for master mode – Acknowledgment failure after address/ data transmission – Detection of misplaced start or stop condition – Overrun/underrun if clock stretching is disabled Interrupt sources: – Communication interrupt – Error condition interrupt – Wakeup from Halt interrupt Wakeup capability: – 5.7 MCU wakes up from low power mode on address detection in slave mode. Analog-to-digital converter (ADC) The STNRG family includes a 10-bit successive approximation ADC with 8 multiplexed input channels. The analog input signal can be amplified before conversion by a selectable gain of 1 or 4(a) times. The analog-to-digital converter can operate either in single or in continuous/circular modes. The ADC unit has the following main features: 8/6 ADC input channel(b) 10-bit resolution Single and continuous conversion mode Independent or fixed channel gain value x1 or x4 to extend dynamic range and resolution to 12-bit equivalent(a) Interrupt events: – EOC interrupt asserted on end of conversion cycle – EOS interrupt asserted on end of conversion sequences – SEQ_FULL_EN interrupt assert on sequencer buffer full ADC input voltage range dependent on selected gain value(a) Selectable conversion data alignment Individual registers for up to 8 successive conversions. Conversion start from SW command or HW trigger event Auto-reload conversion command parameters Auto-flush after single conversion mode Auto-flush after conversion mode program (single/circular) Abort/flush sequence improvement a. The gain x 4 is available only on the STNRG388A type. b. The numbers of ADC input channels depends on the STNRG device. DocID027799 Rev 1 29/130 130 Product overview 5.8 STNRGxxxA Analog comparators The STNRG family includes four independent fast analog comparator units (COMP3-0). Each comparator has an internal reference voltage. The COMP3 can be also configured to use an external reference voltage connected to the CPM3 input pin. On the STNRG388A each comparator has also the external reference voltage line pin. Each comparator internal reference voltage is generated by a dedicated internal-only 4-bit DAC unit. The main characteristics of the analog comparator unit (ACU) are the following: 30/130 Each comparator has an internally/external configurable reference Internal reference voltages configurable in 16 steps with the 83 mV voltage gain from 0 V (VSSA) to 1.24 V (voltage reference) Two stage comparator architecture is used to reach a high gain Comparator output stage value accessible from processor interface Continuous fast cycle comparison time Configurable hysteresis voltage levels Configurable ADC HW trigger request Comparator outputs interrupt capability. DocID027799 Rev 1 STNRGxxxA Pinout and pin description 6 Pinout and pin description 6.1 Pinout Figure 6. STNRG388A - TSSOP38 pinout DocID027799 Rev 1 31/130 130 Pinout and pin description STNRGxxxA Figure 7. STNRG328A - VFQFPN32 pinout STNRG328A 32/130 DocID027799 Rev 1 STNRGxxxA Pinout and pin description Figure 8. STNRG288A - TSSOP28 pinout DocID027799 Rev 1 33/130 130 Pinout and pin description 6.2 STNRGxxxA Pin description Table 4. Pin description Pin number TyTSSOP VFQFPN TSSOP pe 38 32 28 Main function Alternate function 1 Alternate function 2 Alternate function 3 SMED PWM channel 0 General purpose I/O 10 - - Digital input 0 Configurable clock output signal (CCO) - - DIGIN[1]/ GPIO1 [6] Digital input 1 General purpose I/O 16(1) - - SMED PWM channel 1 General purpose I/O 11 - - SMED PWM channel 2 General purpose I/O 12 - - Pin name 1 21 1 I/O GPIO1 [0]/PWM [0] 2 22 2 I/O 3 23 - I 4 24 3 I/O 5 25 4 I/O GPIO1 [2]/ PWM [2] 26(2) 5(2) 8 - - I/O GPIO1 [5]/ PWM[5] 9 27 6 I/O SWIM/GPIO0 [6]/ DIGIN [1](3) SWIM data interface 10 28 7 I/O NRST Reset - - - 11 29 8 PS VDD Digital and I/O power supply - - - 12 30 9 PS VSS Digital and I/O ground - - - 13 31 10 PS VOUT 1.8 V regulator capacitor - - - 14 32 11 I/O GPIO0[4]/Dali_TX/ General I2C_sda/Uart_TX purpose I/O 04 DALI data transmit I2C data UART data transmit 15 1 12 I/O GPIO0[5]/Dali_RX/ General I2C_scl/Uart_RX purpose I/O 05 DALI data receive I2C clock UART data receive 16 2 - I/O GPIO1 [4]/PWM [4] SMED PWM channel 4 General purpose I/O 14 - - 17 3 - I/O DIGIN[4]/I2C_sda/ GPIO1[6] Digital input 4 I2C data General purpose I/O 16 - 18 4 - I/O DIGIN[5]/I2C_scl/ GPIO1[7] Digital input 5 I2C clock General purpose I/O 17 - - - 13 I/O DIGIN54 Digital input 5,4 - - - 6 7 34/130 DIGIN[0]/ CCO_clk GPIO1[1]/PWM[1] I DIGIN [2] Digital input 2 - - - I DIGIN [3] Digital input 3 - - - SMED PWM channel 5 General purpose I/O 15 - - DocID027799 Rev 1 General purpose Digital input 1 (3) I/O 06 - STNRGxxxA Pinout and pin description Table 4. Pin description (continued) Pin number TyTSSOP VFQFPN TSSOP pe 38 32 28 Pin name Main function Alternate function 1 Alternate function 2 Alternate function 3 SMED PWM channel 3 General purpose I/O 13 - - 19 5 14 I/O GPIO1 [3]/PWM [3] 20 6 15 I/O 16 GPIO0[3]/I2C_scl/ General I/O HseOscin/Uart_RX purpose I/O 03 I C clock - GPIO0[0]/Uart_TX/ General I/O I2C_sda/CPM0 purpose I/O 00 UART data transmit I GPIO0[1]/Uart_RX/ General I/O I2C_scl/CPM1 purpose I/O 01 UART data receive 2C 21 22 7 - GPIO0 [2]/I2C_sda/ General HseOscout/Uart_TX purpose I/O 02 I2C data 2 Output crystal UART data oscillator transmit signal Input crystal oscillator signal /input clock signal data Negative analog comparator input 0 clock Negative analog comparator input 1 23 - - 24 8 17 I CPP [3] Positive analog comparator input 3 - - - 25 9 - I CPP [2] Positive analog comparator input 2 - - - CPM32 Negative analog comparator input 3, 2 - - - CPM3 Negative analog comparator input 3 - - - - - - 26 - - 10 - - I I I 2C UART data receive - - 18 I CPP2_CPM3 Positive analog comparator input 2 Negative analog comparator input 3 27 11 19 I CPP [1] Positive analog comparator input 1 - - - 28 12 20 I CPP [0] Positive analog comparator input 0 - - - DocID027799 Rev 1 35/130 130 Pinout and pin description STNRGxxxA Table 4. Pin description (continued) Pin number TyTSSOP VFQFPN TSSOP pe 38 32 28 Pin name Main function Alternate function 1 Alternate function 2 Alternate function 3 29 13 21 PS VDDA Analog power supply - - - 30 14 22 PS VSSA Analog ground - - - 31 - - I ADCIN [7] Analog input 7 - - - 32 - - I ADCIN [6] Analog input 6 - - - 33 15 23 I ADCIN [5] Analog input 5 - - - 34 16 24 I ADCIN [4] Analog input 4 - - - 35 17 25 I ADCIN [3] Analog input 3 - - - 36 18 26 I ADCIN [2] Analog input 2 - - - 37 19 27 I ADCIN [1] Analog input 1 - - - 38 20 28 I ADCIN [0] Analog input 0 - - - 1. Not available on the STNRG288A. 2. The DIGIN3 and DGIN2 are connected together. 3. Available only on the STNRG288A. 6.3 Input/output specifications The STNRG family includes three different I/O types: Normal I/Os configurable either at 2 or 10 MHz maximum frequency Fast I/O operating up to 12 MHz. High speed I/O operating up to 32 MHz The STNRG I/Os are designed to withstand current injection. For a negative injection current of 4 mA, the resulting leakage current in the adjacent input does not exceed 1 µA; further details are available in Section 12 on page 85. 36/130 DocID027799 Rev 1 STNRGxxxA 7 I/O multifunction signal configuration I/O multifunction signal configuration Several I/Os have multiple functionalities selectable through the configuration mechanism described from Section 7.1 to Section 7.5 on page 43. The STNRG I/Os are grouped into four different configurable ports: P0, P1, P2 and P3. 7.1 Multifunction configuration policy STNRG devices support either a cold or warm multifunction signal configuration policy according to the content of the EN_COLD_CFG bit field, a part of the GENCFG option byte register. When the EN_COLD_CFG bit is set, the cold configuration is selected and the multifunction signals are configured according to the values stored in the option bytes; otherwise when the EN_COLD_CFG bit is cleared (default case), the warm configuration mode is chosen and the multifunction pin functionality is configured through the miscellaneous registers. The configuration options and the proper configuration registers are detailed in Table 5. Table 5. Multifunction configuration registers EN_COLD_CFG Configuration policy Multifunction configuration registers 1 Cold AFR_IOMXP0, AFR_IOMXP1 and AFR_IOMXP2 0 (default) Warm MSC_IOMXP0, MSC_IOMXP1 and MSC_IOMXP2 The warm configuration is volatile, thus not maintained after a device reset. 7.2 Port P0 I/O multifunction configuration signal The Port P0 multiplexes several input/output functionalities, increasing the device flexibility. The P0 port pins can be independently assigned to general purpose I/Os or to internal peripherals. All communication peripherals and the external oscillator are hosted by the Port P0 pins. In order to avoid electrical conflicts on the user application board, the P0 signals are configured at reset as GPIO0 inputs without pull-up resistors. Once reset is released, the firmware application must initialize the inputs with the proper configuration according to the application needs. 7.2.1 Alternate function P0 configuration signals The multifunction pins can be configured via one of the following two registers, depending on the overall configuration policy (warm/cold): Cold configuration: AFR_IOMXP0 option byte registers (refer to Section 10 on page 64. After the reset the P0 signals are configured in line with AFR_IOMXP0 contents. Warm configuration: MSC_IOMXP0 miscellaneous register (refer to Section 7.5 on page 43). After the reset, the P0 signals are configured as GPIO input lines with the pull-up disabled. DocID027799 Rev 1 37/130 130 I/O multifunction signal configuration STNRGxxxA Table 6 summarizes the Port P0 configuration scheme. Both registers MSC_IOMXP0 and AFR_IOMXP0 use the same register fields Sel_p054, Sel_p032 and Sel_p010 which respectively control the bits [5, 4], [3, 2] and [1, 0] of the Port P0. Table 6. P0 internal multiplexing signals(1) Port P0 multifunction configuration signal MUX SEL Port pins Multifunction signal Selection fields GPIO0 [1] P0 [1,0](2) GPIO0 [0] (3) CPM1 CPM0(4) UART_rx UART_tx I2C_scl I2C_sda 00(3), (4) Sel_p010 P0 [5, 4] 01 10 RFU reserved encoding P0 [3, 2] Value (binary) 11 GPIO0 [3] GPIO0 [2] 00 I2C_scl I2C_sda HseOscin HseOscout UART_rx UART_tx 11 GPIO0 [5] GPIO0 [4] 00 DALI_rx DALI_tx I2C_scl I2C_sda UART_rx UART_tx Sel_p032 Sel_p054 01 10 01 10 11 1. The Sel_p054, Sel_p032, Sel_p010 are register fields for both registers MSC_IOMXP0 and AFR_IOMXP0. The peripheral conflict (same resources selected on different pins at the same time) has to be prevented by SW configuration. When the I2C interface is selected either on the GPIO0 [5:4] or on the GPIO0 [3:2] signals the related I/O port speed has to be configured at 10 MHz by programming the GPIO0 internal peripheral. 2. Available only on STNRG388A. 3. The CPM1 (external COMP1 reference voltage) selection line requires the following configurations: GPIO0 [1] programmed as input Hiz and the bit field DAC1_EN = '0' and CP1_EN_ERef = '1 of MSC_DACCTR (available only on the STNRG388A). 4. The CPM0 (external COMP0 reference voltage) selection line requires the following configurations: GPIO0 [0] programmed as input Hiz (input high impedance with pull-up disable) and the bit field DAC0_EN = '0' and CP0_EN_ERef = '1 of MSC_DACCTR (available only on the STNRG388A). 7.2.2 Port P0 diagnostic signals The primary I/Os can be used to trace the SMED's state evolution. This feature allows the debug of the complex SMED configurations. The trace selection can be enabled or disabled via register MSC_IOMXSMD. The diagnostic signal selection through MSC_IOMXSMD register overrides the functional configuration of MSC_IOMXP0 register. The Port P0 [5:3] or P0 [2:0] can be configured to output one or two different SMEDs' current states. The SMEDs FSM state signals (coded on three bits) may be multiplexed either on port bits P0 [5:3] or P0 [2:0]; alternatively two different SMEDs signal states can be traced 38/130 DocID027799 Rev 1 STNRGxxxA I/O multifunction signal configuration simultaneously on the same port bits. The SMED trace configuration is forbidden on the Port P [2:0] when the external comparator reference voltage is programmed on the Port P0 [1, 0]. Port 0 I/O signal availability depends on the STNRG device. 7.2.3 Port P0 I/O functional multiplexing signal Figure 9 shows an outline view of the Port P0 multifunction multiplexing scheme. Figure 9. Port P0 I/O functional multiplexing scheme "'*/ "'T JO 1 @*%3 */1 65 1 @0%3 0651 65 1 "'065 "'T PVU .4$@*0.91 "'3@*0.91 ". 1. Where “A/F(s) in” and “A/F(s) out” signals are defined in Section 5.2 on page 28. Verify pinout availability in device pin table X? The P0 [6] is a multifunction signal configurable through the MSC_IOMXP2 [7] and AFR_IOMXP2 [7] register bits. For further details refer to Section-6.4. The Port P0 [6] signal is controlled by P0_ODR [6] and P0_IDR [6] GPIO0 registers. On the STNRG328A and STNRG288A device: 7.2.4 P0_ODR [1:0] bits must be keep clear. P0 interrupt capability Port P0 signals may be configured to generate maskable (IRQ) and un-maskable (NMI) interrupts by programming the MSC_CFGP0<n> and the MSC_STSP0 registers (n = index port signal). The interrupt request may be configured to wake-up the IC device from the WFI (wait for interrupt), AHalt (active Halt) and Halt power saving state. 7.2.5 P0 programmable pull-up and speed feature The I/O speed and pad pull-up resistance (47 k) of the port P0 may be configured through the GPIO0 internal registers. The pull-up resistance of the multifunction signal P0 [6] is always enabled. DocID027799 Rev 1 39/130 130 I/O multifunction signal configuration 7.3 STNRGxxxA Port P1 I/O multifunction configuration signal The Port P1 I/O multifunction pins, similarly to the Port P0, can be individually configured through the following set of registers based on the selected device configuration policy: Cold configuration: AFR_IOMXP1 option byte register (refer to Section 10 on page 64). After reset the P1 signals are configured in line with AFR_IOMXP1 contents. Warm configuration: MSC_IOMXP1 miscellaneous register (refer to Section 7.5). After reset the P1 signals are configured as PWM output lines. Every Port1 I/O can be configured to operate as a PWM output pin or a GPIO. Differently from the port P0s, the pins are configured as PWM output signals by default after reset. Table 7 summarizes the Port P1 configurations as selected by the register fields Sel_p15 … Sel_p10 which respectively control the bits [5] … [0] of the Port P1 (verify resources availability on Table 4: Pin description on page 34). Table 7. Port P1 I/O multiplexing signal(1) Port P1 multifunction configuration signal MUX selection Output signal Multi- function signal Selection bits P1 [0] P1 [1] P1 [2] P1 [3] P1 [4] P1 [5] PWM [0] GPIO1 [0] PWM [1] GPIO1 [1] PWM [2] GPIO1 [2] PWM [3] GPIO1 [3] PWM [4] GPIO1 [4] PWM [5] GPIO1 [5] Sel_p10 Sel_p11 Sel_p12 Sel_p13 Sel_p14 Sel_p15 Value (binary) 1 0 1 0 1 0 1 0 1 0 1 0 1. The Sel_p15…Sel_p10 are common register fields of both registers MSC_IOMXP1 and AFR_IOMXP1. In cold configuration the P1x are configured as defined by the AFR_IOMXP1 option byte. The PWM default polarity level is configured by the register option byte GENCFG. Verify pin out availability in Table 4: Pin description on page 34. 40/130 DocID027799 Rev 1 STNRGxxxA 7.3.1 I/O multifunction signal configuration Port P1 I/O multiplexing signal Figure 10 shows an outline view of the port P1 signal multiplexing scheme. Figure 10. Port P1 I/O multiplexing scheme */165 1@*%3 1@0%3 18. 065165 1 18.PVU .4$@*0.91 "'3@*0.91 ". 1. The P1 [5:0] output signals may be read back from the P1_IDR register only when the pins are configured as GPIO out or PWM signals. The PWM internal signal is read- back also by its own SMED through the SMD<n>_FSM_STS register. P1_ODR [7:6] and P1_IDR [7:6] registers control the GPIO1 [7:6] alternate function signals, for further details refer toSection 7.4. Check device feature availability. 7.3.2 P1 interrupt capability Port P1 signals may be configured to generate maskable (IRQ) and un-maskable (NMI) interrupts by configuring the MSC_CFGP1<n> and the MSC_STSP1 registers (n = index port signal 4- 0). This functionality is applicable to the bit port P1 [4:0]. The interrupt request may be configured to wake-up the IC device from the WFI (wait for interrupt), AHalt (active Halt) and Halt power saving state. 7.3.3 P1 programmable pull-up feature The pad pull-up resistances (47 k) of the Port1 may be configured through the GPIO1 internal register. The PWM output pseudo open drain functionality is controllable by the GPIO1 registers. 7.4 Port P2 I/O multifunction configuration signal The Port2 I/O multifunction pins, similarly to the Port0 and Port2, can be individually configured through the following set of registers based on the selected device configuration policy: Cold configuration: AFR_IOMXP2 option byte registers (refer to Section 10 on page 64. After reset the P2 signals are configured in line with AFR_IOMXP2 contents. Warm configuration: MSC_IOMXP2 miscellaneous register (refer to Section 7.5). After reset the P2 signals are configured as DIGIN input lines with pull-up enabled. Table 8 summarizes the port P2 configurations selected by the register fields Sel_p25 … Sel_p20 which respectively control the bits [5]… [0] of the port P2. The P2 [0] is configured by the CCOEN bit field of the register CKC_CCOR. The SWIM alternate function signal DocID027799 Rev 1 41/130 130 I/O multifunction signal configuration STNRGxxxA (when available) is controlled by the Sel_SWIM bit field provided by registers AFR_IOMXP2 [7] and MSC_IOMXP2 [7]. Table 8. Port P2 I/O multiplexing signal(1) Port P2 multifunction configuration signal MUX SEL Output signal Multi-function signal Value (binary) CCOEN 0(2) DIGIN [0] P2 [0] CCO 1 GPIO1 [6] P2 [1] Sel_P21 DIGIN [1] GPIO0 [7] P2 [3] P2 [5, 4] Selection bits Sel_P23 DIGIN [3] GPIO1 [7] GPIO1 [6] GPIO1 [7] DIGIN [4] I2C_scl I2C_sda DIGIN [5] DIGIN [4] 1(2) 0 1(2) 00 Sel_P2 [5, 4] GPIO0 [6] 01 10 11(2) X(3) SWIM SWIM 0 Sel_SWIM DIGIN1 (3) 0(4) 1(5) 1. The Sel_P2 [5, 4, 3, 1] is a common register field of both registers MSC_IOMXP2 and AFR_IOMXP2. The peripheral conflict (same resources selected on different pins at the same time) has to be prevented by SW configuration. After reset by default P2 [3, 1, 0] are configured as DIGIN [3, 1, 0] signals. The option byte AFR_IOMXP2, before user configuration, by default selects the I2C alternative functionality. The signal ports P2 [3:1] are exclusively interconnected with DIGIN [3:1] primary pins. When the I2C i/f is selected on DIGIN [5:4] signals the I/O speed is auto-configured at 10 MHz and the internal pull-up functionality is controlled by the MSC_INPP2AUX1 register. After reset by default the P2 [0] is configured as the DIGIN [0] signal. GPIO1 [7:6] signals are controlled by P1_ODR [7:6] and P1_IDR [7:6] GPIO1 registers. 2. Default configuration after reset if the option byte is at the manufactory value. Verify pin out availability in device pin table X. 3. SWIM pin: SWIM signal function is selected when CFG_GCR [0] = '0'. 4. SWIM pin: The GPIO0 [6] signal is selected when both Sel_SWIM = '0' and CFG_GCR [0] = '1'. 5. SWIM pin: Available only on the STNRG288A and the P2 [1] (DIGIN1) signal is selected on the SWIM pin when both Sel_SWIM = '1' and CFG_GCR [0] = '1', otherwise it's interconnected with the pin DIGIN10. 7.4.1 P2 ADC hardware trigger The DIGIN [0, 3] signals may be configured to generate a HW trigger request to start the ADC conversion. 7.4.2 P2 interrupt capability Port P2 signals may be configured to generate maskable (IRQ) and un-maskable (NMI) interrupts by configuring the MSC_CFGP2<n> and the MSC_STSP2 registers (n = index port signal 0 - 5). 42/130 DocID027799 Rev 1 STNRGxxxA I/O multifunction signal configuration The interrupt functionality is available on the port P2 [5:4] also in case these signals are configured as GPIO1 [7:6]. The interrupt request may be configured to wake-up the IC device from the WFI (wait for interrupt), AHalt (active Halt) and Halt power saving state. 7.4.3 P2 programmable pull-up feature The pad pull-up resistances (47 k) of Port2 signals are individually controllable by the MSC_INPP2AUX1 register. 7.5 Port P3 analog signal The port P3 is an analog signal port based on the comparator input signals CPP [3:0]. Differently than the digital ports, the P3 is a single function port with fixed signal assignment. 7.5.1 P3 ADC conversion request The CMP [0, 3] internal output signals may be configured to generate a HW trigger request to start the ADC conversion. 7.5.2 P3 interrupt capability The comparator output signals of the port P3 (CMP [3:0]) may be configured to generate maskable interrupts by programming the MSC_CFGP3<n> and the MSC_STSP3 registers (n = index port signal 0-3). The interrupt request may be configured to wake-up the IC device from the WFI (wait for interrupt), AHalt (active Halt) and Halt power saving state. DocID027799 Rev 1 43/130 130 I/O multifunction signal configuration 7.6 STNRGxxxA Multifunction port configuration registers MSC_IOMXP0 (Port P1 I/O MUX control register) Table 9. MSC_IOMXP0 (Port P1 I/O MUX control register) Offset: 0x2A Default value: 0x00 7 6 5 4 3 2 1 0 RFU Sel_P054 [1:0] Sel_P032 [1:0] Sel_P010 [1:0] r r/w r/w r/w The Port0 I/O multifunction signal configurations register (for functionality description refer to Section 7.2 on page 37). Check device feature availability. Bit 1 - 0: Sel_P010 [1:0] Port0 [1:0] I/O multiplexing scheme: 00: Port0 [1:0] the bit port may be configured individually as GPIO [1:0] or as CPM [1:0] (comparator [1:0] external reference voltage): GPIO0 [1:0] signals are controlled by the GPIO0 internal registers. CPM [1, 0]: comparator external reference voltage requires that following configurations: GPIO0 [x] configured as input Hiz (where x = 1,0) DAC<x>_EN = '0' and CP<x>_EN_ERef = '1 of MSC_DACCTR available only on the STNRG388A register. 01: Port0 [1:0] are interconnected to UART_rx and UART_tx signals 10: Port0 [1:0] are interconnected to I2C_scl and I2C_sda signals 11: RFU Bit 3 - 2: Sel_P032 [1:0] Port0 [3:2] I/O multiplexing scheme: 00: Port0 [3:2] are interconnected to GPIO0 [3:2] signals 01: Port0 [3:2] are interconnected to I2C_scl and I2C_sda signals 10: Port0 [3:2] are interconnected to HseOscin and HseOscout analog signals 11: Port0 [3:2] are interconnected to UART_rx and UART_tx signals Bit 5 - 4: Sel_P054 [1:0] Port0 [5:4] I/O multiplexing scheme: 00: Port0 [5:4] are interconnected to GPIO0 [5:4] signals 01: Port0 [5:4] are interconnected to DALI_rx and DALI_tx signals 10: Port0 [5:4] are interconnected to I2C_scl and I2C_sda signals 11: Port0 [5:4] are interconnected to UART_rx and UART_tx signals Bit 7 - 6: RFU reserved; in order to guarantee future compatibility, the bits are kept or set to 0 during register write operations. 44/130 DocID027799 Rev 1 STNRGxxxA I/O multifunction signal configuration MSC_IOMXP1 (Port P1 I/O MUX control register) Table 10. MSC_IOMXP1 (Port P1 I/O MUX control register) Offset: 0x2B Default value: 0x3F 7 6 RFU 5 4 3 2 1 0 Sel_P15 Sel_P14 Sel_P13 Sel_P12 Sel_P11 Sel_P10 r r/w The Port1 I/O multifunction signal configuration register (for functionality description refer to Section 7.3 on page 40). Check device feature availability. Bit 0: Sel_P10 Port1 [0] I/O multiplexing scheme: 0: Port1 [0] is interconnected to GPIO1 [0] signal 1: Port1 [0] is interconnected to PWM [0] signal Bit 1: Sel_P11 Port1 [1] I/O multiplexing scheme: 0: Port1 [1] is interconnected to GPIO1 [1] signal 1: Port1 [1] is interconnected to PWM [1] signal Bit 2: Sel_P12 Port1 [2] I/O multiplexing scheme: 0: Port1 [2] is interconnected to GPIO1 [2] signal 1: Port1 [2] is interconnected to PWM [2] signal Bit 3: Sel_P13 Port1 [3] I/O multiplexing scheme: 0: Port1 [3] is interconnected to GPIO1 [3] signal 1: Port1 [3] is interconnected to PWM [3] signal Bit 4: Sel_P14 Port1 [4] I/O multiplexing scheme: 0: Port1 [4] is interconnected to GPIO1 [4] signal 1: Port1 [4] is interconnected to PWM [4] signal Bit 5: Sel_P15 Port1 [5] I/O multiplexing scheme: 0: Port1 [5] is interconnected to GPIO1 [5] signal 1: Port1 [5] is interconnected to PWM [5] signal Bit 7 - 6: RFU reserved; in order to guarantee future compatibility, the bits are kept or set to 0 during register write operations. DocID027799 Rev 1 45/130 130 I/O multifunction signal configuration STNRGxxxA MSC_IOMXP2 (Port P2 I/O MUX control register) Table 11. MSC_IOMXP2 (Port P2 I/O MUX control register) Offset: 0x13 (indirect area) Default value: 0xFF 7 6 5 4 3 2 1 0 Sel_SWIM RFU Sel_P25 Sel_P24 Sel_P23 RFU Sel_P21 RFU r/w r r/w r/w r/w r r/w r The Port1 I/O multifunction signal configurations register (for functionality description refer to Section 7.4 on page 41). Check device feature availability. Bit 0: RFU reserved; must be kept 0 during register writing for future compatibility Bit 1: Sel_P21 Port2 [1] I/O multiplexing scheme: 0: Port2 [1] is interconnected to GPIO1 [6]. 1: Port2 [1] is interconnected to DIGIN [1] signals. Bit 2: RFU reserved; must be kept 0 during register writing for future compatibility Bit 3: Sel_P23 Port2 [3] I/O multiplexing scheme: 0: Port2 [3] is interconnected to GPIO0 [7]. 1: Port2 [3] is interconnected to DIGIN [3] signals. Bit 5-4: 00: Port2 [5:4] are interconnected to GPIO1 [7:6] signals. 01: Selects the following signal assignment: Port2 [5] is interconnected to the GPIO1 [7] signal. Port2 [4] is interconnected to the DIGIN [4] signal. 10: Port2 [5:4] are interconnected to I2C_Scl and I2C_Sda signals. 11: Port2 [5:4] are interconnected to DIGIN [5:4] signals. Note: The AFR_IOMXP2 [4] register field is capable only to configure the coding value 00 and 01: 00: Port2 [5:4] are interconnected to GPIO1 [7:6] signals. 01: Following signal assignment selection: Port2 [5] is interconnected to the GPIO1 [7] signal. Port2 [4] is interconnected to the DIGIN [4] signal. Bit 6: RFU reserved; in order to guarantee future compatibility, the bits are kept or set to 0 during register write operations. 46/130 DocID027799 Rev 1 STNRGxxxA I/O multifunction signal configuration Bit 7: Sel_SWIM SWIM alternate function signal enable; this feature is active when the SWD field of the register CFG_GCR is set. 0: SWIM pin is configured with the GPIO0 [6] signal. 1: SWIM functionality is preserved. MSC_INPP2AUX1 (INPP aux register) Table 12. MSC_INPP2AUX1 (INPP aux register) Offset: 0x08 (indirect area) Default value: 0x00 7 6 5 4 3 2 ADCTRG_EN RFU INPP2_PULCTR [5:0] r/w r r/w 1 0 Check device feature availability. Bit 5 - 0: INPP2_PULCTR [5:0].This register configures respectively the INPP2 [5:0] pull-up functionality as follows: 0: enable pad pull-up features (enabled by default) 1: disable pad pull-up Bit 6: RFU reserved; in order to guarantee future compatibility, the bits are kept or set to 0 during register write operations. Bit 7: ADCTRG_EN controls the ADC HW triggered conversion request: 0: disable the ADC HW triggered conversion request (disabled by default) 1: enable the ADC HW triggered conversion request. Set/cleared by SW. Cleared by HW when SW/HW conversion starts or when the stop command is issued Note: Due to DIGINs interconnections, the pull-up functionality must be configured in the same way if the two pins are connected together: DIGIN10 is controlled by the register field INPP2_PULCTR [1:0] DIGIN32 is controlled by the register field INPP2_PULCTR [3:2] DIGIN54 is controlled by the register field INPP2_PULCTR [5:4]. When the DIGIN1 signal is selected on the SWIM pin the pull-up is always enabled. DocID027799 Rev 1 47/130 130 Memory and register map STNRGxxxA 8 Memory and register map 8.1 Memory map overview This section describes the register map implemented in STNRG devices. Table 13 shows the main memory map organization. All registers and memory spaces are configured within the first 64 Kbytes of memory, the remaining address spaces are kept reserved for the future use. Table 13. Internal memory map Address Description 00.0000h 00.17FFh 6 kB RAM [data and stack area(1)] 00.1800h 00.3FFFh Reserved 00.4000h 00.43FFh 1 kB data E2PROM 00.4400h 00.47FFh Reserved 00.4800h 00.487Fh 128 option bytes 00.4880h 00.4FFFh Reserved 00.5000h 00.57FFh Peripheral register region 00.5800h 00.5FFFh Reserved 00.6000h 00.67FFh 2 kB boot ROM 00.6800h 00.7EFFh Reserved 00.7F00h 00.7FFFh Core register region 00.8000h 32 interrupt vectors 00.8080h 00.FFFFh 32 kB program Flash 01.0000h FF.FFFFh Reserved 1. By default, the stack address is initialized at 0x07FF and rolls over when it reaches the address value of 0x0400. The stack address value may be modified by the user at runtime. 48/130 DocID027799 Rev 1 STNRGxxxA 8.2 Memory and register map Register map Section 8.2.1 shows the STNRG memory map. 8.2.1 General purpose I/O GPIO0 register map Table 14. General purpose I/O GPIO0 register map Address Register name Register description 0x00.5000 P0_ODR Output data 0x00.5001 P0_IDR Input data P0_DDR Data direction 0x00.5003 P0_CR1 Control register 1 0x00.5004 P0_CR2 Control register 2 0x00.5002 8.2.2 Block GPIO0 General purpose I/O GPIO1 register map Table 15. General purpose I/O GPIO0 register map Address Register name Register description 0x00.5005 P1_ODR Output data 0x00.5006 P1_IDR Input data P1_DDR Data direction 0x00.5008 P1_CR1 Control register 1 0x00.5009 P1_CR2 Control register 2 0x00.5007 Block GPIO1 DocID027799 Rev 1 49/130 130 Memory and register map 8.2.3 STNRGxxxA Miscellaneous registers Direct register address mode Table 16. Miscellaneous direct register address mode Address Register name Register description 0x00.5010 MSC_CFGP00 P00 input line control 0x00.5011 MSC_CFGP01 P01 input line control 0x00.5012 MSC_CFGP02 P02 input line control 0x00.5013 MSC_CFGP03 P03 input line control 0x00.5014 MSC_CFGP04 P04 input line control 0x00.5015 MSC_CFGP05 P05 input line control 0x00.5016 MSC_CFGP20 P20 input line control 0x00.5017 MSC_CFGP21 P21 input line control 0x00.5018 MSC_CFGP22 P22 input line control 0x00.5019 MSC_CFGP23 P23 input line control 0x00.501A MSC_CFGP24 P24 input line control 0x00.501B MSC_CFGP25 P25 input line control 0x00.501C MSC_STSP0 Port0 status 0x00.501D MSC_STSP2 Port2 status 0x00.501E MSC_INPP2 Port2 read RFU Reserved for future use MSC_DACCTR Comparator and DAC configuration(1) 0x00.5021 MSC_DACIN0 DAC0 input data 0x00.5022 MSC_DACIN1 DAC1 input data 0x00.5023 MSC_DACIN2 DAC2 input data 0x00.5024 MSC_DACIN3 DAC3 input data 0x00.5025 MSC_SMDCFG01 SMED 0 - 1 behavior 0x00.5026 MSC_SMDCFG23 SMED 2 - 3 behavior 0x00.5027 MSC_SMDCFG45 SMED 4 - 5 behavior 0x00.5028 MSC_SMSWEV SMED software events 0x00.5029 MSC_SMUNLOCK SMED unlock 0x00.502A MSC_CBOXS0 Connection matrix selection for SMED 0 0x00.502B MSC_CBOXS1 Connection matrix selection for SMED 1 0x00.502C MSC_CBOXS2 Connection matrix selection for SMED 2 0x00.502D MSC_CBOXS3 Connection matrix selection for SMED 3 0x00.502E MSC_CBOXS4 Connection matrix selection for SMED 4 0x00.502F MSC_CBOXS5 Connection matrix selection for SMED 5 0x00.501F 0x00.5020 50/130 Block MSC DocID027799 Rev 1 STNRGxxxA Memory and register map Table 16. Miscellaneous direct register address mode (continued) Address Register name Register description 0x00.5030 MSC_IOMXSMD SMED Trace multiplexing on port 0 0x00.5031 MSC_CFGP10 P10 input line control 0x00.5032 MSC_CFGP11 P11 input line control 0x00.5033 MSC_CFGP12 P12 input line control 0x00.5034 MSC_CFGP13 P13 input line control 0x00.5035 MSC_CFGP14 P14 input line control MSC_CFGP15 P15 input line control MSC_STSP1 Port 1 status 0x00.5038 RFU Reserved for future use 0x00.5039 MSC_INPP3 Port 3 (COMP) read 0x00.503A MSC_IOMXP0 Port 0 alternate function MUX 0x00.503B MSC_IOMXP1 Port 1 alternate function MUX 0x00.503C MSC_IDXADD MSC indirect register 0x00.503D MSC_IDXDAT MSC indirect data 0x00.5036 0x00.5037 Block MSC 1. The register bitmask definition depends on product. DocID027799 Rev 1 51/130 130 Memory and register map STNRGxxxA Indirect register address mode Table 17. Miscellaneous indirect register address mode Address (IDX) Register name Register description 0x00 MSC_FTM0CKSEL Basic timer source clock selection 0x01 MSC_FTM0CKDIV Basic Timer0 clock prescaler 0x02 MSC_FTM0CONF Basic Timer0 counter value 0x03 MSC_FTM1CKDIV Basic Timer1 clock prescaler 0x04 MSC_FTM1CONF Basic Timer1 counter value 0x05 MSC_DALICKSEL DALI clock selection 0x06 MSC_DALICKDIV DALI filter clock division factor 0x07 MSC_DALICONF DALI filter mode configuration 0x08 MSC_INPP2AUX1 INPP2 auxiliary configuration register 1 MSC_INPP2AUX2 INPP2 auxiliary configuration register 2 MSC_DAC0HYS DAC0 hysteresis controls 0x0B MSC_DAC1HYS DAC1 hysteresis controls 0x0C MSC_DAC2HYS DAC2 hysteresis controls 0x0D MSC_DAC3HYS DAC3 hysteresis controls 0x0E MSC_CFGP30 P30 input line control 0x0F MSC_CFGP31 P31 input line control 0x10 MSC_CFGP32 P32 input line control 0x11 MSC_CFGP33 P33 input line control 0x12 MSC_STSP3 Port 3 status 0x13 MSC_IOMXP2 Port2 alternate function MUX register 0x09 0x0A 52/130 Block MSC (indirect) DocID027799 Rev 1 STNRGxxxA 8.2.4 Memory and register map Flash and E2PROM non-volatile memories Table 18. Non-volatile memory register map Address Register name Register description 0x00.505A FLASH_CR1 Control register 1 0x00.505B FLASH_CR2 Control register 2 0x00.505C FLASH_nCR2 Control register 2 (protection) 0x00.505D FLASH_FPR Memory protection FLASH_nFPR Memory protection (complemented register) FLASH_IAPSR Flash status 0x00.5062 FLASH_PUKR Write memory protection removal key register 0x00.5063 RFU Reserved for future use 0x00.5064 FLASH_DUKR Write memory protection removal data 0x00.5071 FLASH_WAIT Time access wait-state reg. 0x00.505E 0x00.505F 8.2.5 Block MIF Reset register Table 19. RST_SR register map Address Block Register name Register description 0x00.50B3 RSTC RST_SR Reset control status DocID027799 Rev 1 53/130 130 Memory and register map 8.2.6 STNRGxxxA Clock controller register Table 20. Clock controller register map Address Register name Register description 0x00.50B4 CLK_SMD0 SMED 0 clock configuration 0x00.50B5 CLK_SMD1 SMED 1 clock configuration 0x00.50B6 CLK_SMD2 SMED 2 clock configuration 0x00.50B7 CLK_SMD3 SMED 3 clock configuration 0x00.50B8 CLK_SMD4 SMED 4 clock configuration 0x00.50B9 CLK_SMD5 SMED 5 clock configuration 0x00.50BA RFU Reserved for future use 0x00.50BB RFU Reserved for future use 0x00.50BC RFU Reserved for future use 0x00.50BD RFU Reserved for future use 0x00.50BE CLK_PLLDIV PLL clock divisor 0x00.50BF CLK_AWUDIV AWU clock divisor 0x00.50C0 CLK_ICKR Internal clock control CLK_ECKR External clock control CLK_PLLR PLL control 0x00.50C3 CLK_CMSR Clock master 0x00.50C4 CLK_SWR Clock switch 0x00.50C5 CLK_SWCR Switch control 0x00.50C6 CLK_CKDIVR Clock dividers 0x00.50C7 CLK_PCKENR1 Peripherals clock enable 0x00.50C8 CLK_CSSR Clock security system 0x00.50C9 CLK_CCOR Configurable clock output 0x00.50CA CLK_PCKENR2 Peripherals clock enable 0x00.50CB RFU Reserved for future use 0x00.50CC CLK_HSITRIMR HSI calibration trimmer 0x00.50CD CLK_SWIMCCR SWIM clock division 0x00.50CE CLK_CCODIVR CCO divider 0x00.50CF CLK_ADCR ADC clock configuration 0x00.50C1 0x00.50C2 54/130 Block CKC DocID027799 Rev 1 STNRGxxxA 8.2.7 Memory and register map WWDG timers Table 21. WWDG timer register map Address 0x00.50D1 0x00.50D2 8.2.8 Block WWDG Register name Register description WWDG_CR Watchdog control WWDG_WR Watchdog window IWDG timers Table 22. IWDG timer register map Address Block 0x00.50E0 0x00.50E1 IWDG 0x00.50E2 8.2.9 Register name Register description IWDG_KR Watchdog key IWDG_PR Watchdog time base IWDG_RLR Watchdog counter value after reload AWU timers Table 23. AWU timer register map Address Block 0x00.50F0 0x00.50F1 AWU 0x00.50F2 DocID027799 Rev 1 Register name Register description AWU_CSR AWU control status AWU_APR AWU asynchronous prescaler buffer AWU_TBR AWU time base selection 55/130 130 Memory and register map 8.2.10 STNRGxxxA Inter-integrated circuit interface (I2C) Table 24. I2C register map Address Register name Register description 0x00.5210 I2C_CR1 I2C control register 1 0x00.5211 I2C_CR2 I2C control register 2 0x00.5212 I2C_FREQR I2C frequency register 0x00.5213 I2C_OARL I2C own add-low register 0x00.5214 I2C_OARH I2C own add-high register 0x00.5215 RFU Reserved for future use 0x00.5216 I2C_DR I2C data register I2C_SR1 I2C status register 1 0x00.5218 I2C_SR2 I2C status register 2 0x00.5219 I2C_SR3 I2C status register 3 0x00.521A I2C_ITR I2C interrupt 0x00.521B I2C_CCRL I2C clock control 0x00.521C I2C_CCRH I2C clock control 0x00.521D I2C_TRISER I2C rising edge 0x00.5217 8.2.11 Block I2C Universal asynchronous receiver/transmitter (UART) Table 25. UART register map Address Register name Register description 0x00.5230 UART_SR UART status 0x00.5231 UART_DR UART data 0x00.5232 UART_BRR1 UART baud rate div mantissa [7:0] UART_BRR2 UART baud rate div mantissa [11:8] SCIDIV FRACT [3:0] UART_CR1 UART control register 1 0x00.5235 UART_CR2 UART control register 2 0x00.5236 UART_CR3 UART control register 3 0x00.5237 UART_CR4 UART control register 4 0x00.5233 0x00.5234 56/130 Block UART DocID027799 Rev 1 STNRGxxxA 8.2.12 Memory and register map System timer registers Table 26. System timer register map Address Block Register name Register description 0x00.5340 STMR_CR1 Control register 1 0x00.5341 STMR_IER Interrupt enable 0x00.5342 STMR_SR1 Status register 1 0x00.5343 STMR_EGR Event generation STMR_CNTH Counter high 0x00.5345 STMR_CNTL Counter low 0x00.5346 STMR_PSCL Prescaler low 0x00.5347 STMR_ARRH Autoreload high 0x00.5348 STMR_ARRL Autoreload low STMR 0x00.5344 8.2.13 Auxiliary timer registers Table 27. Auxiliary timer register map Address Block Register name Register description 0x00.5009 GPIO1 P1CR2 Control register 2 MSC_CFGP15 P15 input line control MSC_STSP1 Port 1 status CLK_CCODIVR CCO clock dividers CLK_CCOR Configurable clock output 0x00.5036 MSC 0x00.5037 0x00.50C6 CKC 0x00.50C9 8.2.14 Basic timer0 registers Table 28. Basic timer0 register map Address Offset 0x00.5031 N.A. 0x00.5037 N.A. 0x00.503C 0x00 0x00.503C 0x01 0x00.503C 0x02 Block MSC MSC (indirect) Register name Register description MSC_CFGP10 P10 input line control MSC_STSP1 Port 1 status MSC_FTM0CKSEL Basic timer source clock selection MSC_FTM0CKDIV Basic Timer0 clock prescaler MSC_FTM0CONF Basic Timer0 counter value DocID027799 Rev 1 57/130 130 Memory and register map 8.2.15 STNRGxxxA Basic timer1 registers Table 29. Basic timer1 register map 8.2.16 Address Offset 0x00.5032 N.A. 0x00.5037 N.A. 0x00.503C 0x00 0x00.503C 0x03 0x00.503C 0x04 Block MSC MSC (indirect) Register name Register description MSC_CFGP11 P11 input line control MSC_STSP1 Port 1 status MSC_FTM0CKSEL Basic timer source clock selection MSC_FTM1CKDIV Basic Timer1 clock prescaler MSC_FTM1CONF Basic Timer1 counter value Digital addressable lighting interface (DALI) Table 30. DALI register map Address Register name Register description 0x00.53C0 DALI_CLK_L Data rate control 0x00.53C1 DALI_CLK_H Data rate control 0x00.53C2 DALI_FB0 Forward message 0x00.53C3 DALI_FB1 Forward message DALI_FB2 Forward message DALI_BD Backward message 0x00.53C6 DALI_CR Control 0x00.53C7 DALI_CSR Control and status register 0x00.53C8 DALI_CSR1 Control and status register 1 0x00.53C9 DALI_REVLN Control reverse signal line 0x00.53C4 0x00.53C5 8.2.17 Block DALI DALI noise rejection filter registers Table 31. DALI filter register map 58/130 Address Offset 0x00.503C 0x05 0x00.503C 0x06 0x00.503C 0x07 Block MSC (indirect) Register name Register description MCS_DALICKSEL DALI clock selection MSC_DALICKDIV DALI filter clock division factor MSC_DALICONF DALI filter mode configuration DocID027799 Rev 1 STNRGxxxA 8.2.18 Memory and register map Analog-to-digital converter (ADC) Table 32. ADC register map and reset value Address Register name Register description 0x00.5400 ADC_CFG Configuration 0x00.5401 ADC_SOC Start of conversion 0x00.5402 ADC_IER Interrupt enable 0x00.5403 ADC_SEQ Sequencer 0x00.5404 ADC_DATL_0 Low part data 0 converted 0x00.5405 ADC_DATH_0 High part data 0 converted 0x00.5406 ADC_DATL_1 Low part data 1 converted 0x00.5407 ADC_DATH_1 High part data 1 converted 0x00.5408 ADC_DATL_2 Low part data 2 converted 0x00.5409 ADC_DATH_2 High part data 2 converted ADC_DATL_3 Low part data 3 converted ADC_DATH_3 High part data 3 converted 0x00.540C ADC_DATL_4 Low part data 4 converted 0x00.540D ADC_DATH_4 High part data 4 converted 0x00.540E ADC_DATL_5 Low part data 5 converted 0x00.540F ADC_DATH_5 High part data 5 converted 0x00.5410 ADC_DATL_6 Low part data 6 converted 0x00.5411 ADC_DATH_6 High part data 6 converted 0x00.5412 ADC_DATL_7 Low part data 7 converted 0x00.5413 ADC_DATH_7 High part data 7 converted 0x00.5414 ADC_SR Status 0x00.5415 ADC_DLYCNT SOC delay counter 0x00.540A 0x00.540B Block ADC DocID027799 Rev 1 59/130 130 Memory and register map 8.2.19 STNRGxxxA State machine event driven (SMEDs) The SMED<n> address register is: ADD_REG = (5500h + (40h) * n) + offset where <n> is the SMED instance number 0 - 5. Table 33. SMED register map Address (offset) Register name Register description 0x00 SMD<n>_CTR Control 0x01 SMD<n>_CTR_TMR Control time 0x02 SMD<n>_CTR_INP Control input 0x03 SMD<n>_CTR_DTR Dithering 0x04 SMD<n>_TMR_T0L Time T0 LSB 0x05 SMD<n>_TMR_T0H Time T0 MSB 0x06 SMD<n>_TMR_T1L Time T1 LSB 0x07 SMD<n>_TMR_T1H Time T1 MSB 0x08 SMD<n>_TMR_T2L Time T2 LSB 0x09 SMD<n>_TMR_T2H Time T2 MSB 0x0A SMD<n>_TMR_T3L Time T3 LSB 0x0B SMD<n>_TMR_T3H Time T3 MSB 0x0C SMD<n>_PRM_ID0 IDLE state parameter0 SMD<n>_PRM_ID1 IDLE state parameter1 0x0E SMD<n>_PRM_ID2 IDLE state parameter2 0x0F SMD<n>_PRM_S00 S0 state parameter0 0x10 SMD<n>_PRM_S01 S0 state parameter1 0x11 SMD<n>_PRM_S02 S0 state parameter2 0x12 SMD<n>_PRM_S10 S1 state parameter0 0x13 SMD<n>_PRM_S11 S1 state parameter1 0x14 SMD<n>_PRM_S12 S1 state parameter2 0x15 SMD<n>_PRM_S20 S2 state parameter0 0x16 SMD<n>_PRM_S21 S2 state parameter1 0x17 SMD<n>_PRM_S22 S2 state parameter2 0x18 SMD<n>_PRM_S30 S3 state parameter0 0x19 SMD<n>_PRM_S31 S3 state parameter1 0x1A SMD<n>_PRM_S32 S3 state parameter2 0x0D 60/130 Block SMED<n> DocID027799 Rev 1 STNRGxxxA Memory and register map Table 33. SMED register map (continued) Address (offset) Register name Register description 0x1B SMD<n>_CFG Timer configuration register 0x1C SMD<n>_DMP_L Counter dump LSB 0x1D SMD<n>_DMP_H Counter dump MSB 0x1E SMD<n>_GSTS General status SMD<n>_IRQ Interrupt request register 0x20 SMD<n>_IER Interrupt enable register 0x21 SMD<n>_ISEL External events control 0x22 SMD<n>_DMP Dump enable 0x23 SMD<n>_FSM_STS FSM core status 0x1F 8.2.20 Block SMED<n> CPU register Table 34. CPU register map Address Register name Register description 0x00.7F00 A Accumulator 0x00.7F01 PCE Program counter extended 0x00.7F02 PCH Program counter high 0x00.7F03 PCL Program counter low 0x00.7F04 XH X - index high XL X - index low 0x00.7F06 YH Y - index high 0x00.7F07 YL Y - index low 0x00.7F08 SPH Stack pointer high 0x00.7F09 SPL Stack pointer low 0x00.7F0A CC Code condition 0x00.7F05 Block CPU Note: Register space accessible in debug mode only. 8.2.21 Global configuration register Table 35. CFG_GCR register map Address Block Register name Register description 0x00.7F60 GCR CFG_GCR Global configuration DocID027799 Rev 1 61/130 130 Memory and register map 8.2.22 STNRGxxxA Interrupt controller Table 36. Interrupt software priority register map Address Register name Register description 0x00.7F70 ITC_SPR0 Interrupt SW priority register 0 0x00.7F71 ITC_SPR1 Interrupt SW priority register 1 0x00.7F72 ITC_SPR2 Interrupt SW priority register 2 ITC_SPR3 Interrupt SW priority register 3 ITC_SPR4 Interrupt SW priority register 4 0x00.7F75 ITC_SPR5 Interrupt SW priority register 5 0x00.7F76 ITC_SPR6 Interrupt SW priority register 6 0x00.7F77 ITC_SPR7 Interrupt SW priority register 7 0x00.7F73 0x00.7F74 8.2.23 Block ITC SWIM control register Table 37. SWIM register map Address Block Register name Register description 0x00.7F80 SWIM SWIM_CSR SWIM control status 0x00.7F90 …. 0x00.7F9B 62/130 DM_BK1E DM … DM_VER DocID027799 Rev 1 DM internal registers STNRGxxxA 9 Interrupt table Interrupt table Table 38 shows the STNRG internal controller's interrupt. Table 38. Interrupt vector exception Source block Description Wakeup from Halt Wakeup from active- halt Interrupt vector address RESET Reset Yes Yes 8000h TRAP Software interrupt 0 NMI NMI (not maskable interrupt) 1 AWU Auto-wakeup from Halt 2 CKC Clock controller Priority 3 PO GPIO0 [5:0] external interrupts 4 P1 GPIO1 [5:0], Aux/Basic timers interrupts 8004h Yes(1) Yes(1) 8008h Yes 800Ch 8010h (1), (2) Yes(1), (2) 8014h Yes(1), (2) Yes(1), (2) 8018h (1), (2) Yes(1), (2) 801Ch Yes 5 P2 DIGIN[5:0] external interrupts Yes 6 SMED0 SMED-0 interrupt 8020h 7 SMED1 SMED-1 control logic 8024h 8 P3 Comparator [3:0] interrupts Yes(1), (2) Yes(1), (2) 8028h 9 (3) RFU Reserved for future use 802Ch 10 RFU(3) Reserved for future use 8030h 11 (3) RFU Reserved for future use 8034h 12 RFU(3) Reserved for future use 8038h 13 RFU(3) Reserved for future use 803Ch 14 (3) RFU Reserved for future use 8040h 15 SMED2 SMED-2 control logic 8044h 16 SMED3 SMED-3 control logic 8048h 17 UART Tx complete 18 19 UART I2 C Receive register DATA FULL 2 I C interrupt 804Ch Indirect (4) Indirect(4) 8050h (4) Yes 8054h Indirect 20 RFU(3) Reserved for future use 8058h 21 (3) Reserved for future use 805Ch RFU 22 ADC End of conversion 8060h 23 SYS-TMR Update/overflow 8064h 24 FLASH EOP/WR_PG_DIS 8068h Indirect(4) Indirect(4) 25 DALI DALI interrupt line 26 SMED4 SMED-4 control logic 8070h 27 SMED5 SMED-5 control logic 8074h DocID027799 Rev 1 806Ch 63/130 130 Option bytes STNRGxxxA Table 38. Interrupt vector exception (continued) Priority Source block Description Wakeup from Halt Wakeup from active- halt Interrupt vector address 28 RFU(4) Reserved future use 8078h 29 RFU(4) Reserved future use 807Ch 1. The P [2, 0] [x] may be configured to generate a NMI requests. 2. The P [3, 0] [x] may be configured to generate an IRQ requests. 3. All RFU and unused interrupts should be initialized with 'IRET' for robust programming 4. The P0 [x] may be configured to generate an IRQ and NMI request. 10 Option bytes The user option byte is a memory E²PROM area allowing users to customize the IC device major functionalities: ROP: read-out protection control field UBC: user boot code protection PWM: configurable reset output value WDG: internal watchdog HW configuration AFR: alternate multifunction signals configuration CKC: clock controller functionalities (PLL, HSE enable, AWU clock selection, etc.) HSE: clock stabilization counter WAIT: Flash and E²PROM wait state access time has to be configured with value 0x00 BOOT: configurable internal boot sources BL: bootloader control sequences Except the ROP byte all the other option bytes are stored twice in a regular (OPT) and complemented format (NOPT) for redundancy. The option byte can be programmed in ICP mode through the SWIM interface or in IAP mode by the application with the exception of the ROP byte that can be only configured via the SWIM interface. For further information about Flash programming refer to the programming manual “How to program STM8S and STM8A Flash program memory and data EEPROM” (PM0051). For information on SWIM programming procedures refer to the “STM8 SWIM communication protocol and debug module” user manual (UM0470). 64/130 DocID027799 Rev 1 Option byte register overview Table 39. Option byte register overview - STNRG388A Option bits DocID027799 Rev 1 Address Option name 4800h ROP ROP [7:0] 00h 4801h UCB UBC [7:0] 00h 4802h nUCB nUBC [7:0] FFh 4803h GENCFG Rst_PWM5 Rst_PWM4 Rst_PWM3 Rst_PWM2 Rst_PWM1 Rst_PWM0 - EN_COLD_CFG 00h 4804h nGENCFG nRst_PWM5 nRst_PWM4 nRst_PWM3 nRst_PWM2 nRst_PWM1 nRst_PWM0 - nEN_COLD_CFG FFh 4805h MISCUOPT - - 1 - LSI_EN IWdg_HW WWdg_HW WWDG_HALT 28h 4806h nMISCUOPT - - 0 - nLSI_EN nIWdg_HW nWWdg_HW nWWDG_HALT D7h 7 6 5 4 3 2 1 0 Default settings CLKCTL PWM_OD - SMD_HWtrg CKAWUSEL1 EXTCLK CKAWUSE L0 PRSC [1:0] 89h 4808h nCLKCTL nPWM_OD - nSMD_HWtrg nCKAWUSEL1 nEXTCLK nCKAWUS EL0 nPRSC [1:0] 76h 4809h HSESTAB HSECNT [7:0] 00h 480Ah nHSESTAB nHSECNT [7:0] FFh 480Bh ENHFEAT - BscTim1 ADC_MFlush BscTim0 - - - - 00h 480Ch nENHFEAT - nBscTim1 nADC_MFlush nBscTim0 - - - - FFh 480Dh WAITSTATE - ADC_NAbt - ADC_AFlush - ADC_ARlod WaitStat [1:0] 00h 480Eh nWAITSTATE - nADC_NAbt - nADC_AFlush - nADC_ARlod nWaitStat [1:0] FFh 480Fh AFR_IOMXP0 - - Sel_P054 [1:0] Sel_P032 [1:0] Sel_P010 [1:0] (2) 00h 4810h nAFR_IOMXP0 - - nSel_P054 [1:0] nSel_P032 [1:0] nSel_P010 [1:0] (2) FFh 4811h AFR_IOMXP1 AUXTMR - Sel_P15 Sel_P14 Sel_P13 Sel_P12 Sel_P11 Sel_P10 3Fh 4812h nAFR_IOMXP1 nAUXTMR - nSel_P15 nSel_P14 nSel_P13 nSel_P12 nSel_P11 nSel_P10 C0h 4813h AFR_IOMXP2 Sel_SWIM ADC_HWtrg 1 Sel_P24 Sel_P23 - Sel_P21 - 7Ah 4814h nAFR_IOMXP2 nSel_SWIM nADC_HWtrg 0 nSel_P24 nSel_P23 - nSel_P21 - 85h Option bytes 65/130 4807h STNRGxxxA 10.1 Option bits Address Option name 4815h 7 6 MSC_OPT0 - - 4816h nMSC_OPT0 - 4817h 487Dh RESERVED - 487Eh OPTBL BL [7:0] 00h 487Fh nOPTBL nBL [7:0] FFh Note: 5 4 3 2 UARTLine [1:0] - - BootSel [1:0] 01h - nUARTLine [1:0] - - nBootSel [1:0] FEh - - - - - 1 0 Default settings - - Option bytes 66/130 Table 39. Option byte register overview - STNRG388A (continued) 00h DocID027799 Rev 1 The default setting values refer to the factory configuration. The factory configuration can be overwritten by the user in accordance with the target application requirements. The factory configuration values are loosed after user programming fields or in case of the ROP unprotecting attempt causing a “Global Flash Erase”. The predefined initialized bit-values (1 or 0) must be preserved during memory writing. An undefined option bit must be keep 0 and the complement value at 1 during the memory writing sequence. Table 40. Option byte register overview - STNRG328A Option bits Option name 4800h ROP ROP [7:0] 00h 4801h UCB UBC [7:0] 00h 4802h nUCB nUBC [7:0] FFh 4803h GENCFG - Rst_PWM4 Rst_PWM3 Rst_PWM2 Rst_PWM1 Rst_PWM0 - EN_COLD_CFG 00h 4804h nGENCFG - nRst_PWM4 nRst_PWM3 nRst_PWM2 nRst_PWM1 nRst_PWM0 - nEN_COLD_CFG FFh 4805h MISCUOPT - - 1 - LSI_EN IWdg_HW WWdg_HW WWDG_HALT 28h 4806h nMISCUOPT - - 0 - nLSI_EN nIWdg_HW nWWdg_HW nWWDG_HALT D7h 4807h CLKCTL PWM_OD - SMD_HWtrg CKAWUSEL1 EXTCLK CKAWUSE L0 PRSC [1:0] 89h 4808h nCLKCTL nPWM_OD - nSMD_HWtrg nCKAWUSEL1 nEXTCLK nCKAWUS EL0 nPRSC [1:0] 76h 7 6 5 4 3 2 1 0 Default settings STNRGxxxA Address Option bits DocID027799 Rev 1 Address Option name 4809h HSESTAB HSECNT[7:0] 00h 480Ah nHSESTAB nHSECNT[7:0] FFh 480Bh ENHFEAT - BscTim1 ADC_MFlush BscTim0 - - - - 00h 480Ch nENHFEAT - nBscTim1 nADC_MFlush nBscTim0 - - - - FFh 480Dh WAITSTATE - ADC_NAbt - ADC_AFlush - ADC_ARlod WaitStat [1:0] 00h 480Eh nWAITSTATE - nADC_NAbt - nADC_AFlush - nADC_ARlod nWaitStat [1:0] FFh 480Fh AFR_IOMXP0 - - Sel_P054 [1:0] Sel_P032 [1:0] - - 00h 4810h nAFR_IOMXP0 - - nSel_P054 [1:0] nSel_P032 [1:0] - - FFh 4811h AFR_IOMXP1 AUXTMR - - Sel_P14 Sel_P13 Sel_P12 Sel_P11 Sel_P10 1Fh 4812h nAFR_IOMXP1 nAUXTMR - - nSel_P14 nSel_P13 nSel_P12 nSel_P11 nSel_P10 E0h ADC_HWtrg 1 Sel_P24 1 - Sel_P21 - 7Ah 4814h nAFR_IOMXP2 nSel_SWIM nADC_HWtrg 0 nSel_P24 0 - nSel_P21 - 85h 7 4813h AFR_IOMXP2 4815h Sel_SWIM 6 5 4 3 2 1 0 Default settings MSC_OPT0 - - UARTLine [1:0] - - BootSel [1:0] 01h 4816h nMSC_OPT0 - - nUARTLine [1:0] - - nBootSel [1:0] FEh 4817h 487Dh RESERVED - - - - - 487Eh OPTBL BL [7:0] 00h 487Fh nOPTBL nBL [7:0] FFh Note: - - - STNRGxxxA Table 40. Option byte register overview - STNRG328A (continued) 00h Option bytes 67/130 The default setting values refer to the factory configuration. The factory configuration can be overwritten by the user in accordance with the target application requirements. The factory configuration values are loosed after user programming fields or in case of the ROP unprotecting attempt causing a “Global Flash Erase”. The predefined initialized bit-values (1 or 0) must be preserved during memory writing. An undefined option bit must be keep 0 and the complement value at 1 during the memory writing sequence. Option bits DocID027799 Rev 1 Option name 4800h ROP ROP [7:0] 00h 4801h UCB UBC [7:0] 00h 4802h nUCB nUBC [7:0] FFh 4803h GENCFG - - Rst_PWM3 Rst_PWM2 Rst_PWM1 Rst_PWM0 - EN_COLD_CFG 00h 4804h nGENCFG - - nRst_PWM3 nRst_PWM2 nRst_PWM1 nRst_PWM0 - nEN_COLD_CFG FFh 4805h MISCUOPT - - 1 - LSI_EN IWDG_HW WWDG_HW WWDG_HALT 28h 4806h nMISCUOPT - - 0 - nLSI_EN nIWDG_HW nWWDG_HW nWWDG_HALT D7h 4807h CLKCTL PWM_OD - SMD_HWtrg CKAWUSEL1 EXTCLK CKAWUSE L0 PRSC [1:0] 89h 4808h nCLKCTL nPWM_OD - nSMD_HWtrg nCKAWUSEL1 nEXTCLK nCKAWUS EL0 nPRSC [1:0] 76h 4809h HSESTAB HSECNT [7:0] 00h 480Ah nHSESTAB nHSECNT [7:0] FFh 480Bh ENHFEAT - BscTim1 ADC_MFlush BscTim0 - - - - 00h 480Ch nENHFEAT - nBscTim1 nADC_MFlush nBscTim0 - - - - FFh 480Dh WAITSTATE - ADC_NAbt - ADC_AFlush - ADC_ARlod WaitStat [1:0] 00h 480Eh nWAITSTATE - nADC_NAbt - nADC_AFlush - nADC_ARlod nWaitStat [1:0] FFh 480Fh AFR_IOMXP0 - - Sel_P054 [1:0] Sel_P032 [1:0] - - 00h 4810h nAFR_IOMXP0 - - nSel_P054 [1:0] nSel_P032 [1:0] - - FFh 4811h AFR_IOMXP1 AUXTMR - - - Sel_P13 Sel_P12 Sel_P11 Sel_P10 0Fh 4812h nAFR_IOMXP1 nAUXTMR - - - nSel_P13 nSel_P12 nSel_P11 nSel_P10 F0h ADC_HWtrg - 1 - - - - 50h 4814h nAFR_IOMXP2 nSel_SWIM nADC_HWtrg - 0 - - - - AFh 4815h MSC_OPT0 - - UARTLine [1:0] - - BootSel [1:0] 01h 4816h nMSC_OPT0 - - nUARTLine [1:0] - - nBootSel [1:0] FEh 7 4813h AFR_IOMXP2 Sel_SWIM 6 5 4 3 2 1 0 Default settings STNRGxxxA Address Option bytes 68/130 Table 41. Option byte register overview - STNRG288A Option bits Address Option name 4817h 487Dh RESERVED 487Eh OPTBL BL [7:0] 00h 487Fh nOPTBL nBL [7:0] FFh Note: 7 6 5 4 3 2 1 0 - - - - - - - - Default settings STNRGxxxA Table 41. Option byte register overview - STNRG288A (continued) 00h DocID027799 Rev 1 The default setting values refer to the factory configuration. The factory configuration can be overwritten by the user in accordance with the target application requirements. The factory configuration values are loosed after user programming fields or in case of the ROP unprotecting attempt causing a “Global Flash Erase”. The predefined initialized bit-values (1 or 0) must be preserved during memory writing. An undefined option bit must be keep 0 and the complement value at 1 during the memory writing sequence. Option bytes 69/130 Option bytes 10.2 STNRGxxxA Option byte register description The option byte registers are mapped inside the E²PROM data region. 10.2.1 ROP (memory read-out protection register) Table 42. ROP (memory read-out protection register) Offset: 0x004800 Default value: 0x00 7 6 5 4 3 2 1 0 ROP [7:0] r/w Bit 7 - 0: ROP [7:0] memory read-out protection: 0xAA: enable read-out protection. When read-out protection is enabled, reading or modifying the Flash program memory and DATA area in ICP mode (using the SWIM interface) is forbidden, whatever the write protection settings are. 10.2.2 UBC (UBC user boot code register) Table 43. UBC (UBC user boot code register) Offset: 0x004801 Default value: 0x00 7 6 5 4 3 2 1 0 UBC [7:0] r/w Bit 7 - 0: UBC [7:0] user boot code write protection memory size: 0x00: no UBC, no Flash memory write-protection 0x01: pages 0 to 1 defined as UBC; 1 Kbyte memory write-protected (0x00.80000x00.83FF) 0x02: pages 0 to 3 defined as UBC; 2 Kbyte memory write-protected (0x00.80000x00.87FF) 0x03: pages 0 to 4 defined as UBC; 2.5 Kbyte memory write-protected (0x00.80000x00.89FF) ... (512 byte every page) 0x3E: pages 0 to 63 defined as UBC; 32 Kbyte memory write-protected (0x00.80000x00.FFFF) Other values: reserved. 70/130 DocID027799 Rev 1 STNRGxxxA 10.2.3 Option bytes nUBC (UBC user boot code register protection) Table 44. nUBC (UBC user boot code register protection) Offset: 0x004802 Default value: 0xFF 7 6 5 4 3 2 1 0 nUBC [7:0] r/w nUBC: not (UBC) EMC byte protection. 10.2.4 GENCFG (general configuration register) Table 45. GENCFG (general configuration register) Offset: 0x004803 Default value: 0x00 7 6 5 4 3 2 1 0 Rst_PWM [5:0] RFU EN_COLD_CFG r/w r r/w Bit 0: The EN_COLD_CFG enables IC cold configuration through the option byte register AFR_IOMXP0, P1 and P2: 0: default case, the IC multifunction signal configuration is performed by the miscellaneous registers MSC_IOMXP0, MSC_IOMXP1 and MSC_IOMXP2 (warm configuration). 1: enables the multifunction signal configuration through the option byte registers AFR_IOMXP0, AFR_IOMXP1 and AFR_IOMXP2 (cold configuration). Bit 1: RFU reserved; must be kept 0 during register writing for future compatibility Bit 7:2: Rst_PWM [5:0] configures the PWM [n] reset value after the NRST signal 0: PWM [n] output low level (native default value) 1: PWM [n] output high level. Note: The PWM signal programmed reset value is configured during the option byte loader phase, then before the NRST is released it assumes its proper initial values. The Rst_PWM5 is available only on the STNRG388A, otherwise keep 0. The Rst_PWM4 is available only on the STNRG388A and STNRG328A, otherwise keep 0. DocID027799 Rev 1 71/130 130 Option bytes 10.2.5 STNRGxxxA nGENCFG (general configuration register protection) Table 46. nGENCFG (general configuration register protection) Offset: 0x004804 Default value: 0xFF 7 6 5 4 3 2 1 0 nRst_PWM [5:0] nRFU nEN_COLD_CFG r/w r r/w nGENCFG: not (GENCFG) EMC byte protection 10.2.6 MISCUOPT (miscellaneous configuration register) Table 47. MISCUOPT (miscellaneous configuration register) Offset: 0x004805 Default value: 0x28 (factory configuration) 7 6 5 4 3 2 1 0 RFU RFU LSI_EN lWdg_hw WWdg_hw WWdg_HALT RFU r r r r/w r/w r/w r/w Bit 0: WWdg_HALT window watchdog reset on Halt: 0: no reset generated on Halt if WWDG is active 1: reset generated on Halt if WWDG is active. Bit 1: WWdg_hw window watchdog hardware enable: 0: window watchdog activation by SW 1: window watchdog activation by HW. Bit 2: IWdg_hw independent watchdog hardware enable: 0: independent watchdog activation by SW 1: independent watchdog activation by HW. Bit 3: LSI_EN low speed internal RCOSC clock enable: 0: LSI clock is not available to CPU 1: LSI cock is enabled for CPU. Bit 4: RFU reserved; must be kept 0 during register writing for future compatibility. 72/130 DocID027799 Rev 1 STNRGxxxA Option bytes Bit 5: RFU reserved; must be kept 1 during register writing for future compatibility. Bit 7 - 6: RFU reserved; must be kept 0 during register writing for future compatibility. 10.2.7 nMISCUOPT (miscellaneous configuration register protection) Table 48. nMISCUOPT (miscellaneous configuration register protection) Offset: 0x004806 Default value: 0xD7 (factory configuration) 7 6 5 4 3 2 1 0 nRFU nRFU nRFU nLSI_EN nlWdg_hw nWWdg_hw nWWdg_HALT r r r r/w r/w r/w r/w nMISCUOPT: not (MISCUOPT) EMC byte protection 10.2.8 CLKCTL (CKC configuration register) Table 49. CLKCTL (CKC configuration register) Offset: 0x004807 Default value: 0x89 (factory configuration) 7 6 5 4 3 2 1 0 PWM_OD RFU SMD_HWtrg CKAWUSEL1 EXTCLK CKAWUSEL0 PRSC [1:0] r/w r r/w r/w r/w r/w r/w Bit 1 - 0: PRSC [1:0] prescaler value for HSE to provide AWU unit with the low speed clock: 00: 24 MHz to 128 kHz prescaler 01: 16 MHz to 128 kHz prescaler 10: 8 MHz to 128 kHz prescaler 11: 4 MHz to 128 kHz prescaler. Bit 3: EXTCLK external clock selection: 0: external crystal oscillator clock connected to HseOscin and HseOscout signals 1: external direct drive clock connected to HseOscin. DocID027799 Rev 1 73/130 130 Option bytes STNRGxxxA Bit 4, 2: CKAWUSEL [1:0] AWU clock selection: 00: low speed internal clock used for AWU module 01: HSE high speed external clock with prescaler used for AWU module 10: reserved encoding value 11: reserved encoding value. Bit 5: SMD_HWtrg enable SMED ADC HW trigger functionality: 0: disable SMED ADC HW trigger request 1: enable SMED ADC HW trigger request; this functionality requires that all SMEDs must be configured with fSMED fMASTER and the ADC_HWtrg option bit of the AFR_IOMXP2 register programmed at '0'. Bit 6: RFU reserved; must be kept 0 during register writing for future compatibility. Bit 7: PWM_OD PWM output pseudo- open drain features: 0: enable PWM output signal open drain. This functionality is configurable by GPIO1 internal registers. 1: disable PWM output signal open drain functionality. 10.2.9 nCLKCTL (CKC configuration register protection) Table 50. nCLKCTL (CKC configuration register protection) Offset: 0x004808 Default value: 0x76 (factory configuration) 7 6 5 nPWM_OD nRFU r/w r 4 3 nSMD_HWtrg nCKAWUSEL1 nEXTCLK r/w r/w 2 1 0 nCKAWUSEL0 nPRSC [1:0] r/w r/w r/w nCLKCTL: not (CLKCTL) EMC byte protection. 10.2.10 HSESTAB (HSE clock stabilization register) Table 51. HSESTAB (HSE clock stabilization register) Offset: 0x004809 Default value: 0x00 7 6 5 4 3 HSECNT [7:0] r/w 74/130 DocID027799 Rev 1 2 1 0 STNRGxxxA Option bytes Bit 7 - 0: HSECNT [7:0] HSE crystal oscillator stabilization cycles: 0x00: 2048 clock cycles 0xB4: 128 clock cycles 0xD2: 8 clock cycles 0xE1: 0.5 clock cycles. 10.2.11 nHSESTAB (HSE clock stabilization register protection) Table 52. nHSESTAB (HSE clock stabilization register protection) Offset: 0x00480A Default value: 0xFF 7 6 5 4 3 2 1 0 nHSECNT [7:0] r/w nHSESTAB: not (HSESTAB) EMC byte protection. 10.2.12 ENHFEAT (EXP features configuration register) Table 53. ENHFEAT (EXP features configuration register) Offset: 0x00480B Default value: 0x00 7 6 5 4 3 2 1 RFU BscTim1 ADC_MFlush BscTim0 RFU r r/w r/w r/w r 0 Bit 0 - 3: RFU reserved; must be kept 0 during register writing for future compatibility. Bit 4: BscTim0 enable basic Timer0: 0: enable basic Timer0 1: disable basic Timer0. Bit 5: ADC_MFlush enable ADC mode flush: 0: enable ADC mode flush 1: disable ADC mode flush. DocID027799 Rev 1 75/130 130 Option bytes STNRGxxxA Bit 6: BscTim1 enable basic Timer1: 0:enable basic Timer0 1: disable basic Timer0. Bit 7: RFU reserved; must be kept 0 during register writing for future compatibility. 10.2.13 nENHFEAT (EXP features configuration register) Table 54. nENHFEAT (EXP features configuration protection) Offset: 0x00480C Default value: 0xFF 7 6 5 4 3 2 1 nRFU nBscTim1 nADC_MFlush nBscTim0 nRFU r r/w r/w r/w r 0 nENHFEAT: not (ENHFEAT) EMC byte protection. 10.2.14 WAITSTATE (Flash wait state register) Table 55. WAITSTATE (Flash wait state register) Offset: 0x00480D Default value: 0x00 7 6 5 4 3 2 1 0 RFU ADC_NAbt RFU ADC_AFlush RFU ADC_ARlod WaitStat[1:0] r r/w r r/w r r/w r/w Bit 1 - 0: WaitStat [1:0] configures the E²PROM and Flash programmable delay read access time: 00: 0 no delay cycle (default case fMASTER at 16 MHz) 01: 1 delay cycles 10: 2 delay cycles 11: 3 delay cycles. Bit 2: ADC_ARlodenable ADC auto-reload conversion command: 0: enable ADC auto-reload conversion command 1: disable ADC auto-reload conversion command Bit 3: RFU reserved; must be kept 0 during register writing for future compatibility. 76/130 DocID027799 Rev 1 STNRGxxxA Option bytes Bit 4: ADC_AFlush enable ADC auto-flush: 0: enable ADC auto-flush command 1: disable ADC auto-flush command Bit 5: RFU reserved; must be kept 0 during register writing for future compatibility. Bit 6: ADC_NAbt enable ADC new abort mode: 0: enable ADC new abort/flush mode 1: disable ADC new abort/flush mode (ADC abort/flush sequence compliant with the STLUXxxxA family). Bit 7: RFU reserved; must be kept 0 during register writing for future compatibility. 10.2.15 nWAITSTATE (Flash wait state register protection) Table 56. nWAITSTATE (Flash wait state protection) Offset: 0x00480E Default value: 0xFF 7 6 5 4 3 2 1 0 nRFU nADC_NAbt nRFU nADC_AFlush nRFU nADC_ARlod nWaitStat [1:0] r r/w r r/w r r/w r/w nWAITSTATE: not (WAITSTATE) EMC byte protection. 10.2.16 AFR_IOMXP0 (alternative Port0 configuration register) Table 57. AFR_IOMXP0 (alternative Port0 configuration register) Offset: 0x00480F Default value: 0x00 7 6 5 4 3 2 1 0 RFU Sel_P054 [1:0] Sel_P032 [1:0] Sel_P010 [1:0] (1) r r/w r/w r/w 1. Available only on the STNRG388A, otherwise keep 0. Bit 5 - 0: Refer to MSC_IOMXP0 miscellaneous register field description in Section 8.2 on page 49. Bit 7 - 6: RFU reserved; must be kept 0 during register writing for future compatibility. DocID027799 Rev 1 77/130 130 Option bytes 10.2.17 STNRGxxxA nAFR_IOMXP0 (alternative Port0 configuration register protection) Table 58. nAFR_IOMXP0 (alternative Port0 configuration register protection) Offset: 0x004810 Default value: 0xFF 7 6 5 4 3 2 1 0 nRFU nSel_P054 [1:0] nSel_P032 [1:0] nSel_P010 [1:0] r r/w r/w r/w nAFR_IOMXP0: not (AFR_IOMXP0) EMC byte protection. 10.2.18 AFR_IOMXP1 (alternative Port1 configuration register) Table 59. AFR_IOMXP1 (alternative Port1 configuration register) Offset: 0x004811 Default value: 0x3F, 0x1F or 0F depends of devices 7 6 5 4 3 2 1 0 AUXTIM RFU Sel_p15(1) Sel_p14(2) Sel_p13 Sel_p12 Sel_p11 Sel_p10 r/w r r/w r/w r/w r/w r/w r/w 1. Available only on the STNRG388A, otherwise keep 0. 2. Available only on the STNRG388A and STNRG328A, otherwise keep 0. Bit 5 - 0: Refer to MSC_IOMXP1 miscellaneous register field description in Section 8.2.3 on page 50. Bit 6: RFU reserved; must be kept 0 during register writing for future product compatibility. Bit 7: AUXTIM CCO aux timer compatibility features 0: CCOaux timer enabled 1: CCOaux timer disabled. 78/130 DocID027799 Rev 1 STNRGxxxA 10.2.19 Option bytes nAFR_IOMXP1 (alternative Port1 configuration register protection) Table 60. nAFR_IOMXP1 (alternative Port1 configuration register protection) Offset: 0x004812 Default value: 0xC0, 0xE0 or 0xF0 depends on devices 7 6 5 4 3 2 1 0 nAUXTIM nRFU nSel_p15 nSel_p14 nSel_p13 nSel_p12 nSel_p11 nSel_p10 r/w r r/w r/w r/w r/w r/w r/w nAFR_IOMXP1: not (AFR_IOMXP1) EMC byte protection. 10.2.20 AFR_IOMXP2 (alternative Port2 configuration register) Table 61. AFR_IOMXP2 (alternative Port2 configuration register) Offset: 0x004813 Default value: 0x7A or 50, depends on devices 7 6 SEL_SWIM ADC_HWtrg r/w r/w 5 4 3 2 1 0 RFU Sel_P24(1) Sel_P23(2) RFU Sel_P21(1) RFU r r/w r/w r r/w r 1. Available only on the STNRG388 and STNRG328A, on the STNRG288A keep 1. 2. Available only on the STNRG388, otherwise keep 0. Bit 0: RFU reserved; must be kept 0 during register writing for future product compatibility. Bit 1: Sel_P21; refer to MSC_IOMXP2 miscellaneous register field description in Section 8.2.3 on page 50. Bit 2: RFU reserved; must be kept 0 during register writing for future product compatibility. Bit 3: Sel_P23; refer to MSC_IOMXP2 miscellaneous register field description in Section 8.2.3. Bit 4: Sel_P24; refer to MSC_IOMXP2 miscellaneous register field description in Section 8.2.3. Bit 5: RFU1 reserved; must be kept 1 during register writing for future products compatibility. DocID027799 Rev 1 79/130 130 Option bytes STNRGxxxA Bit 6: ADC_HWtrg: enable ADC HW trigger functionality. 0: enable ADC HW trigger. 1: disable ADC HW trigger. Bit 7: Sel_SWIM; refer to MSC_IOMXP2 miscellaneous register field description in Section 7.4 on page 41. 10.2.21 nAFR_IOMXP2 (alternative Port2 configuration register protection) Table 62. nAFR_IOMXP2 (alternative Port2 configuration register protection) Offset: 0x004814 Default value: 0x85 or AF, depends on devices 7 6 5 4 nSEL_SWIM nADC_HWtrg nRFU r/w r/w r 3 nSel_P24 nSel_P23 r/w 2 1 0 nRFU nSel_P21 nRFU r r/w r r/w nAFR_IOMXP2: not (AFR_IOMXP2) EMC byte protection. 10.2.22 MSC_OPT0 (miscellaneous configuration reg0) Table 63. MSC_OPT0 (miscellaneous configuration reg0) Offset: 0x004815 Default value: 0x01 7 6 5 4 3 2 1 0 RFU UARTline [1:0] RFU BootSel [1:0] r r/w r r/w Bit 1 - 0: BootSel [1:0] boot-ROM peripheral enables: 00: automatic scan boot sources; this selection enables the automatic scan configuration sequence of all possible initializing peripheral devices: Periph0 (UART), Periph1 (RFU). 01: enable boot source: Periph0 10: enable boot source: Periph1 11: enable boot sources: Periph1, Periph0 Bit 2 - 3: RFU reserved; must be kept 0 during register writing for future compatibility. 80/130 DocID027799 Rev 1 STNRGxxxA Option bytes Bit 5 - 4: UARTline [1:0] selects the UART port configuration pins involved during the bootload sequence in warm configuration mode; in case of cold configuration, this field is ignored since the UART port is selected by the register AFR_IOXP0. 00: boot sequence with UART i/f configured in all possible UART multiplexed signal schemes. This sequence is used when the UART i/f position is not specified. 01: boot sequence with UART i/f configured on P0 (1, 0) available only on the STNRG388A. 10: boot sequence with UART i/f configured on P0 (3, 2) 11: boot sequence with UART i/f configured on P0 (5, 4). Bit 7 - 6: RFU reserved; must be kept 0 during register writing for future compatibility. 10.2.23 nMSC_OPT0 (miscellaneous configuration reg0 protection) Table 64. nMSC_OPT0 (miscellaneous configuration reg0 protection) Offset: 0x004816 Default value: 0xFE 7 6 5 4 3 2 1 0 nRFU nUARTline [1:0] nRFU nBootSel [1:0] r r/w r r/w nMSC_OPT0: not (MSC_OPT0) EMC byte protection. 10.2.24 OPTBL (option byte bootloader) Table 65. OPTBL (option byte bootloader) Offset: 0x00487E Default value: 0x00 7 6 5 4 3 2 1 0 BL [7:0] r/w Bit 7 - 0: BL [7:0] bootloader field checked by the internal BootROM code during the STNRG initialization phase. The content of register locations 0x00487E, 0x00487F and 0x008000 determine the bootloader SW flow execution sequence. DocID027799 Rev 1 81/130 130 Option bytes 10.2.25 STNRGxxxA nOPTBL (option byte boot loader protection) Table 66. nOPTBL (option byte boot loader protection) Offset: 0x00487F Default value: 0x00 7 6 5 4 3 nBL [7:0] r/w nOPTBL: not (OPTBL) EMC byte protection. 82/130 DocID027799 Rev 1 2 1 0 STNRGxxxA Device identification 11 Device identification 11.1 Unique ID The STNRG family provides a 56-bit unique identifier code usable as a device identification number which can be used to increase the device security. The unique ID code is a frozen signature not alterable by the user. The unique device identifier is ideally used by the application software and is suited for: Serial code Security keys in conjunction with cryptographic software to increase the embedded Flash code security Activating the secure boot sequence. Table 67. Unique ID register overview Unique ID bits Address Option name 7 6 5 4 3 2 1 48E0h UID0 LotNum [7:0] 48E1h UID1 LotNum [15:8] 48E2h UID2 LotNum [23:16] 48E3h UID3 WaferNum [4:0] Xcoord [7:5] 48E4h UID4 Xcoord [4:0] Ycoord [7:5] 48E5h UID5 Ycoord [4:0] LotNum [42:40] 48E6h UID6 LotNum [31:24] 48E7h UID7 LotNum [39:32] DocID027799 Rev 1 0 83/130 130 Device identification 11.2 STNRGxxxA Device ID The STNRG device identification model is coded in the following register area and it cannot be altered by the user. Table 68. Dev ID register overview Dev ID bits Address Option name Default settings 7 6 5 4 3 2 1 0 4896h DVD0 DEV_ID[7:0] (1) 4897h nDVD0 nDEV_ID[7:0] (1) 4898h DVD1 RFU Rev_ID [4:0] (1) 4899h nDVD1 nRFU nRev_ID [4:0] (1) 1. Refer to Table 69. The RFU and nRFU values are reserved and the value may be changed within devices. Table 69. Device revision model overview STNRG device revision model Note: 84/130 DEV_ID[7:0] Rev_ID[4:0] Device name 0x22 0b00001 STNRG288A 0x12 0b00001 STNRG328A 0x04 0b00001 STNRG388A Mask the DVD1 and nDVD1 register with 0x1F when read the Rev_ID [4:0] field. DocID027799 Rev 1 STNRGxxxA Electrical characteristics 12 Electrical characteristics 12.1 Parameter conditions Unless otherwise specified, all voltages are referred to VSS. VDDA and VDD must be connected to the same voltage value. VSS and VSSA must be connected together with the shortest wire loop. 12.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = 25 °C and TA = TA max. (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated according to each table specific notes and are not tested in production. 12.1.2 Typical values Unless otherwise specified, typical data are based on TA = 25 °C, VDD and VDDA = 3.3 V. They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range. 12.1.3 Typical curves Unless otherwise specified, all typical curves are given as design guidelines only and are not tested. 12.1.4 Typical current consumption For typical current consumption measurements, VDD and VDDA are connected together as shown in Figure 11. Figure 11. Supply current measurement conditions VDD VDDA VSS VSSA DocID027799 Rev 1 85/130 130 Electrical characteristics 12.1.5 STNRGxxxA Loading capacitors The loading conditions used for pin parameter measurement are shown in Figure 12: Figure 12. Pin loading conditions 12.1.6 Pin output voltage The input voltage measurement on a pin is described in Figure 13. Figure 13. Pin input voltage 86/130 DocID027799 Rev 1 STNRGxxxA 12.2 Electrical characteristics Absolute maximum ratings Stresses above those listed as 'absolute maximum ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect the device reliability. Table 70. Voltage characteristics Symbol Ratings Min. Max. -0.3 6.5 VSS - 0.3 VDD + 0.3 VDDX - VSSX Supply voltage(1) (2) Input voltage on any other pin VIN VDD - VDDA Variation between different power pins VESD V 50 Variation between all the different ground pins(3) VSS - VSSA Unit mV 50 Refer to absolute maximum ratings (electrical sensitivity) in Section 12.4.1 on page 120 Electrostatic discharge voltage 1. All power VDDX (VDD, VDDA) and ground VSSX (VSS, VSSA) pins must always be connected to the external power supply. 2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. 3. VSS and VSSA signals must be interconnected together with a short wire loop. Table 71. Current characteristics Symbol Max.(1) Ratings Total current into VDDX power lines(2) IVDDX IVSSX Total current out of VSSX power lines(2) Output current sunk by any I/Os and control pin IIO Unit 100 100 Ref. to Table 86 on page 104 mA Output current source by any I/Os and control pin IINJ(PIN) IINJ(TOT) (3) (4) , (3), (4), (5) Injected current on any pin ±4 Sum of injected currents ±20 1. Data based on characterization results, not tested in production. 2. All power VDDX (VDD, VDDA) and ground VSSX (VSS, VSSA) pins must always be connected to the external power supply. 3. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. 4. Negative injection disturbs the analog performance of the device. 5. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values). These results are based on characterization with IINJ(PIN) maximum current injection on four I/O port pins of the device. DocID027799 Rev 1 87/130 130 Electrical characteristics STNRGxxxA Table 72. Thermal characteristics Symbol TSTG TJ 12.3 Ratings Max. Storage temperature range Unit -65 to 150 Maximum junction temperature ºC 150 Operating conditions The device must be used in operating conditions that respect the parameters listed in Table 73. In addition, a full account must be taken for all physical capacitor characteristics and tolerances. Table 73. General operating conditions Symbol fCPU Parameter Internal CPU clock frequency Conditions Min. -40 TA 105 °C VDD1, VDDA1 Operating voltages VDD, VDDA Nominal operating voltages Max. Unit 0 16 MHz 3(1) 5.5(1) 3.3(1) 5(1) V 470 3300 nF 0.05 0.2 15 nH 1.8(2) Core digital power supply VOUT Typ. CVOUT: capacitance of external capacitor(3) at 1 MHz ESR of external capacitor(2) (2) ESL of external capacitor JA(4) TA FR4 multilayer PCB Ambient temperature TSSOP38 TSSOP28 80 °C/W VFQFPN32 26 °C/W Pd = 100 mW -40 105 °C 1. The external power supply can be within range from 3 V up to 5.5 V although IC performances are optimized for a power supply equal to 3.3 V. 2. Internal core power supply voltage. 3. Care should be taken when the capacitor is selected due to its tolerance, its dependency on temperature, DC bias and frequency. 4. To calculate PDmax (TA), use the formula PDmax = (TJmax - TA)/JA. 88/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Table 74. Operating conditions at power-up/power-down Symbol tVDD Parameter Conditions Min.(1) Typ. Max.(1) VDD rise time rate 2 µs/V 1 sec./V(2) VDD fall time rate 2 µs/V 1 sec./V(2) tTEMP Reset release delay VDD rising VIT+ Power-on reset threshold 2.65 2.8 2.98 VIT- Brownout reset threshold 2.58 2.73 2.88 Unit 3 VHYS(BOR) Brownout reset hysteresis 70 ms V mV 1. Guaranteed by design, not tested in production. 2. Power supply ramp must be monotone. 12.3.1 VOUT external capacitor The stabilization of the main regulator is achieved by connecting an external capacitor CVOUT(c)to the VOUT pin. The CVOUT is specified in Section 12.3: Operating conditions Care should be taken to limit the series inductance to less than 15 nH. Figure 14. External capacitor CVOUT 12.3.2 Supply current characteristics The STNRG supply current is calculated by summing the supply base current in the desired operating mode as per Table 75, with the peripheral supply current value reported inTable 67 on page 83 and Table 68 on page 84. For example, considering an application where: fMASTER = fCPU = 16 MHz provided by HSI internal RC oscillator CPU code execution in Flash All base peripheral actives: I2C, UART, DALI, ITC, GPIO0, SysTmr, WWDG and IWDG ADC conversion frequency fADC = 5.3 MHz ACU (comparator and DAC units) active 6 PWM toggling at fPWM = 0.5 MHz provided by 6 SMEDs running at fSMED = 12 MHz (NPWM = 6). c. ESR is the equivalent series resistance and ESL is the equivalent inductance. DocID027799 Rev 1 89/130 130 Electrical characteristics STNRGxxxA The total current consumption is given by Equation 1: Equation 1 IDD = IDD(Run2) + IDD(ADC2) + IDD(ACU) + IDD(PLL) + IDD(PWM) where IDD(PWM) = IDD(PWM1) x NPWM More generally, the PWM current consumption is given for each fSMED clock grouping, by Equation 2: Equation 2 NfSMED I DD PWM = i = 1 XXXX I DD PWM i1 N i where i = fSMED clock group index; Ni = PWM number of the i_th clock group; NfSMED = fSMED clock group number. 90/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics IC supply base current consumption Table 75 summarizes the current consumption measured on VDD/VDDA supply pins in relevant operative conditions. Table 75. Supply base current consumption at VDD/VDDA = 3.3/5 V Symbol Code Clock fMASTER Peripheral fCPU (2) Periph , (3) Consumption(1) Typ. (4) Max. Note (4) Op. mode Code area Clock MHz MHz Enb/Dis mA mA IDD(Run1) Flash HSI 2 2 All 2.3 2.77 IDD(Run2) Flash HSI 16 16 All 9.4 11.3 IDD(Run3) RAM HSI 16 16 All 4.2 5.1 IDD(Run4) Flash HSE(5) 16 16 All 10.0 12.1 VDD/VDDA = 3.3 V 10.6 12.74 VDD/VDDA = 5 V IDD(Run5) RAM HSE(5)16 16 16 All 4.6 5.53 VDD/VDDA= 3.3 V All 5.2 6.63 VDD/VDDA = 5 V IDD(SLOW1) Flash HSI 16 2 All 3.6 4.33 IDD(SLOW2) RAM HSI 16 2 All 2.9 3.5 IDD(SLOW3) Flash HSE(5) 16 2 All 3.9 4.7 VDD/VDDA = 3.3 V All 4.5 5.5 VDD/VDDA = 5 V IDD(SLOW4) Flash HSI 16 0.125 All 2.7 3.3 IDD(SLOW5) Flash HSE(5) 16 0.125 All 3.0 3.7 VDD/VDD = 3.3 V All 3.6 4.4 VDD/VDDA = 5 V IDD(SLOW6) Flash LSI 0.153 0.153 All 1.5 1.9 IDD(WFI1) Flash HSI 16 16 All 2.6 3.2 IDD(WFI2) Flash HSE(5) 16 16 All 3.1 3.8 VDD/VDDA =3.3 V All 3.8 5.6 VDD/VDDA =5 V Description Reset exit condition 1. Data based on characterization results not tested in production. 2. “All” means: I2C, UART, DALI, ITC, GPIO0, SysTmr, WWDG and IWDG peripherals active. 3. The peripheral current consumption is supplied by the VCORE voltage (1.8 V). 4. Temperature operating: TA = 25 °C. 5. HSE frequency provided by external quartz. DocID027799 Rev 1 91/130 130 Electrical characteristics STNRGxxxA IC low power current consumption Table 76 summarizes the current consumption measured on VDD/VDDA supply pins in power saving conditions. Table 76. Supply low power consumption at VDD/VDDA = 3.3/5 V Symbol Code Clock Consumption(1) Peripheral 2 (4) (5) (6) (7) MVRreg. MHz Enable Enable mA mA HSI 16 Enable Enable 0.23 0.32 AWU clocked by LSI HSI 16 Enable Disable 0.085 0.12 AWU clocked by LSI IDD(AHLT3) Flash HSE(9), (10) 16 Enable Enable 0.73 0.90 VDD/VDDA =3.3 V 1.4 1.7 VDD/VDDA = 5 V IDD(AHLT4) Flash HSE(9), (10) 16 Enable Disable 0.65 0.95 VDD/VDDA =3.3 V 1.2 1.45 VDD/VDDA = 5 V IDD(HLT1) Flash 16 Enable Disable 0.087 0.13 IDD(HLT2) Flash HSE(9), (10) 16 Enable Disable 0.075 0.11 VDD/VDDA =3.3 V 0.090 0.15 VDD/VDDA= 5 V Source IDD(AHLT1) Flash IDD(AHLT2) Flash HSI Max. , Note E PROM fMASTER Op. mode Code (2) (3) , area Typ. , (7) (8) Description 1. Data based on characterization results not tested in production. 2. Active-halt op. mode: all peripherals except AWU and IWDG are disabled (clock gated). 3. HALT op. mode: all peripherals are disabled (clock gated). 4. E2PROM is considered always enabled. 5. VCORE main DC voltage regulator. 6. Temperature operating: TA= 25 °C. 7. All the analog input signals are connected to GND; the signals of the port P0, P1 and P2 are configured as input with pullup enabled. 8. Temperature operating: TA= 105 °C. 9. HSE frequency provided by external quartz. 10. AWU clocked by HSE source clock. 92/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics IC peripheral current consumption (3.3 V) Table 77 summarizes the peripheral current consumption measured on VDD/VDDA supply pins. Table 77. Peripheral supply current consumption at VDD/VDDA = 3.3 V Symbol Clock Consumption(1) Peripherals PLL fSMED(2) fPWM(3) fADC(4) ADC(5) PWM(6),(7) ACU(8) Typ.(9) Max(9) Enb/dis MHz MHz MHz Enb/dis Num Enb/dis mA mA IDD(PLL) Enab 0 0 0 Disab 0 Disab 2.3 2.7 IDD(ACU) Disab 0 0 0 Disab 0 Enab 1.9 2.3 1.8 2.1 6.69 8.32 8.55 10.4 Op. mode IDD(PWM1PLL96) IDD(PWM4PLL96) IDD(PWM5PLL96) 1 Enab 96 0.5 0 Disab 4 5 Disab IDD(PWM6PLL96) 6 10.12 12.2 IDD(PWM1PLL48) 1 1.12 1.4 4.31 5.31 5.6 6.8 IDD(PWM4PLL48) IDD(PWM5PLL48) Enab 48 0.5 0 Disab 4 5 Disab IDD(PWM6PLL48) 6 6.54 7.85 IDD(PWM1PLL24) 1 0.71 0.9 2.89 3.54 3.9 4.7 IDD(PWM4PLL24) IDD(PWM5PLL24) Enab 24 0.5 0 Disab 4 5 Disab IDD(PWM6PLL24) 6 4.39 5.27 IDD(PWM1PLL12) 1 0.6 0.7 2.2 2.69 2.95 3.6 IDD(PWM4PLL12) IDD(PWM5PLL12) Enab 12 0.5 0 Disab 4 5 Disab IDD(PWM6PLL12) 6 3.33 4 IDD(PWM1PLL6) 1 0.5 0.6 1.85 2.26 2.6 3.2 IDD(PWM4PLL6) IDD(PWM5PLL6) Enab 6 0.5 0 Disab 4 5 Disab IDD(PWM6PLL6) 6 2.81 3.4 IDD(PWM1HSI16) 1 0.5 0.6 1.79 2.19 2.3 3 2.63 3.3 IDD(PWM4HSI16) IDD(PWM5HSI16) Enab 16 0.5 0 Disab 4 5 6 IDD(PWM6HSI16) DocID027799 Rev 1 Disab 93/130 130 Electrical characteristics STNRGxxxA Table 77. Peripheral supply current consumption at VDD/VDDA = 3.3 V (continued) Symbol Op. mode Clock PLL fSMED(2) fPWM(3) fADC(4) ADC(5) PWM(6),(7) ACU(8) Typ.(9) Max.(9) Enb/dis MHz MHz MHz Enb/dis Num. Enb/dis mA mA 0.4 0.5 1.39 1.7 1.95 2.4 IDD(PWM1HSI8) IDD(PWM4HSI8) IDD(PWM5HSI8) Consumption(1) Peripherals 1 Enab 8 0.5 0 Disab 4 5 Disab IDD(PWM6HSI8) 6 2.12 2.55 IDD(PWM1HSI4) 1 0.3 0.4 1.21 1.48 1.7 2.2 IDD(PWM4HSI4) IDD(PWM5HSI4) Enab 4 0.5 0 Disab 4 5 Disab IDD(PWM6HSI4) 6 1.78 2.2 IDD(PWM1HSI2) 1 0.25 0.3 1.07 1.31 1.52 1.9 1.60 1.93 IDD(PWM4HSI2) IDD(PWM5HSI2) Enab 2 0.5 0 Disab 4 5 Disab 6 IDD(PWM6HSI2) IDD(ADC1) Disab 0 0 1 Enab 0 Disab 1.55 1.87 IDD(ADC2) Disab 0 0 5.3 Enab 0 Disab 1.6 1.95 IDD(ADC3) Enab 0 0 6 Enab 0 Disab 1.56 1.88 1. Data based on characterization results not tested in production. 2. SMED frequency: -96 MHz and 6 MHz frequencies require the PLL enabled. -Current table shows only a subset value of possible SMED frequencies. 3. PWM frequency: -PWM toggle frequency is considered fixed to 500 kHz, close to the maximum applicative value. 4. ADC frequency: -6 MHz frequency requires the PLL enabled. -Current table shows only a subset value of possible ADC frequencies 5. ADC configured in circular mode. 6. Number of active PWMs. 7. PWM pins are loaded with a CL (load capacitance) of 50 pF. 8. If enabled all DACs and comparator units are active. 9. Temperature operating: TA = 25 °C 94/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics IC peripheral current consumption (5 V) Table 78 summarizes the peripheral current consumption measured on VDD/VDDA supply pins. Table 78. Peripheral supply current consumption at VDD/VDDA = 5 V Symbol Clock PLL fSMED(2) fPWM(3) fADC(4) ADC(5) Enb/dis MHz MHz MHz Enb/dis Num. IDD(PLL) Enab 0 0 0 Disab IDD(ACU) Disab 0 0 0 Disab Op. mode IDD(PWM1PLL96) IDD(PWM4PLL96) IDD(PWM5PLL96) Consumption(1) Peripherals PWM(6), (7) ACU(8) Typ.(9) Max.(9) Enb/dis mA mA 0 Disab 2.32 2.78 0 Enab 2.22 2.66 1.81 2.17 6.98 8.69 9.0 10.8 1 Enab 96 0.5 0 Disab 4 5 Disab IDD(PWM6PLL96) 6 10.49 12.52 IDD(PWM1PLL48) 1 1.18 1.42 4.58 5.65 5.9 7.5 IDD(PWM4PLL48) IDD(PWM5PLL48) Enab 48 0.5 0 Disab 4 5 Disab IDD(PWM6PLL48) 6 6.88 8.26 IDD(PWM1PLL24) 1 0.8 0.95 3.16 3.88 4.2 5.2 IDD(PWM4PLL24) IDD(PWM5PLL24) Enab 24 0.5 0 Disab 4 5 Disab IDD(PWM6PLL24) 6 4.73 5.68 IDD(PWM1PLL12) 1 0.6 0.7 2.46 3.01 3.3 4.2 IDD(PWM4PLL12) IDD(PWM5PLL12) Enab 12 0.5 0 Disab 4 5 Disab IDD(PWM6PLL12) 6 3.66 4.4 IDD(PWM1PLL6) 1 0.5 0.6 2.11 2.58 2.9 3.6 IDD(PWM4PLL6) IDD(PWM5PLL6) Enab 6 0.5 0 Disab 4 5 Disab IDD(PWM6PLL6) 6 3.11 3.75 IDD(PWM1HSI16) 1 0.6 0.7 2.04 2.49 2.8 3.4 3.13 3.78 IDD(PWM4HSI16) IDD(PWM5HSI16) Enab 16 0.5 0 Disab 4 5 6 IDD(PWM6HSI16) DocID027799 Rev 1 Disab 95/130 130 Electrical characteristics STNRGxxxA Table 78. Peripheral supply current consumption at VDD/VDDA = 5 V (continued) Symbol Op. mode Clock PLL fSMED(2) fPWM(3) fADC(4) ADC(5) Enb/dis MHz MHz MHz Enb/dis IDD(PWM1HSI8) IDD(PWM4HSI8) IDD(PWM5HSI8) Consumption(1) Peripherals PWM(6), (7) ACU(8) Num. Enb/dis 1 Enab 8 0.5 0 Disab 4 5 Disab Typ.(9) Max.(9) mA mA 0.5 0.6 1.64 2 2.3 2.9 IDD(PWM6HSI8) 6 2.56 3.1 IDD(PWM1HSI4) 1 0.47 0.55 1.48 1.81 2.2 2.7 IDD(PWM4HSI4) IDD(PWM5HSI4) Enab 4 0.5 0 Disab 4 5 Disab IDD(PWM6HSI4) 6 2.33 2.78 IDD(PWM1HSI2) 1 0.4 0.54 1.31 1.6 1.9 2.3 2.1 2.49 IDD(PWM4HSI2) IDD(PWM5HSI2) Enab 2 0.5 0 Disab 4 5 Disab 6 IDD(PWM6HSI2) IDD(ADC1) Disab 0 0 1 Enab 0 Disab 2.11 2.54 IDD(ADC2) Disab 0 0 5.3 Enab 0 Disab 2.16 2.6 IDD(ADC3) Enab 0 0 6 Enab 0 Disab 2.17 2.61 1. Data based on characterization results not tested in production.| 2. SMED frequency: - 96 MHz and 6 MHz frequencies require the PLL enabled. - Current table shows only a subset value of possible SMED frequencies. 3. PWM frequency: - PWM toggle frequency is considered fixed to 500 kHz, close to the maximum applicative value. 4. ADC frequency: - 6 MHz frequency requires the PLL enabled. - Current table shows only a subset value of possible ADC frequencies. 5. ADC configured in circular mode. 6. Number of active PWMs. 7. PWM pins are loaded with a CL (load capacitance) of 50 pF. 8. If enabled all DACs and comparator units are active. 9. Temperature operating: TA = 25 °C. 96/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics PWM current consumption overview From Figure 15 to Figure 18 provide an outline view of PWM current consumption results.The consumptions are evaluated considering the maximum current at TA = 25 °C with different SMED operating frequencies. The charts summarize the measurements carried out from Table 77 and Table 78 allowing users to derive the PWM current consumption values. Figure 15. PWM current consumption with fSMED = PLL fPWM = 0.5 MHz at VDD/VDDA = 3.3 V Figure 16. PWM current consumption with fSMED = PLL fPWM = 0.5 MHz at VDD/VDDA = 5 V DocID027799 Rev 1 97/130 130 Electrical characteristics STNRGxxxA Figure 17. PWM current consumption with fSMED = HSI fPWM = 0.5 MHz at VDD/VDDA = 3.3 V Figure 18. PWM current consumption with fSMED = HSI fPWM = 0.5 MHz at VDD/VDDA = 5 V 98/130 DocID027799 Rev 1 STNRGxxxA 12.3.3 Electrical characteristics Low power mode wake-up time Table 79 shows the wakeup time to resume the normal operating mode from different low power state. Table 79. Wake-up times Symbol Parameter Wake-up time active tWU(AH) halt mode to run mode(2) Wake-up time from halt mode to run mode(2) Ref.(3) fCPU fMASTER = 0 to 16 MHz Wake-up time from tWU(WFI) wait mode to run mode(2) tWU(H) Typ.(1) Max.(1) Unit Conditions fCPU = fMASTER = 16 MHz 0.56 (5) MVR voltage Flash in operating mode regulator on(4) Flash in power- down mode(5) 4(6) (5) MVR voltage Flash in operating mode (4) regulator off Flash in power- down mode(5) HSI (after wake-up) 6(6) s 47(6) 49(6) Flash in operating mode(5) 51 Flash in power-down mode(5) 53 1. Data based on characterization results, not tested in production. 2. Measured from the interrupt event to the interrupt vector fetch. 3. tWU(WFI) = 2 x 1/fMASTER + 7 x 1/fCPU. 4. Configured by the REGAH bit in the CLK_ICKR register. 5. Configured by the AHALT bit in the FLASH_CR1 register. 6. Plus 1 LSI clock depending on synchronization (fLSI = 153.6 kHz). 12.3.4 External clock sources and timing characteristics HSE user external clock Subject to general operating conditions for VDD and TA. Table 80. HSE user external clock characteristics Symbol Parameter Conditions -40 °C TA 105 °C Min. Max. Unit (1) MHz fHSE_ext User external clock source frequency VHSEH(2) HSEOSCIN input pin high level voltage 0.7 x VDD VDD VHSEL(2) HSEOSCIN input pin low level voltage VSS 0.3 x VDD -1 +1 ILEAKHSE(2) HSEOSCIN input pin leakage VSS VIN VDD 0 16 V µA 1. In case fHSE is configured as a direct clock for the SMED logics the maximum frequency can be 24 MHz. 2. Data based on characterization results, not tested in production. DocID027799 Rev 1 99/130 130 Electrical characteristics STNRGxxxA Figure 19. HSE external clock source HSE crystal/ceramic resonator oscillator The HSE clock can be supplied with a 1 to 24 MHz crystal/ceramic resonator oscillator. All the information given in this paragraph is based on characterization results with specified typical external components. In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. Refer to the crystal resonator manufacturer for more details (frequency, package, accuracy, etc.). Table 81. HSE crystal/ceramic resonator oscillator Symbol fHSE RF CL1, CL2(2) IDD(HSE) gm tSU(HSE)(4) Parameter Conditions External high speed oscillator frequency Min. 1 Feedback resistor Recommended load capacitance Typ. Unit 16(1) MHz 220 k (3) HSE oscillator power consumption Oscillator transconductance Startup time Max. 20 pF 6 (startup) 2 (stabilized) mA 5 VDD is stabilized mA/V 2.8 ms 1. In case fHSE is configured as a direct clock for the SMED logic the maximum frequency can be 24 MHz. 2. The oscillator needs two load capacitors, CL1 and CL2, to act as load for the crystal. The total load capacitance (Cload) is (CL1 x CL2) / (CL1 + CL2). If CL1 = CL2, Cload = CL1 / 2. Some oscillators have built-in load capacitors, CL1 and CL2. 3. The oscillator selection can be optimized in terms of supply current using a high quality resonator with small Rm value. 4. tSU(HSE) is the start-up time measured from the moment it is enabled (by software) to a stabilized 16 MHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer. 100/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Figure 20. HSE oscillator circuit diagram The crystal characteristics have to be checked by Equation 3. Equation 3 gm» gmCritic where gmCritic is calculated with the crystal parameters as follows: Equation 4 gmCritic = (2 x x fHSE)2 x Rm (2CO + C)2 and where: Rm: motional resistance(d) Lm: motional inductance(d) Cm: motional capacitance(d) CO: shunt capacitance(d) CL1 = CL2 = C: grounded external capacitance d. Refer to the application crystal specification. DocID027799 Rev 1 101/130 130 Electrical characteristics 12.3.5 STNRGxxxA Internal clock sources and timing characteristics HSI RC oscillator Subject to general operating conditions for VDD and TA. Table 82. HSI RC oscillator Symbol fHSI ACCHSI tSU(HSI) Parameter Conditions Min.(1) Frequency Typ. Max.(1) 16 Accuracy of HSI oscillator (factory calibrated)(1), (2) MHz VDD = 3.3 V TA= 25 ºC -1% +1% VDD = 3.3 V -40 ºC TA 105 ºC -4% +4% VDD = 5 V -40 ºC TA 105 ºC -4% +4% HSI oscillator wakeup time including calibration Unit 1 % µs 1. Data based on characterization results, not tested in production. 2. Variation referred to fHSI nominal value. LSI RC oscillator Subject to general operating conditions for VDD and TA. Table 83. LSI RC oscillator Symbol fLSI Parameter Conditions Min.(1) Frequency ACCLSI Accuracy of LSI oscillator tSU(LSI) LSI oscillator wake-up time 3.3 V VDD 5 V -40 ºC TA 105 ºC Typ. Max.(1) Unit 153.6 kHz -10% 10% 7 % µs 1. Guaranteed by design, not tested in production. PLL internal source clock Table 84. PLL internal source clock Symbol Parameter Conditions fIN Input frequency(2) 3.3 V VDD 5 V -40 ºC TA 105 ºC fOUT Output frequency tlock PLL lock time 1. Data based on characterization results, not tested in production. 2. PLL maximum input frequency 16 MHz. 102/130 DocID027799 Rev 1 Min. Typ. Max.(1) 16 Unit MHz 96 200 µs STNRGxxxA 12.3.6 Electrical characteristics Memory characteristics Flash program and memory/data E2PROM memory General conditions: TA = -40 °C to 105 °C. Table 85. Flash program memory/data E2PROM memory Symbol tPROG tERASE Parameter Conditions Standard programming time (including erase) for byte/word/block (1 byte/4 bytes/128 bytes) 6 6.6 Fast programming time for 1 block (128 bytes) 3 3.3 Erase time for 1 block (128 bytes) 3 3.3 Erase/write cycles(2)(program memory) NWE tRET IDDPRG Min.(1) Typ.(1) Max.(1) TA = 25 °C 10 K TA = 85 °C 100 K TA = 105 °C 35 K Data retention (program memory) after 10 K erase/write cycles at TA= 25 °C TRET = 85 °C 15 Data retention (program memory) after 10 K erase/write cycles at TA= 25 °C TRET = 105 °C 11 Data retention (data memory) after 100 K erase/write cycles at TA= 85 °C TRET = 85 °C 15 Data retention (data memory) after 35 K erase/write cycles at TA= 105 °C TRET = 105 °C 6 Supply current during program and erase cycles -40 ºC TA 105 ºC Erase/write cycles(2) (data memory) Unit ms Cycles Years 2 mA 1. Data based on characterization results, not tested in production. 2. The physical granularity of the memory is 4 bytes, so cycling is performed on 4 bytes even when a write/erase operation addresses a single byte. DocID027799 Rev 1 103/130 130 Electrical characteristics 12.3.7 STNRGxxxA I/O port pin characteristics Subject to general operating conditions for VDD and TA unless otherwise specified. Unused input pins should not be left floating. Table 86. Voltage DC characteristics Symbol VIL VIH VOL1 Min.(1) Description Input low voltage (2) Input high voltage Typ. Max.(1) -0.3 0.3 x VDD 0.7 x VDD VDD (3) (4) Output low voltage at 3.3 V , Unit 0.4 (3) (4) VOL2 Output low voltage at 5 V , 0.5 VOL3 Output low voltage high sink at 3.3 V / 5 V(2),(5), (6) 0.6 V 60 k VOH1 VOH2 Output high voltage at 3.3 Output high voltage at 5 V(3), (4) VDD - 0.4 V(3), (4) VDD - 0.5 VOH3 Output high voltage high sink at 3.3 V / 5 HVS Hysteresis input voltage(7) RPU Pull-up resistor V(2), (5), (6) VDD - 0.6 0.1 x VDD 30 45 1. Data based on characterization result, not tested in production. 2. All signals are not 5 V tolerant (input signals can't be exceeded VDDX (VDDX = VDD, VDDA). 3. The parameter applicable to signalsGPIO0 [5:0] (product depending) (high sink selectable by high speed config.). 4. The parameter applicable to signals: GPIO1 [5:0]/PWM [5:0] (product depending). 5. The parameter applicable to the signal: SWIM. 6. The parameter applicable to the signal: DIGIN [0]/CCO_clk. 7. Applicable to any digital inputs. 104/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Table 87. Current DC characteristics Symbol IOL1 IOL2 Description Min. Standard output low level current at 3.3 V and VOL1(2), (3) Standard output low level current at 5 V and VOL2 , High sink output low level current at 3.3 V and VOL3 , IOLhs2 High sink output low level current at 5 V and VOL3(2),(4), (5) , Standard output high level current at 3.3 V and VOH1 , IOH2 Standard output high level current at 5 V and VOLH2(2), (3) 7.75 3 (2) (4) (5) High sink output high level current at 3.3 V and VOH3 , IOHhs2 High sink output high level current at 5 V and VOH3(2), (4), (5) Injection mA 1.5 IOHhs1 I_Inj 5 (2) (3) IOH1 I_Inj Unit 3 (2) (4) (5) Input leakage current digital - analog VSS VIN Max.(1) 1.5 (2) (3) IOLhs1 ILKg Typ. , 5 7.75 VDD(6) ±1 current(7), (8) µA ±4 Total injection current (sum of all I/O and control pins)(7) mA ± 20 1. Data based on characterization result, not tested in production. 2. A high sink selectable by high speed configuration; the parameter applicable to signals: GPIO0 [5:0] (product depending). 3. The parameter applicable to signals: GPIO1 [5:0]/PWM [5:0] (product depending). 4. The parameter applicable to the signal: SWIM. 5. The parameter applicable to the signal: DIGIN [0]/CCO_clk. 6. Applicable to any digital inputs. 7. Maximum value must never be exceeded. 8. Negative injection current on the ADCIN [7:0] signals (product depending) have to avoid since impact the ADC conversion accuracy. Table 88. Operating frequency characteristics Symbol Description Min. Typ. Max.(1) fIL1 Digital input signal operating frequency(2), (3), (4) 12 fIH1 Analog input signal operating frequency(5), (6) 24 fIH2 (7) (8) High speed input signal operating frequency , Unit 128 load(2) fOL1 Standard output signal operating frequency with 50 pF max. fOL2 High sink output signal operating frequency with 50 pF max. load(2), (3) 10 fOH1 High speed output signal operating frequency with 50 pF max. load(7) 12 fOH2 load(8) 32 High speed output signal operating frequency with 50 pF max. 2 MHz 1. Data based on characterization result, not tested in production 2. A high sink selectable by high speed configuration; parameter applicable to signals: GPIO0 [5:0] (product depending). 3. The parameter applicable to the signal: SWIM. 4. The parameter applicable to signals: DIGIN [5:1] (product depending). 5. The parameter applicable to signals: GPIO0 [3:2] when configured as HSE_Oscin/Oscout. 6. The parameter applicable to any analog signals: ADCIN [7:0], CPP [3:0] and CPM3 (product depending). 7. The parameter applicable to signals: GPIO1 [5:0]/PWM [5:0] (product depending). 8. The parameter applicable to the signal: DIGIN [0]/CCO_clk. DocID027799 Rev 1 105/130 130 Electrical characteristics 12.3.8 STNRGxxxA Typical output level curves This section shows the typical output voltage level curves measured on a single output pin for the three pad family present in the STNRG device. Standard pad This pad is associated to the following signals: DIGIN [5:1], SWIM and GPIO0 [5:0] when available. Figure 21. VOH standard pad at 3.3 V Figure 22. VOL standard pad at 3.3 V 106/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Figure 23. VOH standard pad at 5 V Figure 24. VOL standard pad at 5 V DocID027799 Rev 1 107/130 130 Electrical characteristics STNRGxxxA Fast pad This pad is associated to the PWM [5:0] signals if the external pin is available. Figure 25. VOH fast pad at 3.3 V Figure 26. VOL fast pad at 3.3 V 108/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Figure 27. VOH fast pad at 5 V Figure 28. VOL fast pad at 5 V DocID027799 Rev 1 109/130 130 Electrical characteristics STNRGxxxA High speed pad This pad is associated to the DIGIN [0] signals. Figure 29. VOH high speed pad at 3.3 V Figure 30. VOL high speed pad at 3.3 V 110/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics Figure 31. VOH high speed pad at 5 V Figure 32. VOL high speed pad at 5 V DocID027799 Rev 1 111/130 130 Electrical characteristics 12.3.9 STNRGxxxA Reset pin characteristics Subject to general operating conditions for VDD and TA unless otherwise specified. Table 89. NRST pin characteristics Symbol VIL(NRST) VIH(NRST) VOL(NRST) Parameter NRST input low level voltage(1) (1) NRST input high level voltage NRST output low level voltage NRST pull-up resistor tIFP(NRST) NRST input filtered pulse(3) tOP(NRST) (1) Min.(1) NRST not input filtered Typ. Max.(1) -0.3 0.3 x VDD 0.7 x VDD VDD + 0.3 IOL= 2 mA 30 40 60 75 pulse(3) Unit V 0.5 (2) RPU(NRST) tINFP(NRST) Conditions 500 NRST output filtered pulse(3) 15 k ns µs 1. Data based on characterization results, not tested in production. 2. The RPU pull-up equivalent resistor is based on a resistive transistor. 3. Data guaranteed by design, not tested in production. 12.3.10 I2C interface characteristics Table 90. I2C interface characteristics Standard mode Symbol Parameter Min.(2) Max.(2) Fast mode(1) Min.(2) tw(SCLL) SCL clock low time 4.7 1.3 tw(SCLH) SCL clock high time 4.0 0.6 tsu(SDA) SDA setup time 250 100 SDA data hold time 0(3) 0(3) th(SDA) Max.(2) µs 900(3) tr(SDA), tr(SCL) SDA and SCL rise time (VDD = 3.3 to 5 V)(4) 1000 300 tf(SDA), tf(SCL) SDA and SCL fall time (VDD = 3.3 to 5 V)(4) 300 300 th(STA) START condition hold time 4.0 0.6 tsu(STA) Repeated START condition setup time 4.7 0.6 tsu(STO) STOP condition setup time 4.0 0.6 STOP to START condition time (bus free) 4.7 1.3 tw(STO:STA) Cb Capacitive load for each bus line(5) 50 50 1. fMASTER, must be at least 8 MHz to achieve maximum fast I C speed (400 kHz). 2. Data based on standard I2C protocol requirement, not tested in production. 3. The maximum hold time of the start condition has only to be met if the interface does not stretch the low time. 4. I2C multifunction signals require the high sink pad configuration and the interconnection of 1 K pull-up resistances. 112/130 DocID027799 Rev 1 ns µs 2 5. 50 pF is the maximum load capacitance value to meet the I2C STD timing specifications. Unit pF STNRGxxxA 12.3.11 Electrical characteristics 10-bit SAR ADC characteristics Subject to general operating conditions for VDDA, fMASTER, and TA unless otherwise specified. Table 91. ADC characteristics Symbol N Parameter Conditions Resolution ADC Clock frequency 0 VIN2 Conversion voltage range for gain x4(4) 0 tS tSTAB Unit bit M (1) 1 Conversion voltage range for gain x1 ADC main reference Max. 1 VIN1 Vref Typ. 10 RADCIN ADC input impedance fADC Min. voltage(5) 6 (2) 1.25 , MHz (3) 0.3125(2), (3) V 1.250 Sampling time fADC = 6 MHz Wakeup time from ADC standby 0.50 30 tCONV1 Single conversion time including sampling time fADC = 6 MHz 2.42 tCONV2 Continuous conversion time including sampling time fADC = 6 MHz 3 µs 1. Frequency generated selecting the PLL source clock. 2. Maximum input analog voltage cannot exceed VDDA. 3. Exceeding the maximum voltage on the ADCIN [7:0] signals (product depending) for the related conversion scale must be avoided since the ADC conversion accuracy can be impacted. 4. Product depending 5. ADC reference voltage at TA = 25 °C. DocID027799 Rev 1 113/130 130 Electrical characteristics STNRGxxxA ADC accuracy characteristics at VDD/VDDA 3.3 V Table 92. ADC accuracy characteristics at VDD/VDDA 3.3 V Symbol Conditions(1) Parameter Typ.(2) |ET| Total unadjusted error(4), (5), (6) 2.8 |EO| (4) (5) (6) 0.3 (4) (5) (6) (7) 0.4 |EG| Offset error , Gain error , , , , (7) (8) EO+G Offset + gain error , EO+G Offset + gain error(7), (9) EO+G |ED| fADC = 6 MHz gain 1 (7) (10) Offset + gain error , Differential linearity error(2), (3),(4) |EL| Integral linearity 1.4 |ET| Total unadjusted error(4), (5), (6) 2.8 |EO| Offset error(4), (5), (6) 0.3 (4) (5) (6) (7) Gain error , , , Offset + gain EO+G Offset + gain error(5), (9) EO+G |ED| |EL| Offset + gain fADC = 6 MHz gain 4(11) error(7), (10) Differential linearity Integral linearity -8.5 9.3 -11 11 -14.3 11.3 Unit LSB 0.4 error(7), (8) EO+G Max.(3) 0.5 error(4), (5), (6) |EG| Min.(3) error(4), (5), (6) -12.7 15.5 -16.7 18.8 -19.2 18.8 0.5 error(4), (5), (6) 1.4 1. Measured with RAIN < 10 k (RAIN external series resistance interconnected between the AC signal generator and the ADC input pin). 2. Temperature operating: TA = 25 °C. 3. Data based on characterization results, not tested in production. 4. ADC accuracy vs. negative injection current. Injecting negative current on any of the analog input pins should be avoided as this reduces the accuracy of the conversion being performed on another analog input. It is recommended a Schottky diode (pin to ground) to be added to standard analog pins which may potentially inject the negative current. Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in the I/O port pin characteristic section does not affect the ADC accuracy. The ADC accuracy parameters may be also impacted exceeding the ADC maximum input voltage VIN1 or VIN2. 5. Results in manufacturing test mode. 6. Data aligned with trimming voltage parameters. 7. Gain error evaluation with the two point method. 8. Temperature operating range: 0 ºC TA 85 ºC. 9. Temperature operating range: -25 ºC TA 105 ºC. 10. Temperature operating range: -40 ºC TA 105 ºC. 11. Product depending. 114/130 DocID027799 Rev 1 STNRGxxxA Electrical characteristics ADC accuracy characteristics at VDD/VDDA 5 V Table 93. ADC accuracy characteristics at VDD/VDDA 5 V Symbol Conditions(1) Parameter Typ.(2) |ET| Total unadjusted error(4), (5), (6) TBD |EO| (4) (5) (6) 0.5 (4) (5) (6) (7) 0.4 |EG| Offset error , Gain error , , , , (7) (8) EO+G Offset + gain error , EO+G Offset + gain error(7), (9) EO+G |ED| (7) (10) Offset + gain error , Differential linearity error(2), (3), (4) Integral linearity |ET| Total unadjusted error(4), (5), (6) |EO| Offset error(4), (5), (6) , EO+G Offset + gain error(5), (9) EO+G |ED| |EL| Offset + gain Integral linearity 10.9 -13.8 10.9 LSB 0.2 fADC = 6 MHz gain 4(11) error(7), (10) Differential linearity -10.9 1.2 , Offset + gain 8.9 TBD error(7), (8) EO+G -8.3 Unit 2.0 (4) (5) (6) (7) Gain error , Max.(3) 0.8 error(4), (5), (6) |EL| |EG| fADC = 6 MHz gain 1 Min.(3) error(4), (5), (6) -12.2 15.3 -16.4 18.5 -18.8 18.5 0.8 error(4), (5), (6) 2.0 1. Measured with RAIN <10 k (RAIN external series resistance interconnected between the AC signal generator and the ADC input pin). 2. Temperature operating: TA = 25 °C. 3. Data based on characterization results, not tested in production. 4. ADC accuracy vs. negative injection current. Injecting negative current on any of the analog input pins should be avoided as this reduces the accuracy of the conversion being performed on another analog input. It is recommended a Schottky diode (pin to ground) to be added to standard analog pins which may potentially inject negative current. Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in the I/O port pin characteristic section does not affect the ADC accuracy. The ADC accuracy parameters may be also impacted exceeding the ADC maximum input voltage VIN1 or VIN2. 5. Results in manufacturing test mode. 6. Data aligned with trimming voltage parameters. 7. Gain error evaluation with the two point method. 8. Temperature operating range: 0 ºC TA 85 ºC. 9. Temperature operating range: -25 ºC TA 105 ºC. 10. Temperature operating range: -40 ºC TA 105 ºC. 11. Product depending. DocID027799 Rev 1 115/130 130 Electrical characteristics STNRGxxxA ADC equivalent input circuit Figure 33 shows the ADC equivalent input circuit. Figure 33. ADC equivalent input circuit Note: 116/130 The gain x1 ADC input analog voltage range is from 0 up to 1.25 V. The gain x4 ADC input analog voltage range is from 0 up to 312.5 mV (check availability on device). Maximum input analog voltage cannot exceed VDDA. ADC input impedance > 1 M. The ADCIN [7:0] input pins are provided by the ESD protection diodes. DocID027799 Rev 1 STNRGxxxA Electrical characteristics ADC conversion accuracy Figure 34. ADC conversion accuracy ADC accuracy parameter definitions: ET = total unadjusted error: maximum deviation between the actual and the ideal transfer curves. EO = offset error: deviation between the first actual transition and the first ideal one. EOG = offset + gain error (1-point gain): deviation between the last ideal transition and the last actual one. EG = gain error (2-point gain): defined so that EOG = EO + EG (parameter correlated to the deviation of the characteristic slope). ED = differential linearity error: maximum deviation between actual steps and the ideal one. EL = integral linearity error: maximum deviation between any actual transition and the end-point correlation line. DocID027799 Rev 1 117/130 130 Electrical characteristics 12.3.12 STNRGxxxA Analog comparator characteristics Table 94. Analog comparator characteristics Symbol VCPP VCPM CIN Voffset tCOMP Parameter Conditions -40 ºC TA 105 ºC Comparator positive input voltage range Comparator negative external input voltage range Min.(1) Typ. 0 Max.(1) Unit 1.23(2) V (2) (3) 0 1.23 , Input capacitance 3 pF Comparator offset error 15 (4) Comparison delay time V 50 , mV (5) ns 1. Data based on characterization results, not tested in production. 2. Maximum analog input voltage cannot exceed VDDA. 3. The comparator 3 can be configured with the external reference voltage signal CPM3. 4. The overdrive voltage is ± 50 mV. 5. This parameter doesn't consider the delay time of comparator signal synchronization stages and SMED logic. Table 95. Analog comparator hysteresis at VDD/VDDA 3.3 V Symbol Parameter Conditions Hysteresis positive(1) Min. VHYST0 Max. VHYST1, VHYST2 Hysteresis voltage code1, 2 Hysteresis voltage code 3 VHYST4 Hysteresis voltage code 4 VHYST5 Max. Max. N. A. 4 52 0 -60 13 78 -13 -80 Hysteresis voltage code 5 41 148 -45 -150 VHYST6 Hysteresis voltage code 6 56 203 -58 -205 VHYST7 Hysteresis voltage code 7 123 406 -125 -403 -40 ºC TA 105 ºC 1. Data based on characterization results, not tested in production. 118/130 Unit No hysteresis Hysteresis voltage code 0 VHYST3 Hysteresis negative(1) DocID027799 Rev 1 mV STNRGxxxA Electrical characteristics Table 96. Analog comparator hysteresis at VDD/VDDA 5 V Symbol Parameter Conditions Hysteresis positive(1) Min. VHYST0 Max. VHYST1, VHYST2 Hysteresis voltage code1, 2 Hysteresis voltage code 3 VHYST4 Hysteresis voltage code 4 VHYST5 Max. Unit Max. No hysteresis Hysteresis voltage code 0 VHYST3 Hysteresis negative(1) N. A. N. A. -40 ºC TA 105 ºC -1 -56 2 82 -13 -81 mV Hysteresis voltage code 5 17 154 -42 -148 VHYST6 Hysteresis voltage code 6 37 202 -57 -203 VHYST7 Hysteresis voltage code 7 119 398 -124 -400 1. Data based on characterization results, not tested in production. 12.3.13 DAC characteristics Table 97. DAC characteristics Symbol Parameter Conditions N Resolution Vfull scale DAC full scale Voffset DAC offset Vdac DAC out voltage Min.(1) Typ. Max.(1) 4 1.2 -40 ºC TA 105 ºC LSB Voffset bit 1.26 V 4 mV Vfull scale mV 82 INL Integral non linearity Unit mV 0.12 LSB 1. Data based on characterization results, not tested in production. Equation 5 V fullscale – V offset : n 0 15 vV - n + V offset dac n = --------------------------------------------------15 Equation 6 V fullscale – V offset : n 1 14 vvV - n + INL + V offset dac n = --------------------------------------------------15 where: Vfullscale = Vfullscale(sample, T) Voffset = Voffset (sample, T) INL = INL (sample, n) DocID027799 Rev 1 119/130 130 Electrical characteristics STNRGxxxA 12.4 EMC characteristics 12.4.1 Electrostatic discharge (ESD) Electrostatic discharges (3 positive then 3 negative pulses separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts * (n + 1) supply pin). Table 98. ESD absolute maximum ratings Symbol Ratings Conditions Maximum value Unit VESD(HBM) Electrostatic discharge voltage (human body model) TA = 25 °C, conforming to JEDEC/JESD22-A114E 2000 VESD(CDM) Electrostatic discharge voltage (charge device model) TA = 25 °C, conforming to ANSI/ESD STM 5.3.1 ESDA 500 VESD(MM) Electrostatic discharge voltage (machine model) TA = 25 °C, conforming to JEDEC/JESD-A115-A 200 V Data based on characterization results, not tested in production. 12.4.2 Static latch-up Two complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. Table 99. Electrical sensitivity Symbol LU 120/130 Parameter Static latch-up class DocID027799 Rev 1 Conditions Level TA = 105 °C A STNRGxxxA 13 Thermal characteristics Thermal characteristics The STNRG functionality cannot be guaranteed when the device operating exceeds the maximum chip junction temperature (TJmax). TJmax, in °C, may be calculated using Equation 7: Equation 7 TJmax = TAmax + (PDmax x JA) where: TAmax is the maximum ambient temperature in °C JA is the package junction to ambient thermal resistance in °C/W PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax) PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal power. PI/Omax represents the maximum power dissipation on output pins where: PI/Omax = (VOL x IOL) + [(VDD - VOH) x IOH], taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level. Table 100. Package thermal characteristics Symbol Parameter ambient(1) JA TSSOP38 - thermal resistance junction to JA VFQFPN32 - thermal resistance junction to ambient(1) JA TSSOP28 - thermal resistance junction to ambient(1) Value Unit 80 °C/W 26 °C/W 80 °C/W 1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in a natural convection environment. DocID027799 Rev 1 121/130 130 Package information 14 STNRGxxxA Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 14.1 TSSOP38 package information Figure 35. TSSOP38 package outline 0117861_C 122/130 DocID027799 Rev 1 STNRGxxxA Package information Table 101. TSSOP38 package mechanical data(1) Dimensions (mm) Symbol Min. Typ. A 1.20 A1 0.05 A2 0.80 b 0.17 0.27 c 0.09 0.20 (2) 9.60 9.70 9.80 E 6.20 6.40 6.60 E1(2) 4.30 4.40 4.50 D e L k 0.15 1.00 1.05 0.50 0.45 L1 0.60 0.75 1.00 0 aaa 1. Max. 8 0.10 “TSSOP stands for “Thin Shrink Small Outline Package”. 2. “Dimensions “D” and “E1”do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. DocID027799 Rev 1 123/130 130 Package information 14.2 STNRGxxxA VFQFPN32 package information Figure 36. VFQFPN32 package outline 124/130 DocID027799 Rev 1 STNRGxxxA Package information Table 102. VFQFPN32 package mechanical data(1) Dimensions (mm) Symbol Min. Typ. Max. A 0.80 0.90 1.00 A1 0 0.02 0.05 A3 0.20 b 0.18 0.25 0.30 D 4.85 5.00 5.15 D2 3.40 3.45 3.50 E 4.85 5.00 5.15 E2 3.40 3.45 3.50 0.50 0.55 0.40 0.50 e L 0.30 ddd 1. 0.08 “VFQFPN stands for “Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead”. Very thin profile: 0.80 < A 1.00 mm. Details of the terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features. Package outline exclusive of any mold flashes dimensions and metal burrs. DocID027799 Rev 1 125/130 130 Package information 14.3 STNRGxxxA TSSOP28 package information Figure 37. TSSOP28 package outline 126/130 DocID027799 Rev 1 STNRGxxxA Package information Table 103. TSSOP28 package mechanical data(1) Dimensions (mm) Symbol Min. Typ. A Max. 1.20 A1 0.05 A2 0.80 b 0.19 0.30 c 0.09 0.20 (2) 9.60 9.70 9.80 E 6.20 6.40 6.60 E1(3) 4.30 4.40 4.50 D e L 1.00 1.05 0.65 0.45 L1 k 0.15 0.60 0.75 1.00 0 aaa 8 0.10 1. “TSSOP stands for “Thin Shrink Small Outline Package”. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. DocID027799 Rev 1 127/130 130 STNRG development tools 15 STNRGxxxA STNRG development tools The development tools for the STNRG microcontroller are provided by: 16 Raisonance with the C compiler and the integrated development environment (Ride7), which provides start-to-finish control of application development including the code editing, compilation, optimization and debugging. The Ride7 supports the RLink in-circuit debugger/programmer using the SWIM interface (USB/SWIM). IAR Embedded Workbench® for STM8. The IAR Embedded Workbench IAR-EWSTM8 is a software development tool with the highly optimizing C and C++ compiler for the STM8 CPU device. The workbench supports the ST-LINK and STice debug probes using the SWIM interface (USB/SWIM). Order codes Table 104. Ordering information Order code STNRG388A STNRG388ATR STNRG328A STNRG328ATR STNRG288A STNRG288ATR 128/130 Package TSSOP38 VFQFPN32 TSSOP28 DocID027799 Rev 1 Packaging Tube Tape and reel Tube Tape and reel Tube Tape and reel STNRGxxxA 17 Revision history Revision history Table 105. Document revision history Date Revision 28-Apr-2015 1 Changes Initial release. DocID027799 Rev 1 129/130 130 STNRGxxxA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 130/130 DocID027799 Rev 1